锆离子注入锆-4合金缺陷的慢正电子研究

采用慢正电子束多普勒展宽谱研究了Zr离子注入Zr-4合金产生的缺陷及其退火回复行为，发现经过大于离子注入剂量为1×10¹⁶cm^-2的样品所产生的缺陷在注入过程中已经回复，而对剂量为1×10¹⁵cm^-2样品做300℃退火处理，其缺陷基本回复，得出合金缺陷回复能较低的结论. 考虑到材料的缺陷含量越高，其抗腐蚀性能越差，在辐照环境下通过给材料保持一定温度，即可使其缺陷得到较好回复，从而提高材料的抗腐蚀性能.     

单晶YSZ的Xe+辐照损伤的电子显微分析

 不同注量200keV Xe⁺ 注入YSZ单晶样品的电子显微分析结果表明，随着辐照注量的增加，缺陷簇的密度增大，在1×10¹⁵~1×10¹⁶cm^-2Xe⁺注量，缺陷簇密度迅速增大，形成间隙型位错环；当Xe⁺注量增大到1×10¹⁷cm^-2，缺陷簇密度的增加变得缓慢，并且有直径为2～4nm的Xe气泡析出。选区电子衍射花样表明YSZ样品没有产生非晶化转变。在Xe⁺辐照的离位率高达约350dpa的情况下，YSZ晶体没有非晶化，其原因主要是由于注入的Xe⁺以气泡形式析出。     

离子辐照产生的空位型缺陷对Si中B原子热扩散的影响

使用二次离子质谱仪分析了附加的空位型缺陷对单晶Si中注入B原子热扩散的影响. Si中B原子是通过30keV B离子室温注入而引入的, 注入剂量为2×10¹⁴cm^－2. Si中附加的空位型缺陷通过两种方式产生: 一是采用40或160keV He离子注入单晶Si到剂量5×10¹⁶cm^－2,并经800°C退火1h; 二是采用0.5MeV F或O离子辐照单晶Si到剂量5×10¹⁵cm^－2.结果显示, 不同方式产生的附加的空位型缺陷均能抑制注入的B原子在随后热激活退火中发生瞬间增强扩散效应, 并且抑制的效果依赖于离子的种类和离子的能量. 结合透射电子显微镜和卢瑟福背散射分析结果对以上抑制效应进行了定性的讨论.     

采用EPR谱和TEM对YSZ单晶辐照损伤的研究

 利用电子顺磁共振(EPR)谱和透射电子显微镜(TEM)研究了YSZ单晶的辐照效应。200 keV的Xe和400 keV的Cs离子注入［111］取向的YSZ单晶中，注量均为5×10¹⁶ cm^-2。EPR结果表明辐照产生了共振吸收位置g‖=1.989 和 g⊥=1.869、对称轴为［111］的六配位Zr³⁺顺磁缺陷。Cs辐照产生了比Xe 离子辐照多约150倍的六配位Zr³⁺顺磁缺陷。两种样品的剖面电子显微分析表明没有发现非晶化转变，但是Cs离子辐照的样品在损伤集中区域产生了密度较高的缺陷。因此，EPR谱和电子显微观察均说明在相同离位损伤(约160 dpa)的情况下，Cs离子辐照比Xe 离子辐照产生了更多的缺陷。造成这一现象的原因是Cs离子是化学活性的而Xe 离子却是惰性的。     

退火对He注入及随后208Pb27+辐照的Al2O3单晶PL谱的影响

利用高能离子研究了110 keV 的He⁺注入Al₂O₃单晶及随后230 MeV的²⁰⁸Pb²⁷⁺辐照并在不同温度条件下退火样品的光致发光的特性. 从测试结果可以清楚地看到在375 nm，390 nm，413 nm 和450 nm 出现了强烈的发光峰. 经过600 K退火2 h后测试结果显示，390 nm发光峰增强剧烈，而别的发光峰显示不明显. 在900 K退火条件下，390 nm的发光峰开始减弱相反在510 nm出现了较强的发光峰，到1100 K退火完毕后390 nm的发光峰完全消失，而510 nm的发光峰相对增强. 从辐照样品的FTIR谱中看到，波数在460—510 cm^-1间的吸收是振动模式，经过离子辐照后，吸收带展宽，随着辐照量的增大，Al₂O₃振动吸收峰消失，说明Al₂O₃振动模式被完全破坏. 1000—1300 cm^-1之间为Al-O-Al桥氧的伸缩振动模式，辐照后吸收带向高波数方向移动. 退火后的FTIR谱变化不大.     

单晶YSZ的Xe+离子辐照效应研究

 200keV Xe⁺离子辐照使单晶YSZ由无色透明变成紫色透明，结果表明，能量为200keV，注量为1×10¹⁷cm^-22的Xe⁺离子辐照YSZ单晶产生的损伤高达350dpa，在损伤区产生高密度的缺陷，但仍然没有发生非晶化转变。吸收光谱测试结果表明，产生吸收带的注量阈值大约为10¹⁶cm^-2。注量为1×10¹⁶cm^-2和1×10¹⁷cm^-2的样品，吸收带峰值分别位于522nm和497nm。光吸收带可能与Zr阳离子最近邻的氧空位捕获电子形成的F型色心和Y阳离子近邻的氧离子捕获空穴形成的V型色心有关。     

辐照诱发中间相Zr(Cr,Fe)2非晶化的原位电子显微研究

 在美国Argonne国家实验室连接有IVEM-Tandem National Facility加速器的Hitatch3000电子显微镜上，通过能量600keV及注量率为2.5×10¹²cm^-2·s^-1的Ne离子原位辐照,研究了锆-4合金中沉淀相hcp Zr(Cr,Fe)₂的重离子辐照效应，结果表明：600keV的Ne离子在350℃原位辐照至0.2dpa时，hcp-Zr(Cr,Fe)₂沉淀相的层错条纹开始消失；0.8dpa时沉淀相的电子衍射斑点大部分消失，发生明显的化学无序；2.7dpa时明场像衬度完全消失，非晶环已非常明显，表明沉淀相已经非晶化。600keV的Ne离子在350℃辐照hcp-Zr(Cr,Fe)₂相非晶化的临界损伤离位率约为2.7dpa。     

Si离子注入和H等离子体处理对单晶Si中空腔生长的影响研究

室温下首先采用160keVHe离子注入单晶Si样品到剂量5×10¹⁶ions/cm²,部分样品再接受80keVSi离子辐照到较高的剂量5×10¹⁵ions/cm²或接受高密度H等离子体处理.应用透射电镜观测分析了800℃高温退火引起的空腔的形成形貌.结果表明,附加Si离子辐照或H等离子体处理会影响Si中空腔的生长.就Si离子附加辐照而言,由于辐照引入富余的间隙子型缺陷,因此,它会抑制空腔的生长,而高密度H等离子体处理则有助于空腔的生长.定性地讨论了实验结果.     

Ar离子辐照非晶态合金引起的尺寸变化

利用兰州重离子加速器(HIRFL)提供的2.79MeV/u Ar离子,在50K以下的低温辐照了Fe₄₇Ni₂₉V₂Si₆B₁₆等4种非晶态合金样品,室温下使用光学显微镜对辐照前、后的同一样品拍照,对比测量了样品的宏观尺寸. 结果表明:在辐照剂量为1.5×10¹⁴离子/cm²时,非晶态合金形变不明显,测量到的样品宽度相对增长Δb/b₀均小于1.0%;当辐照剂量增加到1.6×10¹⁵离子/cm²时,所有非晶态合金样品都发生了显著的形变,其宽度相对增长分布在4.3%—12.0%之间,对此结果进行了定性的分析.     

FTIR研究快中子辐照直拉硅中的VO2

快中子辐照直拉硅(CZ-Si)经400—450℃热处理后，空位_双氧复合体(VO₂)是其 主要 的缺陷.在300—500℃热处理快中子辐照的CZ_Si后，IR光谱中有919．6cm^-1和 1006cm^-1两个吸收峰伴随VO₂(889cm^-1)出现，这两个IR吸收 峰是VO₂的一种亚稳态缺陷(O-V-O)引起的，此缺陷态是由一个VO(A中心)与次临近的一个 间隙氧原子(O_i)相互作用所形成的.在300℃延长退火时间或升高退火温度，都 会使(O -V-O)转变为稳态VO₂.辐照剂量在10¹⁹数量级，经400—450℃热处 理所形成的缺陷主要为多空位型，而VO₂被抑制.     

Effect of implantation temperature on the blistering behavior of hydrogen implanted GaN

GaN epitaxial layers were implanted by 100 keV H⁺ ions at different implantation temperatures (LN₂, RT and 300 °C) with a fluence of 2.5×10¹⁷ cm^?2. The implanted samples were characterized using Nomarski optical microscopy, AFM, XRD, and TEM. Topographical investigations of the implanted surface revealed the formation of surface blistering in the as-implanted samples at 300 °C and after annealing at higher temperature for the implantation at LN₂ and RT. The physical dimensions of the surface blisters/craters were dependent on the implantation temperature. XRD showed the dependence of damage-induced stress on the implantation temperature with higher stress for the implantation at 300 °C. TEM investigations revealed the formation of a damage band in all the cases. The damage band was filled with large area microcracks for the implantation at 300 °C, which were responsible for the as-implanted surface blistering.     

Effects of discharge current and voltage on the high density of metastable helium atoms

Both hollow-cathode and Penning-type discharges were adopted to excite helium atoms to a metastable state. Experimental data indicate that Penning discharge is more suitable for generating high fractions of metastables in a low-density helium beam for laser-induced fluorescence technique in measuring electric fields at the edge of a plasma. The metastable density increases with increasing helium gas pressure in the range of 1.33×10^{-2}－66.7Pa. The highest metastable density of 3.8×10^{16}m^{-3} is observed at a static gas pressure of 66.7Pa. An approximately linear relationship between the density of metastable helium atoms and the plasma discharge current is observed. Magnetic field plays a very important role in producing a high density of metastable atoms in Penning discharge.     

离子注入形成SOI结构的界面及埋层的俄歇能谱研究

本文中研究了O⁺(200keV,1.8×10¹⁸/cm²)和N⁺(190keV,1.8×10¹⁸/cm²)注入Si形成SOI(Silicon on Insulator)结构的界面及埋层的化学组成。俄歇能谱的测量和研究结果表明:注O⁺的SOI结构在经1300℃,5h退火后,其表层Si和氧化硅埋层的界面存在一个不饱和氧化硅状态,氧化硅埋层是由SiO₂相和这不饱和氧化硅态组成,而且氧化硅埋层和体硅界面不同于表层Si和氧化硅埋层界面;注N⁺的SOI结构在经1200℃,2h退火后,其氮化硅埋层中存在一个富N的疏松夹层,表层Si和氮化硅埋层界面与氮化硅埋层和体硅界面性质亦不同。这些结果与红外吸收和透射电子显微镜及离子背散射谱的分析结果相一致。还对两种SOI结构界面与埋层的不同特征的原因进行了分析讨论。 关键词：     

用于ICF靶的空心玻璃微球的干凝胶法制备

 为用干凝胶法制备用于ICF靶的空心玻璃微球（HGM），研究了载气组份、温度和压力对成球过程和HGM品质的影响，优化了制备工艺参数。结果表明：提高载气中氦气的含量，有利于增加干凝胶粒子的成球率和HGM的纵横比；适当提高载气中氩气的含量，有利于提高HGM的表面质量。降低载气压力可以提高HGM的纵横比；升高载气温度可以提高干凝胶粒子成球率和HGM品质。当载气中氦气的体积分数在50%~80%，载气压力在(0.75~1.00)×10⁵ Pa，载气温度在1 500~1 650 ℃时，干凝胶粒子的成球率较高，HGM的球形度、同心度和表面光洁度较好。制备得到了直径100~500 μm、壁厚0.5~3.0 μm的HGM，其耐压强度、抗大气侵蚀性能和表面粗糙度等指标均满足ICF物理实验要求。     

N+ Implantation-Induced Surface Hardening of Poly (Allyl Diglycol Carbonate) Polymer

The effect of 100 keV N⁺ ions implantation on the surface structure and hardness of poly (allyl diglycol carbonate) (CR-39) polymer was studied. The surface hardness of virgin and implanted CR-39 specimens was determined using a Knoop microhardness test. The surface hardness was found to be enhanced after implantation, e.g., becoming eight times higher at a load of 9.8 mN, for a dose of 2 × 10¹⁶ ions cm^?2. The change in bonding and surface structure of the CR-39 polymer due to implantation was studied using the specular reflectance Fourier transform infrared (FTIR) technique. The disordering produced in the implanted matrix was estimated using the Urbach edge method from the UV-Visible absorption spectra. The relationship of surface hardening with the chemical and structural changes was explored     

Cavities in silicon investigated with the PAC-probe 111In

The perturbed angular correlation technique (PAC) was used to study the creation and development of He-induced cavities. In order to investigate the interaction of Indium atoms with cavities in Silicon the Bonn isotope separator was used to implant overlapping profiles of He (10 keV) and radioactive ¹¹¹In (160 keV) into undoped FZ-silicon. To get insight into the cavity formation mechanism samples were prepared with various He-doses (0.6, 2 and 6× 10¹⁶ ions/cm²). The samples were measured directly after implantation and after different annealing steps (t_hold= 10 min, T = 500–1100oC). Further, different implantation and annealing sequences were used. At higher He doses (2 and 6× 10¹⁶ ions/cm²) we find a large fraction of ¹¹¹In probe atoms subjected to an electric field gradient (EFG) corresponding to a quadrupole interaction frequency (QIF) of ν_Q= 411(6) MHz with η= 0.25(4). The corresponding defect configuration is formed most effectively after He implantation into annealed, ¹¹¹In doped Si. This and the affinity of In to vacancies leads us to the assumption that, similarly to the situation in metals, the Indium atoms act as nucleation centres for vacancy clusters (cavities) and are situated on the inner walls of the cavities. This revised version was published online in August 2006 with corrections to the Cover Date.     

Effect of bombardment with iron ions on the evolution of helium,hydrogen, and deuterium blisters in silicon

The effect of bombardment with iron ions on the evolution of gas porosity in silicon single crystals has been studied. Gas porosity has been produced by implantation hydrogen, deuterium, and helium ions with energies of 17, 12.5, and 20 keV, respectively, in identical doses of 1 × 10¹⁷ cm^–2 at room temperature. For such energy of bombarding ions, the ion doping profiles have been formed at the same distance from the irradiated surface of the sample. Then, the samples have been bombarded with iron Fe¹⁰⁺ ions with energy of 150 keV in a dose of 5.9 × 10¹⁴ cm^–2. Then 30-min isochoric annealing has been carried out with an interval of 50°C in the temperature range of 250–900°C. The samples have been analyzed using optical and electron microscopes. An extremely strong synergetic effect of sequential bombardment of silicon single crystals with gas ions and iron ions at room temperature on the nucleation and growth of gas porosity during postradiation annealing has been observed. For example, it has been shown that the amorphous layer formed in silicon by additional bombardment with iron ions stimulates the evolution of helium blisters, slightly retards the evolution of hydrogen blisters, and completely suppresses the evolution of deuterium blisters. The results of experiments do not provide an adequate explanation of the reason for this difference; additional targeted experiments are required.     

氧分压对Cu-NiFe_2O_4金属陶瓷相成份的影响

用高温固相法合成的NiFe2O4陶瓷粉末,选取Cu为金属陶瓷的金属相成分,研究了氧分压对Cu-NiFe2O4金属陶瓷的相成份的影响,结果表明:当烧结温度为1150℃,氧分压大于2.23Pa时,Cu被大量氧化;氧分压小于4.2×10-3Pa时,Cu和离解的Ni反应生产Cu3.8Ni合金,试样的导电性或抗氧化性都会降低,1150℃下烧结制备Cu-NiFe2O4金属陶瓷的最佳氧分压是(0.3-42.0)×10-2Pa。     

Effect of simultaneous helium implantation on the microstructure evolution of Inconel X-750 superalloy during dual-beam irradiation

This study focuses on investigation into the effect of helium implantation on microstructure evolution in Inconel X-750 superalloy during dual-beam (Ni⁺/He⁺) irradiation. The 1 MeV Ni⁺ ions with the damage rate of 10^?3 dpa/s as well as 15 keV He⁺ ions using rate of 200 appm/dpa were simultaneously employed to irradiate specimens at 400 °C to different doses. Microstructure characterization has been conducted using high-resolution analytical transmission electron microscopy (TEM). The TEM results show that simultaneous helium injection has significant influence on irradiation-induced microstructural changes. The disordering of γ′ (Ni₃ (Al, Ti)) precipitates shows noticeable delay in dose level compared to mono heavy ion irradiation, which is attributed to the effect of helium on promoting the dynamic reordering process. In contrast to previous studies on single-beam ion irradiation, in which no cavities were reported even at high doses, very small (2–5 nm) cavities were detected after irradiation to 5 dpa, which proved that helium plays crucial role in cavity formation. TEM characterization also indicates that the helium implantation affects the development of dislocation loops during irradiation. Large 1/3 〈1?1?1〉 Frank loops in the size of 10–20 nm developed during irradiation at 400 °C, whereas similar big loops detected at higher irradiation temperature (500 °C) during sole ion irradiation. This implies that the effect of helium on trapping the vacancies can help to develop the interstitial Frank loops at lower irradiation temperatures.     

稀土离子注入的ZnS各种颜色发光二极管

ZnS单晶注入一种或两种稀土离子来制备发光二极管。本文研究了发光亮度与注入剂量的关系,发光亮度与电流的关系和发光亮度与温度的关系等。同时记录了电致发光和阴极射线发射光谱。选取两种不同的稀土离子注入到同一晶面,由于它们的比例不同,发光颜色可从一种稀土离子单独发光的颜色连续地改变到另一种颜色。