钽、铁、钨三种体心立方金属裂纹的多尺度模拟及韧脆性分析

采用多尺度准连续介质法计算模拟了钽、铁、钨三种体心立方(body-centered-cubic,BCC)金属的I型裂纹断裂过程.观察了加载过程中裂纹尖端区域原子的位错、孪晶等塑性变形现象,以及裂纹的脆性开裂和扩展现象.模拟结果表明,不同BCC金属材料的裂纹在相同的加载下有不同韧脆性表现.在一定变形范围内,钽裂纹主要表现出的是裂纹尖端附近区域原子的位错和形变孪晶等塑性变形现象;铁裂纹在变形过程中先后表现出了塑性变形和脆性扩展现象,与实验结果吻合;钨裂纹在变形过程中则主要变现出脆性扩展现象.计算了三种金属材料的广义层错能曲线,得到其不稳定层错能;并分别用两种不同的韧脆性准则,对三种材料断裂模型的韧脆性行为进行分析,计算分析结果与模拟结果一致,从而验证了模拟结果的正确性.     

晶体相场法研究应力状态及晶体取向对微裂纹尖端扩展行为的影响

采用晶体相场模拟研究了单向拉伸作用下初始应力状态、晶体取向角度对单晶材料内部微裂纹尖端扩展行为的影响, 以(111)晶面上的预制中心裂纹为研究对象探讨了微裂纹尖端扩展行为的纳观机理, 结果表明: 微裂纹的扩展行为主要发生在<011>(111)滑移系上, 扩展行为与扩展方向与材料所处的初始应力状态及晶体取向紧密相关. 预拉伸应力状态将首先诱发微裂纹尖端生成滑移位错, 进而导致晶面解理而实现微裂纹尖端沿[011]晶向扩展, 扩展到一定程度后由于位错塞积, 应力集中, 使裂纹扩展方向沿另一滑移方向[101], 并形成锯齿形边缘; 预剪切应力状态下, 微裂纹尖端首先在[101]晶向解理扩展, 并诱发位错产生, 形成空洞聚集型长大的二次裂纹, 形成了明显的剪切带; 预偏变形状态下微裂纹尖端则直接以晶面解理形式[101]在上进行扩展, 直至断裂失效; 微裂纹尖端扩展行为随晶体取向不同而不同, 较小的取向角度会在裂纹尖端形成滑移位错, 诱发空位而形成二次裂纹, 而较大的取向角下的裂纹尖端则以直接解理扩展为主, 扩展方向与拉伸方向几近垂直.     

碳纤维布补强梁裂尖奇异性的光学焦散线实验研究

通过光学焦散线方法对碳纤维布加固含裂纹梁进行三点弯荷载下的静荷载和冲击实验,研究了其断裂特性。在静态实验研究中,记录了不同载荷状态下裂纹的焦散斑光学图像,计算了与之对应的裂纹尖端的应力强度因子,分析了试件在粘贴加固不同长度的碳纤维布情况下焦散斑和应力强度因子演化规律。在动态实验中,记录了裂纹扩展的过程和在此过程中不同时刻的焦散斑和裂纹扩展的路线。通过各瞬间的焦散斑图像,分析裂纹的扩展长度及速度,并得到各时刻的动态应力强度因子。     

基于准连续介质方法模拟纳米多晶体Ni中裂纹的扩展

通过准连续介质方法模拟了纳米多晶体Ni中裂纹的扩展过程.模拟结果显示:裂纹尖端的应力场可以导致晶界分解、层错和变形孪晶的形成等塑性形变,在距离裂纹尖端越远的位置,变形孪晶越少,在裂纹尖端附近相同距离处,层错要远多于变形孪晶.这反映了局部应力的变化以及广义平面层错能对变形孪晶的影响.计算了裂纹尖端附近区域原子级局部静水应力的分布.计算结果表明:裂纹前端晶界处容易产生细微空洞,这些空洞附近为张应力集中区,并可能促使裂纹沿着晶界扩展.模拟结果定性地反映了纳米多晶体Ni中的裂纹扩展过程,并与相关实验结果符合得很好     

针对裂尖变形场测量的包络单元局部数字图像相关方法

使用数字图像相关(DIC)方法测量平滑、准确的裂纹尖端位移场和应变场是学术界难题之一。目前常用的方法为基于子区的局部DIC方法,但其子区跨裂纹计算的结果无意义。经过改进的基于子区分割的DIC方法降低了子区内像素点数量,导致精度降低。提出一种基于Hermite单元的局部DIC(HELDIC)方法,依次分块计算感兴趣区域(ROI),利用较大单元包络分块区域剔除单元边界精度较低的数据,通过调整Hermite单元位置使得剔除的数据量最少,再使用所提改进的逐点最小二乘(PLS)方法平滑分块的位移场并得到应变场,从而提高裂纹尖端应变场的平滑度和精确度。实验结果表明,所提方法与传统局部DIC方法相比获得的变形场距离裂纹尖端及裂纹面更近,且在给定的单元和子区大小下的应变场平均误差降低30%以上,是计算裂尖变形场的有效方法。     

用衍射光栅法测试Ⅰ型裂纹尖端区域应力场

本文以正交光栅作为应变传感器,采用衍射光栅法对不同载荷下Ⅰ型裂纹尖端区域应力场进行了测试,结果与有关理论较为一致.     

利用声发射技术监测颗粒填充聚合物材料的裂纹扩展过程

 利用声发射技术监测了颗粒填充聚合物材料含单边缺口试样承受三点弯曲载荷时裂纹尖端形成损伤并断裂的全过程,明显地区分了裂纹尖端起裂和扩展的不同阶段,有效地识别了颗粒填充聚合物材料的破坏模式。研究表明,在承载状态下,裂纹尖端损伤起始和扩展分为3个阶段,且裂纹起裂至快速扩展存在一个演变过程;结合SEM观察结果,判定该材料的断裂模式以颗粒与基材的界面分离为主。     

极低温下Nb3Sn超导体单晶裂纹动态扩展模拟

研究Nb₃Sn超导体的损伤断裂行为对于揭示超导临界性能弱化背后的力学机制具有重要的意义。采用分子动力学模拟方法,研究了极低温下不含裂纹和含中心裂纹的Nb₃Sn单晶在力学拉伸变形作用下的断裂机制和裂纹扩展行为,同时分析了应变率效应对Nb₃Sn单晶断裂机制与裂纹扩展行为的影响。结果表明：不含裂纹的Nb₃Sn单晶在结构受力后出现滑移,滑移带上位错塞积导致应力集中,应力集中使原子键断裂从而萌生裂纹致使Nb₃Sn单晶断裂;而含中心裂纹的Nb₃Sn单晶则由于裂纹尖端应力集中使得原子键断裂形成微裂纹,裂纹扩展致使Nb₃Sn单晶断裂。Nb₃Sn单晶在不同的应变率下表现出不同的断裂机制,在低应变率下表现为脆性断裂,而在高应变率下表现为韧性断裂。     

使用多光谱手段研究熔石英断裂机理

熔石英玻璃是高能激光系统中不可缺少的光学材料,其损伤问题一直是限制系统能量提升的瓶颈之一。通过纳秒激光脉冲诱导熔石英玻璃样品产生断裂,并使用多光谱手段对断裂前后样品进行检测,从而在实验和理论上了解了样品断裂形貌及内部相变结构成因,并从宏观到微观上统一解释了断裂形貌和相变结构的关系。在激光等离子冲击波作用下,熔石英发生断裂,且冲击波作用过程中在玻璃内部产生了推动裂纹扩展的尖端环向应力。在尖端环向应力作用下,不同损伤区域形成了不同扩展速度和长度的裂纹,按照裂纹形貌特性差异可以将断裂区分为雾化区、羽毛区、镜面区三个部分。使用透射光谱、能量散射光谱检测损伤前后样品,发现裂纹的产生引起了玻璃透过率和带隙的下降,且断裂区出现氧原子游离或缺失;使用Raman光谱检测样品损伤前后不同形貌区,发现等离子冲击波使熔石英中Si—O—Si键断裂并发生重组,导致镜面区、羽毛区、雾化区三元拓扑环和四元拓扑环宏观上对应的斯石英相和柯石英相的相对含量依次升高,破坏了材料的固有原子结构特性,使材料断裂区向高密度相转变。氧游离的发生会在玻璃内部产生的大量缺陷,从而使得玻璃透过率及带隙下降,严重影响了玻璃的性能。     

裂纹尖端超声散射场及动应力集中的动态光弹观测

超声波在裂纹尖端发生散射和动应力集中。深入研究裂纹尖端与超声波的相互作用是进行裂纹精确检测与评价的物理基础。在线性声学范畴内,裂纹尖端的散射场与弹性动力学的经典Lamb问题类似,而非线性响应更加复杂。利用动态光弹观测技术,可给出超声波在裂纹尖端散射过程的直观物理图像。无论是用于理论结果的实验验证,还是定量分析线性散射场和动应力集中现象,抑或深入探索非线性响应,动态光弹观测技术都可起到重要作用,因此,相关研究将促进检测声学与无损检测技术的发展。     

Dynamic fracture behavior of syntactic epoxy foams: optical measurements using coherent gradient sensing

Dynamic fracture behavior of syntactic foams made of thin-walled microballoons dispersed in epoxy matrix is studied. Monotonically decreasing dynamic Young's modulus with increasing volume fraction of microballoons is observed using ultrasonic pulse-echo and density measurements. The results are also in good agreement with the Hashin–Shtrikman lower-bound predictions for elastic porous solids. Dynamic crack initiation toughness and crack growth behaviors are examined using instrumented drop-tower tests and optical measurements. Crack initiation toughness shows a linear relationship with Young's modulus over the entire range of volume fraction of microballoons studied. A proposed model based on simple extension of micromechanics prediction agrees well with the measurements. The optical method of coherent gradient sensing (CGS) has been used along with high-speed photography to record crack tip deformation histories in syntactic foam samples subjected to impact loading. Pre- and post-crack initiation events have been successfully captured and apparent dynamic stress intensity factor histories are extracted from the interferograms. Results suggest increasing crack speeds with volume fraction of microballoons. No significant dependence of dynamic fracture toughness on crack speed in any of the volume fractions is observed.     

Linear least squares approach for evaluating crack tip fracture parameters using isochromatic and isoclinic data from digital photoelasticity

In this work, digital photoelasticity technique is used to estimate the crack tip fracture parameters for different crack configurations. Conventionally, only isochromatic data surrounding the crack tip is used for SIF estimation, but with the advent of digital photoelasticity, pixel-wise availability of both isoclinic and isochromatic data could be exploited for SIF estimation in a novel way. A linear least square approach is proposed to estimate the mixed-mode crack tip fracture parameters by solving the multi-parameter stress field equation. The stress intensity factor (SIF) is extracted from those estimated fracture parameters. The isochromatic and isoclinic data around the crack tip is estimated using the ten‐step phase shifting technique. To get the unwrapped data, the adaptive quality guided phase unwrapping algorithm (AQGPU) has been used. The mixed mode fracture parameters, especially SIF are estimated for specimen configurations like single edge notch (SEN), center crack and straight crack ahead of inclusion using the proposed algorithm. The experimental SIF values estimated using the proposed method are compared with analytical/finite element analysis (FEA) results, and are found to be in good agreement.     

Dynamic optical visualization on the interaction between propagating crack and stationary crack

Dynamic interactions between the propagating crack and the static crack in PMMA material are studied by combining high-speed Schardin camera with optical caustic method. A series of dynamic optical bifocal patterns (the specimen-focused image and the off-focused image) around the propagating crack tip and the static crack tip are recorded for PMMA thin strip which contains two collinear-edge-cracks subjected to tensile loading, the variations of the caustic diameter and the distortion of the caustic shape are revealed due to the influence of local stress singularity at the crack tip. Interactions between the moving crack and the static crack are analyzed by means of the evolution of dynamic fracture parameters. The influence of crack interaction on fracture parameters is discussed based on both a K-dominance assumption and a higher order transient crack-tip expansion. These results will be useful to the evaluation of dynamic properties and the design of structures in the cracked polymer material.     

Unstable Fracture Behavior of Rubber Toughened Poly(Styrene-co-Acrylonitrile)

A linear elastic fracture mechanics (LEFM) approach was used to study fracture characteristics of ABS materials. The effects of crack (ligament) length and rubber content on the microscopic deformations taking place at the front of crack tip and in the bulk of the specimens were investigated. The results of fractography studies showed that, in addition to rubber content, the microscopic deformations are influenced by crack length. For some materials this manifests itself as a change in macroscopic response. The ligament length dependent behavior was increased for the samples with higher rubber contents. The results also showed that, although the elastic behavior with unstable crack growth is the dominant micromechanism of deformation, stable crack propagation still occurred in some compositions. All the fracture parameters, including fracture toughness, fracture energy, plastic zone size, and crack tip opening, increased with rubber content. The changes in microscopic and, as a consequence, in the macroscopic deformation behavior of a given specimen with ligament length were attributed to changes in yield stress of the sample and maximum stress on the ligament.     

Finite strain stress fields near the tip of an interface crack between a soft incompressible elastic material and a rigid substrate

We present a numerical study of finite strain stress fields near the tip of an interface crack between a rigid substrate and an incompressible hyperelastic solid using the finite element method (FEM). The finite element (FE) simulations make use of a remeshing scheme to overcome mesh distortion. Analyses are carried out by assuming that the crack tip is either pinned, i.e., the elastic material is perfectly bonded (no slip) to the rigid substrate, or the crack lies on a frictionless interface. We focus on a material which hardens exponentially. To explore the effect of geometric constraint on the near tip stress fields, simulations are carried out under plane stress and plane strain conditions. For both the frictionless interface and the pinned crack under plane stress deformation, we found that the true stress field directly ahead of the crack tip is dominated by the normal opening stress and the crack face opens up smoothly. This is also true for an interface crack along a frictionless boundary in plane strain deformation. However, for a pinned interface crack under plane strain deformation, the true opening normal stress is found to be lower than the shear stress and the transverse normal stress. Also, the crack opening profile for a pinned crack under plane strain deformation is completely different from those seen in plane stress and in plane strain (frictionless interface). The crack face flips over and the tip angle is almost tangential to the interface. Our results suggest that interface friction can play a very important role in interfacial fracture of soft materials on hard substrates.     

Why is nacre strong? II. Remaining mechanical weakness for cracks propagating along the sheets

In our previous paper (Eur. Phys. J. E 4, 121 (2001)) we proposed a coarse-grained elastic energy for nacre, or stratified structure of hard and soft layers found in certain seashells . We then analyzed a crack running perpendicular to the layers and suggested one possible reason for the enhanced toughness of this substance. In the present paper, we consider a crack running parallel to the layers. We propose a new term added to the previous elastic energy, which is associated with the bending of layers. We show that there are two regimes for the parallel-fracture solution of this elastic energy; near the fracture tip the deformation field is governed by a parabolic differential equation while the field away from the tip follows the usual elliptic equation. Analytical results show that the fracture tip is lenticular, as suggested in a paper on a smectic liquid crystal (P.G. de Gennes, Europhys. Lett. 13, 709 (1990)). On the contrary, away from the tip, the stress and deformation distribution recover the usual singular behaviors ( and 1/, respectively, where x is the distance from the tip). This indicates there is no enhancement in toughness in the case of parallel fracture. Received 16 November 2001     

Elastic analysis of a mode Ⅱ crack in an icosahedral quasicrystal

Based on the displacement potential functions, the elastic analysis of a mode Ⅱ crack in an icosahedral quasicrystal is performed by using the Fourier transform and dual integral equation theory. By the solution, the analytic expressions for the displacement field and stress field are obtained. The asymptotic behaviours of the phonon and phason stress fields around the crack tip indicate that the stresses near the crack tip exhibit a square root singularity. The most important physical quantities of fracture theory, crack stress intensity factor and energy release rate, are evaluated in an explicit version.     

Molecular dynamics simulation of brittle fracture in silicon

Brittle fracture in silicon is simulated with molecular dynamics utilizing a modified embedded atom method potential. The simulations produce propagating crack speeds that are in agreement with previous experimental results over a large range of fracture energy. The dynamic fracture toughness is found to be equal to the energy consumed by creating surfaces and lattice defects in agreement with theoretical predictions. The dynamic fracture toughness is approximately 1/3 of the static strain energy release rate, which results in a limiting crack speed of 2/3 of the Rayleigh wave speed.     

α-Fe裂纹的分子动力学研究

通过分子动力学方法，模拟了α-Fe裂纹的单轴拉伸实验中的形变过程.研究了不同晶体取向裂纹的形变特点和断裂机理，观察到各种形变现象，如位错形核和发射，位错运动，堆垛层错或孪晶的形成，纳米空洞的形成与连接等.计算结果表明，裂纹扩展是塑性过程和弹性过程相结合的过程，其中塑性过程表现为由裂尖发射的位错导致的原子切变行为，而弹性过程的发生则是由无位错区中的原子断键所导致.同时还研究了α-Fe裂纹的形变特点和断裂机理与温度场和应力场的依赖关系.