InGaN/GaN多量子阱的组分确定和晶格常数计算

采用金属有机化学气相沉积(MOCVD)技术以蓝宝石为衬底在n型GaN单晶层上生长了InGaN/GaN多量子阱结构外延薄膜，利用高分辨X射线衍射(HRXRD)，卢瑟福背散射/沟道(RBS/channeling)，以及光致发光(PL)技术对InGaN/GaN多量子阱结构薄膜分别进行了平均晶格常数计算、In原子替位率计算和In组分的定量分析.研究表明：InGaN/GaN多量子阱的水平和垂直方向平均晶格常数分别为a_epi=0.3195nm，c_epi=0.5198nm，In原子的替位率为99.3%，利用HRXRD和RBS/channeling两种分析技术计算In的组分分别是0.023和0.026，并与样品生长时设定的预期目标相符合，验证了两种实验方法的准确性；而用室温条件下的光致发光谱(PL)来计算InGaN/GaN多量子阱中In的组分是与HRXRD和RBS/channeling的实验结果相差很大，说明用PL测试In组分的方法是不适宜的. 关键词： InGaN/GaN多量子阱 高分辨X射线衍射 卢瑟福背散射/沟道 光致发光     

用卢瑟福背散射/沟道技术及高分辨X射线衍射技术分析不同Al和In含量的AlInGaN薄膜的应变

利用卢瑟福背散射/沟道技术对在蓝宝石衬底上用金属有机化学气相沉积方法生长的有GaN缓冲层(>2μm)的一系列不同Al和In含量的AlInGaN薄膜进行组分及结晶品质的测量；并结合高分辨X射线衍射技术，通过对AlInGaN的对称(0002)面，及非对称(1015)面的θ—2θ扫描及倒空间扫描，可以精确测定AlInGaN外延层的晶格常数及水平和垂直方向的应变.实验结果表明AlInGaN 薄膜中不同含量Al和In对其应变有较大的影响，结合Vegard定理，对这一现象给出了理论的解释. 关键词： AlInGaN 高分辨X射线衍射 卢瑟福背散射/沟道 弹性应变     

Mg+注入对GaN晶体辐射损伤的研究

在蓝宝石衬底上通过金属有机物化学气相沉积(metal-organic chemical vapor deposition，MOCVD)方法外延生长的GaN薄膜具有良好的结晶品质，χ_min达到2.00%. 结合卢瑟福背散射/沟道(Rutherford backscattering/channeling，RBS/C)和高分辨X射线衍射(high-resolution X-ray diffraction，HXRD)的实验测量，研究了不同剂量和不同角度Mg⁺注入GaN所造成的辐射损伤. 实验结果表明，随注入剂量的增大，晶体的辐射损伤也增大，注入剂量在1×10¹⁵atom/cm²以下，χ_min小于4.78%，1×10¹⁶atom/cm²是Mg⁺注入GaN的剂量阈值，超过这个阈值，结晶品质急剧变差，χ_min达到29.5%；随机注入比沟道注入的辐射损伤大，且在一定范围内随注入角度的增大，损伤也增大，在4×10¹⁵atom/cm²剂量下偏离〈0001〉沟道0°，4°，6°，9°时的χ_min(%)分别为6.28，8.46，10.06，10.85；经过700℃/10min+1050℃/20s两步退火和1000℃/30s高温快速退火后，晶体的辐射损伤都有一定程度的恢复，而且1000℃/30s高温快速退火的效果更好，晶体的辐射损伤可以得到更好的恢复. 关键词： GaN 卢瑟福被散射/沟道 高分辨X射线衍射 辐射损伤     

蓝宝石衬底上生长的Ga2+xO3-x薄膜的结构分析

利用卢瑟夫背散射/沟道技术和金属有机化学气相沉积方法, 对蓝宝石衬底上 在不同温度、压强下生长的Ga_2+xO_3-x薄膜进行结构和结晶品质的测量与分析; 并结合高分辨X射线衍射分析技术, 通过对其对称(402)面的θ–2θ及ω扫描, 确定了其结构类型及结晶品质. 实验表明: 在相同的生长温度(500 ℃)下, 结晶品质随压强的下降而变好, 生长压强为15 Torr (1 Torr=133.322 Pa)的样品其结晶品质最好, 沿轴入射之比χ_min值为14.5%; 在相同的生长压强(15 Torr)下, 结晶品质受生长温度的影响不大, 所以, 生长温度不是改变结晶品质的主要因素; 此外, 在相同的生长条件下制备的样品, 分别经过700, 800和900 ℃退火后, 其结晶品质随退火温度的变化而变化. 退火温度为800 ℃的样品的结晶品质最好, χ_min值为11.1%; 当退火温度达到900 ℃时, 样品部分分解; 经热处理的样品其X射线衍射谱中有一个强的Ga₂O₃ (402)面衍射峰, 其半峰全宽为0.5°, 表明该Ga₂O₃外延膜是(402)择优取向. 关键词： 氧化镓 卢瑟夫背散射 X射线衍射 结晶品质     

用卢瑟福背散射/沟道技术研究ZnO/Zn0.9Mg0.1O/ZnO异质结的弹性应变

利用卢瑟福背散射/沟道技术对射频等离子体辅助分子束外延法生长在蓝宝石衬底上的ZnO/Zn_0.9Mg_0.1O/ZnO异质结进行了组分分析，并得到了异质结弹性应变随深度的变化，应变由界面向表面逐渐释放，并由负变正，且在ZnO与Zn_0.9Mg_0.1O界面处轻微增大.负的应变是由于ZnO与衬底的晶格失配和热失配，而逐渐变为正值是Zn_0.9Mg_0.1O与ZnO的晶格常数差异及弹性应变的 关键词： 异质结 卢瑟福背散射/沟道 弹性应变 ZnMgO     

Ge(001)衬底上分子束外延生长高质量的Ge1-xSnx合金

Ge_1-xSn_x是一种新型IV族合金材料, 在光子学和微电子学器件研制中具有重要应用前景. 本文使用低温分子束外延(MBE)法, 在Ge(001)衬底上生长高质量的Ge_1-xSn_x合金, 组分x分别为1.5%, 2.4%, 2.8%, 5.3%和14%, 采用高分辨X射线衍射(HR-XRD)、卢瑟福背散射谱(RBS) 和透射电子显微镜(TEM)等方法表征Ge_1-xSn_x合金的材料质量. 对于低Sn组分(x≤ 5.3%)的样品, Ge_1-xSn_x合金的晶体质量非常好, RBS的沟道/随机产额比(χ_min)只有5.0%, HR-XRD曲线中Ge_1-xSn_x衍射峰的半高全宽(FWHM)仅100' 左右. 对于x=14%的样品, Ge_1-xSn_x合金的晶体质量相对差一些, FWHM=264.6'. 关键词： 锗锡合金 锗 分子束外延     

用同步辐射X射线衍射技术分析GaN/Si外延膜的结构与应变

选用有AlN和AlGaN缓冲层的GaN/Si作为测试样品,采用同步辐射X射线衍射(SRXRD)技术对样品外延膜(GaN)的几何结构、晶格常量及其应变进行了分析.结果表明,同步辐射X射线衍射实验可以作为一种有效的技术手段,测试固体结构及应变.     

氢化物气相外延生长的GaN膜中的应力分析

对在c面蓝宝石上用氢化物气相外延法(HVPE)生长的六方相纤锌矿结构的GaN膜中的应力进行了分析。高分辨X射线衍射(002)面和(102)面摇摆曲线扫描(半高宽数值分别为317和358角秒)表明生长的GaN膜具有较好的晶体质量。利用高分辨X射线衍射技术准确测量了制备的GaN膜的晶格常数,并计算得到GaN膜中面内双轴应变和面外双轴应变分别为3.37×10-4和-8.52×10-4,等静压应变为-7.61×10-5。拉曼光谱和激光光致发光谱测试表明HVPE-GaN外延膜具有较好的光学特性,利用拉曼光谱的E2模式特征峰和激光光致发光谱中近带边发射峰的频移定量计算了外延膜中的面内双轴压应力和等静压应力。两种方法得到的面内双轴压应力较为相符。     

常压MOCVD生长ZnO薄膜及其性质

用常压MOCVD在蓝宝石 (0 0 0 1)面上生长了氧化锌 (ZnO)薄膜。用AFM、室温PL谱、Hall测量、X射线双晶衍射、卢瑟福背散射 /沟道技术等分析方法研究了样品的表面形貌、结构性能、发光性能和电学性能。AFM分析结果显示 ,薄膜呈六角柱状结晶 ,表面平整 ,粗糙度 (RMS)为 6 .2 5 7nm ,平均晶粒直径达 1.895 μm。室温PL测量该样品在 380nm处有很强的近带边发射 ,半峰全宽为 15nm。使用Hall测量检查了薄膜的电学性质。室温下该样品的载流子浓度为 2× 10 17cm-3 ,迁移率为 75cm2 ·V-1·s-1。用X射线双晶衍射和卢瑟福背散射 /沟道效应研究了薄膜的结晶质量 ,样品的双晶衍射ω扫描半峰全宽为 0 .0 4° ,沟道效应的最小产额比χmin为 3.1%。     

Si1－xGex/Si量子阱发光材料的分子束外延生长及其结构研究

采用固源Si分子束外延,在较高的生长温度于Si(100)衬底上制备出Si1－xGex/Si量子阱发光材料。发光样品的质量和特性通过卢瑟福背散射、X射线双晶衍射及光致发光评估。背散射实验中观察到应变超晶格的反常沟道效应;X射线分析表明材料的生长是共度的、无应力释放的,结晶完整性好。低温光致发光主要是外延合金量子阱中带边激子的无声发射和横光学声子参与的激子复合。并讨论了生长温度对量于阱发光的影响。     

Photoluminescence and persistent photoconductivity of Al<Subscript>x</Subscript>Ga<Subscript>1-x</Subscript>N/GaN heterostructures

We have investigated the optical properties of Al_xGa_1-xN/GaN heterostructures (x=0.08, 0.15, 0.33) grown by metal organic chemical vapor deposition on sapphire using photoluminescence (PL) and persistent photoconductivity (PPC) measurements. For the Al_xGa_1-xN/GaN heterostructures (HS) containing high Al composition, we observed an anomalous temperature-dependent photoluminescence and persistent photoconductivity effects. These results show a strong dependence of the physical properties of Al_xGa_1-xN/GaN HS on the Al content and layer thickness. The anomalous temperature-dependent PL is usually attributed to the presence of carrier localization states. These phenomena are explained based on the alloy compositional fluctuations in the Al_xGa_1-xN/GaN HS. From the PPC measurements, the photocurrent (PC) quenching was observed for Al_xGa_1-xN/GaN HS and it is explained by the metastable states formed in the underlying GaN layer. Also, the mechanisms behind the PC quenching and PPC phenomena are explained in detail. PACS 72.20.Jv; 72.40.+w; 78.55.Cr     

On the characteristics of AlGaN films grown on (111) and (001) Si substrates

High Al-content Al_xGa_1−xN films were deposited on (001) and (111) Si substrates at 1000 °C using high temperature AlN buffer layers. Experimental results show that Al_xGa_1−xN films grown on (111) Si substrates exhibit better crystalline quality than that in the films deposited on (001) Si substrates. Cracks were found in the high Al-content Al_xGa_1−xN/(111) Si samples but they were not observed in the Al_xGa_1−xN films grown on (001) Si substrates having the same film thicknesses and Al compositions. Based upon the results of X-ray diffraction (XRD) and transmission electron microscopy (TEM), it appears that mono-crystalline Al_xGa_1−xN films were achieved on (111) Si substrates while columnar structure was observed in the Al_xGa_1−xN/(001) Si samples. According to the depth profiles of Al_xGa_1−xN/Si samples using secondary ion mass spectroscopic (SIMS) analyses, enhanced Al inter-diffusion in the Al_xGa_1−xN/(001) Si samples was identified. Room temperature (RT) photoluminescence (PL) measurements of the Al_xGa_1−xN (x≦0.10)/(111) Si samples exhibit strong near band edge luminescence. The PL emission linewidth was found to decrease with the decrement of Al-content.     

Tight-binding studies of the electronic band structure of GaAlN and GaInN alloys

The semi-empirical tight-binding (TB) approach with an sp³s^* orbital basis is used to investigate the electronic band structure of cubic Ga_1-xAl_xN and Ga_1-xIn_xN alloys. The spin–orbit splitting in the Hamiltonian and first- and second-neighbour interactions are considered to explore the gap evolution as a function of the concentration x. The TB parameters used in the studies were obtained within the virtual crystal approximation using those of the binary compounds AlN, GaN, and InN. The binary parameters are calculated by applying an empirical TB Hamiltonian taking into account first- and second-neighbour interactions. A direct to indirect gap transition is obtained for Ga_1-xAl_xN at x=0.60. In contrast, the Ga_1-xIn_xN alloys exhibit direct-gap characteristics as a consequence of being formed by the direct-gap binary compounds GaN and InN. PACS 71.20.Nr; 71.23.-k; 71.55.Eq     

Properties of AlyGa1-yN/AlxGa1-xN/AlN/GaN Double-Barrier High Electron Mobility Transistor Structure

Electrical properties of Al_yGa_1-yN/Al_xGa_1-xN/AlN/GaN structure are investigated by solving coupled Schrödinger and Poisson equation self-consistently. Our calculations show that the two-dimensional electron gas (2DEG) density will decrease with the thickness of the second barrier (Al_yGa_1-yN) once the AlN content of the second barrier is smaller than a critical value y_c, and will increase with the thickness of the second barrier (Al_yGa_1-yN) when the critical AlN content of the second barrier y_c is exceeded. Our calculations also show that the critical AlN content of the second barrier y_c will increase with the AlN content and the thickness of the first barrier layer (Al_xGa_1-xN).     

Structural and optical properties of Al1-xInxN epilayers on GaN template grown by metalorganic chemical vapor deposition

This paper reports that Al1 xInxN epilayers were grown on GaN template by metalorganic chemical vapor de-position with an In content of 7%-20%. X-ray diffraction results indicate that all these Al1 xInxN epilayers have a relatively low density of threading dislocations. Rutherford backscattering/channeling measurements provide the exact compositional information and show that a gradual variation in composition of the Al1 xInxN epilayer happens along the growth direction. The experimental results of optical reflection clearly show the bandgap energies of Al1 xInxN epilayers. A bowing parameter of 6.5 eV is obtained from the compositional dependence of the energy gap. The cathodoluminescence peak energy of the Al1 xInxN epilayer is much lower than its bandgap, indicating a relatively large Stokes shift in the Al1 xInxN sample.     

Two-dimensional electron gas densities in AlGaN/AlN/GaN heterostructures

The dependence of two-dimensional electron gas (2DEG) density and distribution in an Al_xGa_1-xN/AlN/GaN heterostructure on the thicknesses of the Al_xGa_1-xN barrier layer and the AlN interfacial layer are investigated theoretically. A competitive contribution of the AlGaN and AlN layers to the 2DEG density is revealed. For an AlN interfacial layer thinner than a critical value d_cAlN, the 2DEG density is dominated by the AlGaN barrier and the 2DEG density increases with the increase of the AlGaN barrier thickness, as in the case of a simple AlGaN/GaN heterostructure. While the AlN interfacial layer will take the dominant contribution to the 2DEG density as its thickness exceeds d_cAlN. In this case, the increase of AlGaN barrier layer thickness leads to the decrease of the 2DEG density. Detailed calculations show that the critical AlN thickness increases with the increase of Al content in the AlGaN barrier. PACS 85.30.De; 73.40.Kp; 02.60.Cb     

Investigation of AlInN HEMT structures with different AlGaN buffer layers grown on sapphire substrates by MOCVD

We investigate the structural and electrical properties of Al_xIn_1–xN/AlN/GaN heterostructures with AlGaN buffers grown by MOCVD, which can be used as an alternative to AlInN HEMT structures with GaN buffer. The effects of the GaN channel thickness and the addition of a content graded AlGaN layer to the structural and electrical characteristics were studied through variable temperature Hall effect measurements, high resolution XRD, and AFM measurements. Enhancement in electron mobility was observed in two of the suggested Al_xIn_1?xN/AlN/GaN/Al_0.04Ga_0.96N heterostructures when compared to the standard Al_xIn_1–xN/AlN/GaN heterostructure. This improvement was attributed to better electron confinement in the channel due to electric field arising from piezoelectric polarization charge at the Al_0.04Ga_0.96N/GaN heterointerface and by the conduction band discontinuity formed at the same interface. If the growth conditions and design parameters of the Al_xIn_1?xN HEMT structures with AlGaN buffers can be modified further, the electron spillover from the GaN channel can be significantly limited and even higher electron mobilities, which result in lower two-dimensional sheet resistances, would be possible.     

Influence of AlN buffer layer thickness on structural properties of GaN epilayer grown on Si (111) substrate with AlGaN interlayer

We present the growth of GaN epilayer on Si(111) substrate with a single AlGaN interlayer sandwiched between the GaN epilayer and AlN buffer layer by using the metalorganic chemical vapour deposition.The influence of the AlN buffer layer thickness on structural properties of the GaN epilayer has been investigated by scanning electron microscopy,atomic force microscopy,optical microscopy and high-resolution x-ray diffraction.It is found that an AlN buffer layer with the appropriate thickness plays an important role in increasing compressive strain and improving crystal quality during the growth of AlGaN interlayer,which can introduce a more compressive strain into the subsequent grown GaN layer,and reduce the crack density and threading dislocation density in GaN film.     

高组份Al值的AlxGa1-x As和AlxGa1-x As/GaAs/AlxGa1-xAs/GaAs多层结构的MOCVD生长

用自制常压MOCVD系统,在半绝缘GaAs衬底上生长高Al组份Al_xGa_1-xAs（其x值达0.83）,和Al_xGa_1-xAs/GaAs/Al_xGa_1-xAs/GaAs多层结构,表面镜面光亮。生长层厚度从几十到十几μm可控,测试表明外延层晶格结构完整,x值调节范围宽,非有意掺杂低,高纯GaAs外延层载流子浓度n_300K=1.7×10¹⁵cm^-3,n_77K=1.4×10¹⁵cm^-3,迁移率μ_300K=5900cmcm²/V.S,μ_77K=55500cm²/V.S。用电子探针,俄歇能谱仪测不出非有意掺杂的杂质,各层间界面清晰平直。 对GaAs,AlGaAs生长层表面缺陷,衬底偏角生长温度及其它生长条件也进行了初步探讨。     

Analysis of GaN epilayers on sapphire substrates with GaN and AlN sublayers

The features and results of X-ray diffraction analysis of GaN films are presented. The films are grown by metalorganic vapor-phase epitaxy on c-plane sapphire substrates using GaN or AlN nucleation layers deposited at a low temperature. Measurements of the twist angle and concentrations of Al _x Ga_1-x N solid solutions are discussed in detail.