The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Residual stress and optical properties of fully rod-like poly(p-phenylene pyromellitimide) in thin films: Effects of soft-bake and thermal imidization history

A soluble poly(amic acid) precursor solution of fully rod-like poly(p-phenylene pyromellitimide) (PMDA-PDA) was spin cast on silicon substrates, followed by soft bake at 80–185°C and subsequent thermal imidization at various conditions over 185–400°C in nitrogen atmosphere to be converted to the polyimide in films. Residual stress generated at the interface was measured in situ during imidization. In addition, the imidized films were characterized in the aspect of polymer chain orientation and ordering by prism coupling and X-ray diffraction. The soft-baked precursor film revealed a residual stress of 16–28 MPa at room temperature, depending on the soft bake condition: higher temperature and longer time in the soft bake gave higher residual stress. The stress variation in the soft-baked precursor film was not significantly reflected in the final stress in the resultant polyimide film. However, the residual stress in the polyimide film varied sensitively with variations in imidization process parameters, such as imidization temperature, imidization steps, heating rate, and film thickness. The polyimide film exhibited a wide range of residual stress, −7 MPa to 8 MPa at room temperature, depending on the imidization condition. Both rapid imidization and low-temperature imidization generated high stress in the tension mode in the polyimide film, whereas slow imidization as well as high temperature imidization gave high stress in the compression mode. Thus, a moderate imidization condition, a single- or two-step imidization at 300°C for 2 h with a heating rate of < 10 K/min was proposed to give a relatively low stress in the polyimide film of < 10 μm thickness. However, once a precursor film was thermally imidized at a chosen process condition, the residual stress–temperature profile was insensitive to variations in the cooling process. All the films imidized were optically anisotropic, regardless of the imidization history, indicating that rod-like PMDA-PDA polyimide chains were preferentially aligned in the film plane. However, its degree of in-plane chain orientation varied on the imidization history. It is directly correlated to the residual stress in the film, which is an in-plane characteristic. For films with residual stress in the tension mode, higher stress films exhibited lower out-of-plane birefringence, that is, lower in-plane chain orienta-tion. In contrast, in the compression mode, higher stress films showed higher in-plane chain orientation. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 1261–1273, 1998     

Structural and compositional effects on thermal expansion behavior in polyimide substrates of varying thicknesses

Polyimide films with thicknesses ranging from 6 μm to 80 μm were prepared with a solvent casting method to explore film thickness effects on the in-plane thermal expansion coefficient (CTE). In the case of polyimide films composed of bulky and flexible molecular units, CTE is consistent regardless of film thickness. In contrast, films with rigid and planar molecular structure show CTE increase according to the increase of film thickness up to 40–50 μm, which then plateau for thicker films. It is apparent that the film thickness dependent thermal expansion originates from complex effects of molecular orientation, charge transfer complex formation, and crystal formation as a function of film thicknesses, through characterization on UV–Vis absorption, crystalline structure, glass transition behavior, and optical retardation. These results provide insight into the design of polymer structures for flexible display substrates that require appropriate CTE values.     

Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films

The mechanism of negative coefficient of thermal expansion (CTE) generation for non-stretched polyimide (PI) films is proposed in this work. Negative CTE behavior was observed in some miscible binary blend films composed of a major fraction of a rod-like semi-crystalline PI derived from pyromellitic dianhydride (PMDA) with p-phenylenediamine (PDA) and flexible PIs based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) whereas homo PMDA/PDA PI film shows a considerably low but a positive CTE value. The results suggest that the negative CTE generation is related to not only a considerably high extent of in-plane orientation of the PMDA/PDA chains but also to the crystallinity of the blends. The present work revealed that some other PIs, a poly(ester imide), and a polybenzoxazole system also display negative CTE and these systems also possess extremely high extents of in-plane chain orientation without exception. In addition to CTE, the morphologies were monitored as a function of imidization temperature for two PI systems, PMDA/2,2′-bis(trifluoromethyl)benzidine and PMDA/m-tolidine by wide-angle X-ray diffraction, FT-IR spectroscopy, birefringence, and film density measurements. The results suggested that the negative CTE phenomenon occurs when PI films possess very high extents of in-plane orientation and a less crystalline morphology simultaneously, thereby significant thermal expansion can be allowed to the thickness direction.     

Optical anisotropy in solution-cast film of cellulose triacetate

The out-of-plane birefringence and its wavelength dispersion are studied employing solution-cast films of cellulose triacetate (CTA). In solution-cast process, CTA molecules are induced to align in the film plane. Although refractive index is the lowest in the oriented direction for the CTA films stretched more than 110 %, refractive index is found to be the lowest in the normal direction for the unstretched cast film. Attenuated total reflection measurements reveal that in-plane alignment of the acetyl group which provides strong polarizability anisotropy is responsible for the phenomenon. Furthermore, the out-of-plane birefringence is found to increase with increasing wavelength, i.e. extraordinary wavelength dispersion, whereas a stretched CTA film shows ordinary wavelength dispersion. The level of the out-of-plane birefringence in cast films depends on the preparation conditions, which is predictable considering the evaporation rate. Moreover, it is demonstrated for the first time that the out-of-plane birefringence and its wavelength dispersion can be modified by addition of a certain plasticizer such as tricresyl phosphate (TCP). During the evaporation, TCP molecules orient in the film plane accompanying the orientation of CTA chains by intermolecular orientation correlation, called nematic interaction. This technique will widen the scope of material design of retardation films because there are numerous liquid compounds having strong polarizability anisotropy.     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.     

Chain orientation and anisotropies in optical and dielectric properties in thin films of stiff polyimides

Thin films of poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA), prepared by thermal imidization of the precursor poly(amic acid) on substrates, have been investigated by optical waveguide, ultraviolet-visible (UV-VIS), infrared (IR), and dielectric spectroscopies. The polyimide films exhibit an extraordinarily large anisotropy in the refractive indices with the in-plane index n_∥ = 1.806 and the out-of-plane index n_⊥ = 1.589 at 1064 nm wavelength. No discernible effect of the film thickness on this optical anisotropy is found between films of ca. 2.1 and ca. 7.8 μm thickness. This large birefringence is attributed to the preferential orientation of the biphenyltetracarboximide moieties with their planes parallel to the film surface, coupled with the strong preference of BPDA-PDA chains to align along the film plane. The frequency dispersion of the in-plane refractive index n_∥ is consistent with the results calculated by the Lorentz–Lorenz equation from the UV-visible spectrum exhibiting several absorption bands in the 170–500 nm region. The contribution from the IR absorption in the range 7000–400 cm,^?1 computed by the Spitzer-Kleinmann dispersion relations from the measured spectra, adds ca. 0.046 to the in-plane refractive index n_∥. Tilt-angle–dependent polarized IR results indicate nearly the same increase for the out-of-plane index n_⊥. Application of the Maxwell relation then leads to the out-of-plane dielectric constant ε^⊥ ? 2.7 at 1.2 × 10¹³ Hz, as compared with the measured value of ca. 3.0 at 10⁶ Hz. Assuming this small difference to remain the same for the in-plane dielectric constants ε_∥, we obtain a very large anisotropy in the dielectric properties of these polyimide films with the estimated in-plane dielectric constant ε_∥ ? 3.4 at 1.2 × 10¹³ Hz, and ε_∥ ? 3.7 at 10⁶ Hz. © 1992 John Wiley & Sons, Inc.     

Effects of chemical structure and precursor on optical properties,thermo-mechanical properties,and molecular orientation and order of thin films of stiff aromatic polyimides

Thin films of rigid poly(p-phenylene pyromellitimide) (PMDA-PDA) and semi-rigid poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA), prepared by thermal imidization of the respective poly(amic acid) and poly(amic ethyl ester) precursors, were characterized with respect to their optical, thermomechanical and structural properties. Both polyimides exhibit an unusually large anisotropy between the in-plane and out-of-plane refractive indices, with n ranging from 0.198 to 0.216 for PMDA-PDA and from 0.230 to 0.242 for BPDA-PDA, nearly independent of the nature of the initial polyimide precursor, film thickness, and film preparation method. PMDA-PDA films exhibit low coefficients of thermal expansion (CTE's) of 6.5 and 8.2 ppm/C for the acid-derived and the ester-derived polyimides, respectively. In comparison, the BPDA-PDA films show CTE values of 4.3 and 18.0 for the acid-derived and ester-derived samples, respectively, despite the small differences in their optical anisotropies. Wide-angle x-ray diffraction patterns obtained in reflection and transmission for the various samples reveal a strong in-plane chain orientation for both PMDA-PDA and BPDA-PDA polyimides, with somewhat better intermolecular packing order for the ester-derived polyimide films. These effects of chemical structure and precursor on properties and structures of the polyimide films are discussed in light of recent theoretical considerations of semiflexible polymers.Dedicated to Prof E. W. Fischer on the occasion of his 65th birthday     

A rod‐like fluorinated polyimide as an in‐plane birefringent optical material 2: Control of optical retardation using spontaneous molecular orientation

Following previous work, a fluorinated polyimide with a rod‐like structure has been investigated as an in‐plane birefringent optical material whose birefringence and thickness can be precisely controlled. Poly(amic acid) films fixed in a metal frame by two sides and thermally cured without any drawing resulted in a polyimide film with an in‐plane birefringence (Δn) larger than 0.1 at 1543 nm. The optical retardation, which is defined as the product of Δn and the film thickness, was controlled by varying the curing and post‐annealing temperatures and by using reactive ion etching. In situ measurements of the tensile stress and the generated retardation showed that the initial orientation at below 200°C was due to the large tensile stress caused by the film shrinkage during imidization and that the increased Δn at higher temperatures was caused by the spontaneous orientation of the polyimide molecules. The curing temperature dependence of refractive indices, optical transmittance in the visible and near‐infrared region, and the wavelength dispersion of retardation of the in‐plane birefringent polyimide films are also reported. Copyright © 1999 John Wiley & Sons, Ltd.     

Measurement of anisotropic refractive indices of free-standing polymer film

A new technique has been developed to measure the optical refractive indices in the parallel and perpendicular directions to the film surfaces and applied to measure the refractive indices of free-standing polymer films. The refractive indices were obtained by measuring the reflectivity as a function of the incident angle. The angle dependence of the reflectivity which results from the interference of the light beam reflected from the front and rear interfaces of the film was analysed by means of the Fresnel equation. This technique can be used to measure the refractive indices in three major axes, i.e. one out-of plane axis and two in-plane axes of the sample. This technique gives values for the refractive indices and the thickness simultaneously with an accuracy comparable to that measured by optical wave-guide technique. The validity of the technique has been tested with polymer films of known refractive indices such as poly(methyl methacrylate) and polyimide (PMDA-ODA).     

The molecular structure of poly(biphenyl dianhydride-p-phenylenediamine) polyimide thin films by infrared spectroscopy: Thickness dependence of structure in the nano- to micrometer range

The molecular structure of poly[biphenyl dianhydride-p-phenylenediamine] (BPDA–PDA) polyimide in ultrathin (3–300 nm) films on silicon has been characterized by polarized infrared spectroscopy in conjunction with ellipsometry and X-ray reflectivity measurements. In spite of the high degree of crystalline packing of the polymer chains, the results show that an unexpected and significant content of imide rings exhibit local structural perturbations, including out-of-plane twisting. Further, the fraction of perturbed rings increases with increasing film thickness while, in contrast, the high degree of in-plane uniaxial film symmetry and planar stacking of the chains remain constant with thickness. These results reveal a new structural aspect of localized ring disorder that arises within the otherwise well-ordered, chain-stacked structure of BPDA–PDA polyimide films. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 1247–1260, 1998     

Nanoindentation and optical properties of poly(4,4′-oxydiphenylene p-phenylene pyromellitimide) copolyimide thin films according to the p-phenylene diamine content

Poly(p-phenylene pyromellitimide) (PMDA-PDA), poly(oxydiphenylene pyromellitimide) (PMDA-ODA), and poly(4,4′-oxydiphenylene p-phenylene pyromellitimide) random copolyimide thin films with different p-phenylene diamine (PDA) contents were prepared. Nanoindentation was used to characterize the mechanical properties (hardness and modulus), and a prism coupler was used for measuring the optical properties (refractive index and birefringence). The hardness and modulus were calculated from curves of the nanoindentation load versus the displacement. The effect of the PDA content on the hardness and modulus was studied. The hardness of the polyimide thin films varied from 0.248 to 0.613 GPa, and the modulus varied from 3.78 to 6.75 GPa at a load of 0.127 mN. The hardness and modulus increased with increasing PDA content, whereas the penetration depth and plastic deformation decreased. As the load increased, the penetration depth increased. The hardness of PMDA-ODA films remained constant, whereas that of PMDA-PDA and PMDA-ODA/PDA films decreased with increasing load. The in-plane refractive index varied from 1.7219 to 1.8244, and the out-of-plane refractive index varied from 1.6390 to 1.5827, as a function of the PDA content. The birefringence varied with the PDA content from 0.0829 to 0.2417. The morphological structure of the prepared polyimide thin films was investigated with wide-angle X-ray diffraction. The mechanical properties and optical properties of the polyimide thin films were strongly dependent on the changes in the morphological structure, which originated from the variation of the composition. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2202–2214, 2004     

In-plane orientation of polyimide

As a nondestructive method of evaluation, we have used integrated optics to investigate thin films (<8 μm) of polyamic acid and polyimide as a function of molecular weight, initial imidization temperature, method of imidization, and annealing treatment. Polyamic acid films were found to exhibit a large optical anisotropy, indicating preferential alignment of the long axis of the molecule in the plane of the film. Imidization increased the birefringence of the film by a factor of 2.5 and reduced the film thickness. The only parameter that was found to effect the anisotropy of the films was the method of imidization. Chemical imidization was found to increase the birefringence by a factor of 3, indicative of a higher degree of molecular orientation parallel to the film surface. This effect was not observed in thicker (>25-μm) films using x-ray diffraction where the orientation function was found to be independent of the method of imidization.     

Effect of orientation on the relative dispersion of PMDA-ODA polyimide and polypropylene

The relative dispersion of birefringence, D_b, is determined for isotactic polypropylene and Kapton HA PMDA-ODA polyimide films. D_b is then used to identify the dependence of dispersion on the orientation of polymers and is interpreted in terms of fringe jumping. Optical relationships between the in-plane birefringence and wavelength are formulated to predict the in-plane birefringence of oriented Kapton HA PMDA-ODA polyimide films at any wavelength. These relations can be used for the direct comparison of the in-plane birefringence of Kapton PMDA-ODA polyimide films obtained from different optical techniques (i.e., polarized microscopy, polarized refractometry, wave guide coupling, etc.). © 1995 John Wiley & Sons, Inc.     

Molecular orientation of rigid‐rod polyimide films characterized by polarized attenuated total reflection/fourier transform infrared spectroscopy

The variations in the molecular orientation of uniaxially drawn rigid‐rod polyimide films were systematically characterized in all three dimensions with polarized attenuated total reflection/Fourier transform infrared spectroscopy. The second‐order orientation coefficients were directly deduced from the anisotropy in IR absorptions of particular bands. With the draw ratio increasing, the state of the molecular orientation changed from being nearly planar to completely uniaxial via biaxial orientation, and the degree of orientation was much larger than that of a semirigid polyimide having an ether linkage at the same draw ratio, which originated from the rigid‐rod structure. In addition, the imide planes were rotationally oriented to the out‐of‐plane direction of the film geometry. Furthermore, the relationship between the molecular chain orientation and the in‐plane birefringence in the biaxial orientation state was examined. The intrinsic birefringence was estimated from biaxial orientation films to be 0.33 at a wavelength of 1307 nm. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 418–428, 2003     

含酰胺结构超低膨胀聚酰亚胺薄膜的热膨胀行为

采用联苯二酐与3种含酰胺结构二胺制备了具有不同取代基团的聚酰胺-酰亚胺薄膜, 考察了酰胺结构对薄膜力学、 耐热及尺寸稳定性的影响, 研究了聚集态结构与薄膜热膨胀行为的关系和规律. 该系列薄膜具有超高强度和优异的耐热性能, 拉伸强度高达280.5 MPa, 玻璃化转变温度在389~409 ℃, 并在30~300 ℃温度范围内表现出超低负膨胀, 热膨胀系数(CTE, ppm/℃, 即10 ⁶ cm·cm ^-1·℃ ^-1)在-3.05~-1.74 ppm/℃之间. 聚集态分析结果表明, 酰胺结构使分子链间形成了强氢键相互作用, 分子链在薄膜面内方向高度有序取向, 并在膜厚方向堆积更为紧密, 使薄膜表现出热收缩现象. 通过不同体积大小的取代基团进一步调控分子链间相互作用及排列堆积, 可实现薄膜在高温下近乎零尺寸形变, 为设计制备超低膨胀聚合物基板材料提供了新思路.     

Thickness dependence of the structural,mechanical and electrical properties of Ni films deposited on polyimide by ion beam‐assisted deposition (IBAD)

Ni thin films with different thicknesses were deposited on pre‐treated polyimide substrates by ion beam‐assisted deposition. Dependence of structural, mechanical and electrical properties of the Ni films on their thickness was investigated. The results showed a clear correlation between film properties and film thickness. The inter‐diffusion at the interface regions of the films with different deposition time were demonstrated by transmission electron microscopy and X‐ray photoelectron spectroscopy. With increasing film thickness, surface roughness of the Ni films firstly decreased and then increased, while the grain size gradually increased. Residual stress of the Ni thin films decreased with increasing Ni film thickness up to 202 nm and then slightly increased as the film thickness further increased. Resistivity decreased, and temperature coefficient of resistivity (TCR) increased with increasing film thickness due to the enhancement of crystallization degree and the increase in grain size. The decrease in surface roughness and residual stress also contributed to the decrease of resistivity and the increase of TCR of the films. An optimal film thickness is suggested, which yielded a relatively high TCR value and low levels of both surface roughness and residual stress. Copyright © 2012 John Wiley & Sons, Ltd.     

Optical anisotropy of polymeric films measured by waveguide propagation mode determination

Extruded thin films of a liquid-crystalline charge-conjugated rigid-rod polymer poly(p-phenylenebenzobisthiazole), PBT, and a semicrystalline thermoplastic polyethylene-terephthalate (Mylar) were fabricated and examined for film thickness, refractive index, and linear attenuation coefficient. Optical waveguide modes were successfully induced on the polymeric films using a prism coupler at λ = 633 and 1300 nm. Highly consistent thickness values were obtained for the polymeric films. In addition, the anisotropic nature of the optical properties was determined using TE and TM propagation modes. A refractive index as high as 2.3 was observed on PBT film. The refractive index data suggested that the PBT and Mylar films were optically anisotropic with refractive indices n? (out-of-plane) invariably smaller than n∥ (in-plane). Large anisotropy was also discovered in the linear attenuation coefficient α, with α_∥/α_? ≈ 50 for the Mylar films. Complementary polarimetric and spectroscopic interference measurements were also applied to investigate the optical anisotropy of the extruded polymeric films. © 1992 John Wiley & Sons, Inc.     

Anisotropic thermal expansion behavior of thin films of polymethylsilsesquioxane, a spin-on-glass dielectric for high-performance integrated circuits

Thin films of poly(methylsilsesquioxane) (PMSSQ) are candidates for use as interdielectric layers in advanced semiconductor devices with multilayer structures. We prepared thin films of PMSSQ with thicknesses in the range 25.0-1151.0 nm by spin-casting its soluble precursor onto Si and GaAs substrates with native oxide layers and then drying and curing the films under a nitrogen atmosphere at temperatures in the range 250-400 degrees C. The out-of-plane thermal expansion coefficient alpha(perpendicular) of each film was measured over the temperature range 25-200 degrees C using spectroscopic ellipsometry and synchrotron X-ray reflectivity, while the in-plane thermal expansion coefficient alpha(parallel) of each film was determined over the temperature range 25-400 degrees C by residual stress analysis. PMSSQ films cured at higher temperatures exhibited reduced thermal expansion, which is attributed to the denser molecular packing and higher degree of cross-linking that arises at higher temperatures. Surprisingly however, all the PMSSQ films were found to exhibit very strong anisotropic thermal expansion; alpha(perpendicular) and alpha(parallel) of the films were in the ranges 140-329 ppm/ degrees C and 12-29 ppm/ degrees C respectively, depending on the curing temperature. This is the first time that cured PMSSQ thin films have been shown to exhibit anisotropic thermal expansion behavior. This anisotropic thermal expansion of the PMSSQ thin films might be due to the anisotropy of cross-link density in the films, which arises because of a combination of factors: the preferential orientation of methyl groups toward the upper film surface and the preferential network formation in the film plane that occurs during curing of the confined film. In addition, the film electron densities were determined using synchrotron X-ray reflectivity measurements and the film biaxial moduli were obtained using residual stress analysis.     

Water‐sorption behaviors of poly(3,4′‐oxydiphenylene pyromellitimide) films depending on the thickness variation

The effect of film thickness on the water‐sorption behaviors of poly(3,4′‐oxydiphenylene pyromellitimide) (PMDA‐3,4′ODA) films was gravimetrically investigated and interpreted with a Fickian diffusion model in films. The diffusion coefficient increased with increasing film thickness, whereas the water uptake and the activation energy decreased. Overall, the water‐sorption behaviors of PMDA‐3,4′ODA films are strongly dependent on the changes in morphological structure, which originated from the variation in the film thickness. As the film thickness increased, the molecular in‐plane orientation decreased, consequently leading to the increased diffusion coefficient and decreased activation energy. In contrast, the water uptake decreased with increasing film thickness because of the increase in the out‐of‐plane packing order. The diffusion coefficient and activation energy were strongly dependent on the in‐plane orientation in the films. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 669–676, 2001