A statistical approach to determine process parameter impact in Nd:YAG laser drilling of IN718 and Ti-6Al-4V sheets

The numerous unique advantages afforded by pulsed Nd:YAG laser systems have led to their increasing utility for producing high aspect ratio holes in a wide range of materials. Notwithstanding the growing industrial acceptance of the technique, the increasingly tighter geometrical tolerances and more stringent hole quality requirements of modern industrial components demand that “defects” such as taper, recast, spatter etc., in laser-drilled holes are minimized. Process parameters like pulse energy, pulse repetition rate, pulse duration, focal position, nozzle standoff, type of gas and gas pressure of the assist gas are known to significantly influence hole quality during laser drilling. The present study reports the use of Taguchi design of experiments technique to study the effects of the above process variables on the quality of the drilled holes and ascertain optimum processing conditions. Minimum taper in the drilled hole was considered as the desired target response. The entire study was conducted in three phases:(a) screening experiments, to identify process variables that critically influence taper in laser drilled holes, (b) Optimization experiments, to ascertain the set of parameters that would yield minimum taper and (c) validation trials, to assess the validity of the experimental procedures and results. Results indicate that laser drilling with focal position on the surface of the material being drilled and employing low level values of pulse duration and pulse energy represents the ideal conditions to achieve minimum taper in laser-drilled holes. Thorough assessment of results also reveals that the laser-drilling process, optimized considering taper in the drilled hole as the target response, leads to very significant improvements in respect of other hole quality attributes of interest such as spatter and recast as well.     

Investigation of a novel hybrid process of laser drilling assisted with jet electrochemical machining

Recast layer and spatter are two inherent defects commonly associated with holes produced with laser drilling. This paper reports a novel hybrid process of laser drilling assisted with jet electrochemical machining (JECM-LD) that aims to minimize such defects and improve the quality of laser-drilled holes. The process based on the application of a jet electrolyte, being aligned coaxially with the focused laser beam, on the workpiece surface during laser drilling. The effect of the jet electrolyte mainly is an electrochemical reaction with materials. The jet electrolyte also cools the workpiece and transports debris during the process. On the basis of a measurement of laser attenuation in electrolyte, an experimental apparatus system is made and JECM-LD experiments have been performed on 0.5-mm-thick 321S20 stainless steel with two lasers at wavelength of 1064 and 532 nm. It is shown that recast layer and spatter have been effectively reduced during the JECM-LD compared with laser drilling in ambient atmosphere conditions.     

A novel anti-spatter and anti-crack laser drilling technique: application to ceramics

This work reports a novel anti-spatter and anti-crack ceramic laser drilling method based on the gelcasting technique. A Nd:YAG solid state laser was used to drill micro-holes directly on a gelcast green alumina body. The results reveal that the irregular spatter at the periphery of the hole inherent to traditional laser drilling methods can be effectively prevented by direct drilling of the gelcast green body. Much more regular hole shapes without microcracks were also successfully obtained. Received: 02 October 2002 / Accepted: 07 October 2002 / Published online: 22 January 2003 RID="*" ID="*"Corresponding author. Fax: +86-10-62771160, E-mail: caikai99@mails.tsinghua.edu.cn     

An investigation into melt flow dynamics during repetitive pulsed laser drilling of transparent media

This paper presents an investigation into the dynamics of repetitive pulsed laser drilling of a visually transparent media using a CO₂ laser source. This enabled the use of a high-speed imaging system for observing, in real time, the behaviour of the drilling process in the laser drilled cavity of 1.5 mm diameter holes of up to 18.5 mm in depth. The work revealed that the instantaneous drilling velocity within each laser pulse can vary considerably from the average drilling velocity as a result of the non-uniform temporal pulse shape and the oscillation of the melt ejection rate. During beam breakthrough, both upward and downward melt ejections were observed to occur inside the drilled hole for a short period of time, after which the material was ejected through the exit end of the holes. It has been shown in this work that the downward melt flow velocity increases with hole depth for a positively tapered hole (from 0.09 to 1.43 m/s) and decreases with hole depth for a negatively tapered hole geometry (from 0.4 to 0.1 m/s), as a result of the change in the assist gas velocity inside the drilled hole with respect to the hole taper geometry. The mechanisms of forming the positively and negatively tapered holes in the transparent media have been correlated with the hole geometry and melt flow velocity. The work has demonstrated a new method of studying the melt dynamics in laser drilling.     

A comprehensive study of the long pulse Nd:YAG laser drilling of multi-layer carbon fibre composites

The results of an extensive experimental study of the free running Nd:YAG laser drilling of a multi-layer carbon fibre composite, where adjacent layers have differently orientated fibres, are reported. For holes drilled with the laser operating in fixed-Q mode at 1064 nm, parallel sections of blind holes illustrating discontinuities in the hole size along a given section direction will be shown to occur at the interface between adjacent layers. An explanation for this effect is proposed. Detailed single pulse drilling characteristics will be presented illustrating the exit hole diameter as a function of pulse energy and material thickness. These characteristics illustrate a ‘stable' drilling regime in which the exit hole diameters are least sensitive to changes in pulse energy or material thickness and a less ‘stable' regime in which they are more strongly dependent on these parameters. Drilling characteristics will be given for two different beam qualities, illustrating the greater drilling depth and reduced hole size achievable with an improved beam quality. Finally holes drilled through a 2 mm thick sample of material with multiple pulses are considered. Size distribution curves for entrance and exit holes will be presented. The total energy required (number of pulses × pulse energy) to drill through 2 mm thick material will be reported as a function of pulse energy in stationary air and argon atmospheres and in a partial vacuum, illustrating a threshold energy which is dependent upon the drilling atmosphere. The threshold energies will be discussed with reference to plasma formation and the reactivity of the drilling atmosphere.     

高精度玻璃打孔技术

光学零件制造领域中,用传统的方法在微晶玻璃上加工高精度内孔存在很多困难,如钻孔时常出现椭圆、中心偏、锥形、爆边等问题。为了解决这些问题,利用简单的钻床和万能外圆磨床设备,在微晶玻璃上完成钻孔、扩孔、磨边加工后,得到了内孔尺寸精度为0.01mm、内孔与外圆同轴度为0.01mm的高精度圆孔。生产实践表明：该工艺重复性良好,加工性能稳定。不仅解决了玻璃钻孔常见问题,而且得到了高精度玻璃内孔。     

Formation and Characteristics of Through Holes with Picosecond-Laser Helical Drilling on Alloy Material

Precision drilling can improve the microhole quality by yielding a reduced recast layer thickness and no heat-affected zone. We evaluate the quality of the helical drilled holes, e.g., the recast layer, microcracks, and circularity by scanning electron microscopy. We investigate the overlap rate of the laser beam and find its influence on the efficiency of through-hole machining. The microhole entrance, exit, and side walls are smooth, without an accumulation of spattering material and the formation of a recast layer and microcracks. Optimum parameters for drilling through holes on alloy material GH2132 are a thickness of 500 μm, a laser fluence of 3.06 · 10^?2 J/mm², a pulse repetition rate of 100 kHz, and a helical speed of 60 rev/s. The tapering phenomenon can be avoided by using a helical system with a rotating stage, and the hole circularity is fairly good. Picosecond laser helical drilling can be effective for manufacturing microholes with a high quality. The development of high-power picosecond laser would promote picosecond laser drilling with future industrial relevance.     

不同脉冲激光波形在打孔实验上的比较与分析

为了获得高质量小孔,克服单脉冲激光打孔的不足,设计了一种能够产生多脉冲激光波形的激光器电源.并在1mm厚的薄钢片上得到直径小于1mm的小孔.多脉冲打孔理论分析表明,多脉冲激光打孔不但减少了熔融物和等离子体的产生,而且降低了激光打孔对高能量的要求,获得的小孔质量优于单脉冲激光打孔.另外脉冲宽度和脉冲间距的选择对激光小孔加工质量起决定性作用,在加工高质量孔的时候,应该选用较短的激光脉冲宽度.实验表明,利用三脉冲激光输出波形打孔所获得的小孔质量要优于单脉冲激光打孔效果,有效脉冲平均能量为350mJ,宽度为100μs,脉冲间距为100μs.     

Efficient submicron processing of metals with femtosecond UV pulses

The generation of submicron-sized holes on metal surfaces by applying femtosecond UV laser pulses was investigated. Different optical schemes based on a Schwarzschild-type reflective objective were used to reach optimized ablation quality and efficiency in different applications (hole ablation, through-hole drilling, generation of surface patterns consisting of holes, etc.). Submicron-sized holes and hole patterns were ablated onto metal surfaces and drilled through ∼5-μm-thick steel foils with 600-nm diameter on the output side. Using a special optical interferometric method, large-area surface processing of high-conductivity materials in the submicron regime was performed. Combining these techniques with the application of high-repetition-rate ultra-short UV laser sources, large-area sub-μm processing of all kinds of materials in industrial environments is possible. Received: 28 February 2002 / Accepted: 12 March 2002 / Published online: 25 October 2002 RID="*" ID="*"Corresponding author. Fax: +49-551/503599, E-mail: psimon@llg.gwdg.de     

Analysis of surface and material modifications caused by laser drilling of AlN ceramics

For the laser drilling of aluminum nitride ceramic the processing results and the effects related to pulsed irradiation were investigated. Images of the drilled surface revealed regular, cylindrically shaped holes of about 100 μm in diameter independently of the laser wavelength (1064/532/355 or 266 nm). The holes were surrounded by circular heat-affected zones of larger diameter. A comparison of the elemental compositions of the original material and the processed one indicated a decrease of the nitrogen concentration in the affected area. The spectral analysis of the ablated material composition revealed the presence of ions and neutrals in dependence on the laser intensity applied. It was found that at intensity values close to the ablation threshold the ejected material consisted mainly of neutrals, while doubling of the intensity resulted in appearance of single-ionized Al species, which were also observed together with Al clusters in the mass spectra of the UV-excited plasma. Their prevailing content was revealed for drilling at higher intensities around 15 GW/cm² at 532 nm. Results of model calculations indicated, in agreement with the experiment, that at the threshold the ceramic decomposes into gaseous nitrogen and solid Al particulates, while at a higher fluence the material particles vaporize and influence the quality of drilling.     

Experimental and theoretical investigation of the drilling of alumina ceramic using Nd:YAG pulsed laser

Alumina ceramics have found wide range of applications from semiconductors, communication technologies, medical devices, automotive to aerospace industries. Processing of alumina ceramics is rather difficult due to its high degree of brittleness, hardness, low thermal diffusivity and conductivity. Rapid improvements in laser technologies in recent years make the laser among the most convenient processing tools for difficult-to-machine materials such as hardened metals, ceramics and composites. This is particularly evident as lasers have become an inexpensive and controllable alternative to conventional hole drilling methods. This paper reports theoretical and experimental results of drilling the alumina ceramic with thicknesses of 5 mm and 10.5 mm using milisecond pulsed Nd:YAG laser. Effects of the laser peak power, pulse duration, repetition rate and focal plane position have been determined using optical and Scanning Electron Microscopy (SEM) images taken from cross-sections of the drilled alumina ceramic samples. In addition to dimensional analysis of the samples, microstructural investigations have also been examined. It has been observed that, the depth of the crater can be controlled as a function of the peak power and the pulse duration for a single laser pulse application without any defect. Crater depth can be increased by increasing the number of laser pulses with some defects. In addition to experimental work, conditions have been simulated using ANYS FLUENT package providing results, which are in good agreement with the experimental results.     

Deep drilling on a silicon plate with a femtosecond laser: experiment and model analysis

The ablation rate when drilling fine holes having large aspect ratios in silicon substrates with femtosecond laser pulses was estimated from mechanically ground cross sections of the ablated holes. The ablation rate shows a dramatic change at the depth at which the laser pulse reaches a certain fluence, which is nearly constant when the initial laser fluence was varied from 14.5 to 59.4 J/cm². The ablation rate, threshold fluence, in three fluence domains, and the transition fluences at which the ablation rate shows a dramatic change, were derived. However, when a pulse energy of 200 μJ was used a much greater ablation rate was obtained, suggesting that another fluence domain for larger ablation rates exists. The experimentally obtained hole depths as a function of shot numbers were reproduced by a theoretical model, which incorporates laser pulse attenuation in the holes that is the same as that in waveguides for some attenuation coefficient and ablation rates for three fluence domains. PACS 42.62.-b; 42.65.Re; 78.40.Fy; 78.47.+p; 81.20.Wk     

Material effects in ultra-short pulse laser drilling of metals

Although hole drilling using ultra-short laser pulses has been shown to produce holes of excellent quality, we have observed that during the evolution of the hole, the morphology of the hole bottom has a dependence on fluence, number of shots, and polarization. We describe the nature of this structure within the hole and under what conditions it is observed.     

钛合金纳秒激光打孔数值模拟和实验研究

为了描述纳秒激光对钛合金打孔过程中孔的形貌及温度场的变化规律,建立激光打孔的物理模型,利用ANSYS中APDL语言进行编程,对温度场进行仿真分析,并利用单元生死技术模拟孔形貌的变化过程。从有限元数值模拟和实验两方面综合分析比较了激光工艺参数(脉冲能量和脉冲数量)对打孔质量(孔深和孔径)的影响,系统论述了钛合金纳秒激光打孔的一般规律,以达到工艺参数优化,提高打孔质量的目的。     

Shadowgraphic imaging of material removal during laser drilling with a long pulse excimer laser

After the development of a novel XeCl excimer laser with a nearly diffraction-limited beam and 175 ns pulse length, research was done on different industrial applications of this laser. Hole drilling, one of these applications, was studied extensively. A better understanding of the drilling process is necessary to optimise the drilling efficiency and to control the quality of the holes. A shadowgraphic imaging technique was used for studying the removal of material from the hole and the absorption of the laser beam by this removed material. Images were made at successive times both during and after the laser pulse.In drilling of thin foils, it was shown that the material was ejected mainly after the laser pulse. A comparison of different materials showed that the drilling process should be optimised for each material independently. Furthermore, the plume was found to be not fully transparent for processing materials with a strong absorption line at or near the laser wavelength. The correlation between material and drilling speed suggests improved energy transfer and improved melt ejection for the materials with this absorption. PACS 42.62.Cf; 52.38.Dx; 52.38.Mf     

Influence of microsupersonic gas jets on nanosecond laser percussion drilling

This paper reports on etching rates and hole quality for nanosecond laser percussion drilling of 200-μm thick 316L stainless steel performed with micro supersonic gas jets. The assist-gas jets were produced using nozzles of 200, 300 and 500 μm nominal throat diameters. Air and oxygen were used separately for the process gas in the drilling trials and the drilling performance was compared to drilling in ambient conditions. The highest etch rate of 1.2 μm per pulse was obtained in the ambient atmosphere condition, but this was reduced by about 50% with assist-air jets from the 200 μm nozzle. Increasing the jet diameter and/or using oxygen assist gas also decreased the etching rate and increased the hole diameter. The 200 μm nozzle using air-assist jets produced the least amount of recast and gave the best compromise for etching rate. A combination of plasma shielding and different gas dynamic conditions inside the holes and at the surface are correlated to the observations of different drilling rates and hole characteristics.     

An optodynamic method for the real-time determination of the depth of a laser-drilled hole

An experimental method for determining the real-time depth of laser-drilled holes is presented. The proposed method involves detecting the laser-induced optoacoustic waves generated during the interaction of the laser beam with the material. Our optodynamic study involved measuring the propagation times of these waves as they traveled through the material and analyzing their temporal behavior during the drilling process. The experimental observations revealed an exponential relationship between the propagation time of the longitudinal stress wave and the number of consecutive laser pulses. Received: 25 October 2001 / Accepted: 27 October 2001 / Published online: 20 December 2001     

The effect of laser peak power and pulse width on the hole geometry repeatability in laser percussion drilling

In this work, the two main factors that influence the repeatability of the laser percussion drilling process are identified. Experimental parametric analysis was carried out to correlate the laser parameters with the repeatability of a laser percussion drilling process. The experiment was conducted using a flash lamp pumped Nd:YAG laser to drill 2 mm thick mild steel sheets. The relationship between the percentage standard deviation (PSD) of entrance hole diameter, hole circularity and the operating parameters is established. Thirty-five holes were drilled and analysed for each set of identical laser parameters. The PSD of entrance hole diameter ranges between 1.47% and 4.78% for an operating window of 3.5–7 kW peak power, and 1–3 ms pulse width. The circularity of the entrance hole (defined as the ratio between the minimum and maximum diameters of the hole) ranges from 0.94 to 0.87, and is found to correlate with repeatability. The work shows that higher peak power, and shorter pulse width gives better hole geometry repeatability. The effect of melt ejection on hole geometry repeatability is also investigated. Melt ejection and spatter formation have been found to contribute to the poor repeatability of the process.     

Analysis of materials modifications caused by UV laser micro drilling of via holes in AlGaN/GaN transistors on SiC

Pulsed UV laser drilling can be applied to fabricate vertical electrical interconnects (vias) for AlGaN/GaN high electron mobility transistor devices on single-crystalline silicon carbide (SiC) substrate. Through-wafer micro holes with a diameter of 50-100 μm were formed in 400 μm thick bulk 4H-SiC by a frequency-tripled solid-state laser (355 nm) with a pulse width of ≤30 ns and a focal spot size of ∼15 μm. The impact of laser machining on the material system in the vicinity of micro holes was investigated by means of micro-Raman spectroscopy and transmission electron microscopy. After removing the loosely deposited debris by etching in buffered hydrofluoric acid, a layer of <4 μm resolidified material remains at the side walls of the holes. The thickness of the resolidified layer depends on the vertical distance to the hole entry as observed by scanning electron microscopy. Micro-Raman spectra indicate a change of internal strain due to laser drilling and evidence the formation of nanocrystalline silicon (Si). Microstructure analysis of the vias’ side walls using cross sectional TEM reveals altered degree of crystallinity in SiC. Layers of heavily disturbed SiC, and nanocrystalline Si are formed by laser irradiation. The layers are separated by 50-100 nm thick interface regions. No evidence of extended defects, micro cracking or crystal damage was found beneath the resolidified layer. The precision of UV laser micro ablation of SiC using nanosecond pulses is not limited by laser-induced extended crystal defects.     

Laser through-hole drilling and laser cutting in teflon

We report a novel technique for laser high-speed drilling and cutting in teflon films. The new laser drilling surpasses the conventional techniques in simplicity, throughput and spatial resolution. The laser cutting and drilling process consists of three simple steps. First, a thin absorbing layer (in this case 300 Å of gold) is deposited on the teflon to allow for laser absorption. Second, the drilling is performed by pulsed-laser irradiation at the rate of one hole per pulse. The irradiation process does not completely open the holes in which debris still remain. Third, the ultrasonic cleaning in water is used to remove the modified and weakly bound material inside the drilled holes, leaving behind 50 m diameter through holes in 25 m thick teflon sheets. The drilling process-window is well mapped. The cutting process is obtained by fast scanning the laser beam at laser powers above a threshold value. This new technique is desirable for packaging because of its drilling speed as high as 60 000 holes per minute, its fast cutting and its low laser equipment cost.