Low temperature CO induced growth of Pd supported on a monolayer silica film

Nucleation, growth and sintering of Pd deposited on an ultra-thin silica film were studied by scanning tunneling microscopy and infrared reflection absorption spectroscopy. No preferential nucleation of Pd on the silica surface was observed both at 90 and 300 K deposition. When adsorbed on Pd clusters formed at 90 K, CO causes a strong sintering effect even at this temperature. The results are rationalized on the basis of a high mobility of Pd carbonyl-like species on the silica film. At a given Pd coverage, the extent of CO induced sintering cannot be achieved by annealing in vacuum. In addition, vacuum sintering, which commences above 700 K, goes simultaneously with interdiffusion of Pd and support.     

PdSi based ohmic contact on n-InP

The electrical and microstructural properties of the PdSi based ohmic contacts on n-InP are discussed in the research. A low specific contact resistance of 2.25 × 10⁻⁶ Ω cm² is obtained on Au/Si/Pd/n-InP contact after rapid thermal annealing (RTA) at 450 °C for 30 s. The low contact resistance can be maintained at the order of 10⁻⁶ Ω cm² even up to 500 °C annealing. From the Auger analysis, it is found that both the outdiffusion of In and the indiffusion of Si into the InP surface occurred at the ohmic contact sample. The formation of the Pd₃Si compound lowered the barrier of the contact. The reactions between Pd and InP of the contact, forming In vacancies, and leading the doping of Si to the InP contact interface.     

In situ atomic force microscopy observation of hydrogen absorption/desorption by Palladium thin film

Grain structure changes in Pd thin film during hydrogen absorption and desorption were observed by in situ atomic force microscopy. The as-sputtered film had a smooth flat surface with 20-30 nm grains. Film that absorbed hydrogen showed buckling, caused by the compressive stress due to lattice expansion as Pd metal reacted with hydrogen to form the hydride. Grains on the buckles were agglomerated and deformed unlike those on flat areas beside the buckles. Film that absorbed and then desorbed hydrogen still showed some buckling; however, many buckles shrank and flattened when the compressive stress of lattice expansion was released during desorption. On both the remaining and the shrunken buckles, grain agglomeration was retained; whereas, the deformed grains reverted back to their original form. X-ray diffraction indicated compressive residual stress in the as-sputtered film and tensile residual stress in the film after hydrogen absorption/desorption. These results indicate that irreversible grain agglomeration is related to residual tensile stress in the film although agglomeration occurs only on the buckled areas.     

The kinetics of the formation of a solid solution in an Ag–Pd polycrystalline film system

The kinetics of homogenization of an Ag–Pd film system with a total thickness of 120 nm and a grain size of 5–10 nm has been studied by means of in situ TEM heating. The film system has been formed by the sequential deposition of components in a vacuum on the substrate at room temperature. It has been shown that diffusion processes are activated, starting from the temperature 453 K, resulting in complete homogenization of the film system at 573 K with preservation of its fine-grained structure. The effective diffusion coefficient in the Ag–Pd system was measured as 10^?17–10^?18 m²/s at 553 K. A possible mechanism of homogenization is discussed.     

Crystallization and surface morphology of Au/SiO2 thin films following furnace and flame annealing

A crystallization and surface evolution study of Au thin film on SiO₂ substrates following annealing at different temperatures above the eutectic point of the Au/Si system are reported. Samples were prepared by conventional evaporation of gold in a high vacuum (10⁻⁷ mbar) environment on substrates at room temperature. Thermal treatments were performed by both furnace and flame annealing techniques. Au thin films can be crystallized on SiO₂ substrates by both furnace and flame annealing. Annealing arranges the Au crystallites in the (1 1 1) plane direction and changes the morphology of the surface. Both, slow and rapid annealing result in a good background in the XRD spectra and hence clean and complete crystallization which depends more on the temperature than on the time of annealing. The epitaxial temperature for the Au/SiO₂ system decreases in the range of 350-400 °C. Furnace and flame annealing also form crystallized gold islands over the Au/SiO₂ surface. Relaxation at high temperatures of the strained Au layer, obtained after deposition, should be responsible for the initial stages of clusters formation. Gold nucleation sites may be formed at disordered points on the surface and they become islands when the temperature and time of annealing are increased. The growth rate of crystallites is highest around 360 °C. Above this temperature, the layer melts and gold diffuses from the substrate to the nucleation sites to increase the distance between islands and modify their shapes. Well above the eutectic temperature, the relaxed islands have hexagonally shaped borders. The mean crystallite diameters grow up to a maximum mean size of around 90 nm. The free activation energy for grain boundary migration above 360 °C is 0.2 eV. Therefore the type of the silicon substrate changes the mechanism of diffusion and growth of crystallites during annealing of the Au/Si system. Epitaxial Au(1 1 1) layers without formation of islands can be prepared by furnace annealing in the range of 300-310 °C and by flame annealing of a few seconds and up to 0.5 min.     

Hydrogen uptake kinetics of Pd coated FeTi films

The kinetics of hydrogen uptake of thin films of FeTi deposited on Si substrates and covered with 20 nm Pd were studied. The films serve as a model system for powdered FeTi, with grains that are (partly) covered with Pd, which serves as a protection for severe oxidation. Two FeTi compositions near the 50/50 composition were studied. The hydrogen uptake kinetics as a function of temperature and pressure were measured by probing the differential pressure between a small hydriding reaction chamber and a reference chamber. Both compositions showed first order kinetics for the largest portion of the uptake. Using results of additional measurements in which the thickness of the layers was varied, a model is proposed in which the uptake proceeds via fast channels through the film, followed by slower diffusion into the bulk. Finally, the influence of oxidation was studied. An FeTi-oxide underneath the Pd layer is a barrier for H diffusion. It was found that by annealing the H uptake rate could be increased. This is probably due to the decomposition of the oxide. Samples partly covered with Pd and partly by FeTi-oxides, obtained by decomposing the fully covered structure by air annealing at 250 °C, showed uptake throughout the entire FeTi film with an even faster rate than in a fully covered film. Some explanation with simple models of the observed phenomena is given.     

Surface characterization and luminescent properties of SrAl2O4:Eu,Dy nano thin films

SrAl₂O₄:Eu²⁺, Dy³⁺ thin films were grown on Si (1 0 0) substrates in different atmospheres using the pulsed laser deposition (PLD) technique. The effects of vacuum, oxygen (O₂) and argon (Ar) deposition atmospheres on the structural, morphological and photoluminescence (PL) properties of the films were investigated. The films were ablated using a 248 nm KrF excimer laser. Improved PL intensities were obtained from the unannealed films prepared in Ar and O₂ atmospheres compared to those prepared in vacuum. A stable green emission peak at 520 nm, attributed to 4f⁶5d¹→4f⁷ Eu²⁺ transitions was obtained. After annealing the films prepared in vacuum at 800 °C for 2 h, the intensity of the green emission (520 nm) of the thin film increased considerably. The amorphous thin film was crystalline after the annealing process. The diffusion of adventitious C into the nanostructured layers deposited in the Ar and O₂ atmospheres was most probably responsible for the quenching of the PL intensity after annealing.     

A diffusion-controlled mullite formation reaction model based on tracer diffusivity data for aluminium,silicon and oxygen

This paper compiles all the data from our tracer diffusivity studies in single crystalline 2/1-mullite. As tracers we used the rare stable isotopes ¹⁸O and ³⁰Si and the artificial pseudo-stable isotope ²⁶Al. Secondary-ion mass spectrometry was applied to analyze the depth distribution of the tracer isotopes after the diffusion annealing. An essential result of our tracer diffusivity studies was the very low diffusivity of ³⁰Si compared to the diffusivities of ²⁶Al and ¹⁸O, which are almost equal. Based on this observation, we propose a reaction model for the diffusion-controlled formation of mullite in the solid state, which assumes that the growth kinetics of a mullite layer is mainly controlled by the diffusion of aluminium ions and oxygen ions.     

Influence of oxygen on diffusion in the Cu/Mo/Au system

The annealing behaviour of the Cu/Mo/Au metallization system is investigated. Backscattering spectrometry reveals a rapid diffusion of Cu and Au across the Mo film and the formation of AuCu after annealing at 600°C for 30 min in vacuum, but only when no impurity is detected in the as-deposited polycrystalline Mo layer. The Au-Cu interaction is impeded when 5.5 at% of oxygen is introduced in the as-deposited Mo layer. The thin film microstructures are analyzed using X-ray diffraction and transmission electron microscopy. The thermal stability difference between the samples with a pure Mo layer and a contaminated Mo layer is discussed in terms of fast diffusion process inhibited by a grain boundary decoration with oxygen atoms.     

稀土元素Ce热引入Si单晶中及Ce在Si中的扩散系数

利用真空淀积和真空热处理(1050℃,20h)向Si单晶中引入了稀土元素Ce,热处理过程中Ce首先与Si形成合金,然后向Si中扩散,于是在Si中形成Ce的扩散层。用二次离子质谱(SIMS)技术测定了Ce的纵向相对浓度分布,并据此分析了Ce在Si中的扩散系数。并在77—450K范围内测量了扩散层的平均电导率。 关键词：     

Processing for optically active erbium in silicon by film co-deposition and ion-beam mixing

Techniques of film deposition by co-evaporation, ion-beam assisted mixing, oxygen ion implantation, and thermal annealing were been combined in a novel way to study processing of erbium-in-silicon thin-film materials for optoelectronics applications. Structures with erbium concentrations above atomic solubility in silicon and below that of silicide compounds were prepared by vacuum co-evaporation from two elemental sources to deposit 200-270 nm films on crystalline silicon substrates. Ar⁺ ions were implanted at 300 keV. Oxygen was incorporated by O⁺-ion implantation at 130 keV. Samples were annealed at 600 °C in vacuum. Concentration profiles of the constituent elements were obtained by Rutherford backscattering spectrometry. Results show that diffusion induced by ion-beam mixing and activated by thermal annealing depends on the deposited Si-Er profile and reaction with implanted oxygen. Room temperature photoluminescence spectra show Er³⁺ transitions in a 1480-1550 nm band and integrated intensities that increase with the oxygen-to-erbium ratio.     

Microstructure, hydrogenation and optical behavior of Mg-Ni multilayer films deposited by magnetron sputtering

Mg-Ni multilayer films with sequential Mg and Ni layers were prepared by direct current magnetron sputtering. The substrate temperature influences the microstructure of the films greatly. The film deposited at 298 K exhibits multilayered structure, while the film shows nanocrystalline/amorphous composite structure at the deposition temperature of 473 K. The optical properties between hydrogenation/dehydrogenation states of the films were performed using spectrophotometer in visible light region. The film deposited at 473 K can switch from mirror-like metallic state towards brownish yellow transparent state under 0.6 MPa H₂ at 298 K, and the optical transmittance modulation reaches up to 20% both at a wavelength of 770 nm and IR region, while the film deposited at 298 K exhibits low optical change, and the optical switching behavior can hardly be found. The extra free energy stored in the boundary of the nanocrystallines benefits the formation of magnesium-based hydride, resulting in the enhancement of the optical switching properties of the Mg-Ni film deposited at 473 K.     

The water-forming reaction on palladium

The water-forming reaction on Pd has been studied on a PdSiO₂Si (Pd-MOS) structure in the temperature range 323–473 K. The reaction is found to be of the Langmuir-Hinshelwood type with the formation of OH beeing rate limiting. Since the Pd-MOS structure works as a sensitive hydrogen detector unique information on the behaviour of hydrogen during this catalytic reaction has been obtained. The reaction can be described in a model where the hydrogen atoms on the Pd surface have a large temperature activated lateral mobility and with no evidence of beeing in hot precursor states. At T = 473 K this means that for oxygen coverages ? 0.01 monolayers all hydrogen adsorbed will also react with oxygen. For smaller oxygen coverages unreacted hydrogen will not initially desorb towards the vacuum but towards the internal Pd surface of the Pd-MOS structure. Futhermore, hydrogen adsorption is blocked by adsorbed oxygen. The sticking coefficient for hydrogen on the bare Pd surface is, however, close to one and only weakly temperature dependent. An effect giving rise to a hysteresis in the work function versus oxygen coverage curve during oxygen adsorption - desorption is also discussed.     

Interdiffusion in two-layer Pd/Ag films II. “Cold” homogenization mechanisms

Interdiffusion processes in thin epitaxial polycrystalline Pd/Ag films in the temperature range 20–500°C are studied by transmission electron microscopy, electron diffraction and electrical resistance methods. Homogenization is investigated both during condensation and under conditions of postcondensation annealing.The basic processes of homogenization associated with GB diffusion along migrating boundaries. It is found that in real polycrystal films with wide spectrum of grain sizes few mechanisms can occur simultaneously or subsequently: recrystallization induced diffusion, diffusion induced grain boundary migration, activation of bulk diffusion in fine grain clusters, bulk diffusion through interphase boundary. The conditions for prevailing one of them can be provided by changing condensation and postcondensation annealing temperatures or by choosing certain grain size.     

Ultrathin Mo/MoN bilayer nanostructure for diffusion barrier application of advanced Cu metallization

Ultrathin Mo (5 nm)/MoN (5 nm) bilayer nanostructure has been studied as a diffusion barrier for Cu metallization. The Mo/MoN bilayer was prepared by magnetron sputtering and the thermal stability of this barrier is investigated after annealing the Cu/barrier/Si film stack at different temperatures in vacuum for 10 min. The failure of barrier structure is indicated by the abrupt increase in sheet resistance and the formation of Cu₃Si phase proved by X-ray diffraction (XRD) and energy-dispersive X-ray spectroscopy (EDS). High resolution transmission electron microscopy (HRTEM) examination suggested that the ultrathin Mo/MoN barrier is stable and can prevent the diffusion of Cu at least up to 600 °C.     

Surface mobility difference between Si and Ge and its effect on growth of SiGe alloy films and islands

Based on first-principles calculations of surface diffusion barriers, we show that on a compressive Ge(001) surface the diffusivity of Ge is 10(2)-10(3) times higher than that of Si in the temperature range of 300 to 900 K, while on a tensile surface, the two diffusivities are comparable. Consequently, the growth of a compressive SiGe film is rather different from that of a tensile film. The diffusion disparity between Si and Ge is also greatly enhanced on the strained Ge islands compared to that on the Ge wetting layer on Si(001), explaining the experimental observation of Si enrichment in the wetting layer relative to that in the islands.     

Diffusion of silicon in titanium nitride films. Efficiency of TiN barrier layers

Two kinds of reactively evaporated titanium nitride films with columnar (B ₀ films) and fine-grained film structure (B ₊ films) have been examined as diffusion barriers, preventing the silicon diffusion in silicon devices. The silicon diffusion profiles have been investigated by 2 MeV ⁴He⁺ Rutherford backscattering spectrometry (RBS) after annealing at temperatures up to 900° C, in view of application of high-temperature processes. The diffusivity from 400 to 900° C: D (m² s^–1)=2.5×10^–18 exp[–31 kJ/mol/(RT)] in B ₀ layers and D (m² s^–1)=3×10^–19 exp[–26 kJ/mol/(RT) in B ₊ TiN layers. The diffusivities determined correspond to grain boundary diffusion, the difference being due to the different microstructure. The very low diffusivity of silicon in B ₊ TiN layer makes it an excellent high-temperature barrier preventing silicon diffusion.     

Radiation-stimulated diffusion in Al–Si alloys

A di-vacancy low-temperature diffusion is proposed to explain diffusion-controlled processes in Al–Si alloys responsible for neutron-induced silicon precipitation. Ab initio calculations of potential barriers for Si atom hopping in aluminium lattice showed that in the case of di-vacancy diffusion, they are small compared with that of mono-vacancy diffusion. The low temperature diffusivity of mono-vacancies is too small to account for the measured Si diffusivities in aluminium. The dependencies of radiation-stimulated diffusion on the neutron flux and on the temperature are obtained and can be used for the experimental verification of the developed model.     

Structural changes during annealing of submicro- and nanocrystalline aluminum alloys

The annealing-induced evolution of the structure and microhardness of submicro-and nanocrystalline Al—3% Mg and Al 1570 alloys produced by torsional severe plastic deformation are studied. Annealing of the Al-3% Mg alloy at 373–423 K and annealing of the Al 1570 alloy at 373–473 K are shown to result in the relaxation of internal stresses and subsequent normal grain growth. As the annealing temperature increases, the microhardness decreases. At higher temperatures (473 K for the Al—3% Mg alloy and 573 K for the Al 1570 alloy), anomalous grain growth takes place. This growth is accompanied by the appearance of numerous grains with a high dislocation density, a high concentration of impurity atoms in grain boundaries, and an increase in the microhardness. These effects are explained.     

The role of grain boundaries in the mechanism of plasma immersion hydrogenation of nanocrystalline magnesium films

In this paper, attention in focused on the nanostructured magnesium films for hydrogen storage. It is shown that 2 μm thick Mg film is transformed into MgH₂ film under high-flux and fluence hydrogen plasma immersion ion implantation at 450 K for 15 min. All hydrogen desorbs at temperature about 530 K, which corresponds to the decomposition of MgH₂ → Mg + H₂↑. The macroscopic and microscopic observations show that magnesium film undergoes a high deformation and restructuring during hydrogenation-dehydrogenation reaction. The suggested hydrogenation model is based upon the incorporation of excess of hydrogen atoms in grain boundaries of nanocrystalline Mg film driven by the increase in surface chemical potential associated with the implantation flux. The results provide new aspects of hydriding of thin nanocrystalline film materials under highly non-equalibrium conditions on the surface.