用离子束溅射方法制备的钛薄膜表面形貌分析

用离子束溅工艺在K9玻璃基片上沉积Ti薄膜，并用原子力显微镜对其表面形貌进行测量，通过数值相关运算，发现在此工艺条件下薄膜生长界面为各向同性的自仿射分形表面，并用粗糙指数、横向相关长度和标准偏差粗糙度对薄膜样品表面进行定量描述。利用自仿射分形表面的相关函数对数值运算的结果进行拟合，得出Ti薄膜生长界面的粗糙度指数α＝0．72，相应的分形维数Df＝2．28，并由此得到在离子束溅射工艺下Ti薄膜屑于守恒生长的结论，其生长动力学过程可用Kuramoto—Sivashinsky方程来描述。     

二氧化锆薄膜表面粗糙度的研究

采用电子束蒸发工艺,利用泰勒霍普森相关相干表面轮廓粗糙度仪,研究了不同基底粗糙度、不同二氧化锆薄膜厚度以及不同的离子束辅助能量下所沉积的二氧化锆薄膜的表面粗糙度。结果表明：随着基底表面粗糙度的增加,二氧化锆薄膜表面粗糙度呈现出先缓慢增加,当基底的粗糙度大于10nm后呈现快速增加的趋势;随着二氧化锆薄膜厚度的增加,其表面均方根粗糙度（RMS）先减小后增大;随着辅助沉积离子能量的增加,其表面粗糙度呈现出先减小后增加的趋势。     

溅射过程中粒子能量对钛薄膜表面形貌影响

借助于原子力显微镜研究了离子束溅射沉积工艺中入射离子能量对制备的Ti薄膜表面形貌的影响。对薄膜表面高度数据进行相关运算，发现在此工艺条件下制备的薄膜具有典型的分形特征，利用分形表面高度—高度相关函数的唯象表达形式对不同能量下制备Ti薄膜表面的高度相关函数进行拟合。得到了薄膜表面的分形维数、水平相关长度、标准偏差粗糙度等参量。研究发现，入射Ar离子能量在300—700eV之间薄膜表面的粗糙度随着沉积粒子的能量增加而增大，分形维数随着入射离子能量的增加而减少。另外，在得到的分形维数基础上对不同溅射电压下Ti薄膜的生长机制进行了初步研究。     

二氧化钛薄膜表面粗糙度研究

为了探究二氧化钛(TiO₂)薄膜表面粗糙度的影响因素, 利用离子束辅助沉积电子束热蒸发技术对不同基底粗糙度以及相同基底粗糙度的K9玻璃完成二氧化钛(TiO₂)光学薄膜的沉积。采用TalySurf CCI非接触式表面轮廓仪分别对镀制前基底表面粗糙度和镀制后薄膜表面粗糙度进行测量。实验表明, TiO₂薄膜表面粗糙度随着基底表面的增大而增大, 但始终小于基底表面粗糙度, 说明TiO₂薄膜具有平滑基地表面粗糙的作用; 随着沉积速率的增大, 薄膜表面粗糙度先降低后趋于平缓; 对于粗糙度为2 nm的基底, 离子束能量大小的改变影响不大, 薄膜表面粗糙度均在1.5 nm左右; 随着膜层厚度的增大, 薄膜表面粗糙度先下降后升高。     

Si(001)基片上反应射频磁控溅射ZnO薄膜的两步生长方法

利用反应射频磁控溅射技术，采用两步生长方法制备了ZnO薄膜，探讨了基片刻蚀时间和低温过渡层沉积时间对ZnO薄膜生长行为的影响.研究结果表明，低温ZnO过渡层的沉积时间所导致的薄膜表面形貌的变化与过渡层在Si(001)表面的覆盖度有关.当低温过渡层尚未完全覆盖基片表面时，ZnO薄膜的表面岛尺度较小、表面粗糙度较大，薄膜应力较大；当低温过渡层完全覆盖Si(001)基片后，ZnO薄膜的表面岛尺度较大、表面粗糙度较小，薄膜应力较小.基片刻蚀时间对薄膜表面形貌的影响与低温过渡层的成核密度有关.随着刻蚀时间的增加，ZnO薄膜的表面粗糙度逐渐下降，表面形貌自仿射结构的关联长度逐渐减小. 关键词： ZnO薄膜 反应射频磁控溅射 两步生长 形貌分析     

非平衡磁控溅射系统的离子束流控制

在非平衡磁控溅射沉积非磁性金属薄膜过程中，离子，原子到达比、沉积速率等参数是影响薄膜结构和性能的重要因素。根据非平衡磁控溅射沉积过程中离子的分布特点，分别考虑离子和中性粒子的传输，导出了对圆形平面靶非平衡磁控溅射沉积薄膜的放电功率、气压和离子束流密度等参数之间的关系，阐明了放电参数对于沉积过程离子束流密度等参数的影响。在Ar放电条件下，测量了系统的伏安特性；采用偏压平面离子收集电极测量了溅射系统轴向离子束流密度随不同的气压、溅射电流和空间位置的变化规律。结果表明模型分析的结论和实验数据的变化趋势相符合。     

溅射粒子能量对金属Mo薄膜表面特性的影响

利用原子力显微镜研究了不同溅射离子能量对Mo薄膜表面形貌的影响.利用特殊设计的夹具，在同一真空内完成所有薄膜样品的制备，减少了多次沉积过程对薄膜生长特性的影响 .对原子力显微镜测量得到的表面高度数据进行相关运算，从统计角度定量地研究了不同沉积能量下Mo薄膜表面特性.结果表明，薄膜表面具有典型的分形特征，在相关运算的基础上给出表面的分形维数、水平相关长度、界面宽度等参数.其中，屏栅电压为500V时制备 的薄膜样品与300和700?V时制备的薄膜样品表面的界面宽度及水平相关长度具有倍数差别，但三种溅射电压下薄 关键词： 离子束溅射 钼 薄膜 分形     

电子束、离子辅助和离子束溅射三种工艺对光学薄膜性能的影响

 运用电子束、离子辅助和离子束溅射三种镀膜工艺分别制备光学薄膜，包括单层氧化物薄膜和增透膜，然后采取一系列测试手段，如Zygo轮廓仪、原子力显微镜、表面热透镜技术和X射线衍射等技术，来分析和研究不同的工艺对这些薄膜性能的不同影响，以判断合理的沉积工艺。     

薄膜系列实验的教学研究

从薄膜制备、生长过程动态分析以及形貌表征3方面设计了薄膜系列实验.用离子束溅射制备金属薄膜,研究了制备条件对溅射速率的影响,测量了薄膜生长过程中电阻的变化,用扫描隧道显微镜或原子力显微镜观测薄膜的表面形貌,并分析不同制备条件得到的薄膜的表面形貌特征.     

电子束蒸发氧化锆薄膜的粗糙度和光散射特性

利用电子束蒸发工艺，以Ag层为衬底，沉积了中心波长为632.8nm的氧化锆(ZrO₂)薄膜，膜层厚度在80—480nm范围内变化.研究了不同厚度样品的粗糙度变化规律和表面散射特性.结果发现，随着膜层厚度的逐渐增加，其表面均方根(RMS)粗糙度和总积分散射(TIS)均呈现出先减小后增大的趋势.利用非相关表面粗糙度的散射模型对样品的TIS特性进行了理论计算，所得结果与测量结果相一致. 关键词： 氧化锆 表面粗糙度 标量散射 电子束蒸发     

生长初期Ta膜的表面动态演化行为

用磁控溅射方法在单晶Si衬底上沉积膜厚为15—250nm的Ta膜.基于原子力显微镜获得的薄膜表面形貌，用动力学标度理论量化表征薄膜表面动态演化行为.结果表明：当膜厚d<50nm时，薄膜生长指数β≈0.17，而d>50nm后β≈0.45；随着d增加，粗糙度指数α由0.24逐渐增加到0.69，且在d>50nm后趋于稳定.Ta膜的表面动态演化行为揭示了其由小岛聚合结构向连续膜演化的生长过程.与自阴影等非局域效应引起的非稳定行为不同的是，当d<50nm时，薄膜表面动态演化的非稳定行为来源于生长初期的小岛聚合，表面小岛沿膜面切向的生长优于沿法向的生长.随着d继续增加，薄膜以连续膜形式生长，表面动态演化趋于稳定.     

直流磁控溅射制备AlN薄膜的结构和表面粗糙度

采用直流磁控反应溅射法,在Si(111)基底上成功制备了多晶六方相AlN薄膜.研究了溅射过程中溅射气压对薄膜结构和表面粗糙度的影响.结果表明:当溅射气压低于0.6 Pa时,薄膜为非晶态,在傅里叶变换红外光谱中,没有明显的吸收峰;当溅射气压不低于0.6 Pa时,薄膜的X射线衍射图中均出现了六方相的AlN(100)、(11...     

Systematic investigation of the reactive ion beam sputter deposition process of SiO<Subscript>2</Subscript>

Ion beam sputter deposition (IBSD) is an established physical vapour deposition technique that offers the opportunity to tailor the properties of film-forming particles and, consequently, film properties. This is because of two reasons: (i) ion generation and acceleration (ion source), sputtering (target) and film deposition (substrate) are locally separated. (ii) The angular and energy distribution of sputtered target atoms and scattered primary particles depend on ion incidence angle, ion energy, and ion species. Ion beam sputtering of a Si target in a reactive oxygen atmosphere was used to grow SiO₂ films on silicon substrates. The sputtering geometry, ion energy and ion species were varied systematically and their influence on film properties was investigated. The SiO₂ films are amorphous. The growth rate increases with increasing ion energy and ion incidence angle. Thickness, index of refraction, stoichiometry, mass density and surface roughness show a strong correlation with the sputtering geometry. A considerable amount of primary inert gas particles is found in the deposited films. The primary ion species also has an impact on the film properties, whereas the influence of the ion energy is rather small.     

Sputtering of the magnetron diode target in the presence of an external ion beam

The effect of an external ion beam on the plasma and target of a dc magnetron sputtering system in the course of reactive deposition of films is investigated. A combined experimental setup consisting of a magnetron diode and a hall-current ion source is constructed. The influence of a fast ion beam on the discharge current formation, the target emission characteristics, and the target etching rate is considered. It is shown that the ion assistance expands the operating range of the magnetron diode, increases the deposition rate, and substantially shortens the target training time. At the same time, it practically does not affect the ionization processes in the plasma.     

Influence of deposition conditions on the microstructure of oxides thin films

Thin films of ZrO₂, HfO₂ and TiO₂ were deposited on kinds of substrates by electron beam evaporation (EB), ion assisted deposition (IAD) and dual ion beam sputtering (DIBS). Then some of them were annealed at different temperatures. X-ray diffraction (XRD) was applied to determine the crystalline phase and the grain size of these films, and the results revealed that their microstructures strongly depended on the deposition conditions such as substrate, deposition temperature, deposition method and annealing temperature. Theory of crystal growth and migratory diffusion were applied to explain the difference of crystalline structures between these thin films deposited and treated under various conditions.     

Preventing kinetic roughening in physical vapor-phase-deposited films

The growth kinetics of the mostly used physical vapor-phase deposition techniques -molecular beam epitaxy, sputtering, flash evaporation, and pulsed laser deposition-is investigated by rate equations with the aim of testing their suitability for the preparation of ultraflat ultrathin films. The techniques are studied in regard to the roughness and morphology during early stages of growth. We demonstrate that pulsed laser deposition is the best technique for preparing the flattest films due to two key features [use of (i) a supersaturated pulsed flux of (ii) hyperthermal species] that promote a kinetically limited Ostwald ripening mechanism.     

Investigation of interface roughness cross-correlation properties of optical thin films from total scattering losses

The interface roughness and interface roughness cross-correlation properties affect the scattering losses of high-quality optical thin films. In this paper, the theoretical models of light scattering induced by surface and interface roughness of optical thin films are concisely presented. Furthermore, influence of interface roughness cross-correlation properties to light scattering is analyzed by total scattering losses. Moreover, single-layer TiO₂ thin film thickness, substrate roughness of K9 glass and ion beam assisted deposition (IBAD) technique effect on interface roughness cross-correlation properties are studied by experiments, respectively. A 17-layer dielectric quarter-wave high reflection multilayer is analyzed by total scattering losses. The results show that the interface roughness cross-correlation properties depend on TiO₂ thin film thickness, substrate roughness and deposition technique. The interface roughness cross-correlation properties decrease with the increase of film thickness or the decrease of substrates roughness. Furthermore, ion beam assisted deposition technique can increase the interface roughness cross-correlation properties of optical thin films. The measured total scattering losses of 17-layer dielectric quarter-wave high reflection multilayer deposited with IBAD indicate that completely correlated interface model can be observed, when substrate roughness is about 2.84 nm.