新型1,3,4-噁二唑衍生物的合成与性质研究

研制高效载流子传输材料是提高有机电致发光器件性能的关键. 采用对酯对二酰氯(5)与含不同链长烷氧取代基的苯甲酰肼(2)缩合制备了一系列腰接羧基1,3,4-噁二唑衍生物, 即1,4-二[5-(4-烷氧基苯)-1,3,4-噁二唑基]-2,5-二羧基苯(7; 烷氧基＝OCnH2n＋1; n＝8, 12, 16), 并采用UV-vis吸收和荧光光谱对合成物进行了表征. 结果表明: 7的分子结构中羧基的横向引入, 对化合物的光物理性质和能带结构产生较大影响. 这些噁二唑化合物的LUMO及HOMO值分别介于－3.62与－3.58 eV之间及－6.94与－6.90 eV之间, 说明它们可能具有良好的电子传输性.     

新型双极有机小分子化合物及其Al3+配合物的合成与发光

合成了一种新的具有“双极”(bipolar)性质的有机小分子蓝色发光材料2-(5-(4-(二苯胺基)苯基)-1,3,4-噁二唑-2-)苯酚［2(5-(4-(diphenylamino)phenyl)-1,3,4-oxadiazol-2-yl)phenol, HPOT］, 并以HPOT为配体, 与铝离子配位, 合成了三(2-(5-(4-(二苯胺基)苯基) 1,3,4-噁二唑-2-)苯酚)合铝［tri(2-(5-(4-(diphenylamino)phenyl)-1,3,4-oxadiazol-2-yl)phenonate)aluminum, AlPOT］配合物. 用 1 H NMR、 HRMS和元素分析进行了表征, 并测定了两种化合物的光致发光性质和热稳定性. 结果表明: 两种新化合物的热稳定性好, 光致发光性能优良, 是制作有机电致发光器件的候选材料.     

2,5-取代-1,3,4-噁二唑衍生物的合成与杀菌活性

利用生物活性亚结构拼接原理,将吡啶环、噻唑环引入到1,3,4-噁二唑母体结构中,设计并合成了一系列新型含吡啶(噻唑)的1,3,4-噁二唑衍生物.通过IR,1H NMR,EI-MS及元素分析等方法对所合成的化合物进行了结构表征.代表化合物2-(6-氯吡啶-3-甲硫基)-5-(吡啶-4-基)-1,3,4-噁二唑(I)经单晶X衍射证实了结构.初步测定了所合成化合物的杀菌活性,并比较了在1,3,4-噁二唑母体结构中引入噻唑杂环和引入吡啶杂环后其杀菌活性的差异.结果表明:目标化合物对测试的5种菌均具有一定的杀菌活性,对水稻纹枯病的抑制效果普遍优于对其它菌种的抑制效果;在1,3,4-噁二唑母体结构中引入噻唑杂环比引入吡啶杂环对其杀菌活性更有利.     

一类新型环金属配体——二唑衍生物的化学结构及其性能

合成了5个2,5-二芳基-1,3,4-噁二唑衍生物环金属配合物配体,其化学结构经1HNMR、IR和元素分析得到确证。利用紫外光谱、荧光光谱、差热分析(DSC)和循环伏安法测试技术分别研究了它们的光谱性能、热性能和电化学性能。结果表明,该类衍生物在二氯甲烷溶液中的最大紫外吸收波长在268～327nm范围,在二氯甲烷溶液和固体膜中的最大荧光发射波长分别在332～390nm和359～439nm范围;DSC分析结果表明,5个噁二唑衍生物的起始吸热峰位于120～328℃之间,其中对称结构的噁二唑衍生物显示了较高的熔融温度;由循环伏安图和相关计算结果表明,5个噁二唑衍生物的还原电位位于-1.03～-0.98V,其相应的最低非占有分子轨道能级(LUMO)在-3.71～-3.76eV之间。     

5,5′-二(对-取代苯基)-2,2′-联噁唑的合成及其光性能研究

合成了8种5,5′-二(对-取代苯基)-2,2′-联噁唑,其中6种是未见报道的新化合物。讨论了它们的结构与光性能间的关系,并比较了它们和5,5′-二(对-取代苯基)-2,2′-联-1,3,4-噁二唑的光性能。     

对称4-枝和8-枝噁二唑衍生物的合成与荧光性质

采用Wittig-Horner和Heck反应合成了3个对称多枝[1,3,4]-噁二唑衍生物2,5-双{4-{4-[N,N-二(4-溴苯基)-氨基] 苯乙烯基}苯基}-1,3,4-噁二唑(BrPASPO), 2,5-双{4-{4-{N,N-二{4-{4-[5-(4-叔丁基苯基)-1,3,4-噁二唑基-2-]苯乙烯基}苯基}氨基}苯乙烯基}苯基}-1,3,4-噁二唑(TPASPO)和2,5-双{4-{4-{N,N-二{4-{3,5-二[5-(4-叔丁基苯基)-1,3,4-噁二唑基-2]-苯乙烯基}苯基}氨基}苯乙烯基}苯基}-1,3,4-噁二唑(OPASPO). 目标化合物的结构经过红外光谱、核磁共振氢谱、质谱和熔点确认. 在CH2Cl2溶液中三者的最大吸收波长分别在403 (BrPASPO), 408 (TPASPO)和409 nm (OPASPO), 荧光发射峰分别为495 (BrPASPO), 509 (TPASPO)和506 nm (OPASPO). 化合物TPASPO和OPASPO在CH2Cl2溶液中的荧光量子产率分别为0.47和0.45. 8枝化合物的荧光寿命高于4枝化合物. 对称多枝化合物具有很强的分子内电荷转移能力和荧光发射能力.     

不对称含噁二唑π-共轭寡聚芳烃的合成及结构-性质关系

以碘代芳烃与芳基硼酸在钯催化下的Suzuki交叉偶合反应为关键步骤,采用收敛法成功合成了一系列结构不对称的含噁二唑π-共轭寡聚芳烃OX-Ph_3An,OX-Ph_3Np和OX-Ph_3TPA,并对它们的结构、热学性质、光学性质和电化学性质进行了表征。结果表明:新合成的不对称含噁二唑π-共轭寡聚芳烃具有很高的热稳定性(T_(dec)=487~517℃)和较高的玻璃态转化温度(T_g=91~112℃)。     

2,5-二[4-(2-芳基乙烯基)苯基]噁二唑的合成及发光特征

二乙烯联苯及其衍生物是一种可发射蓝光的小分子空穴型有机发光材料, 通过Wittig-Horner反应, 将电子传输型噁二唑环“嵌入”其中, 设计合成了6个2,5-二[4-(2-芳基乙烯基)苯基]-1,3,4-噁二唑化合物. 经光谱分析和元素分析等方法确认了它们的化学结构. IR和UV-vis分析数据表明标题化合物分子结构中的C＝C双键均为反式结构特征. 研究结果表明: 2,5-二[4-(2-对二甲氨基苯基乙烯基)苯基]-1,3,4-噁二唑具有良好的蓝色发光性能; 取代基对标题化合物的UV-vis吸收光谱和发光特性的影响显着.     

2,4和8-支噁二唑衍生物的三光子吸收和三光子上转换荧光

用飞秒Ti:sapphire激光测定了3个对称噁二唑衍生物4-{N,N-双[4-(4-[5-(4-叔丁基苯基)-1,3,4-噁二唑-2]苯乙烯基)苯基]氨基}苯甲醛(Bis-oxa)、2,5-双{4-[2-N,N-双(4-{4-[5-(4-叔丁基苯基)-1,3,4-噁二唑-2]苯乙烯基}苯基)氨基苯乙烯基]苯基}-1,3,4-噁二唑(Quadri-oxa)和2,5-双(4-{2-N,N-双[({3,5-二[5-(4-叔丁基苯基)-1,3,4-噁二唑-2]苯基}乙烯基)苯基]氨基苯乙烯基}苯基)-1,3,4-噁二唑(Octu-oxa)的三光子吸收谱和三光子荧光光谱. 在1260 nm飞秒激光激发下, 2,4和8-支噁二唑衍生物的三光子吸收系数分别为5.0×10^-5, 10.0×10^-5和10.0×10^-5 cm³/GW², 三光子频率上转换荧光发射波长分别为533, 544和551 nm. 研究了多支化合物线性吸收和透过、单光子荧光及量子产率、荧光寿命、多光子荧光光谱和三光子吸收系数谱. 对称多支噁二唑衍生物具有很强的三光子吸收和上转换荧光性质.     

新型1,3,4-噁二唑衍生物的能带结构及其对器件性能的影响

利用紫外-可见吸收光谱和电化学方法表征了三个系列新型的1,3,4-噁二唑类化合物的能级结构.设计并制备了以噁二唑衍生物与MEH-PPV的共混物作为发光层的电致发光器件(LED),比较了不同结构噁二唑引入发光层后对器件性能的影响.研究结果表明,以共混物为发光层的LED,其最大亮度可达到11810cd/m2(8.5V),最大流明效率为1.1cd/A.与纯MEH-PPV单层发光器件相比,最大亮度提高了约40倍.结果表明,噁二唑类衍生物具有优良的电子传输特性,将其引入发光层能有效地提高LED的性能.     

Studies of fluorine-containing bismaleimide resins. Part I: Synthesis and characteristics of model compounds

A series of fluorine-containing bismaleimide (FBMI) monomers are synthesized by a 2-step reaction for using as the applications of low-k materials. The synthesized FBMI monomers are characterized by the ¹H, ¹³C, ¹⁹F nuclear magnetic resonance (NMR) spectroscopy and element analysis. These FBMI monomers react with free radical initiator or self-cure to prepare FBMI-polymers. All the self-curing FBMI resins have the glass transition temperatures T _g in the range of 130–141°C and show the 5% weight loss temperatures T _5% of 280–322°C in nitrogen atmosphere. The higher heat resistance of self-curing FBMI resin relative to FBMI-homopolymer is due to its higher cross-linking density. The FBMI resins exhibit improved dielectric properties as compared with commercial bismaleimide (BMI) resins with the dielectric constants ? lower than 2.44 which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymers. Besides, the flame retardancy of all these FBMI resins could be enhanced via the introduction of Br-atom.     

Investigation of bismaleimide containing naphthalene unit. II. Thermal behavior and properties of polymer

Crosslinking of 2,7-bis(4-maleimidophenoxy)naphthalene (BMPN) and 4,4-bismaleimi-dophenylmethane (BMPM) was investigated in the presence of 4,4-diaminodiphenylmethane (DDM) at the 2/1 molar ratio of bismaleimide/DDM. Their curing behaviors were characterized by infrared spectroscopy and differential scanning calorimetry. The presence of a naphthalene group in the backbone of the bismaleimide increased the curing temperature and reduced the polymerization reactivity. The exotherm was shifted to a lower temperature as the amine addition lead to chain extension. Thermal behavior and properties of cured products were investigated by thermogravimetric analyses and dynamic mechanical analyses. Also, at this molar ratio, the properties of the BMPN/DDM showed better T_g, thermal decomposition temperature, and moisture resistance than the epoxy derived from 2,7-dihydroxynapthalene cured with DDM system (DGEDN/DDM). © 1996 John Wiley & Sons, Inc.     

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

Two novel silphenylene-containing cycloaliphatic epoxy resins, 1,4-di [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (DEDSB) and 1,3,5-tri [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (TEDSB) were synthesized through in situ Grignard reaction and hydrosilylation, and characterized by FT-IR and ¹H-NMR. They were colorless transparent viscous liquids. Methyhexahydrophthalic anhydride (MeHHPA) was used to cure the epoxy resins to give glassy solids with high optical clarity. Differential scanning calorimetry (DSC) results indicated that DEDSB and TEDSB showed similar curing reactivity. The cured TEDSB had a higher glass transition temperature, a higher storage modulus and a lower coefficient of linear thermal expansion than the cured DEDSB due to a higher crosslink density. The cured silphenylene-containing epoxy resins exhibited a much higher resistance to discoloration under UV irradiation than the commonly used epoxy resins diglycidyl ether of bisphenol-A (DGEBA). XPS analysis revealed that they were much less susceptible to photo-oxidation than DGEBA.     

Bismaleimides chain-extended by imidized benzophenone tetracarboxylic dianhydride and their polymerization to high temperature matrix resins

Heat-resistant polymers were obtained by thermal polymerization of several bismaleimides or their substituted derivatives. The chain of the polymer precursors was extended by incorporation of imidized benzophenone tetracarboxylic dianhydride between the maleimide rings in order to impart a degree of flexibility in the polymers. The bismaleimides and their corresponding tetraamic acids were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. The differential thermal analysis (DTA) thermograms of the monomers showed exotherms at 200–340°C attributed to the thermally induced polymerization reactions. The influence of different substituents in the maleic double bond on the curing temperature was investigated. The thermal stability of the cured resins was evaluated by thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). They were stable up to 367–433°C both in nitrogen and air atmosphere and afforded 57–68% char yield at 800°C under anaerobic conditions. The structure of the aromatic and aliphatic diamines utilized for imidization was correlated with the thermal stability of the cured resins. The bismaleimide derived from p-phenylenediamine gave the most heat-resistant resin because of its higher rigidity.     

A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package

In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-(2,3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature(40 °C/2 h then 60 °C/1 h) exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40-60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

Efficient gel‐type electrolyte with bismaleimide via in situ low temperature polymerization in dye‐sensitized solar cells

This study reports the characteristics of gel‐type dye‐sensitized solar cells (DSSCs), fabricated with gel‐type electrolyte containing poly‐1,1′‐(methylenedi‐4,1‐phenylene)bismaleimide (PBMI), or poly‐1,1′‐(3,3′‐dimethyl‐1,1′‐biphenyl‐4,4′‐diyl)bismaleimide (PDBBMI), or poly‐N,N′‐(4‐methyl‐1,3‐phenylene)bismaleimide (PMPBMI), prepared by in situ polymerization of the corresponding monomer without an initiator at 30 °C. Incorporating 0.3 wt % content of exfoliated alkyl‐modified nanomica (EAMNM) into PBMI‐gelled electrolyte leads to higher short‐circuit current density (J_sc = 17.14 mA cm^?2) and efficiency (η = 7.02%) than that of neat PBMI‐gel electrolyte (J_sc = 15.32 mA cm^?2, η = 6.41%). Incorporating 0.3 wt % EAMNM into PBMI‐gelled electrolyte results in remarkably stable device performance under continuous light soaking under one sun (100 mW cm^?2) at 55 °C. The efficiency of DSSCs based on PBMI/0.3 wt % EAMNM‐gelled electrolyte drops by only 1.7% (η = 6.93%) after 500 h of continuous light soaking. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Synthesis of a novel phosphorus‐containing curing agent and its effects on the flame retardancy,thermal degradation and moisture resistance of epoxy resins

A novel phosphorus‐containing compound diphenyl‐(1, 2‐dicarboxylethyl)‐phosphine oxide defined as DPDCEPO was synthesized and used as a flame retardant curing agent for epoxy resins (EP). The chemical structure of the prepared DPDCEPO was well characterized by Fourier transform infrared spectroscopy, and ¹H, ¹³C and ³¹P nuclear magnetic resonance. The DPDCEPO was mixed with curing agent of phthalic anhydride (PA) with various weight ratios into epoxy resins to prepare flame retardant EP thermosets. The flame retardant properties, combustion behavior and thermal analysis of the EP thermosets were respectively investigated by limiting oxygen index (LOI), vertical burning tests (UL‐94), cone calorimeter measurement, dynamic mechanical thermal analysis and thermogravimetric analysis (TGA) tests. The surface morphologies and chemical compositions of the char residues for EP thermosets were respectively investigated by scanning electron microscopy and X‐ray photoelectron spectroscopy (XPS). The water resistant properties of the cured EP were evaluated by putting the samples into distilled water at 70°C for 168 hr. The results revealed that the EP/20 wt% DPDCEPO/80 wt% PA thermosets successfully passed UL‐94 V‐0 flammability rating and the LOI value was as high as 33.2%. The cone test results revealed that the incorporation of DPDCEPO effectively reduced the combustion parameters of the epoxy resin thermosets, such as heat release rate and total heat release. The dynamic mechanical thermal analysis test demonstrated that the glass transition temperature (Tg) decreased with the increase of DPDCEPO content. The TGA results indicated that the incorporation of DPDCEPO promoted the decomposition of epoxy resin matrix ahead of time and led to a higher char yield and thermal stability at high temperatures. The surface morphological structures and analysis of the XPS of the char residues of EP thermosets revealed that the introduction of DPDCEPO benefited the formation of a sufficient, compact and homogeneous char layer with rich flame retardant elements on the epoxy resin material surface during combustion. The mechanical properties and water resistance of the cured epoxy resins were also measured. After water resistance tests, the EP/20 wt% DPDCEPO/80 wt% PA thermosets retained excellent flame retardancy, and the moisture adsorption of the EP thermosets decreased with the increase of DPDCEPO content in EP thermosets because of the existence of the P–C bonds and the rigid aromatic hydrophobic structure in DPDCEPO. Copyright © 2015 John Wiley & Sons, Ltd.     

双氰胺固化环氧树脂的研究

<正> 双氰胺做为环氧树脂的固化剂,其贮存期可以达到一年以上,这种固化物的机械和介电性能优异,因此,广泛用于制造层压等电工材料方面。国外许多人都曾对双氰胺与环氧树脂的固化反应历程和固化物的性能做过研究,指出了在固化过程中化学结构的变化     

The thermal and dielectric properties of high performance cyanate ester resins/microcapsules composites

Novel high performance bisphenol A dicyanate ester (BADCy) resins/poly(urea-formaldehyde) microcapsules filled with epoxy resins (MCEs) composites have been prepared. The effects of different contents of MCEs on the thermal and dielectric properties of cured BADCy were investigated using dynamic mechanical analyzer (DMA), thermalgravimetric analyzer (TGA) and broadband dielectric analyzer. The dielectric properties of BADCy/MCEs treated in hot water and hot air were also discussed. The morphologies of BADCy/MCEs composites were characterized by scanning electron microscopy (SEM). Results indicate that the appropriate content of MCEs can improve or maintain the thermal stability, the low dielectric constant and dielectric loss of cured BADCy mainly owing to higher conversion of cyanate ester (-OCN) groups. After aged in hot water and hot air, respectively, BADCy/MCEs composites with small content of MCEs can retain the low dielectric constant and dielectric loss.