透明薄膜的干涉相干峰分离算法

白光干涉技术具有高度唯一性,广泛地被使用在三维表面形貌和台阶高度的测量。但是测量透明薄膜时,薄膜表面和基面都有光线反射与参考光线交汇,在被测表面的同一个位置不同高度两次产生干涉条纹,其干涉相干图中出现两个峰值。通过分析透明薄膜产生的干涉相干图的特点,提出了两种算法用来分离不同表面产生的干涉条纹。理论分析和试验结果表明,利用垂直扫描白光干涉法测量透明薄膜,由峰值分离算法和定位算法分别提取薄膜的上下表面,能够得到透明薄膜的高精度三维形貌和厚度信息。     

基于扫描白光干涉法的表面三维轮廓仪

在强调表面三维形貌测量重要性的基础上 ,介绍了利用扫描白光干涉法测量表面三维微观形貌的原理及三维轮廓仪测量系统的构成。通过给出的几个测量实例 ,反映了该三维轮廓仪的主要特点 ,适合于大范围、高精度、阶梯面的测量。最后分析了影响其测量精度的主要因素。     

基于白光干涉的ICF靶丸表面缺陷测量方法

针对激光惯性约束聚变实验中的靶丸等微球表面缺陷的真实高度测量问题,为解决现有测量方法存在的缺陷跃变处2π整数倍相位缺失问题,提出一种基于垂直扫描白光干涉技术的零位显微干涉测量方法。该方法采用白光球面零位干涉思想,通过垂直扫描球面干涉获取全视场白光干涉图,然后运用七步移相算法及蝙蝠翼校正算法实现靶丸表面缺陷的形貌计算,最后将白光干涉测量法与激光干涉测量法进行对比实验。结果表明,白光干涉法能够有效解决激光干涉法在缺陷跃变处的2π整数倍相位缺失问题,实现靶丸表面缺陷的真实高度测量,从而扩展靶丸类微球表面缺陷的测量范围。     

高精度动态白光干涉测量方法

白光干涉测量技术具有精度高和非接触式测量的优点,是超精密加工领域中的一项重要测量手段。针对白光干涉测量技术容易受环境振动影响的问题,提出了一种动态垂直扫描干涉测量方法(DVSI)。该方法将白光干涉光路分为两个成像通道,得到与白光干涉图同步移相的准单色光干涉图。通过相位-倾斜迭代方法(PTI)对准单色光干涉图进行处理得到实际的移相扫描位置,对白光干涉信号进行相干峰位置的定位,并计算出粗糙的形貌分布,之后利用局部最小二乘方法(LLS)计算出精细的相位分布,将粗糙形貌以及精细相位相结合来复原出待测件的三维形貌。本研究通过数值仿真和实验对比对该方法进行了验证,结果表明本方法具有较好的抗振性能。     

基于白光干涉测试技术的改进Carré相移算法

为了减小白光相移干涉法测量物体微观形貌时产生的误差,对极值法的搜索路径进行优化后与Carré相移算法相结合,提出一种基于白光干涉测试技术的改进Carré相移算法.该算法减小了光源扰动及电荷耦合元件散粒噪声带来的影响,且对相移器的线性误差不敏感,免去了相位解包裹过程,提高了运算效率.采用单刻线样块对扫描步距进行校准实现了光源中心波长的在线修正,减小了由于光源特性及环境扰动误差带来的影响.采用不同算法对标准粗糙度样块进行三维形貌恢复以及表面粗糙度的重复性测量实验,结果表明:该算法对表面粗糙度的测量结果较传统白光干涉算法准确度提高,测量重复性优于1%.     

用白光相移干涉增大表面形貌可测范围的研究

分析研究了我相移干涉应用于表面形貌测量时表面形貌与干涉图像之间的关系,比较了两种不同光谱分布的光束的白光相移干涉特性。依据白光相移干涉中与干涉光强有关的一些特定参量与表面形貌之间的一一对应关系,提出了一种不直接测量相位、避开相位测量不确定性的新方法。所提方法扩大了可测深度范围,可用于测量面形较陡的连续表面或不连续深结构表面。     

垂直扫描白光干涉信号的计算机快速模拟

提出一种垂直扫描白光干涉信号的计算机快速模拟方法。该方法考虑到白光光源光谱分布及垂直扫描干涉系统对白光干涉信号的影响,通过正弦函数多项式拟合的方式减少模拟算法的运算量,消除了现有方法中数值积分运算量大,不便于实际分析的缺点。采用白光LED作为光源,用该方法对白光干涉信号进行模拟分析,并用直接数值积分信号模拟结果与白光干涉垂直扫描测量装置获得的实测信号进行对比,验证了该方法的准确性。     

扫描白光干涉测量技术的算法比较

干涉条纹零光程差位置的确定是扫描白光干涉测量的关键技术之一。介绍了扫描白光干涉法测量物体轮廓的原理,讨论了确定白光干涉条纹零级条纹位置的几种方法,并对随机生成的表面进行了大量的数字模拟测量和分析比较,得出了各种算法对测量准确度的影响。研究结果对白光干涉的应用研究提供了可靠的理论根据。     

多波长表面形貌测量系统中波长校准方法

表面形貌测量在光学元件加工制造和表面功能特性评定等方面有着非比寻常的意义。设计一种三波长轮换的表面形貌测量系统,与传统的白光相移干涉扫描等方法相比较,能够有效扩大测量深度以及形貌精度。多波长测量中波长带来的误差会极大的影响测量的精度,需要准确的校准波长。围绕三波长轮换表面形貌干涉测量系统,提出了利用平面镜干涉图校准三个滤光片波长的方法。通过对粗糙度样本的测量实验及计算结果显示:用校准后的波长计算标准方波样板得到的表面粗糙度数据与未使用为校准波长测得的结果相比其精度提高了1.3%,与标准数据相比较其相对误差仅为4.1%。     

一种四波长轮换的表面形貌干涉测量系统

针对相移干涉法测量表面三维形貌时深度测量范围受波长限制这一问题,提出一种四波长表面形貌干涉测量系统。通过滤波片的轮换,将白光LED光源的光切换出4个不同波长的光源,并依次进行单波长干涉。为解决多波长干涉图像数据处理,采用基于椭圆拟合的算法,在逐帧逐点的相位计算条件下,运用大小尺度相结合的算法实现高精度宽范围的表面形貌测量。实验结果表明:在深度测量范围扩大到约41倍的条件下,测量经中国计量科学研究院采用粗糙度国家基准校准的方波多刻线样板,得到的表面粗糙度数据与校准数据相比,相对误差为4.09%。说明在一定的深度范围内,该系统能够实现表面形貌的高精度测量。     

Properties of Cu film and Ti/Cu film on polyimide prepared by ion beam techniques

Cu film and Ti/Cu film on polyimide substrate were prepared by ion implantation and ion beam assisted deposition (IBAD) techniques. Three-dimension white-light interfering profilometer was used to measure thickness of each film. The thickness of the Cu film and Ti/Cu film ranged between 490 nm and 640 nm. The depth profile, surface morphology, roughness, adhesion, nanohardness, and modulus of the Cu and Ti/Cu films were measured by scanning Auger nanoprobe (SAN), atomic force microscopy (AFM), and nanoindenter, respectively. The polyimide substrates irradiated with argon ions were analyzed by scanning electron microscopy (SEM) and AFM. The results suggested that both the Cu film and Ti/Cu film were of good adhesion with polyimide substrate, and ion beam techniques were suitable to prepare thin metal film on polyimide.     

垂直扫描白光干涉术用于微机电系统的尺寸表征

随着微机电系统的发展,器件设计和加工过程中的表征成为一个主要问题。提出了将扫描白光干涉表面轮廓测量方法用于微结构和器件的几何特性检测上。测量系统采用了米劳显微干涉仪,利用压电陶瓷物镜纳米定位器实现垂直方向100μm范围内的精确扫描,并通过傅里叶变换算法获取条纹包络峰的位置,进而得到器件的整体集合尺寸信息,与相移干涉方法相比大大提高了测量范围。通过测量纳米台阶对该系统进行了精度标定,测量重复性在亚纳米量级。最后通过测量微谐振器和微压力传感器的几何尺寸说明了该方法的功能。     

Testing micro devices with fringe projection and white-light interferometry

Optical sensors are very suitable for the analysis of microscopic structures and micro devices. We compare two very promising methods: the white-light interferometry and the fringe projection technique for the application to this task. The fringe projection is very useful for fast measurement of objects with vertical dimensions of some μm. White-light interferometry is especially useful for highly resolved 3-D measurements. Furthermore, we present a new technique, the scanning fringe projection (SFP), which enables absolute 3-D measurements with one single grating period.     

Dynamic out-of-plane profilometry for nano-scale full-field characterization of MEMS using stroboscopic interferometry with novel signal deconvolution algorithm

A dynamic 3D nano-scale surface profilometer using stroboscopic white-light interferometry with novel signal deconvolution was developed to deliver dynamic surface profilometry with a measurement bandwidth of up to a MHz scale and a vertical resolution reaching 1 nm. Previous work using stroboscopic microscopic interferometry for dynamic characterization of micro-(opto)electromechanical systems (M(O)EMS) has been limited in measurement bandwidth of less than a few hundred kHz due to physical length limitation of stroboscopic light. For high-resonance mode analysis, the stroboscopic light pulse is too lengthy to capture the moving fringes from dynamic motion of the detected structure. In view of this need, a novel deconvolution algorithm using correction of the light response was developed for removing potential image blurs caused by the unavoidable vibration of the tested parts. With this advance in technology, the bandwidth of dynamic measurement can be significantly increased without sacrificing measurement accuracy. A microcantilever beam used in AFM was measured to verify the capability of the system in accurate characterization of dynamic behaviors of M(O)EMS.     

Continuous wavelet transform for micro-component profile measurement using vertical scanning interferometry

White-light interferometric techniques have been widely used in three-dimensional (3D) profiling. This paper presents a new method based on vertical scanning interferometry (VSI) for the 3D profile measurement of a micro-component that contains sharp steps. The use of a white-light source in the system overcomes the phase ambiguity problem often encountered in monochromatic interferometry and also reduces speckle noises. A new algorithm based on the continuous wavelet transform (CWT) is used to retrieve the phase of an interferogram. The algorithm accurately determines local fringe peak and improves the vertical resolution of the measurement. The proposed method is highly resistant to noise and is able to achieve high accuracy. A micro-component (lamellar grating) fabricated by sacrificial etching technique is used as a test specimen to verify the proposed method. The measurement uncertainty of the experimental results is discussed.     

Influence of filler type on wet skid resistance of SSBR/BR composites: Effects from roughness and micro-hardness of rubber surface

The wet skid resistance (WSR) of SSBR/BR(solution styrene-butadiene rubber/butadiene rubber) composites filled with carbon black, silica, and nano-diamond partly replacing carbon black or silica, respectively, was measured with a portable British Pendulum Skid Tester (BPST). A dynamic mechanical thermal analyzer was used to obtain the viscoelasticity of the composites. A 3D scanning white-light interfering profilometer was used and the scratch test performed to characterize surface roughness and micro-roughness, respectively, of the composites. WSR of the silica-filled composite was better than that of the carbon black-filled one, and further enhancement of WSR was obtained by replacing silica with nano-diamond. Tan δ of the composites at 0 °C, 10 Hz, and tensile strain of 2% did not show good correlation with WSR. The surface roughness of the composites had effects on WSR. The scratch test indicated that the higher the hardness of the filler in the composite, the higher the micro-hardness and the better the WSR. Therefore, the surface micro-hardness of the composites is an important factor affecting WSR, besides viscoelasticity and surface roughness.     

Micro-profile measurement based on windowed Fourier transform in white-light scanning interferometry

White-light scanning interferometry (WLSI) has been widely used in micro-profile measurement such as Micro-Electro-Mechanical Systems (MEMS) and Computer Generated Hologram (CGH) diffractive elements. It does not contain phase ambiguity problem which is often encountered in monochromatic wavelength interferometry. This paper presents an algorithm based on windowed Fourier transform (WFT) to extract the phase of a white-light interferogram and compensates for the difference in zero optical path difference (ZOPD) position in WLSI. With the WFT technique, the center wavelength of a white-light source and the phase of a white-light interferogram could be retrieved simultaneously. The effect of noise, scanning interval of a piezoelectric transducer (PZT) and the window size of WFT are also analyzed. Both simulated and experimental results show that the proposed algorithm has good noise immunity and is able to accurately measure the micro-profile of a specimen.     

用光纤白光干涉技术测量晶体的弹光系数

运用折射率椭球分析晶体的弹光效应,给出了三方晶系沿光轴方向的应力与折射率的变化关系.针对晶体的各向异性和折射率随应力变化很小的因素,利用白光干涉技术空间分辨率高的特点,将白光干涉技术拓展到研究各向异性材料的光学性质. 并对测量群折射率的光纤迈克尔逊白光干涉技术进行了改进.采用光栅位移传感器和全保偏光纤提高反射扫描镜的位移准确度.通过测量石英晶体在不同外力下折射率的变化情况,确定了晶体的弹光系数. 石英晶体的弹光系数P33和P13分别为0.110和0.279,其准确度达到0.001.     

WHITE-LIGHT SPECKLE VELOCIMETRY APPLIED TO PLANE FREE CONVECTIVE FLOW

The laminar free-convective flow along heated, vertical wall contours of different geometries is measured with a white-light speckle velocimetric method. The flow field is nominally two-dimensional (plane), and the experimental method can therefore be applied in the forward-scattering mode. The experiments are performed in a water tank, where tracer particle velocities down to 0.3 mm/s can be resolved.The measurements reveal the existence of dead-water regimes in the corner areas of a vertical wall/half-cylinder configuration.