Impact of O2 exposure on surface crystallinity of clean and Ba terminated Ge(1 0 0) surfaces

In analogy with the case of Sr on Si [Y. Liang, S. Gan, M. Engelhard, Appl. Phys. Lett. 79 (2001) 3591], we studied surface crystallinity and oxidation behaviour of clean and Ba terminated Ge(1 0 0) surfaces as a function of oxygen pressure and temperature. The structural and chemical changes in the Ge surface layer were monitored by LEED, XPS and real-time RHEED. In contrast to the oxidation retarding effect, observed for 1/2 monolayer of Sr on Si, the presence of a Ba termination layer leads to a pronounced increase in Ge oxidation rate with respect to clean Ge. In fact, while the Ge(1 0 0) surface terminated with 1/2 ML Ba amorphizes for a pO₂ of 10⁻² Torr, LEED indicates that clean Ge forms a thin (4.5 Å), 1 × 1 ordered oxide upon aggressive O₂ exposure (150 Torr, 200 °C, 30 min). We briefly discuss the origins for the difference in behaviour between Ba on Ge and Sr on Si.     

Oxidation of Pt(1 0 0)-hex-R0.7° by gas-phase oxygen atoms

We utilized temperature programmed desorption (TPD), X-ray photoelectron spectroscopy (XPS), electron energy loss spectroscopy (ELS), and low energy electron diffraction (LEED) to investigate the oxidation of Pt(1 0 0)-hex-R0.7° at 450 K. Using an oxygen atom beam, we generated atomic oxygen coverages as high as 3.6 ML (monolayers) on Pt(1 0 0) in ultrahigh vacuum (UHV), almost 6 times the maximum coverage obtainable by dissociatively adsorbing O₂. The results show that oxidation occurs through the development of several chemisorbed phases prior to oxide growth above about 1 ML. A weakly bound oxygen state that populates as the coverage increases from approximately 0.50 ML to 1 ML appears to serve as a necessary precursor to Pt oxide growth. We find that increasing the coverage above about 1 ML causes Pt oxide particle growth and significant surface disordering. Decomposition of the Pt oxide particles produces explosive O₂ desorption characterized by a shift of the primary TPD feature to higher temperatures and a dramatic increase in the maximum desorption rate with increasing coverage. Based on thermodynamic considerations, we show that the thermal stability of the surface Pt oxide on Pt single crystal surfaces significantly exceeds that of bulk PtO₂. Furthermore, we attribute the high stability and the acceleratory decomposition rates of the surface oxide to large kinetic barriers that must be overcome during oxide formation and decomposition. Lastly, we present evidence that structurally similar oxides develop on both Pt(1 1 1) and Pt(1 0 0), therefore concluding that the properties of the surface Pt oxide are largely insensitive to the initial structure of the Pt single crystal surface.     

Oxidation of graphene on Ru(0 0 0 1) studied by scanning tunneling microscopy

The oxidation of graphene layer on Ru(0 0 0 1) has been investigated by means of scanning tunneling microscopy. Graphene overlayer can be formed by decomposing ethyne on Ru(0 0 0 1) at a temperature of about 1000 K. The lattice mismatch between the graphene overlayer and the substrate causes a moiré pattern with a superstructure in a periodicity of about 30 Å. The oxidation of graphene/Ru(0 0 0 1) was performed by exposure the sample to O₂ gas at 823 K. The results showed that, at the initial stage, the oxygen intercalation between the graphene and the Ru(0 0 0 1) substrate takes place at step edges, and extends on the lower steps. The oxygen intercalation decouples the graphene layer from the Ru(0 0 0 1) substrate. More oxygen intercalation yields wrinkled bumps on the graphene surface. The oxidation of graphene, or the removal of carbon atoms can be attributed to a process of the combination of the carbon atoms with atomic oxygen to form volatile reaction products. Finally, the Ru(0 0 0 1)-(2 × 1)O phase was observed after the graphene layer is fully removed by oxidation.     

Formation and hydrogenation of p(2 × 2)-N on Pt(1 1 1)

The formation of a well-ordered p(2 × 2) overlayer of atomic nitrogen on the Pt(1 1 1) surface and its reaction with hydrogen were characterized with reflection absorption infrared spectroscopy (RAIRS), temperature programmed desorption (TPD), low energy electron diffraction (LEED), Auger electron spectroscopy (AES), and X-ray photoelectron spectroscopy (XPS). The p(2 × 2)-N overlayer is formed by exposure of ammonia to a surface at 85 K that is covered with 0.44 monolayer (ML) of molecular oxygen and then heating to 400 K. The reaction between ammonia and oxygen produces water, which desorbs below 400 K. The only desorption product observed above 400 K is molecular nitrogen, which has a peak desorption temperature of 453 K. The absence of oxygen after the 400 K anneal is confirmed with AES. Although atomic nitrogen can also be produced on the surface through the reaction of ammonia with an atomic, rather than molecular, oxygen overlayer at a saturation coverage of 0.25 ML, the yield of surface nitrogen is significantly less, as indicated by the N₂ TPD peak area. Atomic nitrogen readily reacts with hydrogen to produce the NH species, which is characterized with RAIRS by an intense and narrow (FWHM ∼ 4 cm⁻¹) peak at 3322 cm⁻¹. The areas of the H₂ TPD peak associated with NH dissociation and the XPS N 1s peak associated with the NH species indicate that not all of the surface N atoms can be converted to NH by the methods used here.     

Formation of interface and surface oxides on supported Pd nanoparticles

We have quantitatively studied the interaction between oxygen and an Fe₃O₄-supported Pd model catalyst by molecular beam (MB) methods, time resolved IR reflection absorption spectroscopy (TR-IRAS) and photoelectron spectroscopy (PES) using synchrotron radiation. The well-shaped Pd particles were prepared in situ by metal evaporation and growth under ultrahigh vacuum (UHV) conditions on a well-ordered Fe₃O₄ film on Pt(1 1 1).It is found that for oxidation temperatures up to 450 K oxygen predominantly chemisorbs on metallic Pd whereas at 500 K and above (∼10⁻⁶ mbar effective oxygen pressure) large amounts of Pd oxide are formed. These Pd oxide species preferentially form a thin layer at the particle/support interface, stabilized by the iron-oxide support. Their formation and reduction is fully reversible. Upon decomposition, oxygen is released which migrates back onto the metallic part of the Pd surface. In consequence, the Pd interface oxide layer acts as an oxygen reservoir, the capacity of which by far exceeds the amount of chemisorbed oxygen on the metallic surface.Additionally, Pd surface oxides can also be formed at temperatures above 500 K. The extent of surface oxide formation critically depends on the oxidation temperature. This effect is addressed to different onset temperatures for oxidation of the particle facets and sites. It is shown that the presence of Pd surface oxides sensitively modifies the adsorption and reaction properties of the model catalyst, i.e. by lowering the CO adsorption energy and CO oxidation probability. Still, a complete reduction of the Pd surface oxides can be obtained by extended CO exposure, fully reestablishing the metallic Pd surface.     

The effect of Pt on Ni3Al surface oxidation at low-pressures

The fully-oxidized surface that forms on (1 1 1) oriented Ni₃Al single crystals, with and without Pt addition, at 300-900 K under oxygen pressures of ca. 10⁻⁷ Torr was studied using XPS, AES, and LEIS. Two main types of surfaces form, depending upon oxidation temperature. At low-temperature, the predominant oxide is NiO, capped by a thin layer of aluminum oxide, which we refer to generically as Al_xO_y. At high-temperature (i.e., 700-800 K), NiO is replaced by a thick layer of Al_xO_y. By comparing samples that contain 0, 10 and 20 at.% Pt in the bulk, we find that the effect of Pt is to: (1) reduce the maximum amount of both NiO and Al_xO_y; and (2) shift the establishment of the thick Al_xO_y layer to lower temperatures. Platinum also decreases the adsorption probability of oxygen on the clean surface.     

Hydrogen peroxide treatment on ZnO substrates to investigate the characteristics of Pt and Pt oxide Schottky contacts

We utilize hydrogen peroxide (H₂O₂) treatment on (0 0 0 1) ZnO substrates to investigate the characteristics of Pt and Pt oxide Schottky contacts (SCs). X-ray rocking curves show the mosaicity structure becomes larger after H₂O₂ treatment. Photoluminescence (PL) spectra show the yellow-orange emission peaking at ∼576-580 nm with respect to deep level of oxygen interstitials introduced by H₂O₂ treatment. The threshold formation of ZnO₂ resistive layer on H₂O₂-treated ZnO for 45 min is observed from grazing-incidence X-ray diffraction. The better electrical characteristic is performed by Pt oxide SC with the larger barrier height (1.09 eV) and the lower leakage current (9.52 × 10⁻¹¹ A/cm² at −2 V) than Pt SC on the H₂O₂-treated ZnO for 60 min. X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometer (SIMS) examinations indicate the promoted interface oxide bonding and Zn outdiffusion for Pt oxide contact, different from Pt contact. Based on current-voltage, capacitance-voltage, X-ray diffraction, PL spectra, XPS, and SIMS results, the possible mechanism for effective rectifying characteristic and enhanced Schottky behavior is given.     

3D atom probe study of gas adsorption and reaction on alloy catalyst surfaces II: Results on Pt and Pt-Rh

The 3-dimensional atom probe (3DAP) is a unique instrument providing chemical analysis at the atomic scale for a wide range of materials. A dedicated 3DAP has been built specifically for analysing reactions at metal surfaces, called the catalytic atom probe (CAP). This paper presents an overview of results from the CAP on structural and chemical transformations to surface layers of Pt and Pt-17.4 at.%Rh catalysts following exposure to a number of gases typically emitted by vehicle engine exhausts, normally for 15 min at pressures of 10 mbar. Following exposure to the oxidising gases NO on Pt, and NO, O₂ or N₂O on Pt-Rh, both surfaces appear disrupted, while for Pt-Rh, Rh enrichment of the surface atomic layer is noted over the entire specimen apex for exposure temperatures up to 523 K. However, for oxidising exposures at 573-773 K relatively clean, Rh-depleted surfaces are observed on {0 0 1}, {0 1 1} and {0 1 2} crystallographic regions of Pt-Rh. It is suggested that this result is due to surface diffusion of oxide species over the specimen apex, towards the {1 1 1}-orientated areas where the oxides appear to be stabilised. In contrast, CO exposure appears to have little effect on the either the surface structure or composition of the Pt-Rh alloy. Finally, combinations of two gases (NO + CO, O₂ + NO) were also dosed onto Pt-Rh alloys in the same exposure. These revealed that while NO and CO can co-adsorb without interference, CO prevents the build up of oxide layers and reduces the extent of Rh segregation seen under NO exposure alone. On exposing Pt-Rh to NO after an oxygen exposure, heavily oxidised surfaces, Rh segregation and no intact NO molecules were seen, confirming the ability of oxidised Pt-Rh to dissociate nitric oxide.     

Oxidation of 4H-SiC covered with a SmSix surface alloy

Oxidation of Sm/4H-SiC is studied by X-ray photoemission spectroscopy (XPS) and low energy electron diffraction (LEED). In particular, we report kinetic information from the oxidation of a SmSi_x (1 × 1) surface alloy formed on (0 0 0 1) 4H-SiC. During the initial oxidation of the SmSi_x alloy, a (2 × 2)-LEED pattern is observed. Furthermore, the Sm 2+ valency observed from the clean SmSi_x surface alloy, which is related to surface samarium atoms, disappear at 15 L oxygen exposure. The oxygen atom is consequently deduced to be located at bridge or hollow sites involving one Sm atom. The initial oxidation result in an oxygen deficit SmSiO_x interface oxide, probably as a consequence of the high oxidation temperatures in this work (900-1050 °C). We report that in a prolonged oxidation (longer than 10 kL) a SiO₂ layer forms on top of the samarium silicon oxide interface layer.     

Influence of postdeposition annealing on structural properties and electrical characteristics of thin Tm2O3 and Tm2Ti2O7 dielectrics

We describe the structural properties and electrical characteristics of thin thulium oxide (Tm₂O₃) and thulium titanium oxide (Tm₂Ti₂O₇) as gate dielectrics deposited on silicon substrates through reactive sputtering. The structural and morphological features of these films were explored by X-ray diffraction, X-ray photoelectron spectroscopy, secondary ion mass spectrometry, and atomic force microscopy, measurements. It is found that the Tm₂Ti₂O₇ film annealed at 800 °C exhibited a thinner capacitance equivalent thickness of 19.8 Å, a lower interface trap density of 8.37 × 10¹¹ eV⁻¹ cm⁻², and a smaller hysteresis voltage of ∼4 mV than the other conditions. We attribute this behavior to the Ti incorporated into the Tm₂O₃ film improving the interfacial layer and the surface roughness. This film also shows negligible degrees of charge trapping at high electric field stress.     

Characteristics of sandwich-structured Al2O3/HfO2/Al2O3 gate dielectric films on ultra-thin silicon-on-insulator substrates

Sandwich-structure Al₂O₃/HfO₂/Al₂O₃ gate dielectric films were grown on ultra-thin silicon-on-insulator (SOI) substrates by vacuum electron beam evaporation (EB-PVD) method. AFM and TEM observations showed that the films remained amorphous even after post-annealing treatment at 950 °C with smooth surface and clean silicon interface. EDX- and XPS-analysis results revealed no silicate or silicide at the silicon interface. The equivalent oxide thickness was 3 nm and the dielectric constant was around 7.2, as determined by electrical measurements. A fixed charge density of 3 × 10¹⁰ cm⁻² and a leakage current of 5 × 10⁻⁷A/cm² at 2 V gate bias were achieved for Au/gate stack /Si/SiO₂/Si/Au MIS capacitors. Post-annealing treatment was found to effectively reduce trap density, but increase in annealing temperature did not made any significant difference in the electrical performance.     

In-situ study of the catalytic oxidation of CO on a Pt(1 1 0) surface using ambient pressure X-ray photoelectron spectroscopy

CO and O₂ co-adsorption and the catalytic oxidation of CO on a Pt(1 1 0) surface under various pressures of CO and O₂ (up to 250 mTorr) are studied using ambient pressure X-ray photoelectron spectroscopy (APXPS) and mass spectrometry. There is no surface oxide formation on Pt under our reaction conditions. CO oxidation in this pressure (<500 mTorr), O₂ to CO ratio (<10), and temperature (150 °C) regime is consistent with the Langmuir-Hinshelwood reaction mechanism. Our findings provide in-situ surface chemical composition data of the catalytic oxidation of CO on Pt(1 1 0) at total pressures below 1 Torr.     

Investigation of oxygen states and reactivities on a nanostructured cupric oxide surface

Nanostructured copper (II) oxide was formed on clean copper foil at room temperature using activated oxygen produced by RF discharge. CuO particles of approximately 10-20 nm were observed on the surface by Scanning Tunneling Microscopy (STM). The copper states and oxygen species of the model cupric oxide were studied by means of X-ray Photoelectron Spectroscopy (XPS). These oxide particles demonstrated abnormally high reactivity with carbon monoxide (CO) at temperatures below 100 °C. The XPS data showed that the interaction of CO with the nanostructured cupric oxide resulted in reduction of the CuO particles to Cu₂O species. The reactivity of the nanostructured cupric oxide to CO was studied at 80 °C using XPS in step-by-step mode. The initial reactivity was estimated to be 5 × 10⁻⁵ and was steadily reduced down to 5 × 10⁻⁹ as the exposure was increased. O1s spectral analysis allowed us to propose that the high initial reactivity was caused by the presence of non-lattice oxygen states on the surface of the nanostructured CuO. We established that reoxidation of the partially reduced nanostructured cupric oxide by molecular oxygen O₂ restored the highly reactive oxygen form on the surface. These results allowed us to propose that the nanostructured cupric oxide could be used for low temperature catalytic CO oxidation. Some hypotheses concerning the nature of the non-lattice oxygen species with high reactivity are also discussed.     

Oxidation of ultrathin indium layers on W(1 1 0)--a core-level photoemission study

We have studied the reaction of ultrathin In overlayers on W(1 1 0) with molecular oxygen at 300 K. At a coverage of 0.25 monolayers (ML) oxygen first chemisorbs dissociatively at free tungsten sites and oxidation of In occurs with some delay. At an In coverage of 1.2 ML complete oxidation of the closed overlayer is observed. Layers of 3 ML thickness first show rapid transformation from In to an In₂O₃-like species until an oxide monolayer is formed. Further oxidation occurs at much reduced rate. No oxygen-induced restructuring is observed for In at 300 K, in contrast to the response of Ag monolayers deposited on W(1 1 0).     

Oxidation of Zn in UHV environment at low temperature

Thermal oxidation of polycrystalline Zn foils at 5 × 10⁻⁷ Torr oxygen pressure and at room temperature, 50 °C, 70 °C, 90 °C and 110 °C was studied. In situ photoemission spectroscopy using synchrotron light with photon energy of 57 eV was used to monitor the formation of ZnO and to determine the thickness of the oxide overlayer. At the initial oxidation, the oxidation rate follows a two-stage logarithmic equation and later trends to saturate at a certain thickness depending on the oxidation temperature. The saturated thickness was found to increase with the oxidation temperature. The two-stage oxidation process may be governed by two kinds of space charge presumably formed in the thin oxide overlayer.     

X-ray photoelectron spectroscopic studies on oxidation behavior of nickel and iron aluminides under oxygen atmosphere at low pressures

Oxidation behaviors of NiAl, Ni₃Al, and FeAl under oxygen atmosphere at low pressures were studied by X-ray photoelectron spectroscopy (XPS). Clean surfaces of these aluminides were prepared by fracturing in an ultra high vacuum, and then the fractured surfaces were oxidized by exposing to high-purity oxygen at pressures up to 1.3 Pa without exposing to air. The oxides formed on NiAl and FeAl surfaces were Al₂O₃, whereas the oxide on Ni₃Al was NiAl₂O₄. Aluminum, nickel, and iron on clean surfaces were oxidized even at a pressure of 1.3 × 10⁻⁶ Pa. The oxidation evolves with an increase in the pressure of oxygen, and further oxidation of aluminum occurs prior to that of nickel or iron. The oxidation behaviors under such oxygen atmosphere were similar to those of the aluminides oxidized in air, and these behaviors could be predicted from thermodynamic consideration.     

Reactivities of ultrathin alumina films exposed to intermediate pressures of H2O: Substrate-mediated mechanism for growth and loss of surface order

The response of ordered ultrathin Al₂O₃ films on NiAl(1 1 0) and Ni₃Al(1 1 0) substrates to sequential exposures at varying pressures of H₂O between 10⁻⁷ Torr and 10⁻³ Torr, ambient temperature, was characterized by LEED, AES and density functional theory (DFT) calculations. In all cases, an increase in average oxide thickness, as determined by AES, was observed, consistent with a field-induced oxide growth mechanism. Ordered oxide films of initial average thicknesses of 7 Å and 12 Å grown on NiAl(1 1 0) achieved a limiting thickness of 17(1) Å, while films of initial thickness of 7 Å and 11 Å grown on Ni₃Al(1 1 0) achieved a limiting thickness of 12(1) Å. The LEED patterns for the thinner (7 Å) films were not observed after exposure to 10⁻⁵ Torr (NiAl(1 1 0)), or 10⁻⁴ Torr (Ni₃Al(1 1 0)). In contrast, LEED patterns for the films of greater initial thickness persisted after exposures to 10⁻³ Torr UHV. DFT calculations indicate an Al vacancy formation energy that is significantly greater (by ∼0.5 eV) on the surface that has the thicker oxide film, directly opposite to what may be naively expected. A simple coordination argument supports these numerical results. Therefore, the greater limiting oxide thickness observed on NiAl(1 1 0) demonstrates that the rate determining step in the oxide growth process is not Al removal from the metal substrate and transport across the oxide/metal interface. Instead, the results indicate that the determining factor in the oxide growth mechanism is the kinetic barrier to Al diffusion from the substrate bulk to the oxide/metal interface. The persistence of the LEED patterns observed for the films of greater initial oxide thickness indicates that the surface disorder generally observed for alumina films grown on aluminide substrates and exposed to intermediate pressures of H₂O is due to the growth of a disordered alumina layer over an ordered substrate, rather than to direct H₂O interaction with terrace sites.     

The reaction of oxygen and water with iron films studied by X-Ray photoelectron spectroscopy

Adsorption of oxygen on iron at ambient temperature and low pressure is shown by XPS to give a chemisorbed species and the oxide, Fe₂O₃. At low temperatures a further adsorbed species is detected, similar to the nickel-oxygen system. Correction of the intensity of the oxygen signal for depth results in an oxidation curve in agreement with reported work using other techniques, i.e. oxidation is fast until about four layers of oxide are formed, at an exposure of ca. 10² L, and then proceeds slowly to about ten layers. Adsorption of water vapour produces an overlayer less than one layer in depth at an exposure of 10⁵ L. Comparison of the overlayer depths calculated from the decrease in unoxidised iron signal intensity and from the increase in oxygen intensity gives good agreement for the thick oxide film produced by oxygen adsorption, but not for the thin overlayer formed by exposure to water vapour. This suggests a difference in packing of the ions in the thin overlayer compared to the arrangement in the bulk oxide.     

Active oxidation: Silicon etching and oxide decomposition basic mechanisms using density functional theory

The etching of silicon atom from the Si(1 0 0)-p(2 × 2) surface, i.e. the desorption of SiO molecules from this surface, either clean or pre-oxidized, is investigated at the density functional theory level. The reaction paths for desorption are given as a function of the initial oxidation state of the extracted silicon atom. The associated activation energies and the atomic configurations are discussed. Particularly, it is shown that desorption of SiO molecules takes place during conventional thermal oxide growth (∼2 eV activation) via non-oxidized silicon atoms. Further SiO extraction mechanisms of higher silicon oxidation states required higher temperatures. In particular, doubly oxidized silicon atoms (Si²⁺) are able to decompose with an activation of ∼4 eV which corresponds to the actual temperature where decomposition of oxides is observed. This confirms the statement that decomposition of oxide layer nucleates at the interface with silicon where Si²⁺ has been detected thanks to XPS experiment.     

X-ray photoelectron spectroscopic studies on initial oxidation of iron and manganese mono-silicides

Initial oxidation of iron and manganese mono-silicides (FeSi and MnSi) surfaces was studied by X-ray photoelectron spectroscopy (XPS). Clean surfaces of these silicides were prepared by fracturing in an ultra high vacuum, and then the fractured surfaces were oxidized by exposing to high-purity oxygen at pressures up to 1.3 Pa. For the clean FeSi surface, positive chemical shifts of the Fe 2p_3/2 and Si 2p peaks from elemental Fe and Si were 0.5 eV and 0.1 eV, respectively. For the clean MnSi surface, a negative chemical shift of the Si 2p peak from elemental Si was 0.1 eV. Iron on the FeSi surface was oxidized at an oxygen pressure of 1.3 Pa, whereas the silicon was oxidized under the pressure of 1.3 × 10⁻⁶ Pa, indicating that oxidation of silicon occurred prior to that of iron. Manganese and silicon on the MnSi were simultaneously oxidized in the range from 1.3 × 10⁻⁶ Pa to 1.3 × 10⁻³ Pa; however, over the pressure of 1.3 Pa, the oxidation of manganese occurs prior to that of silicon. These oxidation behaviors at low oxygen pressures were similar to those of the FeSi and MnSi fractured in air.