聚对苯撑/LiNi0.5Fe2O4纳米复合热电材料的制备及其性能研究

本文以流变相反应法原位合成了聚对苯撑/LiNi_0.5Fe₂O₄纳米复合热电材料,并对其热电性能进行表征,研究了放电等离子烧结时保温时间对其热电性能的影响.结果发现,复合材料铁氧体颗粒粒径为100---300nm,其外部被一层聚对苯撑膜包覆.电子在Fe²⁺和Fe³⁺之间的跳跃机理在铁氧体电导中占主导作用,因此聚对苯撑/LiNi_0.5Fe₂O₄复合材料具有n型导电特性.随着保温时间增加,复合材料电导率基本不变,但热导率逐渐增大且Seebeck系数逐渐减小,导致热电优值系数降低.由于结合了有机物高电导率和低热导率以及无机材料高赛贝克系数的优点,所制备的复合材料热电性能较单一材料有较大提高.     

CoSb_3/C_(60)复合材料的固相反应合成和热电性能

用固相反应法和脉冲电流直接通电烧结法制备了CoSb3 C6 0 复合材料 ,其组分通过粉末x射线衍射法确定 ,SEM分析表明C6 0 颗粒是均匀地分布在CoSb3基体中 .在 30 0— 80 0K范围内测量了材料的电导率、赛贝克系数和热导率 ,研究了纳米颗粒的尺寸和分布状态对复合材料热电性能的影响 .外加的C6 0 纳米颗粒在高温时降低了复合材料的晶格热导率 ,而对电传输性能影响较小 ,从而有效地提高了复合材料的热电性能 .与CoSb3相比 ,CoSb3 6 5 4 ? 0复合材料的ZT值提高了 4 0 % .     

金属纳米颗粒的热导率

本文使用统计模拟方法对金属纳米颗粒的电子平均自由程进行了计算,并考察了纳米颗粒的晶格比热和声子平均群速度,最后应用动力学理论对纳米颗粒的电子热导率和声子热导率分别进行了求解.研究结果表明:具有相同特征尺寸的方形、球形纳米颗粒的无量纲电子(或声子)平均自由程比较接近.金属纳米颗粒的电子热导率远大于声子热导率;电子、声子热导率随着直径减小呈现降低趋势,而电子热导率的颗粒尺度依赖性比声子热导率更为明显;随着颗粒直径进一步减小,声子热导率与电子热导率趋于同一数量级.当纳米颗粒特征尺寸大于4倍块材电子(或声子)平均自由程,其电子(或声子)热导率的颗粒尺度依赖性将减弱.     

PbSe-MnSe纳米复合热电材料的微结构和电热输运性能

相比于常见的热电材料PbTe, 另一种硫族铅化合物PbSe具有熔点高、Se储量更丰富等优势, 从而越来越受到科学界的关注. 本文采用熔融淬火结合快速热压烧结工艺制备了Pb_0.98-xMn_xNa_0.02Se(0 ≤x ≤ 0.12)纳米复合热电材料, 系统地研究了不同Mn含量对材料微纳结构、机械性能和热电性能的影响规律. 发现纳米复合样品中有面心立方结构的MnSe球状和薄层状析出物, 显微硬度得到显著增强. 少量固溶的Mn增加了能带简并度, 使功率因子提高, 球状析出物使声子散射增强、热导率降低, 体系的热电优值ZT得到优化; 但是当Mn含量更高时, 赛贝克系数趋于饱和, 连续析出物使晶格热导率反常增大, ZT 没有得到进一步改善. 通过进一步调节Na含量优化了载流子浓度, 获得了ZT=0.65的PbSe-MnSe纳米复合热电材料.     

水基ZnO纳米流体电导和热导性能研究

利用水热法生成了形状规则、粒径均匀的球形ZnO纳米颗粒, 并超声分散于水中, 制备得到稳定的水基ZnO纳米流体. 实验测量水基ZnO纳米流体在体积分数和温度变化时的电导率, 并测试室温下水基ZnO纳米流体在不同体积分数下的热导率. 实验结果表明, ZnO纳米颗粒的添加较大地提高了基液(纯水)的热导率和电导率, 水基ZnO纳米流体的电导率随纳米颗粒体积分数增加呈非线性增加关系, 而电导率随温度变化呈现出拟线性关系; 纳米流体的热导率与纳米颗粒体积分数增加呈近似线性增加关系. 本文在经典Maxwell热导模型和布朗动力学理论的基础上, 同时考虑了吸附层、团聚体和布朗运动等因素对热导率的影响, 提出了热导率修正模型.将修正模型预测值与实验值对比, 结果表明修正模型可以较为准确地计算出纳米流体的热导率. 关键词： 水热法 电导率 热导率 热导模型     

热电材料研究中的基础物理问题

热电转换技术主要包括利用半导体材料的泽贝克（Seebeck）效应将热能直接转化成电能和利用佩尔捷（Peltier）效应直接将电能转化成热能.文章简单回顾了热电转换材料中的物理效应及相关研究进展,重点介绍了常规热电材料（即窄带半导体）中的一些基本物理问题,其中包括一个好的热电材料应该具有的特性,以及提高半导体材料的电导率和泽贝克系数,降低热导率的物理机制和方法.文章还介绍了近年来电子晶体-声子玻璃类材料以及低维热电材料等热点问题的研究进展.最后还简单讨论了非常规热电材料的研究现状与趋势.     

碲化铋薄膜载能粒子相互作用的超快研究

碲化铋禁带宽度非常窄而具有高电导率和塞贝克系数,同时具有低热导率,成为已知室温下优值系数最高的热电材料。已有研究表明,纳米薄膜和超晶格是进一步提高材料热电性能的可行途径。因此超快研究碲化铋纳米薄膜中载能子间的相互作用过程对开发高性能热电材料有重要意义。本文采用飞秒激光泵浦-探测技术,实验研究了沉积在硅基底上厚度为100 nm碲化铋薄膜中各载能粒子的相互作用过程。通过改变延迟时间步长,分别观察到价带电子被光子激发跃迁至导带,激发电子在导带内与声子的能量弛豫及导带电子与空穴复合跃迁至价带,并将能量传递给声子导致声子温度升高的过程。此外,还观察到热应力产生的声波,并据此得到了碲化铋薄膜中纵波声速为2649 m s^-1。     

Si微/纳米带的制备与热电性能

目前,低维材料是热电领域研究的热点,因为块体材料低维化后热电性能会得到显著的改善.块体材料低维化有很多方法,本文基于半导体微加工和聚焦离子束技术制备了尺寸可控的Si微/纳米带,并通过微悬空结构详细研究了不同尺寸Si微/纳米带的热电性能.实验发现:随着Si微/纳米带宽度的减小,材料的热导率发生了显著的降低,从体硅的148 W/(m·K)降低到17.75 W/(m·K)(800 nm);材料的Seebeck系数低于相应的体Si值.热导率的降低主要来源于声子边界散射的增加,这显著抑制了Si材料中声子的传输行为,从而影响热能的传输和转换.在373 K时,800 nm宽的Si微/纳米带的ZT值约达到了0.056,与体硅相比增大了约6倍.聚焦离子束加工技术为将来Si材料提高热电性能提供了新的制备方案,这种技术也可以应用于其他材料低维化的制备.     

高压烧结法制备Bi2Te3纳米晶块体热电性能的研究

用高压烧结法对水热法制备的Bi₂Te₃纳米线及纳米颗粒粉体进行了压制成型, 并与真空热压法制备的样品进行了形貌和热电性能的比较. 研究表明, 高压烧结样品内的晶粒尺寸明显小于热压样品. 热电性能的研究表明, 高压烧结样品的电阻率、赛贝克系数和热导率均优于真空热压样品. 由纳米线粉体高压烧结的样品其热电优值ZT 在室温时达到了0.5, 高于真空热压样品的值, 表明高压烧结是热电材料纳米粉体成型的一种有效方法.     

TeI4掺杂量对n型Bi2Te3基烧结材料热电性能的影响

采用区熔法结合放电等离子体快速烧结(SPS)技术制备了n型Bi2Te3基热电材料.在300-500K的温度范围内测量了各热电性能参数,包括电导率(σ)、塞贝克系数(α)和热导率(κ),研究了掺杂剂TeI4的含量(质量百分比分别为0,0.05,0.08,0.10,0.13和0.15wt%)对热电性能的影响.结果表明:试样的载流子浓度(n)随TeI4含量增加而增大,使电导率增大、塞贝克系数的绝对值先增大而后减小,从而导致品质因子(α2σ)呈先增加后降低的变化趋势;同时,由于异质离子(I-)以及载流子对声子的散射作用增强,可显著降低其晶格热导率.烧结材料的性能优值(ZT=α2σT/κ)对应于TeI4含量为0.08wt%有其最大值,约为0.92.此外,烧结材料的抗弯强度增加至80MPa左右,从而可以显著改善材料的可加工性以及元器件的使用可靠性.     

Graphene for Thermoelectric Applications: Prospects and Challenges

Thermoelectric power generators require high-efficiency thermoelectric materials to transform waste heat into usable electrical energy. An efficient thermoelectric material should have high Seebeck coefficient and excellent electrical conductivity as well as low thermal conductivity. Graphene, the first truly 2D nanomaterial, exhibits unique properties which suit it for use in thermoelectric power generators, but its application in thermoelectrics is limited by the high thermal conductivity and low Seebeck coefficient resulting from its gapless spectrum. However, with the possibility of modification of graphene's band structure to enhance Seebeck coefficient and the reduction of its thermal conductivity, it is an exciting prospect for application in thermoelectric power generation. This article examines the electronic, optical, thermal, and thermoelectric properties of graphene systems. The factors that contribute to these material properties in graphene systems like charge carriers scattering mechanisms are discussed. A salient aspect of this article is a synergistic perspective on the reduction of thermal conductivity and improvement of Seebeck coefficient of graphene for a higher thermoelectric energy conversion efficiency. In this regard, the effect of graphene nanostructuring and doping, forming of structural defects, as well as graphene integration into a polymer matrix on its thermal conductivity and Seebeck coefficient is elucidated.     

晶粒尺寸对CoSb3化合物热电性能的影响

系统地研究了晶粒尺寸对CoSb₃化合物热电性能的影响规律，结果表明晶粒尺寸对CoSb₃化合物的晶格热导率κ_p、电导率σ、能隙宽度E_g和Seebeck系数α有显著影响.当晶粒尺寸由微米尺度减小到纳米尺度时，晶格热导率κ_p显著降低，Seebeck系数α有较大幅度的增加，能隙宽度E_g变宽，电导率σ有一定程度的下降.平均晶粒尺寸为200nm的CoSb₃化合物在温度为700K时，ZT值达到0.43，比平均晶粒尺寸为5000nm的试样增加了4倍.     

基于第一性原理的Mn纳米线掺杂二维SnSe热电性能研究

本文提出了一种在二维SnSe中掺杂一维Mn纳米线的2D-1D复合结构,并系统地研究了其热电性能。结果表明,一维Mn纳米线将电子态汇聚在纳米线附近,提高了材料的各向异性,降低了电子在某一方向上的散射效应,导致了较高的迁移率和电导率。自旋向上和向下的电子态发生简并,导致了较高的塞贝克系数和电导率。此外,Mn纳米线将晶格热导率降低了约0.17 W·m^?1·K^?1。在200至650 K的温度范围内,3Mn-SnSe具有0.73至3.78的极高ZT值,比本征二维SnSe平均提高了约39.2%。     

基于第一性原理的Mn纳米线掺杂二维SnSe热电性能研究

本文提出了一种在二维SnSe中掺杂一维Mn纳米线的2D-1D复合结构,并系统地研究了其热电性能。结果表明,一维Mn纳米线将电子态汇聚在纳米线附近,提高了材料的各向异性,降低了电子在某一方向上的散射效应,导致了较高的迁移率和电导率。自旋向上和向下的电子态发生简并,导致了较高的塞贝克系数和电导率。此外,Mn纳米线将晶格热导率降低了约0.17 W·m^?1·K^?1。在200至650 K的温度范围内,3Mn-SnSe具有0.73至3.78的极高ZT值,比本征二维SnSe平均提高了约39.2%。     

A comparison study on the electronic structures,lattice dynamics and thermoelectric properties of bulk silicon and silicon nanotubes

In order to investigate the mechanism of the electron and phonon transport in a silicon nanotube(SiNT),the electronic structures,the lattice dynamics,and the thermoelectric properties of bulk silicon(bulk Si)and a SiNT have been calculated in this work using density functional theory and Boltzmann transport theory.Our results suggest that the thermal conductivity of a SiNT is reduced by a factor of 1,while its electrical conductivity is improved significantly,although the Seebeck coefficient is increased slightly as compared to those of the bulk Si.As a consequence,the figure of merit(ZT)of a SiNT at 1200 K is enhanced by 12 times from 0.08 for bulk Si to 1.10.The large enhancement in electrical conductivity originates from the largely increased density of states at the Fermi energy level and the obviously narrowed band gap.The significant reduction in thermal conductivity is ascribed to the remarkably suppressed phonon thermal conductivity caused by a weakened covalent bonding,a decreased phonon density of states,a reduced phonon vibration frequency,as well as a shortened mean free path of phonons.The other factors influencing the thermoelectric properties have also been studied from the perspective of electronic structures and lattice dynamics.     

Nanostructuring and improved performance of ternary Bi–Sb–Te thermoelectric materials

A ternary (Bi,Sb)₂Te₃ bulk nanostructured thermoelectric compound has been prepared by a combination of hydrothermal synthesis and hot pressing. It was found that the grain sizes of the hot-pressed bulk sample vary from tens to hundreds of nanometers, which would be favorable to enhance the scattering of both carriers and phonons, resulting in a high Seebeck coefficient with a satisfactory electrical conductivity and a very low thermal conductivity. The highest figure of merit ZT of the nanostructured (Bi,Sb)₂Te₃ bulk sample reaches 1.28 at 303 K, which is not only remarkably higher than the zone-melted one, but also higher than commercial state-of-the-art Bi₂Te₃-based materials. PACS  72.20.Pa; 73.63.Bd; 81.07.Bc     

Effect of nanocomposite structure on the thermoelectric properties of 0.7-at% Bi-doped Mg2Si nanocomposite

Nanocomposites offer a promising approach to the incorporation of nanostructured constituents into bulk thermoelectric materials. The 0.7-at% Bi-doped Mg₂Si nanocomposites are prepared by spark plasma sintering of the mixture of nanoscale and microsized 0.7-at% Bi-doped Mg₂Si powders. Microstructure analysis shows that the bulk material is composed of nano- and micrograins. Although the nanograin hinders electrical conduction, the nanocomposite structure is more helpful to reduce thermal conductivity and increase the Seebeck coefficient, hence improving thermoelectric performance. A dimensionless figure of merit of 0.8 is obtained for the 0.7-at% Bi-doped Mg₂Si nanocomposite with 50-wt % nanopowder, which is about twice larger than that of the sample without nanopowder.     

Ca2+掺杂对CdO多晶热电性能的影响

以CaCO₃作为Ca²⁺源, 利用传统固相烧结法制备了Cd_1-xCa_xO (x=0, 0.01, 0.03, 0.05) 多晶块体样品并研究了Ca²⁺掺杂对CdO高温热电性能的影响. CaCO₃的掺入会导致CdO多晶载流子浓度降低, 使Cd_1-xCa_xO的电阻率ρ和塞贝克系数的绝对值|S|增大、电子热导率κ_e减小. 同时, 在CdO中掺入CaCO₃会引入点缺陷和气孔并可抑制CdO晶粒长大、晶界增多, 从而增加了对声子的散射, 使样品的声子热导率κ_p减小. 由于总热导率的大幅降低, Cd_0.99Ca_0.01O多晶样品在1000 K时的热电优值ZT可达0.42, 比本征CdO提高了约27%, 为迄今n型氧化物热电材料报道的最好结果之一.     

High‐pressure Seebeck coefficients and thermoelectric behaviors of Bi and PbTe measured using a Paris‐Edinburgh cell

A new sample cell assembly design for the Paris‐Edinburgh type large‐volume press for simultaneous measurements of X‐ray diffraction, electrical resistance, Seebeck coefficient and relative changes in the thermal conductance at high pressures has been developed. The feasibility of performing in situ measurements of the Seebeck coefficient and thermal measurements is demonstrated by observing well known solid–solid phase transitions of bismuth (Bi) up to 3 GPa and 450 K. A reversible polarity flip has been observed in the Seebeck coefficient across the Bi‐I to Bi‐II phase boundary. Also, successful Seebeck coefficient measurements have been performed for the classical high‐temperature thermoelectric material PbTe under high pressure and temperature conditions. In addition, the relative change in the thermal conductivity was measured and a relative change in ZT, the dimensionless figure of merit, is described. This new capability enables pressure‐induced structural changes to be directly correlated to electrical and thermal properties.