Numerical and experimental investigation of kerf depth effect on high-frequency phased array transducer

Background

High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the structure design and fabrication of the kerfed ultrasonic array is quite challenging when very high frequency (?100 MHz) is required.

Objective and method

Here we investigate the effect of kerf depth on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore, Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO₃) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last, arrays with a pitch of 25 μm and 40 μm are fabricated and characterized by a network analyzer.

Results

Kerf depth plays an important role in the performance of the transducer array. The crosstalk is proportional to kerf depth. When kerf depth is more than 13 μm, the array with crosstalk less than −20 dB, which is acceptable for the real application, could provide a desired resolution. Compared to beam focusing, kerf depth exhibits more effect on the beam steering/focusing. The lateral pressure distribution is quantitatively summarized for four types of arrays with different kerf depth. The results of half-cut array are similar to those of the full-cut one in both cases of focusing and steering/focusing. The Full-Width-at-Half-Maximum (FWHM) is 55 μm for the half-cut array, and is 42 μm for the full-cut one. The 5-μm-cut array, suffering from severe undesired lobes, demonstrates similar behaviors with the no-cut one. ICP process is used to etch the 36°/Y-cut LiNbO₃ film. The aspect ratio of etching profile increases with the kerf width decreasing till it stops by forming a V-shaped groove, and the positive tapered profile angle ranges between 62° and 80°. If the mask selectivity does not limit the process in terms of achievable depth, the aspect ratio is limited to values around 1.3. The measurement shows the electrical impedance and crosstalk are consistent with the numerical calculation.

Conclusion

The numerical results indicate that half-cut array is a promising alternative for the fabrication of high-frequency ultrasonic linear arrays. In fact, the minimum pitch that could be obtained is around 25 μm, equivalent to a pitch of 1.6λ, with a kerf depth of 16 μm under the optimized ICP parameters.     

PMN-PT single crystal focusing transducer fabricated using a mechanical dimpling technique

A ∼5 MHz focusing PMN-PT single crystal ultrasound transducer has been fabricated utilizing a mechanical dimpling technique, where the dimpled crystal wafer was used as an active element of the focusing transducer. For the dimpled focusing transducer, the effective electromechanical coupling coefficient was enhanced significantly from 0.42 to 0.56. The dimpled transducer also yields a −6 dB bandwidth of 63.5% which is almost double the bandwidth of the plane transducer. An insertion loss of the dimpled transducer (−18.1 dB) is much lower than that of the plane transducer. Finite element simulation also reveals specific focused beam from concave crystal surface. These promising results show that the dimpling technique can be used to develop high-resolution focusing single crystal transducers.     

Modelling and simulation of high-frequency (100 MHz) ultrasonic linear arrays based on single crystal LiNbO3

Background

High-frequency ultrasonic transducer arrays are essential for high resolution imaging in clinical analysis and Non-Destructive Evaluation (NDE). However, the fabrication of conventional backing-layer structure, which requires a pitch (distance between the centers of two adjacent elements) of half wavelength in medium, is really a great challenge.

Objective and method

Here we present an alternative buffer-layer structure with a silicon lens for volumetric imaging. The requirement for the size of the pitch is less critical for this structure, making it possible to fabricate high-frequency (100 MHz) ultrasonic linear array transducers. Using silicon substrate also makes it possible to integrate the arrays with IC (Integrated Circuit). To compare with the conventional backing-layer structure, a finite element tool, COMSOL, is employed to investigate the performances of acoustic beam focusing, the influence of pitch size for the buffer-layer configuration, and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance.

Results

For a 100 MHz 10-element array of buffer-layer structure, the ultrasound beam in azimuth plane in water could be electronically focused to obtain a spatial resolution (a half-amplitude width) of 86 μm at the focal depth. When decreasing from half wavelength in silicon (42 μm) to half wavelength in water (7.5 μm), the pitch sizes weakly affect the focal resolution. The lateral spatial resolution is increased by 4.65% when the pitch size decreases from 42 μm to 7.5 μm. The crosstalk between adjacent elements at the central frequency is, respectively, −95 dB, −39.4 dB, and −60.5 dB for the 10-element buffer, 49-element buffer and 49-element backing arrays. Additionally, the electrical impedance magnitudes for each structure are, respectively, 4 kΩ, 26.4 kΩ, and 24.2 kΩ, which is consistent with calculation results using Krimholtz, Leedom, and Matthaei (KLM) model.

Conclusion

These results show that the buffer-layer configuration is a promising alternative for the fabrication of high-frequency ultrasonic linear arrays dedicated to volumetric imaging.     

Microfabrication of stacks of acoustic matching layers for 15 MHz ultrasonic transducers

This paper presents a novel method used to manufacture stacks of multiple matching layers for 15 MHz piezoelectric ultrasonic transducers, using fabrication technology derived from the MEMS industry. The acoustic matching layers were made on a silicon wafer substrate using micromachining techniques, i.e., lithography and etch, to design silicon and polymer layers with the desired acoustic properties. Two matching layer configurations were tested: a double layer structure consisting of a silicon–polymer composite and polymer and a triple layer structure consisting of silicon, composite, and polymer. The composite is a biphase material of silicon and polymer in 2-2 connectivity. The matching layers were manufactured by anisotropic wet etch of a (1 1 0)-oriented Silicon-on-Insulator wafer. The wafer was etched by KOH 40 wt%, to form 83 μm deep and 4.5 mm long trenches that were subsequently filled with Spurr’s epoxy, which has acoustic impedance 2.4 MRayl. This resulted in a stack of three layers: The silicon substrate, a silicon–polymer composite intermediate layer, and a polymer layer on the top. The stacks were bonded to PZT disks to form acoustic transducers and the acoustic performance of the fabricated transducers was tested in a pulse-echo setup, where center frequency, −6 dB relative bandwidth and insertion loss were measured. The transducer with two matching layers was measured to have a relative bandwidth of 70%, two-way insertion loss 18.4 dB and pulse length 196 ns. The transducers with three matching layers had fractional bandwidths from 90% to 93%, two-way insertion loss ranging from 18.3 to 25.4 dB, and pulse lengths 326 and 446 ns. The long pulse lengths of the transducers with three matching layers were attributed to ripple in the passband.     

面向水下应用的电容式微机械超声换能器*

电容式微机械超声换能器具有宽频带和易于制造二维阵列等优势,已经成为一种重要的新型超声换能器。该文针对图像声呐系统对新型超声换能器的迫切需求,提出了一种电容式微机械超声换能器结构和参数,并利用硅微加工技术制备出了该换能器,最后对其主要性能参数进行了测试和分析。测试结果表明该换能器具有发射和接收超声波的功能,中心工作频率为1.965 MHz,6 dB相对带宽达到109.4%,在1 MHz、2 MHz和3 MHz频率时的接收灵敏度分别为-218.29 d B、-219.39 dB和-218.11 dB。该文研制的电容式微机械超声换能器显示出了优秀的宽频带特性,且工作频率和接收灵敏度性能均基本满足了高频图像声呐系统的需求。     

Bipolar-power-transistor-based limiter for high frequency ultrasound imaging systems

High performance limiters are described in this paper for applications in high frequency ultrasound imaging systems. Limiters protect the ultrasound receiver from the high voltage (HV) spikes produced by the transmitter. We present a new bipolar power transistor (BPT) configuration and compare its design and performance to a diode limiter used in traditional ultrasound research and one commercially available limiter. Limiter performance depends greatly on the insertion loss (IL), total harmonic distortion (THD) and response time (RT), each of which will be evaluated in all the limiters. The results indicated that, compared with commercial limiter, BPT-based limiter had less IL (−7.7 dB), THD (−74.6 dB) and lower RT (43 ns) at 100 MHz. To evaluate the capability of these limiters, they were connected to a 100 MHz single element transducer and a two-way pulse-echo test was performed. It was found that the −6 dB bandwidth and sensitivity of the transducer using BPT-based limiter were better than those of the commercial limiter by 22% and 140%, respectively. Compared to the commercial limiter, BPT-based limiter is shown to be capable of minimizing signal attenuation, RT and THD at high frequencies and is thus suited for high frequency ultrasound applications.     

Aperture array Fabry-Perot interference filter

We demonstrate effective implementation of the Fabry-Perot interferometer with subwavelength aperture arrays on its two metal mirrors to achieve polarization-independent narrow band-pass filtering. By superimposing of aperture array fundamental resonance transmission with one of the Fabry-Perot interference peaks, the moderate filter insertion loss of −5 dB, narrow band-pass width of 15 μm, and efficient out-of-band rejection within the ∼0.1-3 THz range are reported. The Siemens-star-shaped apertures in arrays play an important role to achieve such polarization independence and small insertion loss.     

Investigation of dental samples using a 35MHz focussed ultrasound piezocomposite transducer

Dental erosion and decay are increasingly prevalent but as yet there is no quantitative monitoring tool. Such a tool would allow earlier diagnosis and treatment and ultimately the prevention of more serious disease and pain. Despite ultrasound having been demonstrated as a method of probing the internal structures of teeth more than 40 years ago, development of a clinical tool has been slow. The aim of the study reported here was to investigate the use of a novel high frequency ultrasound transducer and validate it using a known dental technique.A tooth extracted for clinical reasons was sectioned to provide a sample that contained an enamel and dentine layer such that the enamel-dentine junction (EDJ) was of a varying depth. The sample was then submerged in water and a B-scan recorded using a custom-designed piezocomposite ultrasound transducer with a centre frequency of 35 MHz and a −6 dB bandwidth of 24 MHz.The transducer has an axial resolution of 180 μm and a spatial resolution of 110 μm, a significant advance on previous work using lower frequencies. The depth of the EDJ was measured from the resulting data set and compared to measurements from the sequential grinding and imaging (SGI) method.The B-scan showed that the EDJ was of varying depth. Subsequently, the EDJ measurements were found to have a correlation of 0.89 (p < 0.01) against the SGI measurements. The results indicate that high frequency ultrasound is capable of measuring enamel thickness to an accuracy of within 10% of the total enamel thickness, whereas currently there is no clinical tool available to measure enamel thickness.     

Novel power MOSFET-based expander for high frequency ultrasound systems

The function of an expander is to obstruct the noise signal transmitted by the pulser so that it does not pass into the transducer or receive electronics, where it can produce undesirable ring-down in an ultrasound imaging application. The most common type is a diode-based expander, which is essentially a simple diode-pair, is widely used in pulse-echo measurements and imaging applications because of its simple architecture. However, diode-based expanders may degrade the performance of ultrasonic transducers and electronic components on the receiving and transmitting sides of the ultrasound systems, respectively. Since they are non-linear devices, they cause excessive signal attenuation and noise at higher frequencies and voltages. In this paper, a new type of expander that utilizes power MOSFET components, which we call a power MOSFET-based expander, is introduced and evaluated for use in high frequency ultrasound imaging systems. The performance of a power MOSFET-based expander was evaluated relative to a diode-based expander by comparing the noise figure (NF), insertion loss (IL), total harmonic distortion (THD), response time (RT), electrical impedance (EI) and dynamic power consumption (DPC). The results showed that the power MOSFET-based expander provided better NF (0.76 dB), IL (−0.3 dB) and THD (−62.9 dB), and faster RT (82 ns) than did the diode-based expander (NF (2.6 dB), IL (−1.4 dB), THD (−56.0 dB) and RT (119 ns)) at 70 MHz. The −6 dB bandwidth and the peak-to-peak voltage of the echo signal received by the transducer using the power MOSFET-based expander improved by 17.4% and 240% compared to the diode-based expander, respectively. The new power MOSFET-based expander was shown to yield lower NF, IL and THD, faster RT and lower ring down than the diode-based expander at the expense of higher dynamic power consumption.     

Extension of the crosstalk cancellation method in ultrasonic transducer arrays from the harmonic regime to the transient one

This paper describes a procedure to extend the crosstalk correction method presented in a previous paper [A. Bybi, S. Grondel, J. Assaad, A.–C. Hladky-Hennion, M. Rguiti, Reducing crosstalk in array structures by controlling the excitation voltage of individual elements: a feasibility study, Ultrasonics, 53 (6) (2013) 1135–1140] from the harmonic regime to the transient one. For this purpose a part of an ultrasonic transducer array radiating in water is modeled around the frequency 0.5 MHz using the finite element method. The study is carried out at low frequency in order to respect the same operating conditions than the previous paper. This choice facilitated the fabrication of the transducer arrays and the comparison of the numerical results with the experimental ones. The modeled array is composed of seventeen elements with the central element excited, while the others are grounded. The matching layers and the backing are not taken into account which limits the crosstalk only to the piezoelectric elements and fluid. This consideration reduces the structure density mesh and results in faster computation time (about 25 min for each configuration using a computer with a processor Intel Core i5-3210M, frequency 2.5 GHz and having 4 Go memory (RAM)).     

High-frequency ultrasonic transducer based on lead-free BSZT piezoceramics

This paper describes the fabrication and evaluation of a high-frequency (40 MHz) transducer based on lead-free piezoceramics for ultrasonic imaging. The transducer with an aperture size of 0.9 mm has been fabricated using barium strontium zirconate titanate ((Ba_0.95Sr_0.05)(Zr_0.05Ti_0.95)O₃, abbreviated as BSZT) ceramics. The lead-free BSZT has a piezoelectric d₃₃ coefficient of 300 pC/N and an electromechanical coupling factor k_t of 0.45. High-frequency ultrasound transducers were fabricated and a bandwidth of 76.4% has been achieved with an insertion loss of −26 dB. Applications in high resolution biological and medical imaging could be possible with this lead-free material.     

Analysis of 2-D motion tracking in ultrasound with dual transducers

We study displacement and strain measurement error of dual transducers (two linear arrays, aligned orthogonally and coplanar). Displacements along the beam of each transducer are used to obtain measurements in two-dimensions. Simulations (5 MHz) and experiments (10 MHz) are compared to measurements with a single linear array, with and without angular compounding. Translation simulations demonstrate factors of 1.07 larger and 8.0 smaller biases in the axial and lateral directions respectively, for dual transducers compared to angular compounding. As the angle between dual transducers decreases from 90° to 40°, for 1% compression simulations, the lateral RMS error ranges from 2.1 to 3.9 μm compared to 9 μm with angular compounding. Simulation of dual transducer misalignment of 1 mm and 2° result in errors of less than 9 μm. Experiments demonstrate factors of 3.0 and 5.2 lower biases for dual transducers in the axial and lateral directions respectively compared to angular compounding.     

High Frequency PMN-PT 1-3 Composite Transducer for Ultrasonic Imaging Application

Development of PMN-PT single crystal/epoxy 1-3 composites for high-frequency ultrasonic transducers application is presented. The composite was fabricated by using a DRIE dry etching process with a 45% volume fraction of PMN-PT. A 35 MHz ultrasound flat transducer was fabricated with the composite, which was found to have an effective electromechanical coupling coefficient of 0.81, an insertion loss of 18 db, and a -6 dB bandwidth as high as 100%. Tungsten wire phantom image shows that the transducer had an axial resolution of 30 μm, which was in good agreement with the theoretical expectation. The initial results showed that the PMN-PT/epoxy 1-3 composite has many attractive properties over conventional piezoelectric materials for medical imaging applications.     

Design and performance of a compact superconducting duplexer at VHF-band

This paper presents the design, fabrication, and performance of a compact high temperature superconducting duplexer at VHF-band. The duplexer consists of a T-junction and two four-pole filters with an ultra-narrow bandwidth of 400 kHz at 216 MHz and 220 MHz, respectively. By using gap-coupled feedlines in the filter design procedure, the duplexer is constructed by connecting the two filters using a T-junction with short-length branches. The two filters are fabricated on separate substrates and are carefully packaged to achieve a high isolation between the duplexer channels. The duplexer has a compact size of 41.6 mm × 28 mm. The measured results at 73 K show a high performance. The return loss is −17 dB, the insertion losses of both channels are less than 0.16 dB, and the out-of-band rejections are higher than 60 dB. The isolation between the two channels is better than 76 dB.     

Improved beamforming using curved sparse 2D arrays in ultrasound

In this work we have investigated the effect of curving phase-steered sparse periodic two-dimensional arrays in one direction, and relate this effect to the geometry of the arrays. We have shown that curving is equivalent to removing some of the element periodicity, thus adding some “randomness” to the layout. Compared to flat phase-steered periodically sparse two-dimensional arrays, curving offers an even greater suppression of grating lobes located at directions along the curvature. The class of arrays yielding improved performance due to this suppression of grating lobes has been characterized.The point spread functions of some previously proposed array layouts, shown to be promising for ultrasonic imaging, have been simulated. The arrays have been simulated with various number of elements as well as various focal points, with array and field parameters typical to those in volumetric cardiac imaging. On a 48 × 48 element grid with a transducer center frequency of 3 MHz and the target at 40 mm, reductions in the peak sidelobe level of up to 12 dB were recorded for some critical steering directions, without significant differences in the beamwidth. The integrated sidelobe ratio was also examined, showing an almost equivalent performance as the flat array. This study shows that, without adding any complexity to the system, the overall image quality of a volumetric imaging system can be improved significantly by curving the array in one direction.     

A row–column addressed micromachined ultrasonic transducer array for surface scanning applications

Row–column addressed arrays for ultrasonic non-destructive testing (NDT) applications are analyzed and demonstrated in this paper. Simulation and experimental results of a row–column addressed 32 by 32 capacitive micromachined ultrasonic transducer (CMUT) array are presented. The CMUT array, which was designed for medical imaging applications, has a center frequency of 5.3 MHz. The CMUT array was used to perform C-scans on test objects with holes that have diameters of 1.0 mm and 0.5 mm. The array transducer has an aperture size of 4.8 mm by 4.8 mm, and it was used to scan an area of 4.0 mm by 4.0 mm. Compared to an N by N fully addressed 2-D array, a row–column addressed array of the same number of elements requires fewer (N instead of N²) pairs of interconnection and supporting electronic components such as pulsers and amplifiers. Even though the resulting field of view is limit by the aperture size, row–column addressed arrays and the row–column addressing scheme can be an alternative option of 2-D arrays for NDT applications.     

Development of calibration techniques for ultrasonic hydrophone probes in the frequency range from 1 to 100 MHz

The primary objective of this work was to develop and optimize the calibration techniques for ultrasonic hydrophone probes used in acoustic field measurements up to 100 MHz. A dependable, 100 MHz calibration method was necessary to examine the behavior of a sub-millimeter spatial resolution fiber optic (FO) sensor and assess the need for such a sensor as an alternative tool for high frequency characterization of ultrasound fields. Also, it was of interest to investigate the feasibility of using FO probes in high intensity fields such as those employed in HIFU (high intensity focused ultrasound) applications. In addition to the development and validation of a novel, 100 MHz calibration technique the innovative elements of this research include implementation and testing of a prototype FO sensor with an active diameter of about 10 μm that exhibits uniform sensitivity over the considered frequency range and does not require any spatial averaging corrections up to about 75 MHz. The results of the calibration measurements are presented and it is shown that the optimized calibration technique allows the sensitivity of the hydrophone probes to be determined as a virtually continuous function of frequency and is also well suited to verify the uniformity of the FO sensor frequency response. As anticipated, the overall uncertainty of the calibration was dependent on frequency and determined to be about ±12% (±1 dB) up to 40 MHz, ±20% (±1.5 dB) from 40 to 60 MHz and ±25% (±2 dB) from 60 to 100 MHz. The outcome of this research indicates that once fully developed and calibrated, the combined acousto-optic system will constitute a universal reference tool in the wide, 100 MHz bandwidth.     

PMN-PT single crystal thick films on silicon substrate for high-frequency micromachined ultrasonic transducers

In this work, a novel high-frequency ultrasonic transducer structure is realized by using PMNPT-on-silicon technology and silicon micromachining. To prepare the single crystalline PMNPT-on-silicon wafers, a hybrid processing method involving wafer bonding, mechanical lapping and wet chemical thinning is successfully developed. In the transducer structure, the active element is fixed within the stainless steel needle housing. The measured center frequency and −6 dB bandwidth of the transducer are 35 MHz and 34%, respectively. Owing to the superior electromechanical coupling coefficient (k _t ) and high piezoelectric constant (d ₃₃) of PMNPT film, the transducer shows a good energy conversion performance with a very low insertion loss down to 8.3 dB at the center frequency.     

An investigation of a fiber-optic air-backed mandrel hydrophone

In this work, a optical-fiber air-backed mandrel hydrophone is proposed and investigated both analytically and experimentally. The two-dimensional and three-dimensional quasistatically theoretical models of the hydrophone is created and compared, and the phase sensitivity of the hydrophone is analyzed. The theoretical result of phase sensitivity with three-dimensional model is −153.3 dB re rad/μPa. Twenty-two hydrophones of this type according to the model presented are constructed and tested. The experiment results show that experimental results of mean values of phase sensitivity are about −153 ± 0.5 dB re rad/μPa and have the close agreement with the estimation of theoretical models. The size of the fiber sensor is ∅12 × 55 mm, the normal phase sensitivity achieves −308 dB re 1 μPa⁻¹, the 3 dB effective bandwidth of the frequency response is 30 kHz, and the responsivity decreases less than 0.5 dB when static pressure is 2 MPa (200 m water depth). The hydrophone is easy to constructed at low cost with simple structure, and some new type of it with the required performances could be designed according to the model presented.     

Polarization beam splitter with wide bandwidth in air-hole-based periodic dielectric waveguides

A polarization beam splitter with wide bandwidth and simple structure in air-hole-based periodic dielectric waveguides has been proposed and designed. Operation principle of the device is based on different directional coupling properties of beams in TE and TM polarizations in parallel periodic dielectric waveguides. Performances have been evaluated by a finite-difference time-domain simulation. Results show that the polarization beam splitter provides a wide bandwidth of 113 nm with both a high extinction ratio (higher than 21 dB) and a low insertion loss (less than 1.5 dB) for optical communication wavelengths at ∼1.55 μm. Moreover, the performances of the polarization beam splitter are insensitive to longitudinal alignment errors in the coupling region, which is desirable for device fabrication and practical application.