Synthesis of photoreactive polyimide having indan structure

Polyimide containing an indan unit and alkyl moiety with a high molecular weight was prepared from 5,7‐diamino‐1,1,4,6‐tetramethylindan and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride. This polyimide was amorphous and soluble in common organic solvents, such as tetrahydrofuran, chloroform, and cyclopentanone. Thermogravimetry of the polyimide showed good thermal stability, indicating that a 10% weight loss of the polyimide was observed at 500 °C in nitrogen. The glass‐transition temperature of the polyimide was not observed by DSC measurement between room temperature and 400 °C at a heating rate of 10 °C/min (Apparatus: DSC3100 MAC Science Co., Ltd.). Transparency of the polyimide at 365 nm was 80%. The polyimide acted as a photosensitive resist of negative type by UV radiation. The resist had a sensitivity of 31 mJ/cm² and a contrast of 2.3 when it was developed with cyclopentanone at room temperature. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 423–428, 2002     

Determination of methylene bridge crosslinking in chloromethylated PS‐DVB resins

We present the development of a method for the determination of methylene bridge crosslinking in ¹³C‐labeled chloromethylated polystyrene‐divinylbenzene resins. Our system uses a new room temperature reduction of the chloromethyl groups that circumvents the possible challenges associated with additional crosslinking. We demonstrate how the reduction of the chloromethyl groups allowed for the determination of methylene bridging, derived from the methylenebis(ethenylbenzene) crosslinker, based on the integration of the methylene signal in the ¹³C NMR spectra. Utilizing this method, the total crosslinking within the chloromethylated resin generated at 35 °C was determined to be upward of 10 wt %, which increased from 6 wt % in the unfunctionalized resin. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 1955–1960     

Two‐step thermal conversion from poly(amic acid) to polybenzoxazole via polyimide: Their thermal and mechanical properties

Poly(amic acid) was synthesized with a low‐temperature solution polymerization of 3,3′‐dihydroxybenzidine and pyromellitic dianhydride in N,N‐dimethylacetamide. The cast films were thermally treated at various temperatures. The polyimide containing the hydroxyl group was rearranged by decarboxylation, resulting in a fully aromatic polybenzoxazole at temperatures higher than 430 °C. These stepwise cyclizations were monitored with elemental analysis, Fourier transform infrared, and nuclear magnetic resonance. Microanalysis results confirmed the chemical compositions of poly(amic acid), polyimide, and polybenzoxazole, respectively. A cyclodehydration from poly(amic acid) to polyimide occurred between 150 and 250 °C in differential scanning calorimetry, and a cyclodecarboxylation to polybenzoxazole appeared at 400–500 °C. All the samples were stable up to 625 °C in nitrogen and displayed excellent thermal stability. Polybenzoxazole showed better thermal stability than polyimide, but polyimide exhibited better mechanical properties than polybenzoxazole. However, polyimide showed a crystalline pattern under a wide‐angle X‐ray, whereas polybenzoxazole was amorphous. The precursor poly(amic acid) was readily soluble in a variety of solvents, whereas the polyimide and polybenzoxazole were not soluble at all. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2537–2545, 2000     

Preparation and morphological,electrical, and mechanical properties of polyimide‐grafted MWCNT/polyimide composite

Precursor of polyimide, polyamic acid has been prepared sucessfully. Acid‐modified carbon nanotube (MWCNT) was grafted with soluble polyimide then was added to the polyamic acid and heated to 300 °C to form polyimide/carbon nanotube composite via imidation. Morphology, mechanical properties and electrical resistivity of the MWCNT/polyimide composites have been studied. Transmission electron microscope microphotographs show that the diameter of soluble polyimide‐grafted MWCNT was increased from 30–60 nm to 200 nm, that is a thickness of 70–85 nm of the soluble polyimide was grafted on the MWCNT surface. PI‐g‐MWCNT was well dispersed in the polymer matrix. Percolation threshold of MWCNT/polyimide composites has been investigated. PI‐g‐MWCNT/PI composites exhibit lower electrical resistivity than that of the acid‐modified MWCNT/PI composites. The surface resistivity of 5.0 phr MWCNT/polyimide composites was 2.82 × 10⁸ Ω/cm² (PI‐g‐MWCNT) and 2.53 × 10⁹ Ω/cm² (acid‐modified MWCNT). The volume resistivity of 5.0 phr MWCNT/polyimide composites was 8.77 × 10⁶ Ω cm (PI‐g‐MWCNT) and 1.33 × 10¹³ Ω cm (acid‐modified MWCNT).Tensile strength and Young's modulus increased significantly with the increase of MWCNT content. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 3349–3358, 2007     

A simple approach toward low‐dielectric polyimide nanocomposites: Blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane

This article describes a new and simple method for preparing polyimide nanocomposites that have very low dielectric constants and good thermal properties: simply through blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane derivative, octakis(dimethylsiloxyhexafluoropropyl) silsesquioxane (OF). The low polarizability of OF is compatible with polyimide matrices, such that it can improve the dispersion and free volume of the resulting composites. Together, the higher free volume and lower polarizability of OF are responsible for the lower dielectric constants of the PI‐OF nanocomposites. This simple method for enhancing the properties of polyimides might have potential applicability in the electronics industry. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 6296–6304, 2008     

Polymers containing polynuclear aromatics linked by one-carbon bridges

The conversion of naphthalene, anthracene, and phenanthrene to polymeric material via Friedel-Crafts chemistry was investigated. Synthesis of the polymers was accomplished by: (1) self-condensation of the chloromethylated aromatic substrate in the presence of AlCl₃ or SnCl₄ or (2) treatment with chloromethyl ethyl ether (CMEE) and SnCl₄, producing the chloromethylated substrate in situ, followed by self-condensation polymerization. Soluble or insoluble polymers were preferentially produced by varying the stoichiometry, time, or temperature of the reaction. The resulting polymers consisted of the polycyclic aromatic nuclei bridged by methylene groups. The regiochemistry of the polymer linkages was determined through the use of IR, ¹H- and ¹³C-NMR. The polymers showed relatively high thermal and thermo-oxidative stabilities (380–495°C). © 1992 John Wiley & Sons, Inc.     

Synthesis and properties of a second‐order nonlinear optical side‐chain polyimide

A thermal stable aromatic polyimide (PI) with side‐chain second‐order nonlinear optical (NLO) chromophores has been developed. The PI was prepared by the ring‐opening polyaddition of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride with a new diamine having two N‐ethyl‐N‐[4‐[(6‐chlorobenzothiazol‐2‐yl)diazenyl]phenyl]‐2‐aminoethanol units as the NLO chromophore, followed by poling during or after the thermal imidization process. The resulting PI had number and weight‐average molecular weights (M_n, M_w) of 25,000 and 80,000, respectively, and a relatively high glass transition temperature of 180°C. The second harmonic coefficient (d₃₃) of PI at the wavelength of 1.064 μm was 138 pm/V (329.6 × 10⁻⁹ esu) and remained unchanged at elevated temperatures. The corona poling process of the NLO‐substituted poly(amic acid) to the PI was also studied in detail by measuring the second harmonic generation (SHG) from the polymer films. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1321–1329, 1999     

Electrochemical behavior of a new electroactive polyimide derived from aniline trimer

The electrochemical behavior of a soluble polyimide (Tani-polyimide) derived from an aniline trimer was investigated. Similar to processes observed in polyaniline, two typical redox processes involving protonation and ion insertion were observed. Due to the presence of an isolated, short quinonediimine or N,N′-diphenyl-p-phenylenediamine segment, Tani-polyimide displayed an electroactivity at higher potentials and did not undergo an electrochemical degradation reaction. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 4295–4301, 1999     

Amine–quinone polyimide: A new high‐temperature polymer and its use to protect iron against corrosion

A new diamine monomer was synthesized by the Michael addition of 4,4′‐methylene dianiline with 1,4‐benzoquinone. The monomer was condensed with 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride to give a polyamic acid that was soluble in NMP. The polyamic acid was cast onto iron and thermally imidized to yield the amine–quinone polyimide (AQPI‐2). AQPI‐2 had a thermal decomposition temperature of 540 °C (10% TGA weight loss in N₂) and a glass transition at 292 °C, values typical of polyimides. The degradation of the coating on iron after exposure to 0.1 M NaCl electrolyte was followed by electrochemical impedance spectroscopy. Under these conditions a conventional polyimide failed after 3 days exposure, while AQPI‐2 survived more than 24 days exposure. The adhesive bond between the amine–quinone polyimide and the iron surface was so strong that it could not be broken by the electrolyte. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2893–2899, 2000     

Three‐component negative‐type photosensitive polyimide precursor based on poly(amic acid), a crosslinker,and a photoacid generator

A new negative‐working and alkaline‐developable photosensitive polyimide precursor based on poly(amic acid) (PAA), 4,4′‐methylenebis[2,6‐bis(hydroxymethyl)]phenol (MBHP) as a crosslinker, and a photoacid generator (5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐2‐(methylphenyl)acetonitrile (PTMA) has been developed. PAA was prepared by ring‐opening polymerization of pyromellitic dianhydride with 4,4′‐oxydianiline. The photosensitive polyimide precursor containing PAA (65 wt %), MBHP (25 wt %), and PTMA (10 wt %) showed a clear negative image featuring 10 μm line and space patterns when it was exposed to 436 nm light at 100 mJ·cm^?2, post‐exposure baked at 130 °C for 3 min, followed by developing with a 2.38 wt % aqueous tetramethylammonium hydroxide solution at 25 °C. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 593–599, 2005     

Characterization of a thermally imidized soluble polyimide film

A soluble aromatic poly (amic acid) film was converted to a soluble polyimide by staging at 25°C intervals to 325°C and characterized at each interval by several analytical methods. The behavior observed was consistent with an interpretation that a reduction occurred in molecular weight of the poly (amic acid) during the initial stages of cure before the ultimate molecular weight was achieved as a polyimide. This interpretation was supported by the results of solution viscosity, gel permeation chromatography, low angle laser light scattering photometry, and infrared spectroscopy analyses. The results of this study serve to increase our fundamental understanding of how polyimides are thermally formed from poly (amic acid)s.     

Synthesis and properties of polyimide ionomers containing sulfoalkoxy and fluorenyl groups

A series of sulfopropylated and sulfobutylated polyimide copolymers containing fluorenyl groups, SPI‐4, were synthesized to investigate the effect of alkyl side chains on the properties (stability, mechanical strength, water uptake, and proton conductivity) of the polymimide electrolyte membranes. SPI‐4 showed much better hydrolytic stability (in 10% MeOH aq at 100 °C) than the main chain sulfonated polyimide, SPI‐1. Tough, flexible, and ductile membranes were obtained from these copolymers. At high relative humidity all the SPI‐4 membranes showed high mechanical properties (>34 MPa of the maximum stress) and proton conductivity (>0.1 Scm^?1). These properties are comparable to or even better than those of the perfluorosulfonic acid ionomer (Nafion 112). The new polyimide ionomers have proved to be a possible candidate as polymer electrolyte membrane for PEFCs and DMFCs. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4439–4445, 2005     

Synthesis and characterization of intrinsic high‐barrier polyimide derived from a novel diamine monomer containing rigid planar moiety

A new diamine monomer containing rigid planar fluorenone moiety, 2,7‐bis(4‐aminophenyl)‐9H‐fluoren‐9‐one, was synthesized through Suzuki coupling reaction. Then it was reacted with pyromellitic dianhydride to obtain a polyimide (FOPPI) via a conventional two‐step polymerization process. The prepared FOPPI exhibits excellent barrier properties, with the oxygen transmission rate and water vapor transmission rate low to 3.2 cm³·m^?2·day^?1 and 2.9 g·m^?2·day^?1, respectively. The results of wide angle X‐ray diffractograms, positron annihilation lifetime spectroscopy, and molecular dynamics simulations reveal that the excellent barrier properties of FOPPI are mainly ascribed to the crystallinity, high chain rigidity, and low free volume, which are resulted from the rigid planar moiety. FOPPI also shows outstanding thermal stability and mechanical properties with a glass transition temperature up to 420 °C, 5% loss temperature of 607 °C, coefficient of thermal expansion of 1.28 ppm K^?1, and tensile strength of 150.8 MPa. The polyimide has an attractive potential application prospect in the flexible electronics encapsulation area. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55 , 2373–2382     

Preparation and properties of conductive silver/photosensitive polyimide nanocomposites

A new electrically conductive photoresist has been developed. It is based on the dispersion of silver nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 2‐Mercaptopropionic acid was used as the surfactant to modify the silver nanoflake surface for the dispersion of silver nanoflakes in the polymer. The silver/PSPI nanocomposites showed electrical conductivity at a low silver content of 10 wt %. The electrical conductivity of the silver/PSPI nanocomposites ranged from 10 to 10⁴ S/cm, which was dependent on the silver weight fraction in the resist formulation. Patterns with a resolution of 30 μm were obtained from the silver/PSPI nanocomposites. The silver/PSPI nanocomposites had excellent thermal properties. Their glass transition temperatures were above 360 °C and thermal decomposition temperatures were over 420 °C. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 1575–1583, 2009     

New concept of positive photosensitive polyimide: Reaction development patterning (RDP)

A soluble multiblock copolyimide without specific functional groups such as OH and COOH was prepared by a direct one‐pot polycondensation of two types of dianhydrides and diamines in the presence of γ‐valerolactone/pyridine catalyst using N‐methylpyrrolidone (NMP)/toluene mixture as a solvent. The polyimide film containing the photosensitive agent diazonaphthoquinone (DNQ) compound gave positive‐tone behavior by UV irradiation, followed by development in a mixture of ethanolamine/NMP/H₂O (1/1/1 by weight). The scanning electron microscopic photograph of the resultant image showed fine patterns with about 20 μm film thickness. Its pattern forming was based on the photorearrangement of diazonaphthoquinone, a process in which the ring‐opening reaction of imide units of the polyimide with the amine used as a developer and the following degradation of the polymer are induced. Such a new imaging technique combines principles of photolithography and etching of a polyimide to give, what we call, reaction development patterning in which the main chemical reactions directly related to the pattern formation occur during development. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 3451–3463, 2001     

Piezoresistive characteristics of single wall carbon nanotube/polyimide nanocomposites

A systematic study of the effect of single wall carbon nanotubes (SWCNTs) on the enhanced piezoresistive sensitivity of polyimide nanocomposites from below to above percolation was accomplished. The maximum piezoresistive stress coefficient (Π) of 1.52 × 10^?3 MPa^?1 was noted at just above the percolation threshold concentration (Φ ～ 0.05 wt %) of SWCNT. This coefficient value exceeds those of metallic piezoresistive materials by two orders of magnitude (4.25 × 10^?5 MPa^?1 for aluminum). The high piezoresistive characteristics appear to originate from a change in the intrinsic resistivity of the composite caused by the variation of the tunneling distance between conducting inclusions (SWCNTs) under compression or tension. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 994–1003, 2009     

Gas transport properties of asymmetric polyimide membranes prepared by ion‐beam irradiation

Ion beam irradiation has been widely used to modify the structure and properties of membrane surface layers. In this study, the gas permeability and selectivity of an asymmetric polyimide membrane modified by He ion irradiation were investigated using a high vacuum apparatus equipped with a Baratron absolute pressure gauge at 76 cmHg and 35 °C. Specifically, we estimated the effects of the gas diffusion and solubility on the gas permeation properties of the asymmetric membranes with the carbonized skin layer prepared by ion irradiation. The asymmetric polyimide membranes were prepared by a dry–wet phase inversion process, and the surface skin layer on the membrane was irradiated by He ions at fluences of 1 × 10¹⁵ to 5 × 10¹⁵ ions/cm² at 50 keV. The increase in the gas permeability of the He⁺‐irradiated asymmetric polyimide membrane is entirely due to an increase in the gas diffusion, and the gas selectivity increases of the membranes were responsible for the high gas diffusion selectivities. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 262–269, 2007.     

Synthesis of a new pyridine-containing diamine and related polyimide

<正>A new kind of aromatic diamine monomer containing pyridine unit,2,6-bis[4-(4-aminophenoxy)phenoxy]pyridine(BAPP),was synthesized in three steps,using hydroquinone as starting material.A novel pyridine-containing polyimide was prepared from the resulting diamine BAPP with 4,4'-oxydiphthalic anhydride(ODPA) via a conventional two-step thermal imidization method.The resulting polyimide exhibits excellent solubility,film-forming capability and high thermal resistance.     

A positive-working photosensitive alkaline-developable polyimide with a highly dimensional stability and low dielectric constant based on poly(amic acid) as a polyimide precursor and diazonaphthoquinone as a photosensitive compound

A positive-working photosensitive polyimide precursor based on fluorinated poly(amic acid) (FPAA) and 2,3,4-tris(1-oxo-2-diazonaphthoquinon-4-ylsulfonyloxy)benzophenone (D4SB) as a photosensitive compound has been developed. FPAA was prepared by ring-opening polyaddition of dianhydrides, pyromellitic dianhydride and biphenyltetracarboxylic dianhydride, with diamine, 2,2′-bis(trifluoromethyl)benzidine, in methanol. The FPAA film showed excellent transparency to UV light and good solubility in a wide range of organic solvents. The dissolution behavior of FPAA containing 30 wt % D4SB after exposure was studied, and it was found that the difference of dissolution rate between exposed and unexposed parts was enough to get high contrast due to the photochemical reaction of D4SB in the polymer film. The photosensitive fluorinated polyimide (FPI) precursor containing 30 wt % D4SB showed a sensitivity of 80 mJ cm⁻² and a contrast of 7.8 with 365 nm light when it was developed with 0.3% aqueous tetramethyl ammonium hydroxide solution at room temperature. The FPI film cured up to 360°C had a low coefficient of thermal expansion of 10.3 ppm °C⁻¹ and a low dielectric constant of 3.04. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2261–2267, 1998     

Synthesis of high‐refractive index polyimide containing selenophene unit

A highly refractive and transparent aromatic polyimide (PI) containing a selenophene unit has been developed. The PI was prepared by a two‐step polycondensation procedure from 2,5‐bis(4‐aminophenylenesulfanyl)selenophene (APSP) and 4,4′‐[p‐thiobis(phenylenesulfanyl)]diphthalic anhydride (3SDEA), and shows high thermal stabilities, such as a relatively high‐glass transition temperature of 189 °C and 5% weight loss temperature (T_5%) of 418 °C. The optical transmittance of the PI film at 450 nm is higher than 50%. The selenophene unit provides the PI with a refractive index of 1.7594, which is higher than corresponding PIs containing a thiophene or a phenyl unit because of the high polarizability per unit volume of the selenium atom. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 4428–4434, 2009