Competitive technologies of third generation infrared photon detectors

Hitherto, two families of multielement infrared (IR) detectors are used for principal military and civilian infrared applications; one is used for scanning systems (first generation) and the other is used for staring systems (second generation). Third generation systems are being developed nowadays. In the common understanding, third generation IR systems provide enhanced capabilities like larger number of pixels, higher frame rates, better thermal resolution as well as multicolour functionality and other on-chip functions. In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well IR photoconductors (QWIPs) are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. However, the metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an attractive to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm.     

硅基红外探测器的研究进展

由于易与读出电路集成在一起，硅基红外探测器成为一研究热点，文章评述了近年来取得较大进展的几种硅基红外探测器，主要包括非本征硅，GexSi1-x/Si异质结，PtSi及Si基HgCdTe红外探测器件，展望了硅基红外探测器的发展前景。     

Material considerations for third generation infrared photon detectors

In the paper, issues associated with the development and exploitation of materials used in fabrication of third generation infrared photon detectors are discussed. In this class of detectors two main competitors, HgCdTe photodiodes and quantum well photoconductors are considered. The performance figures of merit of state-of-the-art HgCdTe and QWIP focal plane arrays (FPAs) are similar because the main limitations come from the readout circuits. The metallurgical issues of the epitaxial layers such as uniformity and number of defected elements are the serious problems in the case of long wavelength infrared (LWIR) and very LWIR (VLWIR) HgCdTe FPAs. It is predicted that superlattice based InAs/GaInSb system grown on GaSb substrate seems to be an alternative to HgCdTe with good spatial uniformity and an ability to span cutoff wavelength from 3 to 25 μm. In this context the material properties of type II superlattices are considered more in detail.     

Assessment of HgCdTe photodiodes and quantum well infrared photoconductors for long wavelength focal plane arrays

Recent trends in infrared detectors are towards large, electronically addressed two-dimensional arrays. In the long wavelength infrared (LWIR) spectral range HgCdTe focal plane arrays (FPAs) occupy a dominant position. However, the slow progress in the development of large LWIR photovoltaic HgCdTe infrared imaging arrays and the rapid achievements of novel semiconductor heterostructure systems have made it necessary to foresee the future development of different material technologies in fabrication large FPAs. Among the competing technologies in LWIR are the quantum well infrared photoconductors (QWIPs) based on lattice matched GaAs/AlGaAs and strained layer InGaAs/AlGaAs material systems. This paper compares the technical merits of two IR detector arrays technologies; photovoltaic HgCdTe and QWIPs. It is clearly shown that LWIR QWIP cannot compete with HgCdTe photodiode as the single device especially at higher temperature operation (>70 K) due to fundamental limitations associated with intersubband transitions. However, the advantage of HgCdTe is less distinct in temperature range below 50 K due to problems involved in HgCdTe material (p-type doping, Shockley–Read recombination, trap-assisted tunnelling, surface and interface instabilities). Even though the QWIP is a photoconductor, several of its properties such as high impedance, fast response time, long integration time, and low power consumption, well satisfy the requirements of fabrication of large FPAs. Due to the high material quality at low temperature, QWIP has potential advantages over HgCdTe for very LWIR (VLWIR) FPA applications in terms of the array size, uniformity, yield and cost of the systems.     

HOT infrared photodetectors

At present, uncooled thermal detector focal plane arrays are successfully used in staring thermal imagers. However, the performance of thermal detectors is modest, they suffer from slow response and they are not very useful in applications requiring multispectral detection. Infrared (IR) photon detectors are typically operated at cryogenic temperatures to decrease the noise of the detector arising from various mechanisms associated with the narrow band gap. There are considerable efforts to decrease system cost, size, weight, and power consumption to increase the operating temperature in so-called high-operating-temperature (HOT) detectors. Initial efforts were concentrated on photoconductors and photoelectromagnetic detectors. Next, several ways to achieve HOT detector operation have been elaborated including non-equilibrium detector design with Auger suppression and optical immersion. Recently, a new strategies used to achieve HOT detectors include barrier structures such as nBn, material improvement to lower generation-recombination leakage mechanisms, alternate materials such as superlattices and cascade infrared devices. Another method to reduce detector’s dark current is reducing volume of detector material via a concept of photon trapping detector. In this paper, a number of concepts to improve performance of photon detectors operating at near room temperature are presented. Mostly three types of detector materials are considered — HgCdTe and InAsSb ternary alloys, and type-II InAs/GaSb superlattice. Recently, advanced heterojunction photovoltaic detectors have been developed. Novel HOT detector designs, so called interband cascade infrared detectors, have emerged as competitors of HgCdTe photodetectors.     

Uncooled infrared photodetectors in Poland

The history and present status of the middle and long wavelength Hg_1-xCd_xTe infrared detectors in Poland are reviewed. Research and development efforts in Poland were concentrated mostly on uncooled market niche. Technology of the infrared photodetectors has been developed by several research groups. The devices are based on mercury-based variable band gap semiconductor alloys. Modified isothermal vapour phase epitaxy (ISOVPE) has been used for many years for research and commercial fabrication of photoconductive, photoelectromagnetic and other devices. Bulk growth and liquid phase epitaxy was also used. At present, the fabrication of IR devices relies on low temperature epitaxial technique, namely metalorganic vapour phase deposition (MOCVD), frequently in combination with the ISOVPE. Photoconductive and photoelectromagnetic detectors are still in production. The devices are gradually replaced with photovoltaic devices which offer inherent advantages of no electric or magnetic bias, no heat load and no flicker noise. Potentially, the PV devices could offer high performance and very fast response. At present, the uncooled long wavelength devices of conventional design suffer from two issues; namely low quantum efficiency and very low junction resistance. It makes them useless for practical applications. The problems have been solved with advanced 3D band gap engineered architecture, multiple cell heterojunction devices connected in series, monolithic integration of the detectors with microoptics and other improvements. Present fabrication program includes devices which are optimized for operation at any wavelength within a wide spectral range 1–15 μm and 200–300 K temperature range. Special solutions have been applied to improve speed of response. Some devices show picoseconds range response time. The devices have found numerous civilian and military applications. The paper presented there appears in Infrared Photoelectronics, edited by Antoni Rogalski, Eustace L. Dereniak, Fiodor F. Sizov, Proc. SPIE Vol. 5957, 59570K (2005).     

Quantum structure based infrared detector research and development within Acreo’s centre of excellence IMAGIC

Acreo has a long tradition of working with quantum structure based infrared (IR) detectors and arrays. This includes QWIP (quantum well infrared photodetector), QDIP (quantum dot infrared photodetector), and InAs/GaInSb based photon detectors of different structure and composition. It also covers R&D on uncooled microbolometers. The integrated thermistor material of such detectors is advantageously based on quantum structures that are optimised for high temperature coefficient and low noise. Especially the SiGe material system is preferred due to the compatibility with silicon technology. The R&D work on IR detectors is a prominent part of Acreo’s centre of excellence “IMAGIC” on imaging detectors and systems for non-visible wavelengths. IMAGIC is a collaboration between Acreo, several industry partners and universities like the Royal Institute of Technology (KTH) and Linköping University.     

Exploring novel methods to achieve sensitivity limits for high operating temperature infrared detectors

A review of high operating temperature (HOT) infrared (IR) photon detector technology vis-a-vis material requirements, device design and state of the art achieved is presented in this article. The HOT photon detector concept offers the promise of operation at temperatures above 120 K to near room temperature. Advantages are reduction in system size, weight, cost and increase in system reliability. A theoretical study of the thermal generation–recombination (g–r) processes such as Auger and defect related Shockley Read Hall (SRH) recombination responsible for increasing dark current in HgCdTe detectors is presented. Results of theoretical analysis are used to evaluate performance of long wavelength (LW) and mid wavelength (MW) IR detectors at high operating temperatures.     

二维材料异质结高灵敏度红外探测器

要想实现弱光探测,需要探测器具有高灵敏度。石墨烯、过渡金属硫化物、黑磷等二维材料因具有宽光谱吸收、带隙可调、高载流子迁移率等良好的光学与电学性能,广泛应用于红外探测器的制作,然而这些材料存在弱光吸收、载流子迁移率低、空气稳定性差等问题,制约了其在高灵敏度红外探测领域的应用。同单一的二维材料相比,二维材料异质结不仅具有各单一材料的特点,而且由于两种材料的结合展现出新颖的物理特性,近年来在高灵敏度红外探测领域得到了广泛研究。本文基于影响灵敏度的主要因素,分析总结了提高红外探测器灵敏度的主要策略,回顾了近几年基于二维材料异质结高灵敏度红外探测器的发展,总结了其主要性能指标,最后指出了进一步提升红外探测灵敏度所面临的挑战,从如何平衡探测器响应度与响应速度、大面积二维异质结制备、异质结界面优化利用等方面展望了如何获得综合性能良好的高灵敏度红外探测器以及实现探测器商业应用,以期对高灵敏度红外探测领域的发展提供一定的指导意见。     

High frequency response of near-room temperature LWIR HgCdTe heterostructure photodiodes

The high frequency response of near-room temperature long wavelength infrared (LWIR) HgCdTe heterostructure photodiodes is investigated using a Fourier space method. The MOCVD HgCdTe multilayer heterostructures were grown on GaAs substrates. The response time of devices as a function of bias has been measured experimentally by using 10-μm quantum cascade laser and fast oscilloscope with suitable transimpedance amplifier. Results of theoretical predictions are compared with experimental data. It is shown that the response time at weak reverse bias condition is mainly limited by the drift time of carriers moving into π-n+ junction. Using the reverse bias higher than 50 mV, the transit time across the absorber region limits the response time. The response time of small-area devices decreases in the region of week reverse bias achieving value below 1 ns.     

New material systems for third generation infrared photodetectors

Third-generation infrared (IR) systems are being developed nowadays. In the common understanding, these systems provide enhanced capabilities-like larger numbers of pixels, higher frame rates, and better thermal resolution as well as multicolour functionality and other on-chip functions. In this class of detectors, two main competitors, HgCdTe photodiodes and quantum-well photoconductors, have being developed. Recently, two new material systems have been emerged as the candidates for third generation IR detectors, type II InAs/GaInSb strain layer superlattices (SLSs) and quantum dot IR photodetectors (QDIPs). In the paper, issue associated with the development and exploitation of multispectral photodetectors from these new materials is discussed. Discussions is focused on most recently on-going detector technology efforts in fabrication both photodetectors and focal plane arrays (FPAs). The challenges facing multicolour devices concerning complicated device structures, multilayer material growth, and device fabrication are described.     

HgCdTe technology in France

SOFRADIR is one of the leading companies worldwide for the production of second generation InfraRed (IR) detectors. This success is due to the top level quality of the unique and production oriented French HgCdTe technology for manufacturing IR focal plane arrays based on an HgCdTe array and a CMOS readout and multiplexed silicon array. This technology and main products are presented in this paper. Finally, in order to prepare for future military and industrial needs, SOFRADIR has been working in close relationship with CEA-LETI/LIR on third generation developments based on HgCdTe material using Molecular Beam Epitaxy (MBE) growth. To cite this article: P. Tribolet, C. R. Physique 4 (2003).     

History of infrared detectors

This paper overviews the history of infrared detector materials starting with Herschel??s experiment with thermometer on February 11^th, 1800. Infrared detectors are in general used to detect, image, and measure patterns of the thermal heat radiation which all objects emit. At the beginning, their development was connected with thermal detectors, such as thermocouples and bolometers, which are still used today and which are generally sensitive to all infrared wavelengths and operate at room temperature. The second kind of detectors, called the photon detectors, was mainly developed during the 20^th Century to improve sensitivity and response time. These detectors have been extensively developed since the 1940??s. Lead sulphide (PbS) was the first practical IR detector with sensitivity to infrared wavelengths up to ??3 ??m. After World War II infrared detector technology development was and continues to be primarily driven by military applications. Discovery of variable band gap HgCdTe ternary alloy by Lawson and co-workers in 1959 opened a new area in IR detector technology and has provided an unprecedented degree of freedom in infrared detector design. Many of these advances were transferred to IR astronomy from Departments of Defence research. Later on civilian applications of infrared technology are frequently called ??dual-use technology applications.?? One should point out the growing utilisation of IR technologies in the civilian sphere based on the use of new materials and technologies, as well as the noticeable price decrease in these high cost technologies. In the last four decades different types of detectors are combined with electronic readouts to make detector focal plane arrays (FPAs). Development in FPA technology has revolutionized infrared imaging. Progress in integrated circuit design and fabrication techniques has resulted in continued rapid growth in the size and performance of these solid state arrays.     

Quantum structures for multiband photon detection

The work describes multiband photon detectors based on semiconductor micro-and nano-structures. The devices considered include quantum dot, homojunction, and heterojunction structures. In the quantum dot structures, transitions are from one state to another, while free carrier absorption and internal photoemission play the dominant role in homo or heterojunction detectors. Quantum dots-in-a-well (DWELL) detectors can tailor the response wavelength by varying the size of the well. A tunnelling quantum dot infrared photodetector (T-QDIP) could operate at room temperature by blocking the dark current except in the case of resonance. Photoexcited carriers are selectively collected from InGaAs quantum dots by resonant tunnelling, while the dark current is blocked by AlGaAs/InGaAs tunnelling barriers placed in the structure. A two-colour infrared detector with photoresponse peaks at ∼6 and ∼17 μm at room temperature will be discussed. A homojunction or heterojunction interfacial workfunction internal photoemission (HIWIP or HEIWIP) infrared detector, formed by a doped emitter layer, and an intrinsic layer acting as the barrier followed by another highly doped contact layer, can detect near infrared (NIR) photons due to interband transitions and mid/far infrared (MIR/FIR) radiation due to intraband transitions. The threshold wavelength of the interband response depends on the band gap of the barrier material, and the MIR/FIR response due to intraband transitions can be tailored by adjusting the band offset between the emitter and the barrier. GaAs/AlGaAs will provide NIR and MIR/FIR dual band response, and with GaN/AlGaN structures the detection capability can be extended into the ultraviolet region. These detectors are useful in numerous applications such as environmental monitoring, medical diagnosis, battlefield-imaging, space astronomy applications, mine detection, and remote-sensing. The paper presented there appears in Infrared Photoelectronics, edited by Antoni Rogalski, Eustace L. Dereniak, Fiodor F. Sizov, Proc. SPIE Vol. 5957, 59570W (2005).     

LWIR/SWIR switchable two color device based on InP/InGaAs integrated HBT/QWIP

A novel two color infrared (IR) device that allows fast electrical switching between the short wavelength IR (SWIR) band (0.9–1.6 μm) and the long wavelength IR (LWIR) band (8–12 μm) is presented. The integrated sensor is based on MOCVD grown, lattice matched (to InP substrate) epilayers of InGaAs/InP and consists of two, monolithically integrated sections of heterojunction bipolar transistor (HBT) and quantum well infrared photodetector (QWIP).     

Progress in MOCVD growth of HgCdTe heterostructures for uncooled infrared photodetectors

This paper describes the significant progress in the development of metalorganic chemical vapour deposition of Hg_1−xCd_xTe (HgCdTe) multilayer heterostructures on GaAs/CdTe substrates for uncooled infrared photodetectors. The paper focuses on the interdiffused multilayer process (IMP). The optimum conditions for the growth of single layers and complex multilayer heterostructures have been established.

One of the crucial stages of HgCdTe epitaxy is CdTe nucleation on GaAs substrate. Successful composite substrates have been obtained with suitable substrate preparation, liner and susceptor treatment, proper control of background fluxes and appropriate nucleation conditions. Epiready (1 0 0) GaAs wafers with 2–4° disorientation towards 1 0 0 and 1 1 0 have been used. Due to the large mismatch between GaAs and CdTe, both (1 0 0) and (1 1 1) growth may occur. Generally, layers with orientation (1 0 0) show superior morphology compared to (1 1 1), but they are also characterized by hillocks.

The benefits of the precursors, ethyl iodine (EI) and arsine (AsH₃), for controlled iodine donor doping and arsenic acceptor doping at dopant concentrations relevant for HgCdTe junction devices are summarized. In situ anneal seems to be sufficient for iodine doping at any required level. In contrast, efficient As doping with near 100% activation requires ex situ anneal at near saturated mercury vapours.

Finally, the multilayer fully doped heterostructures for photovoltaic devices operated at room temperature have been fabricated. The special attention is focused on the improvement in multijunction LWIR photovoltaic detectors. The performance of photodiodes is also presented.     

Recent Progress in Mid- and Far-Infrared Semiconductor Detectors

The recent developments of semiconductor infrared detectors in extending the wavelength coverage and improving the focal plane array (FPA) performance are reviewed. The emphasis is on the GeSi/Si heterojunction infrared photoemission detectors (HIPs), GaAs/AlGaAs quantum well infrared photodetecots (QWIPs), Si, Ge and GaAs blocked impurity band detectors (BIBS), and Si and GaAs homojunction interfacial work-function internal photo-emission (HIWIP) far-infrared (FIR) detectors. The advantages, current status, and potential limitations of these infrared detectors have also been discussed.     

Uncooled MWIR and LWIR photodetectors in Poland

The history, status, and recent progress in the middle and long wavelength Hg_1−xCd_xTe infrared detectors operating at near room temperatures are reviewed. Thermal generation of charge carriers in narrow gap semiconductor is a major limitation or sensitivity. Cooling is a straightforward way to suppress thermal generation of charge carriers and reduce related noise. However, at the same time, cooling requirements make infrared systems bulky, heavy, and inconvenient in use. A number of concepts to improve performance of photodetectors operating at near room temperatures have been proposed and implemented. Recent considerations of the fundamental detector mechanisms suggest that near perfect detection can be achieved without the need for cryogenic cooling. This paper, to a large degree, is based on the research, development, and commercialization of uncooled HgCdTe detectors in Poland. The devices have been based on 3D-variable band gap and doping level structures that integrate optical, detection and electric functions in a monolithic chip. The device architecture is optimized for the best compromise between requirements of high quantum efficiency, efficient and fast collection of photogenerated charge carriers, minimized thermal generation, reduced parasitic impedances, wide linear range, wide acceptance angles and other device features. Recent refinements in the devices design and technology have lead to sensitivities close to the background radiation noise limit, extension of useful spectral range to > 16 μm wavelength and picosecond range response times. The devices have found numerous applications in various optoelectronic systems. Among them there are fast scan FTIR spectrometers developed under MEMFIS project.     

High performance uncooled InAsSbP/InGaAs photodiodes for the 1.8–3.4 μm wavelength range

Room temperature In_0.97Ga_0.03As photodiodes with an InAs_0.36Sb_0.20P_0.44 transparent window layer operating in the mid-infrared region over the wavelength range 1.8–3.4 μm are reported. The InAs_0.36Sb_0.20P_0.44/In_0.97Ga_0.03As heterojunction photodiodes were grown on p-type (100) InAs substrates by liquid phase epitaxy (LPE). Basic detector characteristics have been measured and compared with other detectors in this wavelength range. The typical detectivity of the photodiodes is 1.2 × 10¹⁰ cm Hz^1/2/W at room temperature, which compares very favourably with that of TE cooled HgCdTe and is at least three times that of cooled PbSe photoconductors. The InAs_0.36Sb_0.20P_0.44/In_0.97Ga_0.03As heterojunction photodiodes offer the advantage of increased sensitivity and extended wavelength response at room temperature compared with that of currently available commercial photodetectors, making them an attractive alternative for a number of mid-infrared applications including optical gas sensors and infrared spectrometers.     

半导体物理效应及其应用讲座第四讲光吸收跃迁效应与半导体红外探测器的应用发展

光吸收跃迁效应是半导体光电探测器的基本物理过程.文章主要介绍光吸收跃迁效应在窄禁带半导体红外探测器应用方面的研究进展.讨论窄禁带半导体带间光吸收跃迁的理论和实验.文章还介绍了本征光吸收系数的表达式及其在材料表征和确定器件截止波长方面的应用,以及它在解释近年来发现的HgCdTe光电二极管电致负荧光现象方面的应用.