适用于RTM成型聚酰亚胺材料研究进展

综述了适用于RTM成型耐高温聚酰亚胺材料的研究进展，主要包括降冰片烯酸酐（NA）封端的PMR聚酰亚胺树脂和使用苯乙炔基封端剂合成的酰亚胺低聚物，在这其中采用苯乙炔基封端剂合成的酰亚胺低聚物具有低的熔体粘度和良好的熔体稳定性，固化交联后的聚合物及树脂基复合材料具有良好的热性能和力学性能。本文介绍了上述聚合物化学合成、结构与性能之间的关系，并对适用于RTM成型耐高温聚酰亚胺材料的应用进行了简单介绍。     

4-苯乙炔苯酐封端聚酰亚胺树脂的合成与性能研究

使用3,3′,4,4′-二苯醚四酸二酐(ODPA)、3,3′,4,4′-联苯四酸二酐(BPDA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3,4′-二氨基二苯醚(3,4′-ODA)和反应性封端剂4-苯乙炔苯酐(4-PEPA)合成了设计分子量为5000的系列苯乙炔基封端的聚酰亚胺低聚物,并使用XRD、DSC、TGA、FT-IR、DMA和流变仪等对低聚物的化学结构、热性能和熔体性能,固化后树脂的热性能和力学性能进行了测试.研究结果表明基于ODPA的低聚物具有低的熔体粘度和良好的熔体粘度稳定性,固化后的树脂具有很高的热失重温度,较高的玻璃化转变温度以及良好的力学性能尤其是高的断裂伸长率(>10%);基于BPDA的低聚物具有一定的结晶性,其结晶熔融温度与苯乙炔基固化交联温度相近,影响了材料的成型工艺性能.     

4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

含氟苯乙炔苯胺封端聚酰亚胺的合成与性能研究

设计并合成了一种含氟苯乙炔苯胺封端剂4-苯乙炔基-3-三氟甲基苯胺(3FPA),使用3FPA与4,4′-(六氟异丙基)双邻苯二甲酸二酐(6FDA)和对苯二胺(p-PDA)制备了计算分子量为5000的聚酰亚胺树脂3FPA-PI-50,并对树脂溶液、树脂模塑粉和树脂模压件的制备与性能进行了研究,实验结果表明3FPA-PI-50树脂溶液具有良好的储存稳定性,成型后树脂具有优异的热性能和热氧化稳定性,后固化后树脂玻璃化转变温度为404℃,5%热失重温度大于530℃.此外树脂具有低的介电常数和吸水率.     

基于乙炔基-苯并噁嗪单元双重交联反应的聚酰亚胺树脂的制备与性能

为开发可低温固化的聚酰亚胺树脂, 通过分子结构设计将苯并噁嗪单元引入聚酰亚胺树脂中, 合成了含苯并噁嗪单元及乙炔基封端的双官能化新型聚酰亚胺预聚体(PIBzA). 经高温处理, 苯并噁嗪单元发生开环交联, 同时, 乙炔基端基发生三聚成环反应, 从而在固化树脂中形成双重交联网络结构. 苯并噁嗪单元的引入使聚酰亚胺树脂最快固化反应温度降低约32 ℃, 有效降低了固化温度. 同时, 苯并噁嗪单元的引入未大幅度降低树脂的耐热稳定性, 其玻璃化转变温度(T_g)介于266~290 ℃之间, 5%热失重温度(T_d,5%)接近500 ℃, 依然可以满足耐高温复合材料的应用需求. 此外, PIBzA固化树脂具有低介电特性, 其介电常数k介于2.3~3.0, 介电损耗介于0.002~0.008, 可满足透波复合材料及先进微电子封装材料的应用需求.     

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.     

苯乙炔封端的BTDA系列酰亚胺预聚体的研究

合成了具有苯侧基的二胺单体1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ), 并与3,3',4,4'-苯酮四羧酸二酐(BTDA)进行缩聚反应, 分别以4-苯乙炔苯酐(PEPA)和4-苯乙炔-1,8-萘二甲酸酐(PENA)作为封端剂, 合成了两个系列的苯乙炔封端的酰亚胺预聚体. DSC测试结果表明, 此类预聚体具有比PETI-5更宽的加工窗口; 利用所合成的预聚体制成了具有较高热分解温度热固性交联PI薄膜. 结果表明, PI预聚体加工性能良好, 其交联后具有优异的力学和热学性能; 同时PEPA封端的预聚体树脂具有比PENA封端的树脂更为优异的综合性能.     

萘乙炔基封端的含硅聚酰亚胺的制备与性能

为了获得兼具良好热性能和加工性能的聚酰亚胺树脂,设计合成了不对称二胺(3-氨基-苯基)-(4’-氨基-苯基)-乙炔(AMPA),含萘环的封端剂3-(萘-1-乙炔基)苯胺(NAA)以及含硅二酐双(3,4-二羧基苯基)二甲基硅烷二酐.为研究结构与性能的关系,引入4,4’-双邻苯二甲酸酐(ODPA)和间氨基苯乙炔(APA)为对照二酐和封端剂,制备了一系列分子链中含硅和内炔基团的聚酰亚胺树脂PI-Si-Ⅰ(以APA为封端剂)和PI-Si-Ⅱ(以NAA为封端剂),以及与之相对照的树脂PI-O-Ⅰ和PI-O-Ⅱ(二酐单体为ODPA). PI-Si树脂在常见溶剂如四氢呋喃中具有很好的溶解度,而PI-Si-Ⅱ树脂更是具有低的熔体黏度和100℃宽的加工窗口.热失重的结果显示固化树脂具有良好的耐热性能,5 wt%热失重温度(T_d5)在547℃左右,质量残留率在79%左右;热裂解分析结果表明在聚酰亚胺主链中引入的硅和内炔基团在高温环境中形成硅氧硅结构和苯环等刚性结构,从而提高树脂的耐热性.     

沉淀剂对含有氨侧基的聚苯撑乙炔发光性能的影响

通过单体4-[(2,5-二溴苯)乙炔基]苯胺和1,4-二乙炔基-2,5-二戊氧基苯之间的Sonogashira偶合反应合成了带有p-氨基苯乙炔基共轭侧基的聚对苯撑乙炔（(PAnPE）). 该共轭聚合物的THF溶液（(2××10-－5 mol•·L-－1）)在473和519 nm处呈现两个比较强的荧光发射峰. 通过调节在聚合物PAnPE-THF溶液中所加入三种沉淀剂（(甲醇、乙酸、稀盐酸溶液）)的体积比例, 来改变PAnPE分子链的聚集态结构, 进而研究对其发光性能的影响规律. 实验结果表明: 由于沉淀剂与聚合物PAnPE分子链之间相互作用能力与方式的不同, PAnPE两个荧光峰的发射强度因聚合物分子链聚集结构不同而呈现不同的变化规律, 这有助于实现在化学传感器中的应用.     

新型乙炔封端聚酰亚胺的制备及性能

用双酚A型二醚二酐(BPADA)和3-乙炔基苯胺(m-APA)进行缩聚反应合成了乙炔基封端的聚酰亚胺预聚体, 并对预聚体的熔体黏度、稳定性和热性能等进行研究. 结果表明, 此类预聚体具有较宽的加工窗口和较低的加工温度, 适合模压成型工艺制备树脂基复合材料. 预聚体经250 ℃固化后显示了优异的热性能, 动态力学分析显示其玻璃化转变温度为363 ℃, 在氮气和空气气氛下5%热失重温度分别为490和492 ℃.     

Phenylethynyl terminated oligoimides derived from 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride and their adhesive properties

A series of phenylethynyl terminated oligoimides based on 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride (DSDA), m-phenylene diamine (m-PDA) or/and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) with calculated molecular weight of 5000 g mol⁻¹ were synthesized. The effect of molecular structure on solubility and melt viscosity of oligoimides as well as the thermal properties of cured polyimide resins was investigated. Experimental results indicated that the oligoimides have good solubility in strong polar solvents to afford homogeneous solutions with the solid content as high as 50 wt%. The oligoimides exhibited better solubility and lower minimum melt viscosity at relatively lower temperature with the incorporation of flexible 6FAPB. These oligoimides could be thermally cured at 320-380 °C to give thermosetted resins. The cured resins have good thermal stability with the glass transition temperatures of 278-329 °C and the onset decomposition temperatures higher than 500 °C. Adhesive properties of polyimides adhered to stainless steel at various conditions were evaluated by lap shear strength test. It was found that the LSS at room temperature increased with the molar ratio of 6FAPB increasing. The polyimides with combination of rigid and flexible structures exhibited good adhesive properties. With the increasing of curing temperature, the lap shear strength of polyimides at elevated temperature maintained at a high level due to the formation of strong bond.     

Development of novel cardo‐containing phenylethynyl‐terminated polyimide with high thermal properties

A phenylethynyl‐terminated reactive diluent [Card‐4‐phenylethynylphthalic anhydride (PEPA)], which contained fluorenyl cardo structures, was successfully synthesized and used as a modifier for flexible phenylethynyl‐terminated imide oligomer (PEI‐PEPA). The chemical structure, crosslink characterization, molecular weights, and thermal properties of the products were characterized. The imide systems with addition of 10, 20, 30, and 40 wt% Card‐PEPA to PEI‐PEPA (PEI‐PEPA‐Card) and their cured resin systems were prepared. The thermal curing behaviors of imide systems at different heating rates were analyzed by using differential scanning calorimetry. Thermal properties such as glass transition temperature (T_g) and char yield at 800°C of the resultant resin systems were studied by differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. The rheological properties were also investigated using a dynamic rheometry. These properties were found to be outstanding compared with pure PEI‐PEPA. The uncured imide systems exhibited lower T_g and lower isothermal viscosity with addition of Card‐PEPA. Furthermore, the T_g and char yield of the cured resin systems increased with addition of Card‐PEPA. The cured resin systems containing 40 wt% Card‐PEPA exhibited the highest T_g of 359°C and char yield at 800°C of 66.5%. Copyright © 2016 John Wiley & Sons, Ltd.     

Polyimides with side groups: Synthesis and effects of side groups on their properties

Polyimides are a class of well-known high-performance polymers combined the excellent mechanical, electrical, and thermal properties and widely applied in many high-tech fields. Traditional polyimides can only be processed in the state of soluble intermediates with a hazardous step of cyclodehydration and elimination of a nonvolatile polar solvent. Therefore, a great effort has been devoted to the development of soluble polyimides that can be processed in the full imidation state. The incorporation of side groups into the polyimide backbone is an efficient approach to resolve above problems with a little sacrifice of its inherent merits. The subtle variation of side groups in polyimide backbones has allowed researchers to tune their final properties. In particular, some special side groups can endow polyimides the specific property or functionality to broaden their application fields. In this article, we summarize the synthesis of polyimides with side groups in recent 20 years and further discuss the effect of side groups on their physical and specific properties. The future research directions of polyimides with side groups are also discussed. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 533–559     

Strong two-photon absorption and its saturation of a self-organized dimer of an ethynylene-linked porphyrin tandem

The two-photon absorption properties of a self-organized dimer of a free-base and zinc(II) porphyrins tandem linked with an ethynylene group and terminated by imidazolyl and phenylethynyl groups were investigated. The self-organized dimer was found to exhibit strong two-photon absorption and furthermore the saturation of the two-photon absorption owing to the intense transition.     

硅氧烷表面改性聚醚酯聚酰亚胺的研究

通过两种方法。即将γ-氨丙基封端的聚二甲基硅氧烷和对氨基苯甲酸酯封端的聚(四亚甲基)醚与均苯四甲酸二酐共缩聚,和将两种预制的聚酰胺酸溶液共混,合成了一组硅氧烷改性的聚醚酯聚酰亚胺材料。ESCA能谱和表面水接触角测量研究材料的表面性质发现,硅氧烷在材料表面富集,对聚醚酯聚酰亚胺材料具有显著的表面改性作用,硅氧烷改性的聚醚酯聚酰亚胺,其热稳定性能和气体透过性能有一定程度的提高,但抗张强度和介电性能有所降低。     

Synthesis and characterization of polyimides endcapped with phenylethynylphthalic anhydride

The synthesis of high glass transition temperature (T_g > 300°C), amorphous, soluble, poly-imide oligomers of controlled molecular weight endcapped with 4-phenylethynylphthalic anhydride endcapping agent is described. The 4-phenylethynylphthalic anhydride was employed to afford a higher curing temperature (380–420°C) which widens the processing window compared to unsubstituted acetylene-endcapped polyimides. The polyimides were synthesized via solution imidization techniques, using the ester-acid of various dianhydrides and aromatic diamines. A “ one-pot” procedure utilizing NMP as the solvent and o-dichlo-robenzene as the azeotroping agent reproducibly produced fully imidized, but yet soluble wholly aromatic polyimides. Thermally cured samples were prepared with gel contents of up to 98% that displayed good solvent resistance. Glass transition temperatures comparable to high molecular weight linear analogs were produced. These polyimides also show excellent thermal stability as judged by thermogravimetric analysis (TGA). Model phenylethynyl imide compounds were synthesized and used to follow and elucidate the nature of the products formed from the phenylethynyl curing by using high temperature magic-angle ¹³C nuclear magnetic resonance (MAS NMR). Preliminary results indicate that the cure reaction can be followed by MAS NMR. However, the nature of the products being formed during the curing process is difficult to determine by the solid-state MAS NMR alone. Differential scanning calorimetry (DSC) data clearly show that the model system does indeed melt and displays a wide window before the strong cure exotherm is observed. © 1995 John Wiley & Sons, Inc.     

PHOTOSENSITIVE POLYIMIDES

The polyimides are known for their practical usage as passivation or insulation in the microelectronics industry. They have excellent properties such as chemical and mechanical resistance, good insulation and planarizability. Photosensitive polyimides have significantly enhances the development in microelectronics devices, since they offer the simplification of polyimide layer pattern generation by eliminating the need for a photoresist. The present review comprises the examples as model as more tractable, soluble in organic solvent and easily processable polyimides without the loss of thermal stability. Present review article deals with the synthesis, characterization and applications of photosensitive polyimides which has been cited in the literature for the past two decades.     

Preparation of Meltable Aromatic Polyimides and Their Adhesive Properties

A series of molecular-weight-controlled aromatic polyimides based on 4,4′-oxydiphthalic anhydride (ODPA), 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) and 3,3′-diaminodiphenylsulfone (3,3′-DDS) were synthesized in the presence of phthalic anhydride (PA) as an end-capping agent. The effect of molecular weight on the solubility, melt viscosity, thermal and mechanical properties of the polyimides was investigated. Experimental results demonstrated that the polyimides exhibit good solubility in most polar aprotic solvents and in some common organic solvents, such as DMSO and THF. Homogeneous and stable polyimide solutions with solid contents as high as 40–45 wt% were prepared. High-quality polyimide films were obtained by casting the polyimide solutions onto glass plates and baking them at a relatively low temperature. The polyimide films exhibited outstanding thermal and mechanical properties. The rheological behavior of the polyimides depends on their molecular weight. The adhesive properties of polyimide films bonded to stainless steel at different temperatures were evaluated by the lap shear strength (LSS) test. The polyimides with moderate molecular weight exhibited better adhesive properties. The LSS of polyimide films at ambient and elevated temperatures increased with increasing bonding temperature, which is attributed to the better flow and wetting of the polymer melts during the bonding process.