Molecular dynamics study of structural damage in amorphous silica induced by swift heavy-ion radiation

In this paper, the radiation defects induced by the swift heavy ions and the recoil atoms in amorphous SiO₂ were studied. The energy of recoil atoms induced by the incident Au ions in SiO₂ was calculated by using Monte Carlo method. Results show that the average energies of recoils reach the maximum (200?eV for Si and 130?eV for O, respectively) when the incident energy of Au ion is 100?MeV. Using Tersoff/zbl potential with the newly built parameters, the defects formation processes in SiO₂ induced by the recoils were studied by using molecular dynamics method. The displacement threshold energies (E_d) for Si and O atoms are found to be 33.5 and 16.3?eV, respectively. Several types of under- and over-coordinated Si and O defects were analyzed. The results demonstrate that Si₃, Si₅, and O₁ are the mainly defects in SiO₂ after radiation. Besides, the size of cylindrical damage region produced by a single recoil atom was calculated. The calculation shows that the depth and the radius are up to 2.0 and 1.4?nm when the energy of recoils is 200?eV. Finally, it is estimated that the Au ion would induce a defected track with a diameter of 4?nm in SiO₂.     

Mechanism of boron diffusion in amorphous silicon

We have elucidated the mechanism for B migration in the amorphous (a-) Si network. B diffusivity in a-Si is much higher than in crystalline Si; it is transient and increases with B concentration up to 2 x 10(20) B/cm(3). At higher density, B atoms in a-Si quickly precipitate. B diffusion is indirect, mediated by dangling bonds (DB) present in a-Si. The density of DB is enhanced by B accommodation in the a-Si network and decreases because of a-Si relaxation. Accurate data simulations allow one to extract the DB diffusivity, whose activation energy is 2.6 eV. Implications of these results are discussed.     

Hydrogen-plasma etching of hydrogenated amorphous silicon: a study by a combination of spectroscopic ellipsometry and trap-limited diffusion model

The kinetics of etching hydrogenated amorphous silicon by a hydrogen plasma has been studied by in-situ spectroscopic ellipsometry measurements. The formation of a hydrogen-rich sublayer is clearly emphasized. Its thickness increases from 7 to 27?nm when the temperature during the hydrogen-plasma treatment is raised from 100 to 250°C. This effect is interpreted by solving the differential equation for trap-limited hydrogen diffusion through a mobile surface. By assigning the thickness of this sublayer to the mean diffusion distance of hydrogen we determined values of the effective diffusion coefficient of hydrogen higher than 10^?14?cm²s^?1 with an activation energy of 0.22?eV. The density of hydrogen traps is found to decrease from 7.3 × 10¹⁸ to 4.5 × 10¹⁷?cm^?3 as the temperature of the hydrogen treatment increases from 100 to 250°C with an activation energy of 0.43?eV. This effect is interpreted by a thermal equilibrium involving hydrogen transitions between shallow states and hydrogen-trapping sites.     

Suppression of boron segregation by interface Ge atoms at SiGe/SiO2 interface

We investigate the migration pathway and barrier for B diffusion at SiGe/SiO₂ interface through first-principles density functional calculations. Similar to the diffusion mechanism reported for Si/SiO₂ interface, a substitutional B, which initially forms a B-self-interstitial complex in SiGe, diffuses to the interface and then to the oxide in form of an interstitial B. At the defect-free interface, where bridging O atoms are inserted to remove interface dangling bonds, it is energetically more favorable for the interstitial B to intervene in the Ge–O bridge bond rather than the Si–O bridge bond at the interface. As a result of the B intervention, interface Ge atoms significantly enhance the stability of B-related defects in the interface region and thereby act as traps for B dopants. At the interface with the Ge–O bridge bond, the overall migration barrier for B diffusion from SiGe to SiO₂ is estimated to be about 3.7 eV, much higher than the reported value of about 2.1 eV at Si/SiO₂ interface. Our results provide a clue to understanding the experimental observation that B segregation toward the oxide is suppressed in SiGe/SiO₂ interface.     

Growth of Co-Silicides from single crystal and evaporated Si

We have investigated the reaction of a thin Co film with a (100) Si (Si ^c ) or an evaporated Si (Si ^e , which is amorphous) substrate during thermal annealing. On either substrate, Co₂Si and CoSi form simultaneously and the growth of each phase has a square root of time dependence. Both silicides grow faster on Si ^c than on Si ^e . A model is proposed to calculate the effective diffusion constant in each silicide from the growth data of the silicides. The activation energies of the effective diffusion constants in Co₂Si and CoSi grown on Si ^c are 1.7±0.1 eV and 1.8±0.1 eV, respectively; while those on Si ^e are 1.85±0.1 eV and 1.9 ±0.1 eV, respectively. The differences observed for the two substrates are tentatively attributed to the presence of impurities in Si^e and to the microstructural differences of the silicides formed on either substrate.     

n‐type conductivity in sublimation‐grown AlN bulk crystals

AlN crystals grown by physical vapour‐phase transport in the presence of a SiC doping source possess n‐type conductivity. The net donor concentration attains up to mid 10¹⁷ cm^–3. The investigation reveals shallow donors forming an impurity band and acceptor‐like electron traps at about 0.5 eV below the conduction band edge. Thermal electron emission from these traps is responsible for the observed n‐type conductivity. The shallow donors are suggested to be due to Si atoms on Al sites. The majority of them is assumed to be compensated by deep acceptors in the lower half of the band gap. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Energetics of Ge nucleation on SiO2 and implications for selective epitaxial growth

We have measured the time evolution of Ge nucleation density on SiO₂ over a temperature range of 673–973 K and deposition rates from 5.1 × 10¹³ atoms/cm² s (5 ML/min) to 6.9 × 10¹⁴ atoms/cm² s (65 ML/min) during molecular beam epitaxy. The governing equations from mean-field theory that describe surface energetics and saturation nucleation density are used to determine the size and binding energy of the critical Ge nucleus and the activation energy for Ge surface diffusion on SiO₂. The critical nucleus size is found to be a single Ge atom over substrate temperatures from 673 to 773 K, whereas a three-atom nucleus is found to be the critical size over substrate temperatures from 773 to 973 K. We have previously reported 0.44 ± 0.03 eV for the Ge desorption activation energy from SiO₂. This value, in conjunction with the saturation nucleation density as a function of substrate temperature, is used to determine that the activation energy for surface diffusion is 0.24 ± 0.05 eV, and the binding energy of the three-atom nucleus is 3.7 ± 0.1 eV. The values of the activation energy for desorption and surface diffusion are in good agreement with previous experiments of metals and semiconductors on insulating substrates. The small desorption and surface diffusion activation barriers predict that selective growth occurring on window-patterned samples is by direct impingement of Ge onto Si and ready desorption of Ge from SiO₂. This prediction is confirmed by the small integral condensation coefficient for Ge on SiO₂ and two key observations of nucleation behavior on the window-patterned samples. The first observation is the lack of nucleation exclusion zones around the windows, and second is the independence of the random Ge nucleation density on patterned versus unpatterned oxide surfaces. We also present the Ge nucleation density as a function of substrate temperature and deposition rate to demarcate selective growth conditions for Ge on Si with a window-patterned SiO₂ mask.     

Diffusion of gold in dislocation-free or highly dislocated silicon measured by the spreading-resistance technique

The diffusion of Au in dislocation-free or plastically deformed Si (10¹¹ to 10¹³ dislocations/m²) was measured with the aid of the spreading-resistance technique. The Au profiles produced indislocation-free Si slices by in-diffusion from both surfaces possess nonerfc-type U shapes as predicted by the so-called kick-out diffusion model. This model is used to calculate the contribution of self-interstitials to the (uncorrelated) Si self-diffusion coefficient,D _I ^SD =0.064×exp(–4.80 eV/kT)m² s^–1, from the present and previous data on the diffusivity and solubility of Au in Si in the temperature range 1073–1473 K. Inhighly dislocated Si the diffusion of Au is considerably faster than in dislocation-free Si. From the erfc-type penetration profiles found in this case, effective Au diffusion coefficients were deduced and combined with data on the solubility of Au in Si. ThusC _i ^eq D _i=0.0064 ×exp(–3.93 eV/kT)m² s^–1 was obtained in the temperature range 1180–1427 K, whereC _i ^eq andD _i are the solubility and diffusivity of interstitial Au in Si.     

Electrical properties and dielectric relaxation of thermally evaporated zinc phthalocyanine thin films

The electrical transport properties and dielectric relaxation of Au/zinc phthalocyanine, ZnPC/Au devices have been investigated. The DC thermal activation energy at temperature region 400-500 K is 0.78 eV. The dominant conduction mechanisms in the device are ohmic conduction below 1 V and space charge limited conduction dominated by exponential trap distribution in potentials >1 V. Some parameters, such as concentration of thermally generated holes in valence band, the trap concentration per unit energy range at the valence band edge, the total concentration of traps and the temperature parameter characterizing the exponential trap distribution and their relation with temperatures have been determined. The AC electrical conductivity, σ_ac, as a function of temperature and frequency has been investigated. It showed a frequency and temperature dependence of AC conductivity for films in the temperature range 300-400 K. The films conductivity in the temperature range 400-435 K increased with increasing temperature and it shows no response for frequency change. The dominant conduction mechanism is the correlated barrier hopping. The temperature and frequency dependence of real and imaginary dielectric constants and loss tangent were investigated.     

EDXRF measurements on gold diffusion-doped Bi1.8Pb0.35Sr1.9Ca2.1Cu3Oy

Gold (Au) diffusion in superconducting Bi_1.8Pb_0.35Sr_1.9Ca_2.1Cu₃O_y was investigated over the temperature range 500-800 °C by the energy dispersive X-ray fluorescence (EDXRF) technique. It is found that the Au diffusion coefficient decreases as the diffusion-annealing temperature decreases. The temperature dependences of Au diffusion coefficient in grains and over grain boundaries are described by the relations D₁=6.7×10⁻⁵exp(−1.19 eV/k_BT) and D₂=9.7×10⁻⁴exp(−1.09 eV/k_BT), respectively. The diffusion doping of Bi-2223 by Au causes a significant increase of the lattice parameter c by about 0.19%. For the Au-diffused samples, dc electrical resistivity and transport critical current density measurements indicated the critical transition temperature increased from 100 to 104 K and the critical current density increased from 40 to 125 A cm⁻², in comparison with those of undoped samples. From scanning electron microscope (SEM) and X-ray diffraction (XRD) measurements it is observed that Au doping of the sample also improved the surface morphology and increased the ratio of the high-T_c phase to the low-T_c phase. The possible reasons for the observed improvement in microstructure and superconducting properties of the samples due to Au diffusion are also discussed.     

Thermally stimulated current and high temperature resistivity measurements of 4H semi-insulating silicon carbide

High purity semi-insulating 4H SiC single crystals have potential applications for room temperature radiation detectors because of the wide band gap and radiation hardness. To control carrier lifetime, a key parameter for high performance radiation detectors, it is important to understand the nature of the deep traps in this material. For this purpose, we have successfully applied thermally stimulated current (TSC) and high temperature resistivity measurements to investigate deep level centers in semi-insulating 4H SiC samples grown by physical vapor transport. High temperature resistivity measurements showed that the resistivity at elevated temperatures is controlled by the deep level with an activation energy of 1.56 eV. The dominant traps revealed by TSC measurements were at 1.1-1.2 eV. The deep trap levels in 4H-SiC samples, the impurity and point defect nature of TSC traps peaked at ∼106 K (0.23 eV), ∼126 K (0.32 eV), ∼370 K (0.95 eV), ∼456 K (1.1-1.2 eV) are discussed.     

MoO_3/Si界面区钼掺杂非晶氧化硅层形成的第一性原理研究

采用基于密度泛函理论的第一性原理计算方法,通过模拟MoO_3/Si界面反应,研究了MoO_x薄膜沉积中原子、分子的吸附、扩散和成核过程,从原子尺度阐明了缓冲层钼掺杂非晶氧化硅(a-SiO_x(Mo))物质的形成和机理.结果表明,在1500 K温度下, MoO_3/Si界面区由Mo, O, Si三种原子混合,可形成新的稳定的物相.热蒸发沉积初始时, MoO_3中的两个O原子和Si成键更加稳定,同时伴随着电子从Si到O的转移,钝化了硅表面的悬挂键. MoO_3中氧空位的形成能小于SiO_2中氧空位的形成能,使得O原子容易从MoO_3中迁移至Si衬底一侧,从而形成氧化硅层;替位缺陷中, Si替位MoO_3中的Mo的形成能远远大于Mo替位SiO_2中的Si的形成能,使得Mo容易掺杂进入氧化硅中.因此,在晶硅(100)面上沉积MoO_3薄膜时, MoO_3中的O原子先与Si成键,形成氧化硅层,随后部分Mo原子替位氧化硅中的Si原子,最终形成含有钼掺杂的非晶氧化硅层.     

非晶合金Fe78Si9B13在脉冲电流作用下的单相晶化

对非晶合金Fe₇₈Si₉B₁₃进行了超短脉冲电流处理，实现了晶化时α-Fe（Si）单相结构析出．可以认为，脉冲电流作用时，电子运动与非晶中空位型结构缺陷间的周期性排斥效应促进了类金属原子从非晶结构单元中析出，使Fe（Si）原子局部富集，导致基体金属相在较低温度下优先成核．而在空位的定向迁移的同时，将伴随B原子的扩散，则B原子局域富集，Fe-B化合物的形核析出就要受到这两个因素的抑制 关键词：     

Study of the hydrogen diffusion and segregation into Fe-C-Mo martensitic HSLA steel using electrochemical permeation test

Diffusion and trapping mechanisms are studied in order to improve Hydrogen embrittlement (HE) resistance of high yield strength steels. Investigations were carried on Fe-C-Mo model steel with a quenched and tempered martensitic microstructure. Hydrogen diffusion was studied by using the electrochemical permeation technique. The influence of the charging current densities in 1 M H₂SO₄ at ambient temperature shows a relation between the apparent diffusion coefficient D_app and the apparent subsurface concentration of hydrogen C_0app. Two domains can be separated and are mainly associated with a competition between two distinct processes: hydrogen trapping and hydrogen diffusion. These results are correlated to the quantities of reversible and irreversible traps into the membrane. Moreover, the experimental results revealed that the apparent diffusion coefficient increases and the total amount of trapped hydrogen decreases with temperature. The activation energy of the diffusion process (0.26 eV) and the trapping process (0.58 eV) are supposed to be, respectively, affiliated with lattice diffusion and with trapping on incidental dislocations and/or on martensitic lath interfaces due to misorientations (geometric necessary dislocations).     

Thermally induced defect photoluminescence in hydrogenated amorphous silicon

The intrinsic defect photoluminescence of hydrogenated amorphous silicon (a-Si:H) films has been investigated at high intensities of optical pumping that lead to heating of the film. It has been revealed that, for short heating times, the intensity of the defect photoluminescence increases exponentially with an increase in the temperature with an activation energy of 0.85 eV, which is considerably higher than the activation energy (∼0.2 eV) determined from experiments on classical annealing. This and other experimental results on the temperature dependence of the intensity and kinetics of the defect photoluminescence have been explained in terms of the “hydrogen glass” model by thermally induced generation of intrinsic defects in amorphous silicon. The results of the calculations are in good agreement with the experimental data on the defect photoluminescence that reflects the formation and annihilation of defects for short heating times under optical excitation.     

Diffusion of Au in amorphous Zr x Ni100−x alloys studied by Rutherford Backscattering Spectrometry

The diffusion coefficients (D) of Au in three binary amorphous Zr _x Ni_100–x (x=61, 65, and 67) alloys were measured in the temperature range 549–623 K using the technique of the Rutherford Backscattering Spectrometry (RBS). The D values were found to lie in the range 1.0×10^–21–9.0×10^–20 m²s^–1 for different alloys. The activation energy (Q) was calculated in each case on the basis of an observed Arrhenius temperature dependence of D. The activation energy was found to scale with the crystallization temperature (T _x) of the alloy. Other published measurements for Au diffusion in amorphous Zr-Ni alloys also appear to follow the scaling relation between Q and T _x.     

Experiments with low-energy muons

Two experiments with low-energy muons are described: the determination of the stopping power of C, Si, Ti and Au for muons at energies down to 2 keV and the measurement of the diffusion times for pµ and dµ atoms in low-pressure (0.25–12 hPa) hydrogen gas. A pronounced Barkas effect was found for muons at the Bragg peak (about 10 keV): the stopping power for µ^– in C, e.g., is about 30% lower than that for µ⁺. The mean kinetic energy of pµ atoms at the end of the cascade in 1 hPa hydrogen gas was determined to be (2.6 ± 0.6) eV (preliminary value).     

Ion implantation damage and crystalline-amorphous transition in Ge

Experimental studies on the damage produced in (100) Ge substrates by implantation of Ge⁺ ions at different energies (from 25 to 600 keV), fluences (from 2×10¹³ to 4×10¹⁴ cm⁻²) and temperature (room temperature, RT, or liquid-nitrogen temperature, LN₂T) have been performed by using the Rutherford backscattering spectrometry technique. We demonstrated that the higher damage rate of Ge with respect to Si is due to both the high stopping power of germanium atoms and the low mobility of point defects within the collision cascades. The amorphization of Ge has been modeled by employing the critical damage energy density model in a large range of implantation energies and fluences both at RT and LN₂T. The experimental results for implantation at LN₂T were fitted using a critical damage energy density of ∼1 eV/atom. A fictitious value of ∼5 eV/atom was obtained for the samples implanted at RT, essentially because at RT the damage annihilation plays a non-negligible role against the crystalline–amorphous transition phase. The critical damage energy density model was found to stand also for other ions implanted in crystalline Ge (Ar⁺ and Ga⁺).     

Optoelectrical investigations on MOS-sandwiches at low temperatures

MOS-structures are irradiated with light of energy from 1.5 to 6 eV at different temperatures (300, 77, 12 K) while the resulting photocurrent is measured. At high photon energies (hv>4 eV) the threshold energy and the scattering mean free path for electrons at the Si — SiO₂-interface are determined. They are independent from temperature. At low photon energies (hv<3 eV) electrons are released from traps with energy levels 1.2 and 1.9 eV below the Si-conduction band. The trap concentration is 4.8 10¹³ cm^–3. The capture cross section is measured in a rather direct way. The temperature and electrical field dependence of this cross section is explained by a trapping model.     

A first-principles study on initial processes of a Ni adatom on the H-terminated Si(0 0 1)-(2×1) surface

We studied the adsorption, surface diffusion, and penetration, i.e. the initial processes of a Ni adatom on the H-terminated Si(001)-(2×1) surface by the first-principles theoretical calculations. As concerns the adsorption, two different types were found. When Ni is deposited onto the Si dimer row, it once captures H from the dimer Si, though it eventually returns H, with no activation energy barrier. Then, Ni moves to the most stable site, which is the off-centered bridge (B) site between the dimer rows, with the activation energy of 0.65 eV. On the other hand, Ni deposited between the dimer rows captures no H and moves to the B site without the energy barrier. Thus an adsorbed Ni atom invariably arrives at the most stable B site at the room temperature. As for the surface diffusion, it needs the activation energies of 0.66 and 1.19 eV for Ni to migrate from the B site in the directions parallel and perpendicular to the dimer row, respectively. Therefore, we concluded that the surface diffusion of Ni is restricted in the valley between the dimer rows at the room temperature. Furthermore, since the penetration of Ni is blocked on this surface, it was also concluded that the surface hydrogenation suppresses silicidation.