气相传输平衡技术制备LiGaO2薄膜

为获得与GaN薄膜晶格失配小的衬底材料,报道了利用气相传输平衡技术(VTE)在(100)-βGa2O3单晶衬底上制备高度[001]取向LiGaO2薄膜的方法。经过X射线衍射分析表明得到的薄膜是由单相LiGaO2组成。利用扫描电镜(SEM)观察表面形貌,发现经气相传输平衡技术处理得到的薄膜表面形貌主要受温度的影响,表面晶粒尺寸随温度上升而增大。而X射线衍射测试表明随着温度上升,所得到的薄膜也从多晶向单晶化转变。在经过退火处理后,通过观察吸收谱发现LiGaO2薄膜中产生色心,并且色心的种类与温度有关。表明可以通过气相传输平衡技术技术,在远低于LiGaO2熔点的温度制备外延GaN用(001)LiGaO2∥(100)β-Ga2O3复合衬底。     

氮化镓/蓝宝石异质结构中极性的研究

用低压金属有机气相外延方法设备在蓝宝石衬底两个相反取向的C面上同时生长六方相氮化镓薄膜,对此进行了扫描电子显微镜、透射电子显微镜的分析和研究.发现当衬底表面是向籽晶面时,生长的六方相氮化镓薄膜为(0001)取向,而当衬底表面是背籽晶面时,生长的氮化镓薄膜则为(0001)取向.     

腐蚀时间对蓝宝石衬底上外延生长GaN质量的影响

使用熔融的KOH在高温下对c面蓝宝石衬底进行不同时间的腐蚀,借助扫描电镜、原子力显微镜对衬底表面进行了表征,然后利用金属有机物化学气相沉积设备在不同腐蚀时间的衬底样品上进行了GaN材料的外延生长。通过X射线衍射结果比较了两组衬底上外延材料的质量,利用原子力显微镜结果对外延层表面形貌进行了分析,最后论述了腐蚀时间的调整对蓝宝石衬底上外延生长氮化镓质量的影响机理。     

直流反应磁控溅射在氮化的蓝宝石衬底上制备AlN薄膜

通过直流磁控反应溅射装置,在蓝宝石(0001)衬底和氮化的蓝宝石(0001)衬底上成功制备了氮化铝(AIN)薄膜。利用X射线衍射仪、原子力学显微镜和双光束扫描分光计,研究了蓝宝石氮化对AIN薄膜结构、应力、晶粒尺寸、形貌和光学性质的影响。X射线衍射研究表明:制备的AIN薄膜具有较强的(0002)择优取向,蓝宝石衬底的氮化不仅能够改善AIN结晶质量,而且还可以减少薄膜的残余应力。但是,原子力学显微镜结果表明:在蓝宝石衬底上制备的AIN薄膜的晶粒大小分布比在氮化的蓝宝石衬底上制备的AIN薄膜的晶粒大小分布更加均匀。我们认为,蓝宝石衬底在氮化的过程中形成的AIN具有过多的位错和缺陷,正是这些位错和缺陷造成了在氮化的蓝宝石衬底上制备的AIN薄膜的晶粒大小分布的不均匀性。吸收光谱显示:蓝宝石衬底的氮化并没有对AIN薄膜的光学性质产生明显的改善。     

AlN/蓝宝石模板上生长的GaN研究

研究了在分子束外延制备的AlN/蓝宝石模板上采用金属有机物化学气相外延生长的非故意掺杂GaN的材料性质.采用X射线衍射(XRD)、透射电镜(TEM)和原子力显微镜研究了AlN模板的晶体质量和表面相貌对GaN的影响.结果表明,当AlN的表面粗糙度较小时,尽管AlN模板的位错密度较高((102)面XRD ω扫描半高全宽900—1500 arcsec),但生长得到的GaN依然具有和在蓝宝石衬底上采用"二步法"生长的GaN可比拟的晶体质量((002)面XRD ω扫描半高全宽200—30 关键词： 氮化镓 氮化铝 金属有机物化学气相外延     

p型氮化镓的低温生长及发光二极管器件的研究

采用金属有机物化学气相淀积技术(MOCVD)在蓝宝石衬底上低温(870—980℃)生长p型氮化镓 (p-GaN).用Hall测试仪测量材料的电学性能，发现当温度低于900℃时，材料的电阻率较高 ；在900—980℃均可获得导电性能良好的p-GaN.另外，电导性能除与掺杂浓度有关，还与p- GaN生长条件有关，氮镓摩尔比过低导电性能就较差，过高则会引起表面粗糙.采用优化后的 p-GaN制作了绿光发光二极管器件，发现生长温度越低器件发光强度越高，反向电压也越高 ，但正向电压只是略有升高. 关键词： Ⅲ-Ⅴ族半导体 氮化镓 发光二极管 金属有机物化学气相淀积     

ZnO薄膜的分子束外延生长及性能

利用分子束外延(MBE)和氧等离子体源辅助MBE方法分别在Si(100)、GaAs(100)和蓝宝石Al2O3(0001)衬底上用Zn、ZnS或以一定Zn-O化学计量比作缓冲层,改变衬底生长温度和氧压,并在氧气氛下,进行原位退火处理,得到ZnO薄膜。依据X射线衍射(XRD)图,表明样品的结晶性能尚好,且呈c轴择优取向;实验结果表明在不同衬底上生长的ZnO薄膜,由于晶格失配度不同,其衍射峰也有区别。用原子力显微镜(AFM)观测薄膜的表面形貌,为晶粒尺寸约几十纳米的ZnO纳米晶,且ZnO晶粒呈六边形柱状垂直于衬底的表面。采用掠入射X射线反射率法测膜厚。在360nm激发下,样品的发光光谱是峰值为410,510nm的双峰谱,是与样品表面氧缺陷有关的深能级发光。     

低温CVD法在玻璃衬底上制备ZnO纳米线阵列

采用化学气相沉积(CVD)法在镀Cr(20nm)的玻璃衬底上,低温制备了ZnO纳米线阵列。利用扫描电子显微镜(SEM)和X射线衍射(XRD)对样品的表面形貌和微结构进行了分析表征。结果表明:源分解温度1350℃,衬底温度450～500℃,氩气流量为35sccm时,ZnO纳米线在玻璃衬底上呈现有序生长;XRD谱图中只观测到ZnO(002)衍射峰。表明制备的纳米线阵列具有高度c轴择优取向生长特性和较高的结晶质量。     

LiGaO2衬底上ZnO外延膜的结构与光学特性

采用磁控溅射法在(001),(100)及(010)LiGaO2衬底上制备了ZnO薄膜,通过X射线衍射(XRD)、原子力显微镜(AFM)、透过光谱以及光致发光谱(PL)对薄膜的结构、形貌及光学性质进行了表征.结果表明LiGaO2衬底不同晶面上制备的ZnO薄膜具有不同的择优取向,在(001)、(100)及(010)LiGaO2上分别获得了[001]、[1100]及[1120]取向的ZnO薄膜;不同取向的ZnO薄膜表面形貌差异较大;薄膜在可见光波段具有较高的透过率;在ZnO薄膜的光致发光谱中只观察到了位于378 nm的紫外发射峰,而深能级发射几乎观察不到,(1100)取向的薄膜紫外发射峰强度最大,半高宽也最小,薄膜光致发光件质的差异丰要和晶粒尺寸有关.     

SiO2图形化蓝宝石衬底对GaN生长及LED发光性能的影响

为了提高氮化镓(GaN)基发光二极管(LEDs)的发光性能,采用等离子体增强化学气相沉积(PECVD)在蓝宝石衬底上沉积SiO_2薄膜,经过光刻和干法刻蚀技术制备了SiO_2图形化蓝宝石衬底(SiO_2 patterned sapphire substrate, SPSS),利用LED器件的外延生长和微纳加工技术获得了基于SPSS的GaN基LED器件。通过分析GaN外延层晶体质量、光提取效率和LED器件性能,重点研究了SPSS对GaN生长及LED发光性能的影响。实验及模拟仿真结果表明,与常规图形化蓝宝石衬底(Conventional patterned sapphire substrate, CPSS)相比,SPSS上生长的GaN外延层位错密度较低,晶体质量较高,SPSS-LED的光提取效率提高26%、光输出功率和亮度均提高约5%。     

Characteristics of the crystalline and luminescence properties of a-plane GaN films grown on γ-LiAlO_2(302) substrates

A-plane GaN films are deposited on(302) γ-LiAlO 2 substrates by metalorganic chemical vapor deposition(MOCVD) . The X-ray diffraction(XRD) results indicate that the in-plane orientation relationship between GaN and LAO substrates is [010] LAO [0001] GaN and [203] LAO [1100] GaN with 0.03% and 2.85% lattice mismatch,respectively. Raman scattering results indicate that the strain in the films decreases along with the increase in the thickness of the films. In addition to the band edge emission at 3.42 eV,defects-related luminescence at 3.35 eV is observed in the photoluminescence(PL) spectra. The cathodoluminescence(CL) spectra indicate that the 3.35-eV emission is related to the V pits.     

溶胶-凝胶法制备SiO2基片Er3+∶Al2O3光学薄膜

用溶胶凝胶法在SiO2 基片上提拉制备了掺Er3 + ∶Al2 O3 光学薄膜。采用扫描电子显微镜、原子力显微镜、差热热重分析仪、X射线衍射仪研究了掺Er3 + ∶Al2 O3 光学薄膜的形貌和结构特性。在 90 0℃烧结后 ,SiO2 基片上提拉 15次形成厚度 8μm掺摩尔比 0 .0 1Er3 + 的面心立方结构γ Al2 O3 薄膜具有明显 (110 )择优取向 ,掺摩尔比 0 .0 1Er3 + 对γ Al2 O3 的晶体结构和结晶生长过程未产生显著影响。薄膜具有均匀多孔结构 ,平均粒径为 30～ 10 0nm ,平均孔径为 5 0～ 10 0nm ,表面起伏度为 10～ 2 0nm。掺摩尔比 0 .0 1Er3 + ∶γ Al2 O3 薄膜 ,获得了中心波长为1.5 34μm(半峰全宽为 36nm)的光致发光谱。     

Microstructural study of MBE-grown ZnO film on GaN/sapphire (0001) substrate

Single crystalline ZnO film is grown on GaN/sapphire (0001) substrate by molecular beam epitaxy. Ga₂O₃ is introduced into the ZnO/GaN heterostructure intentionally by oxygen-plasma pre-exposure on the GaN surface prior to ZnO growth. The crystalline orientation and interfacial microstructure are characterized by X-ray diffraction and transmission electron microscopy. X-ray diffraction analysis shows strong c-axis preferred orientation of the ZnO film. Cross-sectional transmission electron microscope images reveal that an additional phase is formed at the interface of ZnO/GaN. Through a comparison of diffraction patterns, we confirm that the interface layer is monoclinic Ga₂O₃ and the main epitaxial relationship should be and .      

基于SSCVD方法的a-b轴取向ZnO薄膜制备

以Zn₄(OH)₂(O₂CCH₃)₆·2H₂O为单一固相有机源,采用单源化学气相沉积法(Single sour cechem icalvapor deposition,SSCVD)在Si(100)衬底上制备ZnO薄膜,用X射线衍射(XRD)、原子力显微镜(AFM)分析ZnO薄膜样品的晶体结构和微观形貌,并用X射线光电子能谱(XPS)对薄膜的锌氧化学计量比进行了分析。研究结果表明:在非平衡条件下所得到的ZnO薄膜沿a-b轴取向生长,基片温度对ZnO薄膜生长过程影响较大,随着基片温度的升高,薄膜呈现c轴生长趋势;晶粒成柱状、尺寸均匀、膜层结构致密;薄膜样品中n_Zn:n_O=0.985。     

Fabrication of MgO barrier for a magnetic tunnel junction in as-deposited state using amorphous RE–TM alloy

MgO (1 0 0) textured films on Fe buffer layer with (1 0 0) preferential orientation were prepared by a reactive facing targets sputtering system at a substrate temperature of 100 °C during MgO deposition. This process can allow fabrication of MgO (1 0 0) tunneling barrier layer without high-temperature annealing process after the sputter-deposition. In addition, FeCo (1 0 0) preferred orientation films prepared on GdFeCo layers were improved with GdFeCo thickness. MgO films deposited on Fe (or FeCo) buffer layers revealed apparent (1 0 0) preferred orientation at the early stage of the film growth. 3 nm-thick MgO films deposited on GdFeCo [100 nm]/Fe [3 nm] exhibited (1 0 0) texture. Magnetic characteristic of perpendicular-magnetic tunnel junction (P-MTJ) element with the structure of GdFeCo [100 nm]/Fe [3 nm]/MgO [3 nm]/Fe [3 nm]/TbFeCo [100 nm] exhibited high squareness ratio of 0.8 and coercivity of free layer as low as 117 Oe by anomalous Hall effect, and (1 0 0) preferred orientation of 3 nm-thick MgO layer was observed by an X-ray diffractometer.     

一种应用于MOCVD的3波长在线红外测温方法

根据金属有机物化学气相沉积(MOCVD)在线红外测温的发展需要,提出一种3波长免探测孔有效面积校准和反射率修正的测温方法。给出了探测1 300 nm、1 150 nm、940 nm 3波长的在线测温探头设计方案和光路图,将该探头应用于THOMAS SWAN CCS MOCVD 5.08 cm (2英寸)Si(111)衬底上生长10 μm GaN外延层的在线测温。测量结果表明:在700 ℃~1 100 ℃范围内,探头多次测量的重复性误差在1.0 ℃内,在950 ℃~1 100 ℃范围内,以EpiTT红外测温仪为参考,探头测温精度在1 ℃内,距离容差性为2 mm。该探头应用于我国自主研发的MOCVD 5.08 cm Si(111)衬底上生长InGaN/GaN MQW结构蓝光LED外延片,可得最低测温量程为435 ℃,n-GaN生长过程中测量噪声为0.75℃。结果分析表明:该3波长免修正在线红外测温法对于高质量单层薄膜外延生长具有一定可行性,对于多层复杂结构外延生长需要进一步改进。     

气相外延GaN的拉曼散射

测量了在蓝宝石衬底上气相外延生长GaN的拉曼散射谱.除观察到已被确认的两个E2,一个A1(TO)和一个E1(TO)声于振动以外,在734±3cm-1处观察到一个散射峰且从实验上确认其为GaN的纵向光学声子模E1(LO).而且发现其强度与外延层晶体质量密切相关.A1(TO)和高频E2散射峰相对强度变化显示不同生长条件引起的外延层质量的变化.     

Electrochemical liftoff of freestanding GaN by a thick highly conductive sacrificial layer grown by HVPE

Separation technology is an indispensable step in the preparation of freestanding GaN substrate. In this paper, a largearea freestanding GaN layer was separated from the substrate by an electrochemical liftoff process on a sandwich structure composed of an Fe-doped GaN substrate, a highly conductive Si-doped sacrificial layer and a top Fe-doped layer grown by hydride vapor phase epitaxy(HVPE). The large difference between the resistivity in the Si-doped layer and Fe-doped layer resulted in a sharp interface between the etched and unetched layer. It was found that the etching rate increased linearly with the applied voltage, while it continuously decreased with the electrochemical etching process as a result of the mass transport limitation. Flaky GaN pieces and nitrogen gas generated from the sacrificial layer by electrochemical etching were recognized as the main factors responsible for the blocking of the etching channel. Hence, a thick Si-doped layer grown by HVPE was used as the sacrificial layer to alleviate this problem. Moreover, high temperature and ultrasonic oscillation were also found to increase the etching rate. Based on the results above, we succeeded in the liftoff of ～ 1.5 inch GaN layer. This work could help reduce the cost of freestanding GaN substrate and identifies a new way for mass production.