弧光放电法原位清洗光学元件

光学元件受到污染后其光学性能会变差，如何对其进行清洗，尽可能地恢复其原来的性能，使其能够重新使用显得很重要。本文介绍—种碳污染的原位清洗方法——射频弧光放电法，利用原子氧与光学元件表面所沉积的碳反应以达到清洗的目的。清洗装置建立后对北京同步辐射装置（BSRF)上所使用的光学元件进行了清洗，取得了较好的效果。     

基于石英晶体天平和微纳光纤的有机污染物在线监测

为了监测高功率激光驱动器中有机污染物的挥发特性以及其在光学元件表面的沉积特性,研究了基于石英晶体微量天平和微纳光纤传感器的真空腔体内有机物在线监测技术.首先测试了不同分子态污染物浓度时石英晶体天平的响应性能,然后采用视角因子等分法对微纳光纤传感器和石英晶体天平进行对比实验,模拟有机污染物在光学表面沉积的特性.实验结果表明,石英晶体天平和微纳光纤测试有机物在光学表面沉积时响应一致,均可用于高功率激光驱动器有机污染物的在线监测;当污染物面密度大于0.5×10-5g/cm2时,微纳光纤传感器有较高精度和响应速度;有机污染物浓度越高,其更容易吸附沉积在光学元件表面.     

超声波加工盲孔的研究

本文以超声波加工机对玻璃等硬脆材料元件的加工工艺为主要研究对象,阐述了超声波加工的原理、变幅杆和刀具的设计以及加工工艺的研究,并将它应用在空间光学系统中光学元件的轻量化的加工。同时对加工后的表面微观特性——表面微裂纹和表面微应力进行具体测试分析,以解决在复杂的空间环境中元件的表面质量对使用精度和应力变形的影响,从而提出适于大型光学元件轻量化的工艺技术方法。     

光学亚表面损伤的探测和后处理技术

光学元件的损伤问题已成为高功率固体激光装置研制的核心问题，而紫外的损伤尤为严重。光学元件的激光损伤与能吸收能量的多种缺陷有关，例如：表面污染、表面擦伤和材料本体的缺陷(气泡或所含杂质)等。研究工作拟从光学元件的亚表面损伤人手，探测不同的光学制造工艺造成的特征亚表面缺陷，研究这些缺陷对激光损伤研制的影响。建立亚表面缺陷化学后处理装置，减少或消除亚表面缺陷所引起激光损伤的程度，为光学元件制造工艺选型提供必要的依据。     

表面颗粒污染物诱导薄光学元件初始损伤的机理

基于光传输理论研究了前表面颗粒污染物诱导薄光学元件产生初始损伤的原因,提出了颗粒遮光效应和颗粒造成的光学元件局部热变形两者共同作用对光束进行扰动的损伤机理.研究结果表明:对于高功率激光光束,薄光学元件局部热变形对光束的扰动是产生较高光强调制的重要原因;随着激光脉冲发射次数的增加,局部热变形的表面形状、位相延迟幅度、热扩散长度不断变化,会在光学元件内不同厚度处和后表面xy方向上的不同位置处产生较高的光强调制,不仅容易引起后表面产生多个损伤点,也可能在光学元件内就产生损伤,并且在厚度方向上的损伤点是分散的.     

用激光清洗金膜表面硅油污染物

采用CO2激光对镀金K9玻璃表面的二甲基硅油污染物进行清洗,在激光器单点作用模式下,分别研究了激光功率和作用时间对清洗效果的影响;并研究了连续扫描工作模式下的激光清洗效果。采用光学显微镜和傅里叶变换红外光谱仪表征激光清洗效果,研究结果表明:通过良好的控制激光参数,采用CO2激光清洗二甲基硅油具有明显的效果;此种非接触式清洗方式可确保K9玻璃表面的金膜完好无损。采用有限元分析软件模拟计算了激光功率和作用时间对清洗过程中温度的影响,计算结果与实验结果规律一致。     

同步辐射活化氧清洗碳污染的研究

利用自行设计的实验装置,研究了同步辐射光活化氧对光学元件表面碳污染的清洗作用。清洗前样品的碳层厚度为10.3 nm,同步辐射光被引入实验用真空室内,真空室内干燥氧气的压强维持在1.0 Pa,研究显示同步辐射活化氧能有效地清除硅片表面的石墨型碳层。通过测试清洗前后碳膜的反射率和使用IMD软件对清洗后硅片反射率的拟合,可得碳层的去除率为1.75 nm/h。     

熔石英表面铜膜污染物诱导损伤实验研究

 在熔石英元件表面溅射一层厚度小于10 nm的金属铜膜污染物,并测试元件的透过率。测试355 nm熔石英元件的激光损伤阈值,并用光学显微镜观测损伤形态。实验结果表明：污染后的熔石英元件的损伤阈值降低20%左右,元件表面的金属污染物薄膜经强激光辐照,在熔石英表面形成很多坑状微损伤,分布不均的热应力导致表面起伏,并有明显的烧蚀现象,导致基底损伤阈值下降。建立的光吸收和热沉积传输模型初步解释污染物膜层导致熔石英元件损伤的机理。     

玻璃质光学元件表面微裂纹的研究

研究了影响玻璃质光学元件表面质量的主要因素,认为表面微裂纹是表面强度改变的主要原因。用机械磨削初成形工艺方法分析研究了表面微裂纹产生的原因;通过裂纹尖端应力集中及Griffith能量平衡理论,分析了裂纹扩展方式;结合表面结构缺陷理论及研磨处理表面微缺陷工艺,阐述了HF腐蚀法对微裂纹的去除机理及效果;最后,综述了通过生产工艺提高玻璃强度的方法,重点讨论了离子交换法,镀膜法和HF腐蚀法等表面处理技术,指出使用HF腐蚀法去除表面微裂纹更适用于玻璃质光学元件的表面加工。     

CF_4/Ar/O_2等离子体对熔石英元件的修饰工艺

采用感应耦合等离子体刻蚀技术,以CF4/Ar/O2为反应气体对熔石英元件表面进行修饰,研究并分析了CF4和Ar流量对刻蚀速率、熔石英表面粗糙度和微观形貌的影响。结果表明,CF4化学刻蚀与Ar的物理轰击对熔石英样品表面修饰效果存在一定竞争关系,当它们达到平衡时表面粗糙度最小。通过对不同流量气体刻蚀过后熔石英表面粗糙度和光学显微形貌分析获得了较为理想的气流量配比,该研究为反应等离子体修饰熔石英光学元件以获得较高光学性能提供工艺参考。     

高功率激光装置大口径光学元件侧面清洗实验

针对高功率激光装置内部最易产生受激布里渊散射(SBS)效应的大口径取样光栅(BSG)元件,测试了经过化学刻蚀、紫外激光清洗作用处理后,大口径光学元件BSG侧面在355 nm激光辐照下的损伤阈值、损伤形态以及产生的石英颗粒气溶胶对环境污染程度的分析。结果表明:经过化学刻蚀,BSG侧面的损伤阈值提高78%,基本与通光面的损伤阈值相当,而经过紫外激光处理后的损伤阈值提升不高,仅为通光面损伤阈值的56%。侧面对比分析了相同激光能量辐照下样片侧面产生的气溶胶污染状况,结果表明紫外激光处理同样可以提高光学元件侧面产生污染物的阈值,且对光学元件性能没有影响。通过微观形貌和对通光口径影响分析表明,紫外激光清洗处理比化学刻蚀具有更好的安全性和适用性。     

X‐ray photoelectron spectroscopy process optimization for characterization of trace contamination elements for extreme ultraviolet resist outgassing study

X‐ray photoelectron spectroscopy (XPS) is used for elemental identification and quantification in a number of fields, and the optimization of XPS performance can help in making better use of the limited XPS tool availability. In the field of extreme ultraviolet (EUV) lithography, one of the requirements is having a clean vacuum environment to minimize contamination of the EUV optics. EUV resist outgassing is viewed as one of the main issues that could affect the vacuum environment. There is a program underway to measure the relative contamination rates from different resists following the ASML (provider of lithography systems) approved protocols for witness plate testing. One of the key steps is the XPS measurement of residue on the optics after cleaning. The role of XPS in quantification of species that adhere to the ruthenium‐coated silicon witness plate sample is discussed. The various XPS tool parameters like the pass energy and source setting were optimized for our application of witness plate analysis. The statistics of our XPS tool were studied, and combined with the fundamental XPS equations, a simple mathematical model was developed to optimize the number of scans for the various elements of interest in our witness plate study. Using the optimized number of scans, the acquisition time to measure the contaminant elements to a precision better than 0.1 at.% was minimized. The model devised in the paper can be adapted to other XPS measurements requiring different levels of precision. Copyright © 2013 John Wiley & Sons, Ltd.     

Characterization,optimization and surface physics aspects of in situ plasma mirror cleaning

Although the graphitic carbon contamination of synchrotron beamline optics has been an obvious problem for several decades, the basic mechanisms underlying the contamination process as well as the cleaning/remediation strategies are not understood and the corresponding cleaning procedures are still under development. In this study an analysis of remediation strategies all based on in situ low‐pressure RF plasma cleaning approaches is reported, including a quantitative determination of the optimum process parameters and their influence on the chemistry as well as the morphology of optical test surfaces. It appears that optimum results are obtained for a specific pressure range as well as for specific combinations of the plasma feedstock gases, the latter depending on the chemical aspects of the optical surfaces to be cleaned.     

浅谈印制电路板的一种清洗工艺

焊接是电子设备的生产中的重要步骤,焊接后必须进行清洗才能保证电子设备的可靠性、电气指标和工作寿命。鉴于军工产品必须要清洗,所以清洗工艺对于军工产品尤为重要。文中介绍了清洗的重要性,讨论了印制电路板污染物的种类和来源分析,提出了一种可靠的清洗工艺——溶剂气相清洗。气相清洗通常被认为是去除零件上有机污垢的一种最有效的清洁方法,这种方法甚至能去除工业中遇到的最为顽固的污垢。在溶剂蒸气清洗机中清洁后的零件从机器中出来时是干燥的,而且表面无任何残留物。     

Laser cleaning of particle and grease contaminations on the surface of optics

In the high power laser facility, surface contaminations on the optics will worsen the laser beam quality and damage the optics. Particle and grease contaminations are two of the usual contaminations on the surface of optics. In this work, the 1064-nm laser induced plasma shockwave cleaning is utilized to remove SiO₂ particle contaminations on the K9 glass surface. The results indicate the removal ratio can reach above 95%. The effects of parameters (particle position, laser gap distance and laser energy) on the cleaning efficiency have been studied in the case of single pulse laser cleaning. In addition, CO₂ laser (10.6 μm) is utilized to remove the dimethylsilicone oil contaminations on the gold-coated K9 glass surface. The results show that CO₂ laser can effectively remove the dimethylsilicone oil by properly controlling the laser parameters. The cleaned area increases with the increased laser power or irradiation time when the other parameters are constant.     

In situ oxygen plasma cleaning of a PECVD source for hard disk overcoats

Reducing the thickness of the diamond-like carbon protective overcoat to a thickness of about 2–3 nm is one major key to increase the recording density of magnetic disk drives. Plasma-enhanced chemical vapor deposition (PECVD) deposited carbon layers have been shown to be denser and harder than those produced by conventional sputter deposition. One key problem of PECVD deposited carbon is the contamination of the carbon film by particles produced inside the carbon source after long-time operation. This particle production limits the runtime of the source drastically. To avoid this particle generation the source was cleaned by an intermittent in situ oxygen plasma process. The cleaning efficiency was investigated by recording the pressure change inside the source during the cleaning process caused by the CO production. The ratio of the cleaning time and the deposition time shows no significant dependence on the deposition time. An almost linear increase of the ratio with the acetylene flow was observed. This results from a higher deposition rate at higher acetylene flow, leading to a higher contamination inside the source. A strong dependence of the cleaning rate on the oxygen flow in the cleaning process was measured. More oxygen leads to a strong decrease of the needed cleaning time. Adding Ar gas to the oxygen discharge shows no improvement of the needed cleaning time. The cleaning process seems to be dependent only on the amount of reactive oxygen species in the discharge . PACS 62.20.Qp; 52.50.Dg; 52.77.Bm; 52.80.Pi     

HF酸腐蚀提高K9基板损伤阈值

针对K9玻璃基板的HF酸化学腐蚀工艺开展研究,标定了40%和2%高低两种体积分数的HF酸的腐蚀速率;分析了基板表面形貌随腐蚀深度的变化规律;研究了腐蚀时间、HF酸体积分数、超声波工艺对激光损伤阈值的影响,提出了能够有效减少损伤敏感的氟硅盐沉淀、提高损伤阈值的优化腐蚀清洗工艺流程。采用优化的腐蚀清洗工艺流程进行了实验验证,结果表明用体积分数为2%的HF酸在高温和超声波条件下腐蚀90s后,测得1064nm波长激光作用下K9基板抗激光损伤阈值提高了75%。     

Physical and chemical effects of acoustic cavitation in selected ultrasonic cleaning applications

Acoustic cavitation in a liquid medium generates several physical and chemical effects. The oscillation and collapse of cavitation bubbles, driven at low ultrasonic frequencies (e.g., 20 kHz), can generate strong shear forces, microjets, microstreaming and shockwaves. Such strong physical forces have been used in cleaning and flux improvement of ultrafiltration processes. These physical effects have also been shown to deactivate pathogens. The efficiency of deactivation of pathogens is not only dependent on ultrasonic experimental parameters, but also on the properties of the pathogens themselves. Bacteria with thick shell wall are found to be resistant to ultrasonic deactivation process. Some evidence does suggest that the chemical effects (radicals) of acoustic cavitation are also effective in deactivating pathogens. Another aspect of cleaning, namely, purification of water contaminated with organic and inorganic pollutants, has also been discussed in detail. Strong oxidising agents produced within acoustic cavitation bubbles could be used to degrade organic pollutants and convert toxic inorganic pollutants to less harmful substances. The effect of ultrasonic frequency and surface activity of solutes on the sonochemical degradation efficiency has also been discussed in this overview.     

大功率电子加速器光学性能的研究

利用在SC程序基础上的改进程序对一种工业用大功率电子加速器的光学系统性能进行了研究.经过优化计算并给出了计算结果.     

Influence of surface conditions on thermal positron reemission spectra from W(100)

Our measurements trace the temporal dependence of positron reemission spectral features, namely, the reemission intensity, energy and angular distributions with post-cleaning time and oxygen exposure. The unwanted inelastic component in the reemission spectra can be kept at less than 6 % of the total reemitted positrons during long and continuous operation by simply ensuring the cleanliness of the sample with better vacuum level. Simultaneously the other optimized spectral features of the beam can be maintained except for the reemission spectral intensity which decreased with increasing time after cleaning. Even though oxygen at high temperature is used normally in the cleaning process of the tungsten moderators, exposure of the sample to oxygen at room temperature caused an exponential reduction in the reemission yield with exposure time.