Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg

The isothermal time–temperature-transformation (TTT) cure diagram is developed in this article to investigate the effect of thermoplastic toughening agent on glass transition temperature (T _g) and cure kinetics of an epoxy carbon fiber prepreg, Cycom 977-2 unidirectional (UD) tape. The glass transition temperature was measured using differential scanning calorimetry (DSC) over a wide range of isothermal cure temperatures from 140 to 200 °C. Times to gelation and vitrification were measured using shear rheometry. The glass transition temperature master curve was obtained from the experimental data and the corresponding shift factors were used to calculate the activation energy. The kinetic rate model was utilized to construct iso-T _g contours using the calculated activation energy. It was observed that the iso-T _g contours did not follow the behavior of the neat epoxy resin, since they deviated from the gel time curve. This deviation was believed to be the effect of the thermoplastic toughening agent. The behavior of the neat epoxy resin in 977-2 was shown by constructing the iso-T _g contours using the activation energy obtained from gel time modeling.     

Epoxy resins (DGEBA): The curing and physical aging process

Differential scanning calorimetry (DSC) and infrared spectroscopy (IR) were used to monitor the degree of cure of partially cured epoxy resin (Epon 828/MDA) samples. The extent of cure, as determined by residual heat of reaction, concurred with that determined by monitoring the infrared radiation absorbance of the epoxide group near 916 cm^?l. The fictive temperature T_{f, g} was found to increase with the degree of cure, increasing rapidly during cure until reaching a value near the cure temperature T_c of 130°C (approximately 80% cure) where the material vitrified. The greatly reduced reaction rate during the final 20% of cure was not only a consequence of vitrification but, as revealed by infrared spectroscopy, the result of the depletion in the number of reactive epoxide groups. The endothermic peak areas and peak temperatures evident during the DSC scans were used as a measure of the extent of “physical aging” which took place during the cure of this resin, and after, fully cured samples were aged 37°C below their ultimate glass temperature for various periods of time. The rate of physical aging slowed as the temperature increment (T_t,g ? T_c) increased. Although an endothermic peak was evident after only 1 h of cure (T_{f, g} = 138.3°C), such a peak did not appear until fully cured samples were aged for 16 h or more. Enthalpy data revealed that for partially cured material, the fictive temperature T_{f, a}, reflecting physical aging, increased with curing time. In contrast, the T_{f, a}, for fully cured samples decreased with sub-T_g aging time. The characteristic jump in the heat capacity ΔC_p which occurred at the T_{f, g} decreased as curing progressed. This decrease appears to be dependent upon the rotational and vibrational degrees of freedom of the glass. Finally, a graphical method of determining the fictive temperature T_{f, a}, of partially and fully cured epoxy material from measured endothermic peak areas was developed.     

Acceleration of the cationic polymerization of an epoxy with hexanediol

Thin films of 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexane carboxylate were UV irradiated (1.1 J cm^-2) under isothermal conditions ranging from 0 to 50°C. Under these conditions the polymerization advanced quickly but only to a conversion level of less than 10% before the reaction rate slowed by more than an order of magnitude. This drop off in rate was not caused by the glass transition temperature, T _g, reaching or exceeding the reaction temperature, T _rxn, since the epoxide's T _g remained at least 40°C below T _rxn. Raising the sample temperature above 60°C caused a sharp increase in the conversion level. At 100°C conversion exceeds 80% and the ultimate T _g approaches 190°C. The addition of 10 mass% 1,6-hexanediol, HD, to the epoxy caused the conversion at room temperature to quintuple over the level obtained without the alcohol present. The heat liberated from this alcohol epoxy blend during cure on a UV conveyor belt system caused the sample's temperature to increase by about 100°C above ambient whereas the epoxy alone under these conditions only experienced a modest temperature rise of about 26°C. If the amount of HD in the blend is increased above 10% the heat of reaction at 23°C decreases due to HD being trapped in a nonreactive crystalline phase. Boosting reaction temperatures above 50°C melts the HD crystals and yields significantly improved conversion ratios. As the level of alcohol blended with the epoxy is raised its ultimate T _g is lowered and when the concentration of alcohol in the blend nears 30 mass%T _g drops below room temperature. This revised version was published online in July 2006 with corrections to the Cover Date.     

Effects of curing on the glass transition temperature and moisture absorption of a neat epoxy resin

Apparent glass transition temperature (T_g) measurements were made on smaples of a neat epoxy resin that had been cured at four different temperature and for four different times at each temperature. The apparent T_g data increase with cure time toward an asymptote that was dependent on cure temperature. The asymptotic dependence of T_g on cure temperature may be explained by the effect of cure temperature on the reaction rates and available reaction sites. The asymptotic increase with cure time may be understood in terms of the resin's extent of cure. Moisture-conditioning studies were also made and the amount of moisture absorbed was correlated with the extent of cure. The absorbed moisture's interaction with the resin's molecular structure was deduced to by primarily at hydroxyl sites.     

Continuous and gradual photo-activation methods: influence on degree of conversion and crosslink density of composite resins

Thermal properties and degree of conversion (DC%) of two composite resins (microhybrid and nanocomposite) and two photo-activation methods (continuous and gradual) displayed by the light-emitting diode (LED) light-curing units (LCUs) were investigated in this study. Differential scanning calorimetry (DSC) thermal analysis technique was used to investigate the glass transition temperature (T _g) and degradation temperature. The DC% was determined by Fourier transform infrared spectroscopy (FT-IR). The results showed that the microhybrid composite resin presented the highest T _g and degradation temperature values, i.e., the best thermal stability. Gradual photo-activation methods showed higher or similar T _g and degradation temperature values when compared to continuous method. The Elipar Freelight 2^TM LCU showed the lowest T _g values. With respect to the DC%, the photo-activation method did not influence the final conversion of composite resins. However, Elipar Freelight 2^TM LCU and microhybrid resin showed the lowest DC% values. Thus, the presented results suggest that gradual method photo-activation with LED LCUs provides adequate degree of conversion without promoting changes in the polymer chain of composite resins. However, the thermal properties and final conversion of composite resins can be influenced by the kind of composite resin and LCU.     

Physical aging of poly(ether sulfone)-modified epoxy resin

The physical aging process of 4,4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with poly(ether sulfone) (PES) was studied by differential scanning calorimetry (DSC) at four aging temperatures between T_g-50°C and T_g-10°C. At aging temperatures between T_g-50 and T_g-30°C, the experimental results of epoxy resin blended with 20 wt% of PES showed two enthalpy relaxation processes. One relaxation process was due to the physical aging of PES, the other relaxation process was due to the physical aging of epoxy resin. The distribution of enthalpy relaxation process due to physical aging of epoxy resin in the blend was broader and the characteristic relaxation time shorter than those of pure epoxy resin at the above aging temperatures (between T_g-50 and T_g-30°C). At an aging temperature between T_g-30 and T_g-10°C, only one enthalpy relaxation process was found for the epoxy resin blended with PES, the relaxation process was similar to that of pure epoxy resin. The enthalpy relaxation process due to the physical aging of PES in the epoxy matrix was similar to that of pure PES at aging temperatures between T_g-50 and T_g-10°C. © 1997 John Wiley & Sons, Inc.     

Cure kinetics of thermosetting bisphenol E cyanate ester

Resin injection repair is a common method to repair delamination damage in polymer matrix composites (PMCs). To repair high-temperature PMCs, the resin should have a very low viscosity, yet cure into a compatible adhesive with high temperature stability. Normally, thermosetting polymers with high glass transition temperatures (T _g) are made from monomers with high room temperature viscosities. Among the high temperature resins, bisphenol E cyanate ester (BECy, 1,1’-bis(4-cyanatophenyl)ethane), is unique because it has an extremely low viscosity of 0.09–0.12 Pa s at room temperature yet polymerizes as a cross-linked thermoset with a high T _g of 274°C. BECy monomer is cured via a trimerization reaction, without volatile products, to form the high T _g amorphous network. In this study, the cure kinetics of BECy is investigated by differential scanning calorimetry (DSC). Both dynamic and isothermal experiments were carried out to obtain the kinetic parameters. An autocatalytic model was successfully used to model isothermal curing. The activation energy from the autocatalytic model is 60.3 kJ mol⁻¹ and the total reaction order is about 2.4. The empirical DiBenedetto equation was used to evaluate the relationship between T _g and conversion. The activation energy of BECy from the dynamic experiments is 66.7 kJ mol⁻¹ based on Kissinger’s method, while isoconversional analysis shows the activation energy changes as the reaction progresses.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Time-temperature transformation (TTT) cure diagram of an unsaturated polyester resin

The curing of an unsaturated polyester resin was studied by differential scanning calorimetry (DSC), thermal mechanical analysis (TMA), and Fourier-transform infrared spectroscopy (FTIR). The results are presented in the form of a time-temperature-transformation (TTT) diagram. The kinetic analysis was performed by means of the dynamic Ozawa method. This analysis was used to determine the curing times (t) at various conversions (α) and temperatures (T) (isoconversional lines ln t = A + E/RT). The equivalence of the Ozawa method and the isothermal isoconversional adjustment ln t = A + E/RT were demonstrated. The relationship between the glassy transition temperature (T_g) and the conversion α was determined by DSC. It was established that this relationship is one-to-one and independent of mass, initiation system, and curing temperature (T_c). The T_g-α relationship was adjusted using the DiBenedetto equations and heat capacity data. Using the T_g-α relationship and the isoconversional lines, the vitrification curve was determined and it was observed that the vitrification times obtained are consistent with those obtained experimentally when T_c = T_g. Gelation was determined by TMA, the material being considered gelled when it reached sufficient mechanical stability for the TMA measuring probe to become embedded in it. At that moment the conversion reached was determined by DSC. It was seen that the material always gels at constant conversion, regardless of the curing temperature. The gelation line (gel times) were traced from the corresponding isoconversional line. © 1997 John Wiley & Sons, Inc.     

Effect of microstructure on hydrolytic degradation studies of poly (l-lactic acid) by FTIR spectroscopy and differential scanning calorimetry

Structural changes during thermally induced crystallization and alkaline hydrolysis of Poly(l-lactic acid) (PLLA) films were investigated using differential scanning calorimetry (DSC), FTIR spectroscopy, weight loss, HPLC and optical microscopy. It was shown that crystallinity (χ_c), glass transition temperature (T_g) and melting temperature (T_m) were found to be strongly annealing temperature (T_a) dependent. The FTIR study of PLLA films suggested that the bands at 921 and 956 cm⁻¹ could be used to monitor the structural changes of PLLA. An independent infrared spectroscopic method was developed for the first time to determine crystallinity of PLLA before degradation and it showed good qualitative correlation with DSC crystallinity. The higher crystallinity values determined by FTIR were attributed to the intermediate phase included in the IR crystallinity. Both the weight loss data and the percentage of lactic acid obtained by HPLC showed that the alkaline hydrolysis of PLLA films increased with increasing crystallinity. The DSC observation showed an increase in T_g and no significant change in T_m and heat of fusion, while IR showed an increase in IR crystallinity with increasing hydrolysis time. The increase in IR crystallinity and T_g with hydrolysis time suggested that degradation progressed from the edges of the crystalline lamellas without decreasing lamellar thickness, but increased the intermediate phase and the short-range order.     

Study of the Crystallization of an Aromatic Poly-ether-ketone (PK99) by Calorimetric and X-ray Analysis

An analysis of the crystallization behaviour of a new poly(aryl-ether-ether-ketone-ketone), PK99, by differential scanning calorimetry (DSC) and wide-angle X-ray diffraction (WAXD) is presented. Isothermal crystallization TG were obtained in the whole range between the glass transition temperature (T _g) and the melting temperature (T _m) as a consequence of the slow crystallization kinetics stemming from the closeness of these transitions. The calorimetric results, compared with WAXD data, were applied to determine the theoretical melting temperature and crystallization enthalpy. The DSC and WAXD data were combined in order to calculate the total amount of the crystallizable fraction of the polymer, and a model was proposed to explain the difference between the fractions of crystallinity observed with these techniques. The thermal and X-ray data were also correlated with different lamellar morphologies arising from the crystallization conditions. Finally, DSC experiments on the crystallized sample were used to detect the presence of a rigid amorphous phase which does not relax at T _g. This revised version was published online in July 2006 with corrections to the Cover Date.     

Positronium annihilation in amine-cured epoxy polymers

Positronium annihilation spectroscopy (PAS) has been used to study the microstructural properties of amine-cured epoxy polymers. We have determined the free-volume “hole” sizes in these polymers by comparing the observed ortho-positronium lifetimes with the known lifetime–free volume correlation for low-molecular-weight systems. The free volumes for four epoxies with different crosslink densities are found to vary significantly over the temperature range between ?78° and 250°C. The free-volume holes for these polymers are found to range from 0.025 to 0.220 nm³. Two important transition temperatures were found: one corresponds to the glass transition temperature T_g determined by differential scanning calorimetry (DSC), and the other occurs about 80–130°C below T_g. The sub-T_g transition temperature is interpreted tentatively as being where hole size reaches dimensions adequate for positronium trapping or else the onset temperature for local mode or side-chain motions. These two transition temperatures plus two additional onset temperatures are found to be correlated with crosslink densities calculated from stoichiometry.     

Effects of water on epoxy cure kinetics and glass transition temperature utilizing molecular dynamics simulations

Effects of water on epoxy cure kinetics are investigated. Experimental tests show that absorbed water in an uncured bisphenol‐F/diethyl‐toluene‐diamine epoxy system causes an increase in cure rate at low degrees of cure and a decrease in cure rate at high degrees of cure. Molecular simulations of the same epoxy system indicate that the initial increase in cure rate is due to an increase in molecular self‐diffusion of the epoxy molecules in the presence of water. Effects of water on the glass transition temperature (T_g) of the crosslinked thermoset are also studied. Both experiments and simulations show that water decreases T_g. Both types of results indicate that T_g effects are small below 1% water by weight, but that T_g depression occurs much quickly with increasing water content above 1%. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1150–1159     

A study of the kinetics of the microwave cure of a phenylethynyl‐terminated imide model compound and imide oligomer (PETI‐5)

The kinetic mechanism of the microwave cure of a simple phenylethynyl‐terminated imide model compound, 3,4′‐bis[(4‐phenylethynyl)phthalimido]diphenyl ether (PEPA‐3,4′‐ODA) and a phenylethynyl‐terminated imide oligomer (PETI‐5, M_n 5000 g/mol) was studied. Dielectric properties of the model compound and PETI‐5 were measured in the microwave range from 0.4 GHz to 3 GHz. FTIR was used to follow the cure of the model compound (PEPA‐3,4′‐ODA), while thermal analysis (DSC) was used to follow the cure of the PETI‐5 oligomer. The changes in room temperature IR absorbance of phenylethynyl triple bonds at 2214 cm⁻¹ of PEPA‐3,4′‐ODA as a function of cure time were measured after cure temperatures of 300, 310, 320, and 330 °C. The changes in the glass‐transition temperature, T_g, of PETI‐5 as a function of cure time were measured after cure at 350, 360, 370, and 380 °C, respectively. The T_g 's were determined to calculated the relative extent of cure, x, of the PETI‐5 oligomer according to the DiBenedetto equation. For the model compound, the reaction followed first order kinetics, yielding an activation energy of 27.6 kcal/mol as determined by infrared spectroscopy. For PETI‐5, the reaction followed 1.5th order, yielding an activation energy of 17.1 kcal/mol for the whole cure reaction, as determined by T_g using the DiBenedetto method. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2526–2535, 2000     

Advances in nano thermal analysis of coatings

This article discusses AFM-based localized thermal analysis of crosslinked polymer coatings based on a recent breakthrough in nanoscale thermal probe technology. The addition of a thermal tip to a conventional AFM adds a new and valuable capability of spatially resolved thermal analysis to the AFM. It is particularly useful for thin films since it enables the measurement of transition temperatures (melting (T _m) or glass (T _g)) on selected regions of the sample aiding in the identification and characterization of phases on the length scales approaching macromolecular dimensions. Examples include the monitoring of the softening point of automotive clearcoat systems, as a function of cure time and cure temperature and characterization of degradation and embrittlement of weathered acrylic-polyurethane coatings. Comparison of nano thermal analysis with bulk DSC and MDSC is made and its inherent advantages over DSC in analyzing surfaces, is demonstrated.     

Cure kinetics of epoxy composite applied on stator bars insulation

Cure kinetics study of epoxy resin composite, employed as stator bars insulation system, was evaluated through differential scanning calorimetry using the dynamic methodology, different heating rates. These experiments provided some important information about the system as activation energy (E _a = 65.4 kJ mol⁻¹), glass transition (T _g) values on different curing stages including the final cured material information and, besides that, it enables the comparison of these data with new materials under development. The activation energy value allows the determination of different energy needs of the system under evaluation, specially temperature for the material cure, improving the possibility of comparison between different insulation systems in use in the high voltage insulation business. The composite conversion degree based on the cure enthalpy (ΔH _cure) at different time of cure was also subject of analysis and from that it was possible to comprehend the cure pattern which allows the cure state prediction of further samples of this type of material and the more accurate evaluation of similar samples acquired directly from stator bars.     

Characterisation of structural relaxation phenomena in polymeric materials from thermal analysis investigations

Measurements have been performed on poly(ethylene terephthalate)glycol/montmorillonite nanocomposites with different filler contents using differential scanning calorimetry (DSC) and temperature modulated differential scanning calorimetry (TMDSC). According to the strong-fragile concept proposed by Angell, we have determined the values of the fragility index m. In a second time, we have calculated the average size of a cooperative rearranging region (CRR) z(T _g) at the glass transition according to the definition proposed by Solunov. However, z(T _g is a dimensionless quantity and then only allows a comparative study between different samples. To calculate the average number of monomer units by CRR noted N _α, we have used the method developed by Donth. The results show that the presence of montmorillonite in PET_g matrice implies modifications on structural relaxation phenomena. Furthermore, we have shown that z(T _g and N _α values have the same evolution in function of filler content.     

Radiation-induced polymerization of glass-forming systems. II. Effect of temperature on the polymerization rate at higher conversion

The effect of temperature and conversion on the polymerization rate at higher conversion was investigated with regard to the γ-ray-induced polymerization of hydroxyethyl methacrylate (HEMA) and glycidyl methacrylate (GMA) in the supercooled phase. The polymerization rate changed from acceleration to depression at various conversions, depending on the polymerization temperature. It was found that T_v at which the viscosity of the system became ca. 10³ cpoise influenced the shape of the polymerization time–conversion curve. The experimentally obtained conversion reflection point in the polymerization time–conversion curve agreed with the conversion where the polymerization temperature is the same as the calculated T_v of the system. When the polymerization temperature was lower than T_v of the monomer, no acceleration of the polymerization occurred. When the polymerization temperature was higher than T_v of the polymer, no depression of the polymerization rate was observed. The effect of temperature on the saturated conversion (final conversion) was also examined in terms of T_g of the polymerization system. The experimentally obtained saturated conversion agreed with the conversion where the polymerization temperature is the same as the calculated T_g of the system.     

Curing reaction of o-cresol novolac epoxy resin according to hardener change

The investigations of cure kinetics and glass transition temperature (T_g) versus reaction conversion (α) of o-cresol novolac epoxy resin with the change of hardener were performed. All kinetic parameters of the curing reaction such as the reaction rate order, activation energy, and frequency factor were calculated. The curing mechanisms were classified into two types. One was an autocatalytic mechanism and the other was a nth order kinetic mechanism. The constants related to the chain mobility of polymer segments were obtained by using the DiBenedetto equation. We have tried to correlate the relationships between curing mechanism and molecular structures of hardeners from these results. © 1993 John Wiley & Sons, Inc.     

Photopolymerization kinetics of oligo(ethylene oxide) and oligo(methylene) oxide dimethacrylates

The influence of temperature on the photopolymerization kinetics of oligo(methylene) oxide and oligo(ethylene oxide) dimethacrylate series has been investigated by isothermal DSC. The DSC curves showed a rapid rise in rate due to the Trommsdorff effect, and then a slow decline. A shoulder, apparent on many of the DSC curves at low conversions, became more prominent when the cure temperature was lowered. The kinetics were relatively insensitive to the dimethacrylate structure in the early stages of the reaction, but became more dependent as the reaction proceeded. A previously derived mathematical model, which allows for the influence of diffusion on the rate constants, was used to predict the kinetics. The dependence of the maximum rate and conversion on the curing temperature were adequately described by the model. The experimentally observed shoulder on the rate curve was also predicated as was the evolution of the rate/time curves with curing temperature. Similar predictions were found when a nonsteady state version of the model was used. The radiation intensity exponent varied from 0.3 to 0.6 possibly due to chain-length effects and pseudo-first order termination, respectively. The final degree of conversion increased with curing temperature (T_cure) and was correlated with the flexibility of the dimethacrylate. These data were fitted to a theoretical expression relating the final conversion to the resin T_g and to the T_cure. © 1993 John Wiley & Sons, Inc.