Description of phenomenological process during thermal formation of an epoxy system in presence of metal nanoparticles using advanced kinetics analysis

The curing process of diglycidyl ether of bisphenol A (DGEBA)–isophoronediamine (IPDA) system filled with different contents of Fe nanoparticles (nano-Fe) has been investigated by differential scanning calorimetry and Fourier transform infrared spectroscopy analysis in order to understand the effect of nano-Fe. These studies revealed that high percentage of the nanofiller, i.e. 10 %, results in improved epoxy matrix as evidenced by increasing in the reaction heat and conversion degree. Kinetics of DGEBA/IPDA/10 % nano-Fe cure was studied by calorimetry measurements at isothermal mode. Isothermal kinetic parameters, including k ₁, k ₂, m, and n were determined and it was shown that the reaction kinetics could be expressed well by dα/dt = (k ₁ + k ₂ α ^m)(1?α)ⁿ which called Kamal model. The results also showed that the diffusion control does not occur. The excellent fitting Kamal model with experimental data at the end of the isothermal cure process could be mentioned as evidences here. The dispersion of 10 % nano-Fe into epoxy matrix was analyzed by atomic force microscopy observations.     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Kinetic studies of the effect of ABS on the curing of an epoxy/cycloaliphatic amine resin

Using differential scanning calorimetry (DSC), we have studied, under isothermal and dynamic conditions, the kinetics of the cure reaction for an epoxy resin based on the diglycidyl ether of bisphenol A (DGEBA) modified with different contents of acrylonitrile–butadiene–styrene (ABS) and cured with 1,3‐bisaminomethylcyclohexane (1,3‐BAC). Kinetic analysis were performed using three kinetic models: Kissinger, Flynn–Wall–Ozawa, and the phenomenological model of Kamal as a result of its autocatalytic behavior. Diffusion control is incorporated to describe the cure in the latter stages, predicting the cure kinetics over the whole range of conversion. The total heats of reaction were not influenced by the presence of ABS. The autocatalytic mechanism was observed both in the neat system as well as in its blends. The reaction rates of the blends and the maximum conversions reached did not change too much with the ABS content. Blending ABS within the epoxy resin does not change the reaction mechanism of the epoxy resin formation. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 351–361, 2000     

Curing and thermomechanical properties of off-stoichiometric anhydride–epoxy thermosets

In the present work, we report the preparation and characterization of a new family of thermosets based on off-stoichiometric anhydride–epoxy formulations in the presence of an anionic initiator. Diglycidyl ether of bisphenol A (DGEBA) and hexahydro-4-methylphthalic anhydride (HHMPA) have been used as epoxy and anhydride comonomers, respectively, and 1-methylimidazole (1MI) has been used as anionic initiator. The isothermal curing kinetics and the thermal properties of the stoichiometric and the off-stoichiometric systems have been compared. The kinetics of the isothermal curing has been analyzed by differential scanning calorimetry (DSC) using an isoconversional method and the ?esták–Berggren equation to determine the activation energy, the frequency factor and the reaction orders. The materials obtained were characterized by DSC and dynamic mechanical analysis. Gelation during epoxy–anhydride condensation was determined by thermomechanical analysis. At the same curing temperature, the reaction is faster in the system with excess of epoxy groups. However, the glass transition temperatures of the partially cured stoichiometric system are greater. The gelation time of the off-stoichiometric system is shorter than that of the stoichiometric one. The results indicate that the dual-curing character of off-stoichiometric DGEBA/HHMPA thermosets with 1MI as anionic initiator makes them suitable for multistage curing processes with easy control of degree of cure and material properties in the intermediate stage and enhanced final material properties.

     

Kinetics of cure for a coating system including DGEBA (n = 0)/1,8-NDA and barium carbonate

The increasing demand for low-cost and high performance coatings has promoted the development of chip epoxy-based coatings using inert fillers. Attention has been paid here on employing mixtures of DGEBA with barium carbonate as novel ceramic-based filler to produce a coating using 1,8-naphthalene diamine (1,8-NDA) as the crosslinking agent. A substantial increase in the T_g, from 85 to 100 °C, is observed for the optimum composition. The 1,8-NDA-cure of the epoxy composites showed an autocatalytic mechanism. At a specific conversion range the cure reaction of the composites will be controlled by a diffusion-control cure reaction rather than by Kamal autocatalytic model. Model-free isoconversional method is utilized to construct apparent activation energy dependence on conversion plot. The effect of diffusion control is described by an approach proposed by Chern and Poehlein. Greater diffusion control is observed as the cure temperature decreased.     

Influence of fillers and additives on the cure kinetics of an epoxy/anhydride resin

The cure kinetics of a cycloaliphatic epoxy resin with and without additives and cured with an anhydride hardener was investigated by isothermal and nonisothermal differential scanning calorimetry (DSC).Dynamic measurements were used to predict the total heat of reaction of the epoxy resin as well as its activation energy based on the methods of Kissinger and Ozawa. With these methods the inhibition and acceleration effects of additives and fillers on the kinetics have been demonstrated. Additives for advanced processing and property upgrade were added in less than 2 wt.%, whereas fillers on base of SiO₂ were incorporated in more than 50 wt.%. The effect of SiO₂ surface treatment was also objective of this study.To describe the dependence of the conversion on time and temperature, isothermal DSC data were fitted to an autocatalytic model developed by Kamal and extended with a diffusion factor. The results show a very good agreement within the whole conversion range. Also the highly-filled system could be described very well by the phenomenological Kamal model.     

Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

Cationic cure of epoxy resin initiated by methylanilinium salts as a latent thermal initiator

The effect of the novel N‐crotyl‐N,N‐dimethyl‐4‐methylanilinium hexafluroantimonate (CMH) initiator on cure kinetics and rheological properties of diglycidylether of bisphenol A (DGEBA) epoxy cationic system was investigated. From DSC measurements of the DGEBA/CMH system, it was found that this system exhibited excellent thermal latent characteristics at a given temperature and revealed complex cure behavior as indicated by multiple exotherms. The conversion and conversion rate of the DGEBA/CMH system increased with increasing the concentration of initiator, attributed to the high activity of CMH. Viscoelastic properties during gel formation of DGEBA initiated by CMH were investigated by rheological techniques under isothermal conditions. The gel time obtained from the modulus crossover point t(G′) = G″ was affected by a high curing temperature and the concentration of CMH, resulting in a high degree of network formation in cationic polymerization. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 2397–2406, 2001     

酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

Thermosetting polymers from epoxy resin and a Nickel catalyst of diethylenetriamine

The kinetics and mechanism of cure reaction of DGEBA using a chelate of Ni(II) with diethylenetriamine (dien), Ni(dien)₂I_2, as a curing agent was studied by DSC. TG curve of the complex curing agent showed mass loss in two region of temperature: 200–320 and 450–550 °C. Dynamic DSC measurements showed only one exothermic peak with a maximum about 250 °C depending on the heating rate. According to the methods of KAS and Ozawa–Flynn–Wall the values of E _a were 92.5 and 96.2 kJ/mol, respectively. The isoconversional kinetic analysis in whole range of conversion, α = 0.02–0.95, showed small changes in the E _a values in the region of α = 0.04–0.6 and most likely represent some average values (E _a = 110 kJ/mol) between the values of E _a of non-autocatalyzed and autocatalyzed reactions. Using the sole dependence of E _a on α, the time required to reach fully cured materials under isothermal conditions were also predicted and compared with the experimental results.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Epoxy/POSS organic-inorganic hybrids: ATR-FTIR and DSC studies

Organic-inorganic hybrid nanocomposites were prepared by reaction of an octaepoxy-silsesquioxane, OECh, with an epoxy-amine system. OECh was used to partially replace the thermosetting resin, diglycidyl ether of bisphenol A, DGEBA, in its reaction with an aromatic diamine, 4,4′-(1,3-phenylenediisopropylidene) bisaniline, BSA. The OECh was characterized by different techniques. The curing kinetics of ternary systems formed by DGEBA, OECh and BSA, was followed by Attenuated Total Reflectance-Fourier Transform Infrared Spectroscopy, ATR-FTIR. All the mixtures were prepared with a stoichiometric ratio between epoxy and amine groups. The degree of reaction of glycidyl epoxy ring along the curing cycle selected was obtained from the infrared spectra. A peak-height method based on the ratio of the height of the characteristic to reference absorbance peak was used. The curing kinetic of different blends was obtained by differential scanning calorimetry, DSC. Three different methods, the differential of Kissinger, the integral of Flynn-Wall-Ozawa and the phenomenological model of Kamal, were used in order to obtain the kinetic parameters of the cure reaction. It is observed that the presence of POSS accelerates the rate of opening of glycidyl epoxy rings from DGEBA. The behaviour of the mixture during the curing process can be explained with an autocatalytical model, corrected with the contribution of the diffusion of the molecules during the course of the reaction.     

The effect of zeolite on the curing of epoxy resin by polyaniline: a kinetic study

Polyaniline sulfate‐zeolite composite was prepared by emulsion polymerization. Epoxy resin was cured using polyaniline‐sulfate salt and various amounts of polyaniline sulfate‐zeolite composite. The kinetics of the cure reaction for an epoxy resin based on the diglycidyl ether of bisphenol A (DGEBA) with polyaniline‐sulfate and polyaniline sulfate‐zeolite composite have been studied using differential scanning calorimetry (DSC) under isothermal and dynamic conditions. Isothermal kinetics analysis was performed using the phenomenological model of Kamal. Dynamic kinetic analysis was performed using Kissinger's method. Copyright © 2002 John Wiley & Sons, Ltd.     

Studies on epoxy resins cured by cationic latent thermal catalysts: The effect of the catalysts on the thermal,rheological, and mechanical properties

To investigate the effect of catalysts on the thermal, rheological, and mechanical properties of an epoxy system, a resin based on diglycidyl ether of bisphenol‐A (DGEBA) was cured by two cationic latent thermal catalysts, N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH). Differential scanning calorimetry was used for the thermal characterization of the epoxy systems. Near‐infrared spectroscopy was employed to examine the cure reaction between the DGEBA and the latent thermal catalysts used. The rheological properties of the blend systems were investigated under an isothermal condition with a rheometer. To characterize the mechanical properties of the systems, flexure, fracture toughness (K_IC), and impact tests were performed. The phase morphology was studied with scanning electron microscopy of the fractured surfaces of mechanical test samples. The conversion and cure activation energy of the DGEBA/BQH system were higher than those of the DGEBA/BPH system. The crosslinking activation energy showed a result similar to that obtained from the cure kinetics of the blend systems. The flexure strength, K_IC, and impact properties of the DGEBA/BQH system were also superior to those of the DGEBA/BPH system. This was a result of the substituted benzene group of the BQH catalyst, which increased the crosslink density and structural stability of the epoxy system studied. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 187–195, 2001     

Effect of the substituted benzene group on thermal and mechanical properties of epoxy resins initiated by cationic latent catalysts

Epoxy resins (DGEBA) were cured by cationic latent thermal catalysts, that is, N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH) to investigate the effect of substituted benzene group on cure kinetics and mechanical properties of epoxy system. Differential scanning calorimetry (DSC) was undertaken for activation energy of the system. It was also characterized in terms of flexural, fracture toughness, and Izod impact strengths for the mechanical tests. As a result, the cure reaction of both epoxy systems resulted in an autocatalytic kinetic mechanism accelerated by hydroxyl groups. Also, the conversion and cure activation energy of the DGEBA/BQH system were higher than those of DGEBA/BPH system. The mechanical properties of the DGEBA/BQH system were also superior to those of the DGEBA/BPH system, as well as the morphology. This was probably due to the consequence of the effect of the substituted benzene group of the BQH catalyst, resulting in increasing the crosslinking density and structural stability in the epoxy system studied. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2419–2429, 2004     

Cure Kinetics of Poly(acrylonitrile-butadiene-styrene) Modified Epoxy–Amine System

The cure kinetics of epoxy based on the diglycidyl ether of bisphenol A (DGEBA) modified with different amounts of poly(acrylonitrile-butadiene-styrene) (ABS) and cured with 4,4′-diaminodiphenylsulfone (DDS) was investigated by employing differential scanning calorimetry (DSC). The curing reaction was followed by using an isothermal approach over the temperature range 150–180°C. The amount of ABS in the blends was 3.6, 6.9, 10 and 12.9 wt%. Blending of ABS in the epoxy monomer did not change the reaction mechanism of the epoxy network formation, but the reaction rate seems to be decreased with the addition of the thermoplastic. A phenomenological kinetic model was used for kinetic analysis. Activation energies and kinetic parameters were determined by fitting the kinetic model with experimental data. Diffusion control was incorporated to describe the cure in the latter stages, predicting the cure kinetics over the whole range of conversion. The reaction rates for the epoxy blends were found to be lower than that of the neat epoxy. The reaction rates decreased when the ABS contents was increased, due to the dilution effect caused by the ABS on the epoxy/amine reaction mixture.     

几种聚醚胺改性蒙脱土对环氧树脂固化过程的影响

首先制备了五种聚醚胺改性蒙脱土(MMT), 并将这五种聚醚胺改性蒙脱土加入到双酚A 型环氧树脂E51 和聚醚胺D400体系中, 采用差示扫描量热法(DSC)考察了五种聚醚胺改性MMT对环氧树脂升温固化进程的影响. 随后, 优选一种EP/MMT 混合体系即EP/D400-T500-MMT 混合体系, 系统地研究了该体系与纯环氧树脂体系在130, 140, 150 及160 ℃等几个温度下的等温固化过程, 考察了等温固化时间对固化度和固化度变化速率的影响以及固化度与固化度变化速率之间的关系, 并利用Kamal 模型进行拟合计算了固化动力学参数. 研究结果表明, 与纯环氧树脂相比, 几种聚醚胺改性MMT 的固化放热峰均向高温迁移, 同时聚醚胺D400 协同插层MMT 降低了高分子量聚醚胺插层MMT 所导致的环氧树脂DSC 曲线的畸变情况; EP/D400-T500-MMT 混合体系和纯环氧体系的等温固化反应过程符合Kamal 模型;在相同的固化温度下, EP/D400-T5000-MMT 混合体系的反应速率常数k₁ 和k₂ 值以及反应级数m 均比纯EP 体系小, 而反应级数n 以及总反应级数m+n 值比纯EP 体系大, 表明两种聚醚胺协同插层的改性蒙脱土D400-T5000-MMT 的加入降低了环氧体系固化反应速率. 另外, EP/D400-T5000-MMT 混合体系的活化能E_a1 和E_a2 与纯EP 体系的相比也略有升高.     

Kinetics study of imidazole-cured epoxy-phenol resins

The reaction kinetics of diglycidyl ether of bisphenol A (DGEBA) cured with different concentrations of imidazole and bisphenol A (BPA) were investigated by using differential scanning calorimetry. Both dynamic and isothermal DSC were studied. Two initiation mechanisms were found to play roles in the curing reactions. One was based on adduct formation of epoxy groups with pyridine-type nitrogen and the other was based on ionic complexes of imidazole and BPA. The subsequent propagation was composed of three main reactions, viz. the epoxide/phenol reaction, the acid/base reaction, and the epoxide/R-O⁻ reaction. A generalized kinetics model was developed and used to predict the conversion of epoxide groups using a wide range of imidazole and BPA concentrations, and cure temperature. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3233–3242, 1999     

Rheokinetic cure characterization of epoxy–anhydride polymer system with shape memory characteristics

An epoxy resin capable of exhibiting shape memory property was derived by curing diglycidyl ether of bisphenol A (DGEBA) with a blend of carboxy telechelic poly(tetramethyleneoxide) (PTAC) and pyromellitic dianhydride (PMDA). The cure kinetics of DGEBA/PTAC/PMDA blend of varying compositions was investigated using isothermal rheological analysis. The overall reaction conformed to a second-order autocatalytic model. The kinetic parameters including reaction order, kinetic constants and activation energy were determined. The results showed that increase of PTAC decreased the overall activation energy and frequency factor of the cure reaction. This effect resulted in a diminution of the overall rate of curing. The catalysis by PTAC has its origin from the activation of epoxy groups by the protons of the COOH groups. The autocatalysis was caused by the COOH groups generated by the reaction of alcohol groups with anhydride. The activation energy for the autocatalysis was more than that for the primary reaction as the COOH groups responsible for autocatalysis were generated on a sterically hindered polymer backbone. The kinetics helped generate a master equation conforming to second-order autocatalytic model that could predict the cure profile of a specified resin system at a given temperature, leading to cure optimization.