Cure of epoxy resins with esters of cyanoacetic acid

Esters of cyanoacetic acid are a novel class of epoxy curing agents. The model reaction between ethyl cyanoacetate (ECA) and phenyl glycidylether (PGE) yielded a cyano-spiro-dilactone under conditions similar to the resin cure. The structure of the spiro compound resulting from 2 ECA and 2 PGE was elucidated by MS, IR, ¹H-, and ¹³C-NMR techniques. Ammonia is split off from 1 ECA and acts in statu nascendi as a satellite hardener. An overall model reaction equation for the cyanoacetyl cure is proposed. The cure of bisphenol A–diglycidylether (BADGE) with ECA and with neopentylglycol-biscyanoacetate (NPGCA) is described over a wide range of the molar ratio. Clear and tough solids are obtained with a glass transition temperature up to 130°C. Cyanoacetates are latent hardeners requiring a curing initiator. Since N-4-chlorophenyl N′-dimethylurea is a latent initiator, liquid “one-shot” systems can be formulated that are stable at room temperature and harden quickly above 120°C. Heat aging properties of cured specimens are reported. A series of novel liquid, resinous, and crystalline cyanoacetates and their potential as curing agents are described.     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Storage stability and curing behavior of epoxy‐dicyandiamide systems with carbonyldiimidazole‐Cu (II) complexes as the accelerator

The reaction between carbonyldiimidazole (CDI) and copper (II) nitrate produces a new Cu (II) complex with nitrate as the counter anion. TGA, UV, and FTIR analyses confirmed that the coordination number of CDI in this complex is two. The acceleration effect of the complex in epoxy‐dicyandiamide (DICY) curing systems has been evaluated by DSC and TMA, and the increasing viscosity of the mixture was monitored during the storage. The results revealed that the complex is not only very effective for the acceleration of epoxy‐DICY systems, leading to a rapid gelation within 21 min at 120 °C, but it is also chemically stable at ambient temperature. This is reflected by the slow increase of viscosity of the accelerated curing systems stored at 35 °C, even over 56 days. In addition, the effects of the [Cu(CDI)₂]²⁺ complex with different counter anions, that is, bromide, chloride, nitrate, sulfate, phthalate, and acetate, were compared using a series of tests. By comparing with N,N‐dimethyl‐N′‐phenylurea (fenuron), the widely used latent accelerator for DICY‐epoxy curing systems, the complexes with bromide and nitride were found to be better, both regarding storage stability and for their acceleration effect. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 3470–3476     

Near‐infrared spectroscopic studies on the cure behaviors of the CAE/DGEBA blend system initiated by a thermal latent catalyst

The latent properties and cure behaviors of an epoxy blend system based on cycloaliphatic epoxy (CAE) and diglycidyl ether of bisphenol A (DGEBA) epoxy containing N‐benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator were investigated with near‐infrared (N‐IR) spectroscopy. The assignments of the latent properties and cure kinetics were performed by the measurements of the N‐IR reflectance for epoxide and hydroxyl functional groups at different temperatures and compositions. As a result, this system showed more than one type of reaction, and BPH was an excellent thermal latent catalyst without any coinitiator. The cure behaviors were identified by the changes in the absorption intensity of the hydroxyl groups at 7100 cm⁻¹ with different composition ratios. Moreover, characteristic N‐IR band assignments were used to evaluate the reactive kinetics and were shown to be an appropriate method for studying the cure behaviors of the CAE/DGEBA blend system containing a thermal latent catalyst. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 326–331, 2001     

Biaspartimide-diamines as Curing Agents for Epoxy Resins

Various 4,4′ -bis(N²-[4-(4-aminophenoxy)phenyl]aspartimido)diphenylmethane-type bisaspartimide-diamines have been used as solventless curing agents for epoxy resins. The thermal curing was performed at 170, 190, and 230°C to give a tough brown polymer. Thermogravimetric analysis of the polymer obtained showed thermal stability up to 330°C and char yields of 45% in N₂ at 800°C and 12% in air at 700°C. The thermal curing reaction was monitored using FT-IR. The synthesized polymers are useful for making composites, laminates, and adhesives.     

Cationic cure of epoxy resin initiated by methylanilinium salts as a latent thermal initiator

The effect of the novel N‐crotyl‐N,N‐dimethyl‐4‐methylanilinium hexafluroantimonate (CMH) initiator on cure kinetics and rheological properties of diglycidylether of bisphenol A (DGEBA) epoxy cationic system was investigated. From DSC measurements of the DGEBA/CMH system, it was found that this system exhibited excellent thermal latent characteristics at a given temperature and revealed complex cure behavior as indicated by multiple exotherms. The conversion and conversion rate of the DGEBA/CMH system increased with increasing the concentration of initiator, attributed to the high activity of CMH. Viscoelastic properties during gel formation of DGEBA initiated by CMH were investigated by rheological techniques under isothermal conditions. The gel time obtained from the modulus crossover point t(G′) = G″ was affected by a high curing temperature and the concentration of CMH, resulting in a high degree of network formation in cationic polymerization. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 2397–2406, 2001     

Lanthanide–imidazole complexes as latent curing agents for epoxy resins

Imidazoles have for some time been recognized as curing agents for epoxy resins. Once the resin and the imidazole compound are mixed there is a relatively short time in which the mixture can be used, since the polymerization (curing) reaction occurs to some extent even at room temperature causing the reaction mixture to thicken. In order to circumvent this problem we have found that imidazoles can be complexed with organo-lanthanide compounds thereby tying up the imidazole and retarding its rate of reaction in the cure of epoxy materials at ambient temperatures. When it is desired to enhance the rate of cure the temperature of the mixture is simply raised. This paper concerns studies of the epoxy cure reaction with the M(THD)₃–IM series. M represents the lanthanide metals Eu, Ho, Pr, Dy, Yb, and Gd, and THD is 2,2,6,6-tetramethyl-3,5-heptanedione. Cure reactions were followed by differential scanning calorimetry and in some cases by infrared spectroscopy. We have demonstrated that these organo-lanthanide–imidazole complexes are effective thermally latent curing agents for epoxy resins. At a temperature of 150°C cure is quite rapid. In the course of these studies it has also been determined that there is an inverse correlation between the lanthanide ionic radius in the complex and the temperature at which the cure reaction occurs. Thus the Yb compound, where the imidazole is most strongly bound, cures at the highest temperature and Pr, where imidazole is bound most weakly, at the lowest. Consistent with these facts is the observation that the Yb compound also gives the longest latency period when mixed with epoxy resin.     

Mechanism of the tertiary amine-catalyzed dicyandiamide cure of epoxy resins

Infrared and NMR data on tertiary amine-catalyzed, dicyandiamide—epoxy resin (and model compound) systems have been utilized to elucidate the mechanism of the curing process. The early exothermic curing reaction is shown to be ring opening of the resin epoxy groups by dicyandiamide imino and amino anionic species, giving rise to N-alkyl cyanoguanidines; a minor amount of polyether formation also occurs at this time. After the exothermic reaction is essentially complete at <90°C., a slow, high temperature (110–200°C.) addition of hydroxyl hydrogen across the nitrile triple bond occurs, giving rise to an imino ether which then rearranges to the guanyl urea.     

The effects of glass beads and silane treatments on the curing behavior of a brominated epoxy resin: DSC analyses

The curing characteristics of a brominated epoxy resin/dicyandiamide (DICY) system filled with silane-treated glass beads are studied using isothermal differential scanning calorimetry (DSC). Three different silane coupling agents, N-(2-aminoethyl)-3-aminopropyl-trimethoxysilane, N-[2-(vinylbenzylamino)-ethyl]-3-aminopropyl-trimethoxysilane, and 3-glycidoxypropyl-trimethoxysilane, are applied. It is found that the reaction heats of the epoxy system are little affected by the curing temperature and the untreated glass fillers, but changed with the addition of silane-coated glass beads. The effect of glass beads on the curing reaction is more significant at the low curing temperature and conversion. The silane treatment results in changes in T_g, activation energy, reaction heat, reaction rate, and reaction order. Three silanes respond differently because of their differences in the activated reaction with the matrix system. Regardless of the various curing mechanisms involved, a simple kinetic expression can describe the curing extent at 170 and 180°C with a good accuracy for all systems studied. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35: 2063–2071, 1997     

The curing of epoxy resins with aminophenoxycyclotriphosphazenes

Aminophenoxycyclotriphosphazenes have been used as curing agents for epoxy resins. The thermal curing was performed in stages at 120–125 and 175–180°C followed by postcuring at 225°C to give tough brown polymers. The thermal curing reaction was monitored using FTIR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins has shown thermal stability up to 350–340°C. The char yield obtained in nitrogen at 800°C was about 55–42% and in air at 700°C was about 40–32%. Graphite cloth laminates were prepared. The mechanical properties evaluated were found superior to those of commonly used epoxy resin systems. These resins are useful for making fire- and heat-resistant composites, laminates, molded parts, and adhesives.     

Cure behavior of diglycidylether of bisphenol A/trimethylolpropane triglycidylether epoxy blends initiated by thermal latent catalyst

Cure behaviors of diglycidylether of bisphenol A (DGEBA)/trimethylolpropane triglycidylether (TMP) epoxy blends initiated by 1 wt % N‐benzylpyrazinium hexafluoroantimonate (BPH) as a cationic latent catalyst were investigated using DSC and rheometer. This system showed more than one type of reaction and BPH could be excellent thermal latent catalyst without any co‐initiator. The cure activation energy (E_a) obtained from Kissinger method using dynamic DSC data was higher in DGEBA/TMP mixtures than in pure DGEBA. Rheological properties of the blend system were investigated under isothermal condition using a rheometer. The gel time was obtained from the analysis of storage modulus (G′), loss modulus (G″) and damping factor (tanδ). The crosslinking activation energy (E_c) was also determined from the Arrhenius equation based on the gel time and curing temperature. As a result, the crosslinking activation energy showed a similar behavior with that obtained from Kissinger method. And the gel time decreased with increasing TMP content, which could be resulted from increasing the activated sites by trifunctional epoxide groups and decreasing the viscosity of DGEBA/TMP epoxy blend in the presence of TMP. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2114–2123, 2000     

Sucrose-based epoxy monomers and their reactions with diethylenetriamine

Two sets of sucrose-based epoxy monomers, namely, epoxy allyl sucroses (EAS), and epoxy crotyl sucroses (ECS), were prepared by epoxidation of octa-O-allyl and octa-O-crotyl sucroses (OAS and OCS, respectively). Synthetic and structural characterization studies showed that the new epoxy monomers were mixtures of structural isomers and diastereoisomers that contained varying numbers of epoxy groups per sucrose. EAS and ECS can be tailored to contain an average of one to eight epoxy groups per sucrose. Quantitative ¹³C-NMR spectrometry and titrimetry were used independently to confirm the average number of epoxy groups per sucrose. Sucrose-based epoxy monomers were cured with diethylenetriamine (DETA) in a differential scanning calorimeter (DSC), and their curing characteristics were compared with those of diglycidyl ether of bisphenol A (DGEBA) and diepoxycrotyl ether of bisphenol A (DECEBA). EAS and DGEBA cured at 100 to 125°C and exhibited a heat of cure of about 108.8 kJ per mol epoxy. ECS and DECEBA cured at 150 and 171°C, respectively, and exhibited a heat of cure of about 83.7 kJ per mol epoxy. Depending upon the degree of epoxidation (average number of epoxy groups per sucrose) and the concentration of DETA, glass transition temperatures (T_gs) of cured EAS varied from −17 to 72°C. DETA-cured ECS containing an average of 7.3 epoxy groups per sucrose (ECS-7.3) showed no DSC glass transition between −140 and 220°C when the ratio of amine (NH) to epoxy group was 1:1 and 1.5:1. Maximum T_gs obtained for DETA-cured DGEBA and DECEBA polymers were 134 and 106°C, respectively. DETA-cured bisphenol A-based epoxy polymers degraded at about 340°C, as observed by thermogravimetric analysis (TGA). DETA-cured sucrose-based epoxy polymers degraded at about 320°C. Sucrose-based epoxies cured with DETA were found to bind aluminum, glass, and steel. Comparative lap shear tests (ASTM D1002–94) showed that DETA-cured epoxy allyl sucroses with an average of 3.2 epoxy groups per sucrose (EAS-3.2) generated a flexible adhesive comparable in bond strength to DGEBA. However, DETA-cured ECS-7.3 outperformed the bonding characteristics of both DGEBA and EAS-3.2. All sucrose-based epoxy polymers were crosslinked and insoluble in water, N,N-dimethylformamide, tetrahydrofuran, acetone, and dichloromethane. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2397–2413, 1998     

BDMA-catalyzed DDA-epoxy resin system: Temperature and composition effects on curing mechanism

DSC and IR data on benzyldimethylamine-catalyzed dicyandiamide-DGEBA prepolymer system have been utilized to investigate the influences of temperature and composition on the curing mechanism. Etherification as a competitive reaction is favored at lower temperature. On the other hand, the reaction pathway of dicyandiamide (DDA) varies with temperature, especially at the first stage of reaction. At 100°C, the reaction of DDA is shown to be essentially the substitution of the hydrogen atoms by ring-opening of epoxy groups, giving rise to N-alkyl cyanoguanidine. But at 140°C or 160°C, the initial reaction of DDA involves a transformation of nitrile groups to imine groups. A greater amount of BDMA and a higher amine-to-epoxy ratio favor the etherification. The glass transition temperature T_g is a complex function of these different mechanisms; higher T_g could be reached with a amino-to-epoxy ratio equal to 0.6 and after a curing cycle including a precure at 100°C.     

Synthesis and characterization of novel epoxy monomers and liquid crystal thermosets

Four new epoxy monomers have been synthesized and characterized as part of a program to prepare novel liquid crystal thermoset (LCT) materials. Three of the new epoxy monomers contained a biphenyl mesogen and were not liquid crystalline (LC). The remaining epoxy monomer, which contained a 1,4-dibenzoyloxybenzene mesogen, was synthesized in an overall yield of 30% and displayed a broad (83°C) nematic liquid crystalline phase. The new liquid crystalline epoxy monomer was cured at 120°C and postcured at 175°C with a stoichiometric amount of 1,4-phenylenediamine. The thermal transitions of the resulting LCT were studied by differential scanning calorimetry (DSC), polarized light optical microscopy (POM), thermomechanical analysis (TMA), and wide angle x-ray diffraction (WAXD) as a function of cure time and temperature. A process characterization diagram was constructed which shows that LCTs based on this new LC monomer can be processed in the liquid crystalline phase over a broad range of times and temperatures. Qualitative agreement with previous epoxy LCT results was found, as LCT's with smectic phases and without clearing temperatures were observed at long cure times (high crosslink densities), whereas nematic phases with clearing temperatures predominated in networks at short cure times (low crosslink densities). © 1993 John Wiley & Sons, Inc.     

Effect of nanosilica on the kinetics of cure reaction and thermal degradation of epoxy resin

Nanocomposites from nanoscale silica particles(NS),diglycidylether of bisphenol-A based epoxy(DGEBA),and 3,5-diamino-N-(4-(quinolin-8-yloxy) phenyl) benzamide(DQPB) as curing agent were obtained from direct blending of these materials.The effect of nanosilica(NS) particles as catalyst on the cure reaction of DGEBA/DQPB system was studied by using non-isothermal DSC technique.The activation energy(E_a) was obtained by using Kissinger and Ozawa equations. The E_a value of curing of DGEBA/DQPB/10%NS system showed a decrease of about 10 kJ/mol indicating the catalytic effect of NS particles on the cure reaction.The E_a values of thermal degradation of the cured samples of both systems were 148 kJ/mol and 160 kJ/mol,respectively.The addition of 10%of NS to the curing mixture did not have much effect on the initial decomposition temperature(T_i) but increased the char residues from 20%to 28%at 650℃.     

Cure state detection for pre-cured carbon-fibre epoxy prepreg (CFC) using Temperature-Modulated Differential Scanning Calorimetry (TMDSC)

Carbon-fibre prepregs have found widespread use in lightweight applications. They are based on a carbon-fibre fabric impregnated with reactive epoxy resin. Prepreg materials are generally pre-cured so that they have a higher molecular weight than typical resins in order to reduce resin flow, which facilitates storage and later processing properties.The measurements were carried out using commercially available materials and follow the published DMA investigations of the same material [1]. TMDSC was used to find the correlation between curing conditions, the degree of cure and glass transition temperature. TMDSC has the advantage over standard DSC that it enables better determination of the glass transition temperature, which is often accompanied by an exothermic curing reaction, and thus overshadowed. The influence of the amplitude of temperature modulation was tested in preliminary experiments. For non-cured material a glass transition temperature of approximately 0 °C was determined; whereas for the totally cured material it was approximately 230 °C. The changes in degree of cure, temperature of actual glass transition and post-reaction are given as a function of curing time at 180 °C. The correlation between actual glass transition temperature and degree of cure is derived.     

Cure behavior of epoxy resin/MMT/DETA nanocomposite

The Flory's gelation theory, non-equilibrium thermodynamic fluctuation theory and Avrami equation have been used to predict the gel time t _g and the cure behavior of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposites at various temperatures and organo-montmorillonite loadings. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method, and the results show that the addition of organo-montmorillonite reduces the gelation time t _gand increases the rate of curing reaction, the value of k, and half-time of cure after gelation point t_1/2 decreases with the increasing of cure temperature, and the value of n is ~2 at the lower temperatures (<60°C) and decreases to ~1.5 as the temperature increases, and the addition of organo-montmorillonite decreases the apparent activation energy of the cure reaction before gelation point, but has no apparent effect on the apparent activation energy of the cure reaction after gelation point. There is no special curing process required for the formation of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposite. This revised version was published online in July 2006 with corrections to the Cover Date.     

Synthesis and curing of liquid crystalline epoxy resin based on naphthalene mesogen

Aromatic liquid crystalline epoxy resin (LCE) based on naphthalene mesogen was synthesized and cured with aromatic diamines to prepare heat‐resistant LCE networks. Diaminodiphenylester (DDE) and diaminodiphenylsulfone (DDS) were used as curing agents. The curing reaction and liquid crystalline phase of LCE were monitored, and mechanical and thermal properties of cured LCE network were also investigated. Curing and postcuring peaks were observed in dynamic DSC thermogram. LCE network cured with DDE displayed liquid crystalline phase in the curing temperature range between 183 and 260°C, while that cured with DDS formed one between 182 and 230°C. Glass transition temperature of cured LCE network was above 240°C, and crosslinked network was thermally stable up to 330°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 419–425, 1999