电解精炼制备太阳级硅杂质行为研究

在氟化物电解质体系下,把Cu与冶金级多晶硅熔配成合金作为阳极,利用杂质与硅析出电位的差别,通过控制电解工艺条件和参数,对冶金硅进行了电解精炼提纯研究.结果表明,阳极铜硅合金对硅中的杂质有滞留作用,且在大电流密度下Cu不会随着合金中硅的减少而溶解到电解质中;预电解对电解质净化效果明显,XRF分析表明P含量从10降为1ppmw;阴极电沉积的硅呈颗粒状,并与电解质混杂,随着电解时间的延长,分散的硅的颗粒聚集成1—2cm直径的大尺寸硅球.ICP-AES分析表明,最后得到的产物硅与冶金级硅相比,硼含量由12·7降低到2·2ppmw,磷含量由98·6减少到4·1ppmw,说明电解精炼除杂进行多晶硅的提纯是有效和可行的.     

低温退火磷吸杂工艺对低少子寿命铸造多晶硅电性能的影响

本文针对低少子寿命铸造多晶硅片进行试验, 通过一种将多温度梯度磷扩散吸杂工艺与低温退火工艺结合的新型低温退火吸杂工艺, 去除低少子寿命多晶硅片中影响其电性能的Fe杂质及部分晶体缺陷, 提高低少子寿命多晶硅所生产的太阳电池各项电性能. 通过低温退火磷扩散吸杂工艺与其他磷扩散吸杂工艺的比较, 证明了低温退火吸杂工艺具有更好的磷吸杂和修复晶体缺陷的作用. IV-measurement发现经过低温退火工艺处理后的低少子寿命多晶硅, 制备的太阳电池光电转换效率比其他实验组高0.2%, 表明该工艺能有效地提高低少子寿命多晶硅太阳电池各项电性能参数及电池质量. 本研究结果表明新型低温退火磷吸杂工艺可将低少子寿命硅片应用于大规模太阳电池生产中, 提高铸造多晶硅材料在太阳能领域的利用率, 节约铸造多晶硅的生产成本. 关键词： 低温退火 磷吸杂 低少子寿命多晶硅 太阳电池     

多晶硅表面织构化新工艺的研究

先后采用电化学腐蚀法和化学酸腐蚀法腐蚀多晶硅,用于制备高效率多晶硅太阳电池.首先将多晶硅片在HF和CH3 CH2 OH体积比为1:2的溶液中进行电化学预腐蚀,具体研究不同电流密度对多晶硅绒面形貌的影响;然后采用化学酸腐蚀法进行二次腐蚀,去除多晶硅表面的疏松结构,得到高性能的多晶硅绒面.使用扫描电镜观察多晶硅表面腐蚀形貌...     

集成电路中的物理问题讲座第四讲 半导体中深能级杂质缺陷与深能级瞬态谱

大家知道,不含杂质的纯半导体几乎没有什么直接的用途.为了制造半导体器件,人们总是先将半导体材料尽可能地提纯,然后用扩散、离子注入等方法将一定数量的特定杂质掺入半导体的一定部位,以控制半导体的导电类型和电阻率,再经金属蒸发等工艺,最终制成半导体器件.因此,研究杂质的性质和作用是很重要的.在半导体中,有两类性质和作用都绝然不同的杂质:一类杂质是在禁带中引入的能级与导带底或价带顶的能量差很小,远远小于禁带宽度,这类杂质称为浅杂质,它决定着半导体的导电类型与电阻率;另一类杂质在禁带中引入的能级与导带底及价带顶的能量差都…     

表面钝化对多晶硅绒面形貌的影响

多晶硅表面制绒技术是太阳能光伏产业亟待突破的一个关键技术.本文根据多晶硅强酸制绒的基本原理,提出了表面活性剂钝化多晶硅表面以降低硅原子与酸反应速度从而改善多晶硅绒面形貌的方法.实验研究了不同含量的添加剂对酸液刻蚀多晶硅绒面形貌的影响,用扫描电镜观察对应的绒面结构,用积分反射仪测量其绒面的表面反射率.实验结果表明:加入活性剂后酸液能使多晶硅表面陷阱坑分布更加均匀,并且能有效消除产生漏电流的缺陷性深沟槽,样品表面反射率比较低,其表面反射率降低到21.5%.与传统酸液腐蚀的多晶硅绒面结构相比,陷阱坑密度明显增加,这种方法在多晶硅太阳电池的生产中是有价值的.     

第一性原理研究Mn和Cu掺杂六钛酸钾(K_2Ti_6O_(13))的电子结构和光学性质

六钛酸钾(K_2Ti_6O_(13))是宽带隙半导体光催化材料,只能响应波长较短的紫外光.为了使K_2Ti_6O_(13)对可见光响应,本文采用第一性原理方法,研究过渡金属Mn和Cu掺杂改性后K_2Ti_6O_(13)的电子结构和光学性质.计算结果表明:Mn,Cu掺杂后K_2Ti_6O_(13)禁带中出现了杂质能级,这些杂质能级由O 2p和Ti 3d与Mn 3d或Cu 3d态杂化而成.对于Mn掺杂的K_2Ti_6O_(13),其带隙值变小,位于能带中间的杂质能级可作为电子跃迁的桥梁,从而实现了对可见光的吸收.对于Cu掺杂的K_2Ti_6O_(13),其带隙值虽略有增大,但是若考虑将与价带相连的杂质能级,带隙值将大大减小,且此杂质能级可抑制光生载流子的复合,使得掺杂后K_2Ti_6O_(13)吸收带边红移至可见光区并在可见光范围内吸收强度明显增强.总的而言,Mn,Cu的掺杂实现了钛酸钾对可见光的吸收,同时Cu掺杂的效果要优于Mn掺杂的效果.研究结果对K_2Ti_6O_(13)在光催化领域上的应用具有重要的意义.     

硅片及其太阳电池的光衰规律研究

采用氙灯模拟太阳光源,将光强调至1000 W/m2,研究常规太阳能级单晶硅片、多晶硅片和物理提纯硅片的原片、去损减薄片、热氧化钝化片、双面镀氮化硅(SiN x:H)膜钝化片、碘酒钝化片以及太阳电池的光衰规律.利用WT-2000少子寿命测试仪以及太阳电池I-V特性测试仪分别对硅片的少子寿命和太阳电池的I-V特性参数随光照时间的变化进行了测试.结果表明:所有硅片以及太阳电池在光照的最初60 min内衰减很快随后衰减变慢,180 min之后光衰速率变得很小,几乎趋于零.     

p型多晶硅薄膜应变因子与掺杂浓度关系理论研究

多晶硅薄膜具有良好的压阻特性,晶粒结构和掺杂浓度决定其压阻特性.一般通过调节掺杂浓度改变压阻参数,但现有的多晶硅薄膜压阻系数与掺杂浓度的理论关系和适用范围不够全面.为了完善多晶硅薄膜压阻理论,基于多晶硅纳米薄膜隧道压阻模型,以及硅价带和空穴电导质量随应力改变的机理,提出了一种p型多晶硅薄膜压阻系数算法.该算法分别求取了晶粒中性区和复合晶界区的压阻系数π_(11),π_(12)和π_(44)的理论公式,据此可以计算任意择优晶向排列多晶硅的纵向和横向压阻系数.根据材料的结构特性,求取了p型多晶硅纳米薄膜和普通多晶硅薄膜应变因子,绘制了应变因子与掺杂浓度的关系曲线,与测试结果比较,具有较好的一致性.因此,该算法全面和准确,对多晶硅薄膜的压阻特性的改进和应用具有重要意义.     

空间辐射效应的蒙特-卡罗模拟

 概述了天然宇宙空间的辐射环境,简要地分析了辐射效应机制,在辐射效应的蒙特-卡罗模拟中对靶材料作了无定形假设,入射粒子在靶材料中的弹性能量损失采用经典二体散射公式,非弹性能量损失高能时采用Beth-Bloch公式,低能时采用Lindhard-Scharff公式,中能时采用插值公式,撞出晶格原子引起的次级损伤用Kinchin-Pease模型计算,最后对100KeV硼离子入射于硅材料引起的辐射效应进行了模拟计算,并给出了计算结果和分析。     

金属诱导低温制备多晶硅薄膜工艺新进展

多晶硅薄膜由于兼具稳定性、高光敏性、便于大面积沉积等优势成为目前光伏领域的研究热点.本文综述了近几年金属诱导非晶硅薄膜晶化的新工艺,介绍了各种工艺条件对多晶硅薄膜材料的结构、金属含量的调控规律.最后展望了未来的发展趋势.     

Development of silicon purification by strong radiation catalysis method

Using a new type of solar furnace and a specially designed induction furnace,cost effective and highly efficient purification of metallurgical silicon into solar grade silicon can be achieved.It is realized by a new method for extracting boron from silicon with the aid of photo-chemical effect.In this article,we discussed the postulated principle of strong radiation catalysis and the recent development in practice.Starting from ordinary metallurgical silicon,we achieved a purification result of 0.12 ppmw to 0.3 ppmw of boron impurity in silicon by only single pass of a low cost and simple process,the major obstacle to make ’cheap’ solar grade silicon feedstock in industry is thus removed.     

Anomalous transient tail diffusion in boron-implanted silicon

Abstract

Anomalous transient tail diffusion is interpreted as being associated with the equilibration of the metastable state formed by the implantation process. During annealing, the sample approaches the thermodynamic equilibrium via quasi-chemical reactions involving radiation defects. The corresponding set of reaction-diffusion equations can be solved giving the space and time evolution of the defect profiles as well as their electrical activity. To exemplify the approach, the tail diffusion of the boron implants with peak concentrations transcending the solubility limit will be discussed in detail. Finally, a simple explanation will be given of the influence of lattice damage on boron diffusion due to pre- or post-implantation of silicon and boron atoms, respectively.     

纳秒紫外重复脉冲激光烧蚀单晶硅的热力学过程研究

采用波长为355 nm的纳秒紫外重复脉冲激光对单晶硅片进行了盲孔加工实验, 观测了随脉冲增加激光烧蚀硅片的外观形貌和盲孔孔深、孔径的变化规律, 并对紫外激光辐照硅片的热力学过程进行了分析. 研究结果表明:紫外激光加工硅盲孔是基于热、力效应共同作用的结果, 热效应会使得硅材料熔化、气化甚至发生电离产生激光等离子体,为材料的去除提供条件;激光等离子体冲击波以及高温气态物向外膨胀会对熔化材料产生压力致使其向外喷射,为重复脉冲的进一步烧蚀提供了条件;力效应主要沿着激光传输的方向,垂直于硅表面,使得去除部位主要集中在孔的深度方向,达到较高的孔径比,实验观察孔径比可达8:1;此外,激光等离子体的产生也阻止了激光对靶面的作用,加之随孔深的增加激光发生散焦,使得烧蚀深度有一定的限制,实验观察烧蚀脉冲个数在前100个时加工效率较高.     

Electrical properties of purified solar grade silicon substrates using a combination of porous silicon and SiCl4

This work investigates the photo-thermal treatment of solar grade (SG) silicon to reduce impurities to a low level suitable for high efficiency low-cost solar cells application. It describes experiment carried out by using a tungsten lamps furnace (rapid thermal processing, RTP) to purify solar grade silicon wafers using a combination of porous silicon (PS) and silicon tetrachloride. This process enables to attract the impurities towards the porous layer where they react with SiCl₄ to form metallic chlorides. The gettering effect was studied using the Hall Effect and the Van Der Pauw methods to measure the resistivity, the majority carrier concentration and mobility. We have obtained a significant improvement of the majority carrier mobility after such thermo-chemical treatment. The gettering efficiency is also evaluated by the relative increase of the minority carrier diffusion length L, measured by the light beam induced current (LBIC) technique.     

The influence of thin helium films on the phonon spectrum of optically excited silicon

We have studied the phonon spectra resulting from laser pulse excitation of a silicon surface. We used a phonon spectrometer based on pressure tuned boron levels in silicon (Si: B-spectrometer). A new design allowed us to use the spectrometer in vacuum for the first time. We observed phonon frequencies up to 1 THz. The pulse shapes indicated both, quasidiffusion and a long exciton lifetime. On adding helium films to the surface we have found dramatic changes of the spectrum. Full thermalisation was reached already at a thickness of 1.5 monolayers. This indicates a strong anharmonic interaction in the very first monolayers at these high frequencies and, in addition, a strong confinement of the phonons to the surface by quasidiffusion.     

Analysis of heating effect on the process of high deposition rate microcrystalline silicon

A possible heating effect on the process of high deposition rate microcrystalline silicon has been studied.It includes the discharge time-accumulating heating effect,discharge power,inter-electrode distance,and total gas flow rate induced heating effect.It is found that the heating effects mentioned above are in some ways quite similar to and in other ways very different from each other.However,all of them will directly or indirectly cause the increase of the substrate surface temperature during the process of depositing microcrystalline silicon thin films,which will affect the properties of the materials with increasing time.This phenomenon is very serious for the high deposition rate of microcrystalline silicon thin films because of the high input power and the relatively small inter-electrode distance needed.Through analysis of the heating effects occurring in the process of depositing microcrystalline silicon,it is proposed that the discharge power and the heating temperature should be as low as possible,and the total gas flow rate and the inter-electrode distance should be suitable so that device-grade high quality deposition rate microcrystalline silicon thin films can be fabricated.     

连续碳纤维增强碳化硅的辐照效应

连续碳纤维增强碳化硅材料除了具有碳化硅材料固有的低中子活化性能，低衰变热性能和低氚渗透性能等优点以外，还具有密度低、线性膨胀系数小、高比强度、高比模量、耐高温、抗氧化、抗蠕变、抗热震、耐化学腐蚀、耐盐雾、优良的电磁波吸收特性等一系列优异性能，是各类核工程重要的潜在候选材料。在核聚变工程应用领域，连续碳纤维增强碳化硅材料作为第一壁材料不可避免地会受到各种辐射粒子的影响。研究清楚这些辐射粒子对它的辐照效应对其在核工程领域的安全使用至关重要。采用蒙特卡罗方法与分子动力学方法进行模拟计算，研究了氕、氘、氚和氦四种粒子对连续碳纤维增强碳化硅的辐照效应。SRIM和LAMMPS计算结果表明:当入射原子能量为100 eV，连续碳纤维增强碳化硅中碳的浓度在80%~85%时，氕、氘、氚和氦原子的溅射率存在最小值；入射粒子的种类对溅射率的影响显著，氦原子的溅射率大于氘原子和氚原子，而氘原子和氚原子的溅射率相差不大但均显著大于氕原子；溅射率随入射能量的增加先迅速增加后逐渐减小，氕、氘、氚和氦原子入射能量分别在200，400，600和800 eV时存在溅射率最大值；当氦原子入射能量为100 eV时，溅射率随入射角度的增加而逐渐减少。这些结果对连续碳纤维增强碳化硅材料在核工程上的应用具有一定的参考意义。Continuous carbon fiber reinforced silicon carbide material has the low neutron activation, low decay heat performance and tritium permeability, which are inherent performance of silicon carbide materials. It also has other advantages such as low density, small linear expansion coefficient, specific strength and specific modulus, high temperature resistance, oxidation resistance, creep resistance, thermal shock, resistance to chemical corrosion, salt fog resistance, excellent electromagnetic wave absorption properties, etc. It is an important potential candidate material in various field of nuclear engineering. In the field of nuclear fusion engineering applications, continuous carbon fiber reinforced silicon carbide as the first wall material will inevitably be bombarded by a variety of radiation particles. The radiation effect is critical to its safe use in nuclear engineering. The Monte Carlo method and the molecular dynamics method were used to study the radiation effect of protium, deuterium, tritium and helium on continuous carbon fiber reinforced silicon carbide. The SRIM and LAMMPS simulation results show that when the incident energy is 100 eV and the concentration of carbon in the continuous carbon fiber reinforced silicon carbide is about 80% ~ 85%, the sputtering yield of protium, deuterium, tritium and helium atoms have the minimum values. The kind of incident particle has a significant effect on the sputtering yield. The sputtering yield of helium atoms is larger than that of tritium atoms and deuterium atoms. There is not much difference between the sputtering yield of deuterium atoms and tritium atoms, and both the sputtering yield of deuterium atoms and tritium atoms are larger than that of protium atoms. The sputtering yield initially increases rapidly with the increase of the incident energy and then decreases gradually. The incident energy of the protium, deuterium, tritium and helium atoms has the maximum value of the sputtering yield at 200, 400, 600 and 800 eV, respectively. When the incident energy of helium atoms is 100 eV, the sputtering yield decreases while the increase of the incident angle. These results can provide a certain reference for the application of continuous carbon fiber reinforced silicon carbide materials in nuclear engineering.     

碳化硅表面硅改性层的磁介质辅助抛光

为了实现碳化硅表面硅改性层的精密抛光,获得高质量光学表面,对磁介质辅助抛光技术进行研究。设计了适合碳化硅表面硅改性层抛光的磁介质辅助抛光工具,并对抛光工具的材料去除函数进行研究。针对材料去除函数的特性,对数控磁介质辅助抛光的驻留时间算法进行了研究。采用磁介质辅助抛光技术对碳化硅表面硅改性层平面样片进行了抛光实验。经过一次抛光迭代,碳化硅样片表面硅改性层的面形精度(均方根)由0.049λ收敛到0.015λ（λ=0.6328 μm）,表面粗糙度从2 nm改善至0.64 nm。实验结果表明基于矩阵代数的驻留时间算法有效,磁介质辅助抛光适合碳化硅表面硅改性层加工。     

Passivation of black silicon boron emitters with atomic layer deposited aluminum oxide

The nanostructured surface – also called black silicon (b‐Si) – is a promising texture for solar cells because of its extremely low reflectance combined with low surface recombination obtained with atomic layer deposited (ALD) thin films. However, the challenges in keeping the excellent optical properties and passivation in further processing have not been addressed before. Here we study especially the applicability of the ALD passivation on highly boron doped emitters that is present in crystalline silicon solar cells. The results show that the nanostructured boron emitters can be passivated efficiently using ALD Al₂O₃ reaching emitter saturation current densities as low as 51 fA/cm². Furthermore, reflectance values less than 0.5% after processing show that the different process steps are not detrimental for the low reflectance of b‐Si. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Atomic and Electronic Structures of Traps in Silicon Oxide and Silicon Oxynitride

Silicon oxide (SiO₂) and silicon oxynitride (SiO_xN_y) are two key dielectrics used in silicon devices. The excellent interface properties of these dielectrics with silicon have enabled the tremendous advancement of metal-oxide-semiconductor (MOS) technology. However, these dielectrics are still found to have pronounced amount of localized states which act as electron or hole traps and lead to the performance and reliability degradations of the MOS integrated circuits. A better understanding of the nature of these states will help to understand the constraints and lifetime performance of the MOS devices. Recently, due to the available of ab initio quantum-mechanical calculations and some synchrotron radiation experiments, substantial progress has been achieved in understanding the atomic and electronic nature of the defects in these dielectrics. In this review, the properties, formation and removal mechanisms of various defects in silicon oxide and silicon oxynitride films will be critically discussed. Some remarks on the thermal ionization energies in connection with the optical ionization energies of electron and hole traps, as well as some of the unsolved issues in these materials will be highlighted.