Epoxy resins from rosin acids: synthesis and characterization

A series of multifunctional cycloaliphatic glycidyl ester and ether epoxy resins were synthesized by reaction of condensed rosin acid‐formaldehyde resins with epichlorohydrin. The chemical structure of the produced resins was determined by IR and ¹H‐NMR analysis. The molecular weight of the produced resins was determined by gel permeation chromatography (GPC). A series of poly‐ (amide‐imide) hardeners were prepared from condensation of Diels–Alder adducts of rosin acid‐maleic anhydride and acrylic acid with triethylene tetramine and pentaethylene hexamine. These amines were also condensed with Diels–Alder adducts of rosin ketones. The curing exotherms of the produced epoxy resins with poly(amide‐imide) hardeners were investigated. The data of mechanical properties, solvent and chemical resistance indicate the superior adhesion of the cured epoxy resins. Copyright © 2004 John Wiley & Sons, Ltd.     

Confirmation of the presence of imine bonds in thermally cured polyimides

Model compounds for imines formed during the thermal curing of short chain polyimides have been synthesized and characterized. These compounds have imine bonds (C?N) formed by the nucleophilic attack of primary amines on imide carbonyls. The C?N stretching mode appears at 1649–1664 cm^?1 in the Raman and infrared spectra of these compounds and the band assigned to the carbonyl mode in an imide ring with an imine bond appears near 1740 cm^?1. These compounds have been prepared and characterized to verify the conclusions of a previously reported study in which bands observed in thermally cured short chain polyimides at 1656 and 1742 cm^?1 were assigned as the C?N and associated C?O modes, respectively. It has also been confirmed that the C?N stretching mode in the imide model compounds is inherently IR weak and can only be seen if the concentration of imine species is high. © 1993 John Wiley & Sons, Inc.     

Synthesis and characterization of poly(epoxy‐imide) crosslinked networks

Poly(epoxy imide)s were prepared by a reaction between a hydroxyl‐group‐containing soluble copolyimide and commercial epoxy resins at 220 °C for 2 h. Poly(epoxy imide) thin films exhibited higher thermal stability and lower dielectric constants than a commercial flip‐chip package material (U300). The thermal stabilities of the poly(epoxy imide)s were 1.4–2.0 times higher than that of U300. The thermal stability increased with increasing crosslink density and with decreasing bulky CF₃ groups (which were easily decomposable). The dielectric constants of the poly(epoxy imide)s were 1.1–1.3 times lower than that of U300, and this is highly desirable for the microelectronic packaging industry. The dielectric constant dramatically decreased when bulky CF₃ groups were added and when the functionalities of epoxy resins decreased. The residual stresses, slopes in the cooling curves, and glass‐transition temperatures of the poly(epoxy imide)s were measured with a thin‐film stress analyzer. Low residual stresses and slopes in the cooling curves were achieved with a higher crosslink density. However, in the presence of bulky CF₃ groups, the copolyimide backbone structure did not affect the residual stress values. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4293–4302, 2004     

Partially bio‐based poly(amide imide)s by polycondensation of aromatic diacylhydrazides based on lignin‐derived phenolic acids and aromatic dianhydrides: Synthesis,characterization, and computational studies

Two new bio‐based diacylhydrazide monomers, namely, 4,4′‐(propane‐1,3‐diylbis(oxy))bis(3‐methoxybenzohydrazide) and 4,4′‐(propane‐1,3‐diylbis(oxy))bis(3,5‐dimethoxybenzohydrazide) were synthesized starting from lignin‐derived phenolic acids, namely, vanillic acid and syringic acid. A series of poly(amide imide)s was synthesized by polycondensation of these diacylhydrazide monomers with commercially available aromatic dianhydrides. Poly(amide imide)s showed inherent viscosity in the range 0.44–0.56 dL g^?1 and exhibited good solubility in organic solvents. Poly(amide imide)s could be cast into transparent, flexible, and tough films from their N ,N‐dimethylacetamide solutions. Poly(amide imide)s showed 10% weight loss in the temperature range 340–364 °C indicating their good thermal stability. Glass transition temperature (T _g) of poly(amide imides)s were measured by DSC and DMA which were in the range 201–223 °C and 214–248 °C, respectively. The T _g values of poly(amide imide)s were dependent on the number methoxy substituents on aromatic rings of diacylhydrazide monomers. Molecular dynamics simulation studies revealed that chain rigidity is the dominant factor for observed trends in T _g. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55 , 3636–3645     

Surface modification of imide containing polymers I: Catalytic groups

This paper describes basic studies of the surface modification of polyimide covered wires for insulation of electrical machines. Drain-off of the impregnating resin during production should be reduced by introduction of surface catalytic groups. ¹H NMR kinetic analysis of aminolytic ring opening reaction of low molecular model compounds for polyimides showed very fast modification reactions. The catalytic effect of various functional groups on unsaturated polyester imide, acrylate and epoxy resins was investigated by DSC. Co(II)-catalysts and tertiary aliphatic amines proved highest activity for double bond containing systems and epoxy resins, respectively. Aminolytic treatment of Kapton^® slides was followed by ATR-IR spectroscopy. Plate-plate rheometer measurements of epoxy resins employing tertiary amine-treated Kapton^® slides proved significantly reduced gelling temperature.     

Synthesis,characterization, and thermal stability of bismaleimides derived from maleimido benzoic acid

Bismaleimides containing ester, amide, urethane, and imide groups in the backbone were synthesized from maleimido benzoic acid via its acid chloride or isocyanate with 4,4′-dihydroxy-diphenyl-2,2-propane, 3,3′-diamino diphenyl sulfone, and 3,3′,4,4′-benzophenone tetracarboxylic acid anhydride by simple condensation or addition reaction. The new bismaleimides are characterized by IR, ¹H-NMR, and elemental analysis. DSC studies of these bismaleimides indicated a curing exotherm in the temperature range 150–270°C with heat of polymerization 30–50 J/g. Thermogravimetric analysis of the uncured resins showed high thermal stability and char yield for imide containing bismaleimide. The observed char yields of the bismaleimide resins are in accordance with the calculated C/H ratios.     

Synthesis and characterization of epoxy resins containing imine group and their curing processes with aromatic diamine

The epoxy resins containing imine bonding were prepared from hydroxyl substituted Schiff base monomers in two steps. At the first step, hydroxyl substituted Schiff base monomers were synthesized via condensation reaction. At the second step, epoxy resins were synthesized from the reaction between Schiff base monomers and epichlorohydrine (EPC). Then curing processes of epoxy resins were achieved by p-phenylenediamine compound. The structures of resulting compounds were confirmed by FT-IR, UV-Vis and ¹H-NMR. TG-DTA and DSC measurements were performed for thermal characterizations of the compounds. Chemical resistances of the cured epoxy-amine systems were determined for coating applications in acidic, alkaline and organic solvents. HCl (10%, aqueous solution), NaOH (10%, aqueous solution), DMSO, DMF, N-methylpyrrolidone, ethanol, THF and acetone were used for corrosion tests. Chemical resistance data of the synthesized epoxy resins demonstrated that they have good chemical resistance against various acid, alkaline and common organic solvents. Surface morphologies of epoxy resin and the cured epoxy resin were determined with scanning electron microscopy (SEM) measurements. Also, optical band gap (E_g) values of Schiff base monomers and epoxy resins were calculated from UV-Vis measurements.     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Fluorinated polyamides and poly(amide imide)s based on 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy)benzene,aromatic dicarboxylic acids,and various monotrimellitimides and bistrimellitimides: Syntheses and properties

A CF₃‐containing diamine, 1,4‐bis(4‐amino‐2‐trifluromethylphenoxy) benzene ( I ), was prepared from hydroquinone and 2‐chloro‐5‐nitrobenzotrifluoride. Imide‐containing diacids ( V _a–h and VI _a,b ) were prepared through the condensation reaction of amino acids, aromatic diamines, and trimellitic anhydride. Then, a series of soluble fluorinated polyamides ( VII _a–h ) and poly(amide imide)s ( VIII _a–h and X _a,b ) were synthesized from I with various aromatic diacids ( II _a–h ) and imide‐containing diacids ( V _a–h and VI _a,b ) via direct polycondensation with triphenyl phosphate and pyridine. The polyamides and poly(amide imide)s had inherent viscosities of 1.00–1.70 and 0.79–1.34 dL/g, respectively. All the synthesized polymers showed excellent solubility in amide‐type solvents such as N‐methyl‐2‐pyrrolidinone, N,N‐dimethylacetamide, and N‐dimethylformamide and afforded transparent and tough films via solvent casting. Polymer films of VII _a–h , VIII _a–h , and X _a,b had tensile strengths of 91–113 MPa, elongations to break of 8–40%, and initial moduli of 2.1–2.8 GPa. The glass‐transition temperatures of the polyamides and poly(amide imide)s were 254–276 and 255–292 °C, respectively, and the imide‐containing poly(amide imide)s had better thermal stability than the polyamides. The polyamides showed higher transparency and were much lighter in color than the poly(amide imide)s, and their cutoff wave numbers were below 400 nm. In comparison with isomeric IX _{c – h} , poly(amide imide)s VIII _c–h exhibited less coloring and showed lower yellowness indices. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3116–3129, 2004     

New organosoluble and thermally stable poly(amide‐imide)s with benzoxazole or benzothiazole pendent groups: synthesis and characterization

Two new benzoxazole or benzothiazole‐containing diimide‐dicarboxylic acid monomers, such as 2‐[3,5‐bis(N‐trimellitimidoyl)phenyl]benzoxazole ( 2 _o ) or 2‐[3,5‐bis(N‐trimellitimidoyl)phenyl]benzothiazole ( 2 _s ) were synthesized from the condensation reaction between 3,5‐diaminobenzoic acid and 2‐aminophenol or 2‐aminothiophenol in polyphosphoric acid (PPA) with subsequent reaction of trimellitic anhydride in the presence of glacial acetic acid, respectively, and two new series of modified aromatic poly(amide‐imide)s were prepared. This preparation was done with pendent benzoxazole or benzothiazole units from the newly synthesized diimide‐dicarboxylic acid and various aromatic diamines by triphenyl phosphite‐activated polycondensation. In addition, the corresponding unsubstituted poly(amide‐imide)s were prepared under identical experimental conditions for comparative purposes. Characterization of polymers was accomplished by inherent viscosity measurements, FT‐IR, UV–visible, ¹H‐NMR spectroscopy and thermogravimetry. The polymers were obtained in quantitative yields with inherent viscosities between 0.39 and 0.81 dl g^?1. The solubilities of modified poly(amide‐imide)s in common organic solvents as well as their thermal stability were enhanced compared to those of the corresponding unmodified poly(amide‐imide)s. The glass transition temperature, 10% weight loss temperature, and char yields at 800°C were, respectively, 7–26°C, 17–46°C and 2–5% higher than those of the unmodified polymers. Copyright © 2010 John Wiley & Sons, Ltd.     

Synthesis and Some Reactions of New N-[Aryl(Benzyl,Cyclohexyl, Propyl)sulfonyl]-4-azatricyclo[5.2.1.02,6]dec-8-enes

A synthesis was accomplished of 4-azatricyclo[5.2.1.02,6]dec-8-ene by aminolysis of bicyclo[2.2.1]hept-2-ene-endo,endo-5,6-dicarboxylic acid anhydride followed by transformation of amidoacid into imide that was subsequently reduced by lithium aluminum hydride. The reaction of the key tricyclic amine with sulfonyl chlorides afforded N-[aryl(benzyl, cyclohexyl, propyl)sulfonyl]-4-azatricyclo[5.2.1.02,6]dec-8-enes.The sulfonamides were subjected to epoxidation with perphthalic acid. By reaction of sulfonamides with p-nitrophenyl azide triazolines were obtained. The structure of compounds synthesized was confirmed by IR, ^1Hand ¹³ NMR spectra.     

Solution‐Processable n‐Type Semiconductors Based on Unsymmetrical Naphthalene Imides: Synthesis,Characterization, and Applications in Field‐Effect Transistors

A series of unsymmetrical naphthalene imide derivatives ( 1a , 1b , 2 , 3 , 4 , 5 ) with high electron affinity was synthesized and used in n‐channel organic field‐effect transistors (OFETs). They have very good solubility in common organic solvents and good thermal stability up to 320 °C. Their photophysical, electrochemical, and thermal properties were investigated in detail. They showed low‐lying LUMO energy levels from ?3.90 to ?4.15 eV owing to a strong electron‐withdrawing character. Solution‐processed thin‐film OFETs based on 1a , 1b , 2 , 3 , 4 were measured in both N₂ and air. They all showed n‐type FET behavior. The liquid‐crystalline compounds 1a , 1b , and 3 showed good performance owing to the self‐healing properties of the film in the liquid‐crystal phase. Compound 3 has an electron mobility of up to 0.016 cm² V^?1 s^?1 and current on/off ratios of 10⁴–10⁵.     

Synthesis and characterization of novel aromatic poly(imide–benzoxazole) copolymers

New poly(imide–benzoxazole) copolymers were prepared directly from a dianhydride, a diacid chloride, and a bis(o‐diaminophenol) monomer in a two‐step method. In the first step, poly(amic acid–hydroxyamide) precursors were synthesized by low‐temperature solution polymerization in an organic solvent. Subsequently, the thermal cyclodehydration of the poly(amic acid–hydroxyamide) precursors at 350 °C produced the corresponding poly(imide–benzoxazole) copolymers. The inherent viscosities of the precursor polymers were around 0.19–0.33 dL/g. The cyclized poly(imide–benzoxazole) copolymers had glass‐transition temperatures in the range of 331–377 °C. The 5% weight loss temperatures ranged from 524 to 535 °C in nitrogen and from 500 to 514 °C in air. The poly(imide–benzoxazole) copolymers were amorphous, as evidenced by the wide‐angle X‐ray diffraction measurements. The structures of the precursor copolymers and the fully cyclized copolymers were characterized by Fourier transform infrared, ¹H NMR, and elemental analysis. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 6020–6027, 2005     

Synthesis of new polyhedral oligomeric silsesquioxane derivatives as some possible antimicrobial agents

1,3-Dipolar cycloaddition reactions were studied to synthesize Polyhedral oligomeric silsesquioxane (POSS)-based norbornyl imide derivatives containing izoxazoline groups in good yields. And also 1,3-dipolar cycloaddition reactions of azomethine ylides with POSS-based norbornene dipolarophiles for a synthesis of the novel POSS-based norbornane-fused spiro-1,3-indandionolylpyrrolidines are reported. All newly synthesized POSS compounds were structurally characterized by FTIR, ¹H, ¹³C NMR, HRMS and GC/MS analyses.     

Synthesis, characterization and some properties of epoxy resins containing azomethine bonding

New epoxy resins were prepared from hydroxyl substituted Schiff base monomers in two steps. The first step is based on the synthesis of hydroxyl substituted Schiff base monomers via condensation reaction. The second step includes the reaction between Schiff base monomers with epichlorohydrine (EPC) to obtain epoxy resins. The structures of resulting compounds were confirmed by FTIR and ¹H-NMR. TG-DTA and DSC measurements were made for thermal characterizations of the compounds. Chemical resistances of the cured epoxy-amine systems in acidic, alkaline and organic solvents were determined for coating applications. HCl (aqueous solution, 10%), NaOH (aqueous solution, 10%), DMSO, DMF, N-methylpyrrolidone, ethanol, THF and acetone were used for corrosion tests. Chemical resistance data show that the synthesized resins have good chemical resistance against various acid, alkaline and common organic solvents.     

Synthesis and characterization of polyesteramides derived from an oxazoline-functional alcohol and dicarboxylic acid anhydrides

Novel polyesteramides were synthesized by copolymerization in bulk of 5-(4,5-dihydro-1,3-oxazol-2-yl)-1-pentanol and various cyclic dicarboxylic acid anhydrides at temperatures varying between 120 and 200°C. The polymers resulting from polycondensation were characterized by means of ¹H–NMR, FTIR, MALDI–TOF–MS, SEC, and DSC. The glass transition temperatures, T_g, of the copolymers were varied between −28 and +31°C as a function of the anhydride type. Molecular weights, M_w, were dependent on reaction temperature, reaction time, and anhydride type. Spectroscopic investigation of reaction products and esteramide model compounds provided evidence for imide by-product formation, which accounts for the low degree of polymerization. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3367–3376, 1999     

Liquid Nickel Salts: Synthesis,Crystal Structure Determination,and Electrochemical Synthesis of Nickel Nanoparticles

New nickel‐containing ionic liquids were synthesized, characterized and their electrochemistry was investigated. In addition, a mechanism for the electrochemical synthesis of nanoparticles from these compounds is proposed. In these so‐called liquid metal salts, the nickel(II) cation is octahedrally coordinated by six N‐alkylimidazole ligands. The different counter anions that were used are bis(trifluoromethanesulfonyl)imide (Tf₂N^?), trifluoromethanesulfonate (OTf^?) and methanesulfonate (OMs^?). Several different N‐alkylimidazoles were considered, with the alkyl sidechain ranging in length from methyl to dodecyl. The newly synthesized liquid metal salts were characterized by CHN analysis, FTIR, DSC, TGA and viscosity measurements. An odd‐even effect was observed for the melting temperatures and viscosities of the ionic liquids, with the complexes with an even number of carbon atoms in the alkyl chain of the imidazole having a higher melting temperature and a lower viscosity than the complexes with an odd number of carbons. The crystal structures of several of the nickel(II) complexes that are not liquid at room temperature were determined. The electrochemistry of the compounds with the lowest viscosities was investigated. The nickel(II) cation could be reduced but surprisingly no nickel deposits were obtained on the electrode. Instead, nickel nanoparticles were formed at 100 % selectivity, as confirmed by TEM. The magnetic properties of these nanoparticles were investigated by SQUID measurements.     

Synthesis,characterization, and antioxidant and anticholinesterase activities of pyrazolo derivatives

Twenty-four pyrazolo derivatives (1–4)(a-f) were synthesized and characterized by FTIR, ¹H, and ¹³C NMR (Nuclear Magnetic Resonance), and elemental analysis. The synthesized compounds were also investigated for their antioxidant and anticholinesterase activities. The compounds (3–4)(a-f) carrying morpholine ring were more active than the piperidinyl containing compounds (1–2)(a-f) in both activities. The compound 4f showed higher activity in both assays as compared with the others. Additionally, the anticholinesterase activity test provided higher values than the galantamine in the BChE assay. Therefore, compound 4f can be used as anticholinesterase agent and/or anticholinesterase assay standard.     

Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application

In this paper, two silicon‐containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex‐3‐enyl‐1‐methanol with di‐ or tri‐chlorosilane compounds. Then, after epoxidation, two new cycloaliphatic epoxy resins with different epoxy groups were successfully prepared. Their chemical structures were confirmed by ²⁹Si NMR, ¹H NMR, and Fourier‐transform infrared spectra (FTIR). The properties of cured products, including viscoelasticity, glass transition temperature (T_g), coefficient of thermal expansion, thermal stability and water absorption, were investigated. Compared to the difunctional epoxy resin, the trifunctional one exhibited a remarkably increased cross‐linking density from 0.82 to 4.08 × 10^?3 mol/cm³ and T_g from 157 to 228°C. More importantly, prior to curing, they had viscosities of only 240–290 mPa sec at 25°C, which were much lower than that of ERL‐4221 (409 mPa sec), providing the possibility of easy processing. The high glass transition temperatures, good thermal stabilities, and mechanical properties as well as excellent flowability endow the silicon‐containing epoxy resins with promising potential in microelectronic packaging application. Copyright © 2011 John Wiley & Sons, Ltd.     

Halogenated hydroxy-aryloxy phosphazenes and epoxy oligomers based on them

By partial substitution of the chlorine atoms in hexachlorocyclotriphosphazene for halophenols and subsequent reaction of the resulting halogenated phenoxy phosphazene and 2,2-di(4-hydroxyphenyl)propane monophenolate hydtoxy-aryloxy phosphazenes were synthesized with a molecular weight of 1100–1400 g mol^?1. Epoxide oligomers (epoxy number of 6–8%), which are cured with the formation of non-combustible compositions [PV-0 class of resistance to combustion according to State Standard (GOST 28157-89)], were obtained by reaction of these compounds with epichlorohydrin. Introduction of 5–50 wt% halogenated epoxyphophazene oligomers in industrial resin ED-20 can significantly improve the flame resistance of compositions based on these compounds.