Ti-2Al-2.5Zr合金He离子辐照效应研究

 在Ti-2Al-2.5Zr合金中注入能量为75 keV的He离子，注入剂量分别为5×10¹⁶cm^-2，1×10¹⁷ cm^-2。通过显微硬度测量和剖面电子显微观察，研究了He离子对Ti-2Al-2.5Zr合金力学性能和显微组织的影响。结果表明:样品的显微硬度随He离子注量的增加而升高，在温度为350和550 ℃的Ar气中退火后硬度有所下降。剖面电子显微观察发现有位错环和He气泡生成，退火后He气泡有长大、缺陷有回复的趋势。辐照产生的位错环是辐照后硬度升高的直接原因，其退火发生回复又引起硬度随退火温度的升高而降低。     

离子辐照产生的空位型缺陷对Si中B原子热扩散的影响

使用二次离子质谱仪分析了附加的空位型缺陷对单晶Si中注入B原子热扩散的影响. Si中B原子是通过30keV B离子室温注入而引入的, 注入剂量为2×10¹⁴cm^－2. Si中附加的空位型缺陷通过两种方式产生: 一是采用40或160keV He离子注入单晶Si到剂量5×10¹⁶cm^－2,并经800°C退火1h; 二是采用0.5MeV F或O离子辐照单晶Si到剂量5×10¹⁵cm^－2.结果显示, 不同方式产生的附加的空位型缺陷均能抑制注入的B原子在随后热激活退火中发生瞬间增强扩散效应, 并且抑制的效果依赖于离子的种类和离子的能量. 结合透射电子显微镜和卢瑟福背散射分析结果对以上抑制效应进行了定性的讨论.     

离子注入ZnO薄膜的拉曼光谱研究

室温下,用80 keV N⁺和400 keV Xe⁺离子注入ZnO薄膜,注入剂量分别为5.0×10¹⁴—1.0×10¹⁷/cm²和2.0×10¹⁴—5.0×10¹⁵/cm².利用拉曼散射技术对注入前后的ZnO薄膜进行光谱测量和分析,研究了样品的拉曼光谱随离子注入剂量的变化规律.实验结果发现,未进行离子注入的样品在99,435 cm<     

Si离子注入和H等离子体处理对单晶Si中空腔生长的影响研究

室温下首先采用160keVHe离子注入单晶Si样品到剂量5×10¹⁶ions/cm²,部分样品再接受80keVSi离子辐照到较高的剂量5×10¹⁵ions/cm²或接受高密度H等离子体处理.应用透射电镜观测分析了800℃高温退火引起的空腔的形成形貌.结果表明,附加Si离子辐照或H等离子体处理会影响Si中空腔的生长.就Si离子附加辐照而言,由于辐照引入富余的间隙子型缺陷,因此,它会抑制空腔的生长,而高密度H等离子体处理则有助于空腔的生长.定性地讨论了实验结果.     

Ni离子注入多晶ZrO2的表面电性能和结构

对氧化钇(Y₂O₃)部分稳定氧化锆(ZrO₂)样品在室温下进行了Ni离子注入(140kev,5×10¹⁵-2×10¹⁷ios/cm²)和热退火处理.应用电学测量,Rutherford背散射技术(RBS),X射线光电子能谱(XPS)和喇曼光谱方法研究了Ni离子注入多晶ZrO₂的表面电性能,注入层结构及其热退火的影响。     

Zn离子注入和退火对ZnO薄膜光学性能的影响

 利用溶胶凝胶方法在石英玻璃衬底上制备了ZnO薄膜，将能量56 keV、剂量1×10¹⁷ cm^-2的Zn离子注入到薄膜中。离子注入后，薄膜在500~900 ℃的氩气中退火，利用X射线衍射谱、光致发光谱和光吸收谱研究了离子注入和退火对ZnO薄膜结构和光学性质的影响。结果显示：衍射峰在约700 ℃退火后得到恢复；当退火温度小于600 ℃时，吸收边随着退火温度的提高发生蓝移，超过600 ℃时，吸收边随着退火温度的提高发生红移；近带边激子发光和深能级缺陷发光都随退火温度的提高而增强。     

单晶YSZ的Xe+离子辐照效应研究

 200keV Xe⁺离子辐照使单晶YSZ由无色透明变成紫色透明，结果表明，能量为200keV，注量为1×10¹⁷cm^-22的Xe⁺离子辐照YSZ单晶产生的损伤高达350dpa，在损伤区产生高密度的缺陷，但仍然没有发生非晶化转变。吸收光谱测试结果表明，产生吸收带的注量阈值大约为10¹⁶cm^-2。注量为1×10¹⁶cm^-2和1×10¹⁷cm^-2的样品，吸收带峰值分别位于522nm和497nm。光吸收带可能与Zr阳离子最近邻的氧空位捕获电子形成的F型色心和Y阳离子近邻的氧离子捕获空穴形成的V型色心有关。     

H等离子体处理对Si中He注入空腔引起的效应

室温下分别采用40,160和1550 keV的He离子注入单晶Si样品到相同的剂量5×10¹⁶cm^-2,部分经He注入过的样品然后再分别接受高密度H等离子体处理.利用透射电子显微镜分析比较了随后800°C高温退火引起的空腔形成.结果表明,附加的H等离子体处理对空腔生长所产生的效应明显地依赖于He离子的能量.对于40 keV He离子注入,空腔的形成和热生长似乎不受H等离子体处理的影响,而对于160 keV He离子注入,附加的等离子体处理则促进了空腔的生长并伴随着空腔分布区域的变窄.对于1550keV He离子注入,H等离子体处理对空腔产生的效应介于40和160 keV注入情况之间.结合H等离子体处理在Si中所引起的缺陷的产生及其热演变过程对实验结果进行了讨论.     

1 053，527，351 nm倍频分离膜的制备与性能研究

 用电子束蒸发及光电极值监控技术在石英基底上沉积了三倍频分离膜，将部分样品置空气中于250 ℃温度下进行3 h热退火处理。然后用Lambda900分光光度计测量了样品的光谱性能；用表面热透镜技术测量了样品的弱吸收值；用调Q脉冲激光装置测试了样品分别在355 nm和1 064 nm的抗激光损伤阈值。实验结果发现，样品的实验光谱性能良好，退火前后其光谱性能几乎没有发生温漂，说明薄膜的温度稳定性好；同时弱吸收平均值从退火前的1.07×10^-4下降到退火后的6.2×10^-5，从而使对基频的抗激光损伤阈值提高，从14.6 J/cm²上升到18.8 J/cm²，但是三倍频阈值在退火后有显著降低，从7.5 J/cm²下降到2.5 J/cm²。     

单晶YSZ的Xe+辐照损伤的电子显微分析

 不同注量200keV Xe⁺ 注入YSZ单晶样品的电子显微分析结果表明，随着辐照注量的增加，缺陷簇的密度增大，在1×10¹⁵~1×10¹⁶cm^-2Xe⁺注量，缺陷簇密度迅速增大，形成间隙型位错环；当Xe⁺注量增大到1×10¹⁷cm^-2，缺陷簇密度的增加变得缓慢，并且有直径为2～4nm的Xe气泡析出。选区电子衍射花样表明YSZ样品没有产生非晶化转变。在Xe⁺辐照的离位率高达约350dpa的情况下，YSZ晶体没有非晶化，其原因主要是由于注入的Xe⁺以气泡形式析出。     

Structural state of III nitride layers implanted with erbium ions

The defect structure of AlGaN/GaN superlattices and GaN layers grown through vapor-phase epitaxy from organometallic compounds is investigated using x-ray diffraction analysis before and after implantation with erbium ions at an energy of 1 MeV and a dose of 3 × 10¹⁵ cm^?2, as well as after annealing. For a superlattice with a total thickness larger than the implantation depth, the satellites of the superlattice region strained under the action of ions disappear in the x-ray diffraction pattern after annealing at temperatures higher than 900°C. This suggests that the radiation-induced defects responsible for the positive deformation in the layer are annealed at these temperatures. However, annealing even at a temperature of 1050°C does not lead to complete recovery of the initial state and the positive deformation in the remaining regions is caused by residual defects. An analysis of the x-ray diffraction patterns demonstrates that, in samples with thin superlattices located at the depth corresponding to maximum radiation damage, the periodic structure that disappears after implantation at a dose of 3 × 10¹⁵ cm^?2 is not recovered even after annealing at a temperature of 1050°C. This inference is confirmed by the results of examinations with an electron microscope.     

Spatial distribution of defects produced by boron ion implantation of silicon

A simple technique for the study of the spatial distribution of the damage produced by ion implantation of silicon has been developed. The damage depth distribution for 40 keV boron ions in silicon has been studied at irradiation doses from 7 × 10¹¹ to 3.9 × 10¹⁴ ions/cm² and the relative defect peak depth R _d/R _p = 0.85 determined. An increase of layer conductivity as the surface part of the implanted layer is removed has been revealed. This effect is caused by the presence of radiation defects in the surface region of the layer. The “electrical” cluster diameter is about 28 A and the overlapping cluster dose is close to 1 × 10¹³ ions/cm².     

磷离子注入速率对4H-SiC(0001)晶格恢复与电阻率降低的影响

高剂量的磷离子注入4H-SiC(0001)晶面，注入速率从1.0×1012到4.0×1012 P+ cm-2s-1变化，而注入剂量固定为2.0×1015 P+ cm-2。室温注入，1500oC的高温下退火。利用光荧光和拉曼谱分析注入产生的晶格损伤以及退火后的残余缺陷。通过霍耳测试来分析注入层的电学性质。基于上述测试结果，发现通过减小磷离子的注入速率，极大地减少了注入层的损伤及缺陷。考虑到室温注入以及相对较低的退火温度(1500 oC)，在注入速率为1.0×1012 P+ cm-2s-1及施主浓度下为4.4×1019 cm-3的条件下，获得了非常低的方块电阻106 Ω/sq。     

Damage anneal of antimony/phosphorus double implants in silicon

A method is presented for avoiding the dislocation generation in (100) silicon implanted with phosphorus doses up to 5×10¹⁵ ions/cm² at 50 keV. The residual defects after the damage anneal are considerably reduced if the phosphorus implant is combined with a low dose, e.g. 1×10¹⁴ ions/cm², antimony implant which produces a deeper surface layer of amorphous silicon. It is essential that the phosphorus ions are implanted shallower than the antimony ions, and come to rest within the amorphous layer. Subsequent thermal annealing proceeds by a solid phase epitaxial regrowth mechanism.     

Corrosion behavior of tin ions implanted zirconium in 1N H2SO4

In order to study the effect of tin ion implantation on the aqueous corrosion behavior of zirconium, specimens were implanted with tin ions to a fluence ranging from 1 × 10²⁰ to 5 × 10²¹ ions/m², using a metal vapor vacuum arc source (MEVVA) at an extraction voltage of 40 kV. The valence states and depth distributions of elements in the surface layer were analyzed by X-ray photoelectron spectroscopy (XPS) and auger electron spectroscopy (AES) respectively. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were used to examine the micro-morphology and microstructure of tin-implanted samples. When the fluence was greater than 1 × 10²⁰ ions/m², many small tin balls were produced in the implanted surface. The potentiodynamic polarization technique was employed to evaluate the aqueous corrosion resistance of implanted zirconium in a 1N H₂SO₄ solution. It was found that a significant improvement was achieved in the aqueous corrosion resistance of zirconium implanted with 1 × 10²⁰ ions/m². When the fluence is higher than 1 × 10²⁰ ions/m², the corrosion resistance of zirconium implanted with tin ions decreased compared with that of the non-implanted zirconium. Finally, the mechanism of the corrosion behavior of the tin-implanted zirconium is discussed.     

Dynamic behavior of implanted nitrogen in zirconium at various stages of implantations

Abstract

Depth profiles of nitrogen implanted into Zr with an energy of 50 keV were calculated by dynamic SASAMAL code with three different assumptions for the diffusion of excess atoms over stoichiometry, i.e., ‘no diffusion', ‘both-sides-diffusion’ and ‘upward-diffusion'. To distinguish nitrogens implanted certain stage of implantations, alternate implantations of ¹⁵N and ¹⁴N were used. The results were compared with the experimental results by the resonance nuclear reaction analysis, NRA. For ¹⁵N implantation with fluences from 1 × 10¹⁷ to 1 × 10¹⁸ ions/cm², the calculated results with ‘upward-diffusion’ agreed very well with the NRA results for all fluences. For the depth profile of pre-implanted ¹⁵N (1 × 10¹⁷ ions/cm²), which was changed by the subsequent ¹⁴N implantation with fluences of 1 ～ 10 × 10¹⁷ ions/cm², the agreement with the NRA results was satisfactory until the ¹⁴N fluence did not exceed 5 × 10¹⁷ ions/cm², but for higher fluences, the retained probabilities of ¹⁵N obtained by the ‘upward-diffusion’ code were too low compared with the experimental value obtained by NRA. For the depth profiles of ¹⁵N (1 × 10¹⁷ ions/cm²) implanted following after implantations of ¹⁴N with fluences of 1 ～ 10 × 10¹⁷ ions/cm², the agreement with the NRA results was quite good for all ¹⁴N fluences. It is concluded that the approximation of ‘upward-diffution’ is proper satisfactorily for the treatment of atoms implanted at the final stage of implantations, but a problem is left for the treatment of atoms implanted at the early stage of implantations.     

Changes in Structural and Optical Properties of Polycarbonate Induced by Ag+ Ion Implantation

Transparent polycarbonate samples were implanted with 1 MeV Ag⁺ ions to various doses ranging from 5 × 10¹⁴ to 3 × 10¹⁶ ions cm^?2 with a beam current density of 900 nA cm^?2. Modification in the structure of polycarbonate as a function of the implantation fluence was investigated using micro-Raman spectroscopy, glancing angle X-ray diffraction, and UV-Vis spectroscopy. Raman spectroscopy pointed toward the formation of graphite structures/clusters due to the ion implantation. UV-Vis absorption analysis suggests the formation of a carbonaceous layer and a drastic decrease in optical band gap from 4.12 eV to 0.50 eV at an implanted dose of 3 × 10¹⁶ ions cm^?2. The correlation between the decrease in band gap and the structural changes is discussed.     

The electrical behaviour of abrupt ion implanted and diffused P+N junctions

Abstract

Results are reported of measurements of the properties of diodes formed by ion implantation, and for comparison boron diffused P⁺N diodes of similar area close by on the same chip. The four group III acceptor impurities were implanted separately to a dose of 5 × 10¹⁵ ions/cm² at room temperature into similar samples of suitably masked silicon. Boron ions were also implanted at liquid nitrogen temperature and 450°C. Annealing was limited to a maximum temperatare of 550 °C.

Measurements have been made of sheet resistance, forward and reverse I-V characteristics (from 10^?9 amps/cm²), reverse breakdown voltage, noise, minority carrier storage time and junction series resistance.

The bulk properties of boron implanted diodes were found to be reproducible. The introduction of recombination centres by implantation is the major factor influencing variation in these properties between one implantation condition and another. Changes in surface oxide conditions probably affect reverse leakage currents and breakdown voltages.

The properties of boron implanted diodes are considered suitable for applications such as the MOSFET, and are superior to those of the AI, Ga and In implanted diodes.     

The near surface changes in boron implanted 4145 steel

Boron implanted 4145 steel was evaluated for changes in the near-surface region property such as microhardness. The surfaces when implanted with ¹¹B⁺ ions at 135 keV energy to a dose 1 × 10¹⁷ ions cm^?2 resulted in increase of microhardness for 10 to 40 gms of applied load. An increase upto 40% in microhardness could be observed in the specimen when annealed at 310δC for 3 hours. Furthermore, the effect of ion-beam induced intermixing of 250Å thin carbon film due to boron implantation was also studied for different doses ranging from 1 × 10¹⁷ to 3 × 10¹⁷ boron ions cm^?2. An increase in microhardness with applied load was observed for 1 × 10¹⁷ ions cm^?2 concentration, while hardest layer was formed at 3 × 10¹⁷ ions cm^?2 dose which practically had very little effect to 10 and 20 gms of load.     

X-ray diffraction studies of silicon implanted with high-energy erbium ions

Silicon crystals after implantation of erbium ions with energies in the range 0.8–2.0 MeV and doses in the range 1×10¹²–1×10¹⁴ cm⁻² have been studied by two-and three-crystal x-ray diffraction. Three types of two-crystal reflection curves are observed. They correspond to different structural states of the implanted layers. At moderate doses (1×10¹²–1×10¹³ cm⁻²) a positive strain is observed, due to the formation of secondary radiation defects of interstitial type. An increase of the implantation dose is accompanied by the formation of an amorphous layer separating the bulk layer and a thin monocrystalline surface layer. At an implantation dose of 1×10¹⁴ cm⁻² the monocrystalline surface layer is completely amorphized. Parameters of the implantation layers are determined. A model of the transformation of structural damage is discussed. Fiz. Tverd. Tela (St. Petersburg) 39, 853–857 (May 1997)