共查询到20条相似文献,搜索用时 93 毫秒
1.
2.
3.
设计了一种超导接头用于ITER校正场线圈和超导电流引线之间电流和液氦传输。介绍了校正场线圈超导接头和超导体的结构,计算了接头的直流电阻,确定了合理的超导接头制造工艺。超导接头样品电阻的检测值为1.4nΩ,低于5nΩ的设计值。 相似文献
4.
5.
6.
7.
《核聚变与等离子体物理》2015,(1)
为把电流引线罐从EAST大厅移到离装置约30m外的电源大厅,重新设计和制造了连接新旧超导导体间的13对超导接头。介绍了其中1对超导接头的结构设计、空隙率的确定、理论直流电阻计算、压降计算和加工装配方案等。为此,制造了1对超导接头,并进行通电测试,结果表明,所设计的超导接头结构和加工工艺满足EAST工程的要求。 相似文献
8.
为把电流引线罐从EAST 大厅移到离装置约30m 外的电源大厅,重新设计和制造了连接新旧超导导体间的13 对超导接头。介绍了其中1 对超导接头的结构设计、空隙率的确定、理论直流电阻计算、压降计算和加工装配方案等。为此,制造了1 对超导接头,并进行通电测试,结果表明,所设计的超导接头结构和加工工艺满足EAST 工程的要求。 相似文献
9.
10.
焊接技术是高温超导带材实际应用中的关键技术,焊接温度、焊料、搭接长度等工艺环节对带材接头性能都有一定的影响.本文针对高温超导一代Bi2223/Ag带材和二代YBCO带材的接头焊接工艺进行了系统的实验研究,包括焊接温度对带材性能的影响、不同焊料及搭接长度对接头性能的影响等.实验结果表明:一代Bi2223/Ag高温超导带材在400℃焊接温度以内载流能力不会发生明显退化,而二代YBCO带材对温度较敏感,在200℃以上带材性能会出现明显退化;在Bi2223/Ag及YBCO带材各自的焊接温区内,不同焊料对带材接头性能有一定的影响,但液氮温度下接头电阻均能达到10-8Ω量级,其临界电流与带材短样相比无太大变化;两种超导带材的接头电阻均与焊接搭接长度成反比,适当增加焊接搭接长度可以减小接头电阻,提高带材接头性能. 相似文献
11.
S. Kar R. Kumar P. Konduru T.S. Datta 《Physica C: Superconductivity and its Applications》2010,470(13-14):523-527
Stainless steel laminated BSCCO/Ag tapes are commercially available for HTS pancake magnet development. The joint between pancakes could be achieved in several configurations like straight lap joint, cross-bridge joint and combination of both. Each type of joint shows different characteristic. We have experimentally studied the characteristic of three types of joint configuration between two pancakes made of SS-laminated BSCCO/Ag tape at 77 K. We have developed two types of cross-bridge joint and one with combination of both straight lap joint and cross-bridge joint. The joint resistance for all three configurations has been compared. The rise in temperature at each joint has been estimated. The joint configuration with the combination of both straight lap joint and cross-bridge joint has given lowest joint resistance which is 0.25 μΩ at 77 K but this configuration has more locally heated zones. 相似文献
12.
13.
Ren Jialie 《Physica C: Superconductivity and its Applications》2010,470(13-14):598-601
Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24 h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%. 相似文献
14.
15.
T. Joseph Sahaya Anand Chua Kok Yau Yeow See Leong Lim Weng Keat Hng May Ting 《Current Applied Physics》2013,13(8):1674-1683
Effects of High Temperature Storage (HTS) and bonding toward microstructure change of intermetallic compound (IMC) at the wire bonding interface of 3 types of bond pad (Al, AlSiCu and NiPdAu) were presented in this paper. Optical and electron microscope analyses revealed that the IMC growth rate of samples under 175 and 200 °C HTS increased in the order of Al > AlSiCu > NiPdAu. Besides, higher HTS and bonding temperatures also promoted higher IMC thickness. The compositional study showed that higher HTS and bonding temperature developed rapid interdiffusion in bonding interface. In the mechanical ball shear test, a decrease of the shear force of Al and AlSiCu bond pads after 500 h HTS was believed due to poorly developed IMC at bonding interface. On the other hand, shear force degradation at 1000 h was due to excessive growth of IMC that in turn causes the formation of defects. For NiPdAu bond pad, increasing trend of shear force with HTS duration at 175 °C implied a good reliability of the Cu wire bonding. The rapid microscopic inspection on Cu wired Al bond pad under HTS 175 °C showed the IMC development from the periphery to the center of the ball bond. However, after 500 h voids started to develop until the crack was observed at 1000 h. 相似文献
16.
17.
18.
本文利用分子动力学模拟方法对相同初始沉积条件下的单个Cu原子和Cu13团簇与Fe(001)表面的相互作用分别进行了模拟研究, 并将两者的模拟结果进行了比较分析. 单个Cu原子和Cu13团簇的初始入射能量范围均为1eV/atom、3eV/atom、5eV/atom和10eV/atom, 初始入射角度均为0o、10o、30o和45o, 衬底温度分别为100K、300K和800K. 对单个Cu原子和Cu13团簇的原子动能、质心高度、迁移距离和最终沉积形貌进行了分析, 对比研究了相同初始沉积条件下单个Cu原子和Cu13团簇在沉积过程中和沉积效果上的具体差异. 模拟结果表明: 单个Cu原子和Cu13团簇与Fe(001)表面的相互作用机制存在差异, Cu13团簇表现出显著的集体效应. 在特定沉积条件下, 由于Cu13团簇的集体效应, 导致Cu13团簇与Fe(001)表面的结合能力和在Fe(001)表面上的扩散能力均强于单个Cu原子. 相似文献
19.
高温超导磁体在闭环运行时,可以提供稳定磁场,但是由于高温超导带材无法实现无阻焊接,成为高温超导磁体闭环运行的技术瓶颈.本文利用第二代高温超导带材制备闭环超导环,采用内部励磁和外部励磁对超导环进行励磁,在液氮温度中(77 K)测量超导环的中心俘获磁场.结果表明超导环在内部励磁俘获的磁场值比外部励磁俘获的磁场值高;外部励磁中,超导环中插入铁芯柱能提高俘获场;内部励磁中,超导环在螺线管闭环运行俘获的磁场值比开环运行俘获的磁场值高.结果对于高温超导闭环磁体励磁和高温超导带材磁通动力学研究具有很重要参考价值. 相似文献