Synthesis and properties of a phosphorus-containing flame retardant epoxy resin based on bis-phenoxy (3-hydroxy) phenyl phosphine oxide

A reactive phosphorus-containing compound, bis-phenoxy (3-hydroxy) phenyl phosphine oxide (BPHPPO) was first successfully synthesized to produce the phosphorus-containing flame retardant epoxy resin (BPHPPO-EP). The chemical structures were characterized from FTIR, MS, NMR spectra and elemental analyses. Thermal degradation behaviors and flame retardant properties of the cured epoxy resins were investigated from the thermogravimetric analysis (TGA) and the limiting oxygen index (LOI) test using 4,4′-diaminodiphenylsulfone (DDS) as curing agent. The high char yields and the high limiting oxygen index values were found to certify the great flame retardancy of this phosphorus-containing epoxy resin.     

Effect of Hyperbranched Polyester on Modification of Epoxy Resins Cured with Anhydride

Epoxy resins are widely used in coatings, adhesives and polymer composites, but the applications of cured epoxy resins are often restricted by their poor toughness. HBP can be used as toughener to improve the toughness of epoxy resins due to its high-dens…     

有机硅改性丙烯酸环氧单酯光-热混杂固化体系的表面性能

以有机硅改性丙烯酸环氧单酯为树脂配制了一系列紫外光-热混杂固化体系.通过FTIR表征了光-热固化过程双键和环氧特征吸收峰的变化.研究了不同的稀释剂对光固化和光-热混杂固化膜的凝胶率、吸水率、表面水接触角等性能的影响,并用能谱仪(EDS)测试了固化膜表面硅元素的含量.结果表明:光固化膜的凝胶率低于86.5%,而光-热混杂固化膜的凝胶率在97.0%左右.与丙烯酸环氧单酯光-热固化体系相比,有机硅改性丙烯酸环氧单酯光-热固化膜的表面水接触角有显著提高,由62.53°提高到99.27°,EDS测试也表明有机硅有富集于固化膜表面的特性.     

Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility,Waterproof and Mechanical Properties for LED Encapsulation

An oligo-fluoropolymer(PFM) with functional cycloaliphatic epoxy and fluorinated groups was obtained via free radical polymerization and applied to the modification of cycloaliphatic epoxy resins(CE). The chemical structure of PFM was characterized by Fourier transform infrared(FTIR) spectroscopy, gel permeation chromatography(GPC) and nuclear magnetic resonance(NMR) spectroscopy, and the effects of different PFM concentrations(0.5%—6%, mass fraction) on the thermal resistance, mechanical properties, surface dewettability, light transmission, refractive index and various cured polymer properties were studied in detail. The DSC and TGA results demonstrate that the modified epoxy resins possess a higher thermal resistance than the neat epoxy resin. The improvements in the surface dewettability and water resistance are caused by the high crosslinking density and the enrichment of the oligo-fluorinated random copolymers dispersed in the matrix. The fracture surface morphologies of the thermosets were investigated by scanning electron microscopy(SEM) and transmission electron microscopy(TEM). It was observed that the optical transmittance of the composites was maintained even though microphase separation occurred during the curing process. With respect to the corresponding properties of the neat epoxy resins, the 2 phr(parts per hundreds of resin) PFM thermoset exhibited relatively better comprehensive properties, making the cured material a good candidate for light-emitting diode(LED) encapsulation.     

Thermal decomposition of fire retardant brominated epoxy resins cured with different nitrogen containing hardeners

Epoxy resins frequently have to meet a flame retardancy grade which can be accomplished by incorporating brominated reactive compounds, like tetrabromobisphenol A (TBBA) cured by a number of hardeners. A few brominated epoxy resins (BERs) have been prepared by curing a mixture of diglycidyl ethers of bisphenol A (DGEBA)/diglycidyl ethers of tertabromobisphenol A (DGETBBA) and different hardeners: dicyandiamide (DICY), 4,4′-diaminodiphenyl sulphone (DDS) and polyethylene polyamine (PEPA). The use of different hardeners strongly affects the thermal degradation behaviour of the BER.The main volatile products of pyrolysis, characterized by Pyrolysis-Gas Chromatography-Mass Spectroscopy (PY-GC-MS) at 423 °C were phenol, isopropyl- and isopropenylphenol, mono- and di-brominated phenols, bisphenol A, mono-, di-, tri- and tetra-brominated bisphenol A. No nitrogen containing volatile products or HBr were evolved whereas SO₂ is formed from BER cured with DDS (BER-DDS) and bromoethylene from BER cured with PEPA (BER-PEPA). Differences of 30-60 °C in thermal stability of epoxy network have been found, depending on the hardener. The experimental evidence suggests a cooperative action of bromine and nitrogen in chain scission of epoxy resins. In particular the ability of the hardener in fixing HBr, evolved from TBBA units, seems to depend on the basicity of the N atom of the hardener: the lower the basicity, the lower the scavenging effectiveness and consequently the higher the thermal stability.     

Mass spectroscopy of epoxylated novolac resin cured with phthalocyanine tetraamines

Mass spectroscopy was done at different temperatures on epoxylated novolac resin DEN 438 (Dow Chemical Co.) alone, and after curing with various metal(II) phthalocyanine tetraamines (MPTA). Possible modes of fragmentation are given to explain the experimental results. Gas-chromatographic/mass-spectroscopic (GC–MS) analyses of MPTA derivatives indicated the presence of only trace quantities of benzene, aniline, cyanobenzene, and orthodicyanobenzene. The GC–MS studies of the cured DEN 438 epoxy resins indicated that the mechanisms of thermal degradation are qualitatively similar, and some common features were observed in their fragmentation in an electron beam and by thermal degradation. This study is a further assessment of the utility of these phthalocyanine derivatives for curing epoxy resins to produce heat-resistant polymer systems.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Synthesis and effect of hyperbranched (3-hydroxyphenyl) phosphate as a curing agent on the thermal and combustion behaviours of novolac epoxy resin

A novel type of hyperbranched (3-hydroxyphenyl) phosphate (HHPP) with high functionality as a curing agent of epoxy resins was synthesized and characterized by FTIR, ¹H NMR and vapor phase osmometry (VPO). The cured epoxy resin with HHPP possessed improved glass transition temperature. The thermostability and flame retardancy of O-cresol novolac epoxy resin cured with different contents of HHPP were investigated by thermogravimetric analysis (TGA), limiting oxygen index (LOI) and cone calorimetry. The obtained results show that the samples containing a higher percentage of HHPP exhibit relatively lower thermostability at lower temperature while higher thermostability at elevated temperature and more char was formed compared with those containing a lower percentage of HHPP. The LOI value increased from 22.0 to 30.0 when HHPP, instead of 1,3-dihydroxybenzene, was used as a curing agent. The 25 wt% addition of HHPP in the curing agent complex effectively decreased the heat release rate and improved the char yield to the content nearly similar as those of the epoxy resin cured with pure HHPP.     

Synthesis, characterization, and cure properties of phosphorus-containing epoxy resins for flame retardance

An organophosphorus compound, 10-(2,5-dihydroxyl phenyl)-9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DHPDOPO), was synthesized through the reaction of 9,10-dihydro-9-oxa-10-phosphaphnanthrene-10-oxide (DOPO) and p-benzoquinone, and characterized by elemental analysis, Fourier transform infrared spectrum (FTIR), and ¹H-NMR and ³¹P-NMR spectroscopes. Consequently, the phosphorus-containing epoxy resins with phosphorus content of 1 and 2 wt.% were prepared via the reaction of diglycidyl ether of bisphenol-A with DHPDOPO and bisphenol-A, and confirmed with FTIR and gel permeation chromatography (GPC). Phenolic melamine, novolak, and dicyanodiamide (DICY) were used as curing agents to prepare the thermosetted resins with the control and the phosphorus-containing epoxy resins. Thermal properties and thermal degradation behaviors of these the thermosetted resins were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Phenolic melamine-cured resins exhibited higher glass transition temperatures than the other cured resins due to the high rigidity of their molecular chain. TGA studies demonstrated that the decomposition temperatures of the novolak-cured resins were higher than those of the others. A synergistic effect from the combination of the phosphorus-containing epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermosetted resins.     

含硅磷杂化物环氧树脂固化物性能研究

首先用γ-环氧丙氧基三甲氧基硅烷(KH-560)和亚磷酸二乙酯(DEP)反应的中间产物进行水解缩合反应,合成了一种含磷低聚硅氧烷杂化物.并用FTIR,NMR,GPC对其结构及分子量进行了表征.然后将含磷低聚硅氧烷引入到双酚A环氧树脂(E-54)制备硅磷杂化物环氧树脂的固化物.对这种含硅磷杂化物环氧树脂固化物的性能研究发现其极限氧指数为23～29,DSC分析结果玻璃化转变温度(Tg)可以达到204℃,失重5%的温度(Td)5%比纯E-54提高近20℃.该固化物具有阻燃性能,同时具有较好的热性能。     

Nano- and micro-structured random copolymer modified cycloaliphatic epoxy resins for use as light-emitting diode encapsulation

Poly(2,2,3,4,4,4-Hexafluorobutylmethacrylate–random–glycidolmethacrylate) random copolymer (P(HFBMA-r-GMA)) was synthesized via free radical polymerization. The novel reactive random copolymer was incorporated to modify cycloaliphatic epoxy resins and obtain the nano- or micro- structured composites. The chemical structures of P(HFBMA-r-GMA) were confirmed by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). The morphology and light transmittance of the cured epoxy resins were observed by scanning electron microscopy (SEM), transmission electron microscope (TEM) and ultraviolet-visible spectrophotometry (UV-vis), respectively. It is indicated that the optical transmittance of composites were basically kept although the microphase separation occurred in the curing process, which has a profound influence on the mechanical properties and refractive indexes. The thermal properties, surface dewettability and water absorbency of the cured epoxy resins were examined by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), contact angle measurement and immersion test respectively. The experimental results revealed that the values of glass transition temperatures (Tg), surface dewettability and water resistance were effectively improved by the high cross-linking density and the enrichment of the fluorinated random copolymer dispersing in the composites. With respect to the corresponding properties of the neat epoxy resin, P (HFBMA-r-GMA)-0.25 hybrimer embraced the relatively good comprehensive properties, making the modified epoxy resins as good candidates for LED encapsulation.     

Synthesis and Property of Flame Retardant Epoxy Resins Modified with 2-（Diphenylphosphinyl）-l,4-benzenediol

2-（Diphenylphosphinyl）-1,4-benzenediol（DPO-HQ） was synthesized by the reaction of diphenylphos- phine oxide（DPO） with 1,4-benzoquinone（BQ）, and characterized by Fourier transform infrared（FTIR）, and nuclear magnetic resonance（1H NMR, 13C NMR, 31p NMR） spectrometries. The thermal stability of DPO-HQ was investi- gated by thermogravimetric analysis（TGA）. Flame retardant epoxy resin was synthesized based on DPO-HQ. The thermal properties and burning performance of cured epoxy resins were measured by differential scanning calorime- try（DSC）, thermogravimetric analysis（TGA）, limited oxygen index（LOI） and vertical burning test（UL-94V）. The morphologies of cured epoxy resins after combustion were investigated by scanning electron microscopy（SEM） and electron probe microanalysis（EPMA）. Moreover, the thermal stability（both in air and in N2） of DPO-HQ and its cured epoxy resin was compared with that of 10-（2,5-dihydroxyphenyl）-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- oxide（DOPO-HQ） and its cured epoxy resin. The thermal stability of DPO-HQ is comparable with that of DOPO-HQ, while the thermal stability of cured epoxy resin based on DPO-HQ is better than that based on DOPO-HQ.     

活性酯固化环氧树脂物性的研究

主要对活性酯固化环氧树脂的吸水性、高耐湿性、电气特性等方面进行了研究,同时也对其树脂极性、交联结构、分子链运动等方面也进行了研究．     

Thermal and flame retardant properties of epoxy resin cured by a novel phosphorus-containing 4,4′-bisphenol novolac curing agent

A novel flame retardant curing agent for epoxy resin (EP), i.e., a DOPO (9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide)-containing 4,4'-bisphenol novolac (BIP-DOPO) was synthesized and characterized by Fourier transform infrared (FTIR), ¹H NMR, ³¹P NMR spectroscopy, and gel permeation chromatography. The epoxy resin cured by BIP-DOPO itself or its mixture with a commonly used bisphenol A-formaldehyde novolac resin (NPEH720) was prepared. The flame retardancy of the cured EP thermosets were studied by limiting oxygen index (LOI), UL 94 and cone calorimeter test (CCT), and the thermal properties by thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results show that the cured epoxy resin EPNP/BI/3/1, which contains 2.2% phosphorus, possesses a value of 26.2% and achieves the UL 94 V-0 rating. The data from cone calorimeter test demonstrated that the peak release rate, average heat release rate, total heat release decline sharply for the flame retarded epoxy resins, compared with those of pure ones. DSC results show that the glass-transition temperatures of cured epoxy resins decrease with increasing phosphorus content. TGA indicates that the incorporation of BIP-DOPO promotes the decomposition of epoxy resin matrix ahead of time and leads to higher char yield. The surface morphological structures of the char residues reveal that the introduction of BIP-DOPO benefits to the formation of a continuous and solid char layer on the epoxy resin material surface during combustion.     

A flame-retardant epoxy resin based on a reactive phosphorus-containing monomer of DODPP and its thermal and flame-retardant properties

A flame-retardant epoxy resin (EP) was synthesized based on a novel reactive phosphorus-containing monomer, 4-[(5,5-dimethyl-2-oxide-1,3,2-dioxaphosphorinan-4-yl)oxy]-phenol (DODPP), and its structures were characterized by FTIR, ¹H NMR and ³¹P NMR spectra. The DODPP-EP₃/LWPA (low molecular weight polyamide), which contains 2.5% phosphorus, can reach UL-94 V-0 rating and a limiting oxygen index (LOI) value of 30.2%. The thermal properties and burning behaviours of cured epoxy resins were investigated by differential scanning calorimeter (DSC), thermogravimetry (TG), LOI, UL-94 tests and cone calorimetry. The morphologies of residues of cured epoxy resins were investigated by scanning electron microscopy (SEM). DSC shows that the glass-transition temperatures of cured epoxy resins decrease with increasing phosphorus content. TGA shows that the onset decomposition temperatures and the maximum-rate decomposition temperatures decrease, while char yields increase, with the increase of phosphorus content. The data from the cone calorimeter tests give the evidence that heat release rate (HRR), peak heat release rate (PHRR), average heat release rate (Av-HRR), average mass loss rate (Av-MLR) and the fire growth rate index (FIGRA) decrease significantly for DODPP-EP₃/LWPA. SEM shows that the DODPP-EP₃/LWPA forms lacunaris and compact charred layers which inhibit the transmission of heat during combustion.     

Epoxy resins. III. Application of fourier transform IR to degradation studies of epoxy systems

Three cured epoxy resins were investigated under various degradation conditions by Fourier transform infrared (FTIR) spectroscopy for measurement. The epoxy resins were the diglyadyl ethers of bisphenol A (DGEBA), phenolphthalein (DGEPP), and 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF). The thermal stability order of functional groups that incurred DGEBA was total methyl group ～ total benzene ring > methylene > p-phenylene > ether linkage > isopropylidene. The oxidative thermal and photodegradation processes were found to be related to the classical autocatalytical oxidation of aliphatic hydrocarbon segments. The Wieland rearrangement, Norrish-type reaction, Claisen rearrangement, and other possible degradation mechanisms were suggested by the data.     

Epoxy resins and epoxy blends studied by near infra-red spectroscopy

The cure and the final network of epoxy resins have been investigated by numerous techniques, nevertheless a clear understanding of this network structure has not yet been achieved. FTIR analysis of polymeric materials provides highly precise measurements that are widely interpretable in terms of chemical structure. Yet the high absorption of fundamental bands requires careful sample preparation to reduce the thickness of the sample or special reflection techniques are needed. Furthermore, the occurrence of overlapping bands for epoxy resin (N-H and O-H vibrations in the 3000 cm⁻¹ region) renders the quantitative analysis in the region mid IR particularly difficult. However, the overtone and combination bands are 10–100 times weaker than the fundamental ones and are observed in near infrared (NIR) region. Longer pathlengths than Mid IR ones can be used allowing transmission analysis of thick samples (1-20 mm) without special preparation. NIR absorption bands have different intensities depending on the anharmonicity of vibrations. The strongest absorption bands are due to protons connected to carbon, nitrogen, oxygen. Hydrogen bonding due to inter- and intramolecular interactions can cause band broadening, peak position shifts and intensity variations. NIR spectroscopy is therefore a useful technique to investigate polymeric materials and was used to study the cure reactions of various epoxy resins cured with amine hardener. Using different NIR techniques (reflectance, transmission and microscopy) we will briefly present some results concerning hydrogen bonding between epoxy and amine hardener before curing, epoxy resins, glass/epoxy composites and epoxy/PES (polyethersulfone) blends.     

Synthesis and properties of biobased epoxy resins. part 1. Glycidylation of flavonoids by epichlorohydrin

Biobased epoxy resins were synthesized from a catechin molecule, one of the repetitive units in natural flavonoid biopolymers also named condensed tannins. The reactivity of catechin toward epichlorohydrin to form glycidyl ether derivatives was studied using two model compounds, resorcinol and 4‐methylcatechol, which represent the A and B rings of catechin, respectively. These model molecules clearly showed differences in reactivity upon glycidylation, explaining the results found with catechin monomer. The reaction products were characterized by both FTIR and NMR spectroscopy and chemical assay. The glycidyl ether of catechin (GEC) was successfully cured in various epoxy resin formulations. The GECs thermal properties showed that these new synthesized epoxy resins displayed interesting properties compared to the commercial diglycidyl ether of bisphenol A (DGEBA). For instance, when incorporated up to 50% into the DGEBA resin, GEC did not modify the glass‐transition temperature. Epoxy resins formulated with GEC had slightly lower storage moduli but induced a decrease of the swelling percentage, suggesting that GEC‐enhanced crosslinking in the epoxy resin networks. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

PHASE STRUCTURE AND PROPERTIES OF EPOXY RESIN MODIFIED BY POLYSILOXANE BEARING PENDANT AMINO GROUPS

Polysiloxane-modified epoxy resins were prepared through the reaction of epoxy resin with polydimethylsiloxanesbearing pendant N-(β-aminoethyl)-γ-aminopropyl groups. The morphology and properties of the cured epoxy resins modifiedby the polysiloxanes were investigated. It was found that the phase structure and properties of the cured epoxy resins dependmainly on the amino group content in the polydimethylsiloxane and the level of the modifier. The change of phase structurein the cured epoxy resin systems was responsible for the dramatic change in their mechanical and surface properties.