Functionalized polyimide based on mercaptoacetic acid locking imine reaction: Synthesis and coating application

To meet the high requirements for polyimide (PI) manufacturing process without sacrificing material performance, a new type fabrication method for PI is proposed here. Based on the classical Kapton system, functionalized precursor polyamide acid (MPAA) resin solution with high solid content, low viscosity and high relative molecular weight was obtained via mercaptoacetic acid locking imine (MALI) reaction, and a series of linear Mali-Polyimide (MPI) films were prepared and their properties were well investigated. The results showed that MPIs have relatively excellent thermal stability (T_d5%: 598 ~ 601°C), good heat resistance (T_g: 277 ~ 278 °C) and high adhesion strength. This work emphasizes the possibility and potential of MALI reaction in PI synthesis and is expected to be applied in coating and adhesive field.     

Reduced curing kinetic energy and enhanced thermal resistance of phthalonitrile resins modified with inorganic particles

The effects of inorganic particles such as Al₂O₃ and B₄C on the solidification kinetics and heat resistance of phthalonitrile resin were investigated. The properties of the blends and the cured products were tested by rheometer, differential scanning calorimetry, Fourier transform infrared spectroscopy, and thermogravimetric analysis. The results revealed that B₄C and Al₂O₃ inorganic particles could prolong the gel time of phthalonitrile resin and broaden the processing window. The curing kinetic analysis showed that the presence of the particles could significantly reduce the curing activation energy of phthalonitrile resins by 72.38 kJ/mol down to 43.03 kJ/mol. Meanwhile, the heat resistance of the phthalonitrile resin was improved. Among them, the blend system combined with 30% B₄C showed prominent thermoresistance. And while the T_d5% weight loss temperature was 600°C, char yield at 1000°C was higher than 86% under nitrogen atmosphere; while the T_d5% weight loss temperature was 581°C, char yield at 1000°C was higher than 80% under air atmosphere. Hence, the resulting resins were good candidate matrix of high‐temperature structural composites.     

Approaches to improve the film ductility of colorless cycloaliphatic polyimides

This study described approaches for improving the film ductility of colorless cycloaliphatic polyimides (PIs). An unexpected toughening effect was observed when a PI derived from pyromellitic dianhydride (PMDA) and 4,4′‐methylenebis(cyclohexylamine) was modified by copolymerization with a low isophoronediamine (IPDA) content of 5 to 30 mol%, despite there being no film‐forming ability in the homo PMDA/IPDA system. For example, at an IPDA content of 20 mol%, the copolymer showed significantly improved film toughness (maximum elongation at break, ε_{b max} = 57%), excellent optical transparency (light transmittance at 400 nm, T₄₀₀ = 83.7%), and a high glass transition temperature (T_g = 317°C). This toughening effect can be interpreted on the basis of the concept of chain slippage. In this study, the PIs derived from bicyclo[2.2.2]octane‐2,3,5,6‐tetracarboxylic dianhydride (H‐BTA) with various diamines were also systematically investigated to evaluate the potential of H‐BTA‐derived systems. The combinations of H‐BTA with ether‐containing diamines led to highly tough PI films (ε_{b max} > 100%) with very high T_gs, strongly contrasting with the results of an earlier study. The observed excellent properties are related to the steric structure of H‐BTA. Our interest also extended to the solution processability. A copolyimide derived from H‐BTA with a sulfone‐containing diamine and an ether‐containing diamine achieved a very high optical transparency (T₄₀₀ = 86.8%), a very high T_g (313°C), and good ductility (ε_{b max} = 51%) while maintaining solution processability. Thus, these approaches enabled us to dramatically improve the ductility of cycloaliphatic PI films that have, to date, been considered brittle.     

Influence of chlorosulfonated polyethylene network structure on poly(acrylonitrile-styrene-acrylate)/poly(α-methylstyrene-acrylonitrile) blends: Mechanical properties,morphologies, glass transition behavior and heat resistance

Acrylonitrile-styrene-acrylate terpolymer and poly(α-methylstyrene-acrylonitrile) (ASA/α-MSAN, 25/75) with different loadings of chlorosulfonated polyethylene (CSM) were prepared via melt blending, with goals of toughening modification of ASA/α-MSAN blends and maintaining the heat resistance simultaneously. The results revealed CSM had excellent toughening effect at room temperature. At 0 °C, impact strength increased linearly with CSM content. However, toughening effect of CSM was undesirable at −30 °C. The temperature-dependent toughening efficiency of CSM was significantly related to its glass transition behavior. Scanning electron microscope analysis on cryo-fractured surfaces revealed the toughening mechanism was the formation of CSM toughening network in matrix, which was further confirmed by selective extraction tests. The formation of CSM network could lead to increased glass transition temperature of the blends at the low temperature region according to dynamic mechanical thermal analysis. Different from other toughening agents, CSM network uncompromised the heat resistance of ASA/α-MSAN blends.     

New polymer electrolyte membrane for medium-temperature fuel cell applications based on cross-linked polyimide Matrimid and hydrophobic protic ionic liquid

New hydrophobic protic ionic liquid, 2-butylaminoimidazolinium bis(trifluoromethylsulfonyl)imide (BAIM-TFSI), has been synthesized. The ionic liquid showed good thermal stability to at least 350 °C. The conductivity of BAIM-TFSI determined by electrochemical impedance method was found to be 5.6 × 10^?2 S/cm at 140 °C. Homogeneous composite films based on commercial polyimide (PI) Matrimid and BAIM-TFSI containing 30–60 wt% of ionic liquid were prepared by casting from methylene chloride solutions. Thermogravimetric analysis data indicated an excellent thermal stability of PI/BAIM-TFSI composites and thermal degradation points in the temperature range 377 °C–397 °C. The addition of ionic liquid up to 50 wt% in PI films does not lead to any significant deterioration of the tensile strength of the polymer. The dynamic mechanical analysis results indicated both an increase of storage modulus E′ of PI/BAIM-TFSI composites at room temperature and a significant E′ decrease with temperature compared with the neat polymer. The cross-linking of the PI with polyetheramine Jeffamine D-400 allowed to prepare PI/Jeffamine/BAIM-TFSI (50%) membrane with E′ value of 300 MPa at 130 °C. The ionic conductivity of this cross-linked composite membrane reached the level of 10^?2 S/cm at 130 °C, suggesting, therefore, its potential use in medium-temperature fuel cells operating in water-free conditions.     

Determination of ultra-low glass transition temperature via differential scanning calorimetry

A novel method was developed to determine the ultra-low glass transition temperature (T_g) of materials through physical blending via differential scanning calorimetry. According to the Fox equation for polymer blends, a blend of two fully compatible polymers has only one T_g. The single T_g is a function of the T_gs of the two simple polymers. Thus, the ultra-low T_g of one material can be obtained from the T_gs of another polymer and their blends. The error of T_g measurements depends on the measurement error of the T_gs for the blends and another polymer. The method was successfully applied to determine the T_gs of acetyl tributyl citrate (ATBC), tributyl citrate (TBC) and poly(ethylene glycol)s (PEG)s with different molecular weights. The T_gs for ATBC, TBC, PEG-4000 and PEG-800 were ?57.0 °C, ?62.7 °C, ?76.6 °C and ?83.1 °C, respectively. For all the samples, the standard deviation of measurements was less than 3.3 °C, and the absolute error of measurements was theoretically not more than 5.3 °C. These results indicate that this method has acceptable precision and accuracy.     

Functionalized reduced graphene oxide/epoxy composites with enhanced mechanical properties and thermal stability

One-pot hydrothermal reduction of graphene oxide (GO) in N-methyl-2-pyrrolidone (NMP) suspension was performed, wherein GO surface were functionalized by free radicals generated from NMP molecules. The NMP functionalized reduced GO (NMPG) nanosheets were then incorporated into epoxy matrix to prepare epoxy composites. The significant improvement of 100 and 240% in fracture toughness (critical intensity factor, K_IC) and fracture energy (critical strain energy release rate, G_IC) achieved from single edge notched bending (SENB) test revealed the excellent toughening ability of NMPG. The improved compatibility and interfacial interaction between the epoxy matrix and NMPG yielded∼28, 19 and 51% improvement in tensile strength, Young's and storage modulus, respectively. Thermal stability of pure epoxy and its composites was determined at 5, 10 and 50% weight loss, which showed 30, 27.5 and 29 °C improvement with 0.2 wt% NMPG loading. The work provides a simple method to prepare graphene-based epoxy composites with improved performance.     

Miscible polybenzimidazole blends with a benzophenone-based polyimide

Miscible blends of the aromatic polybenzimidazole, poly(2,2(m-phenylene)-5,5′-benzimidazole) (PBI), and the aromatic polyimide formed from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and 3,3′-diaminobenzophenone (LaRC TPI) have been prepared. Blends with PBI were prepared in N,N-dimethylacetamide solution starting with either the polyamic acid or a 95% imidized form of LaRC TPI; the blend was then precipitated into water or cast as films. The mixture was then imidized thermally to obtain PBI/LaRC TPI blends. Evidence for miscibility was obtained in the form of single composition dependent T_g's intermediate between those of the component polymers and single tan δ dynamic mechanical relaxation peaks. The IR spectra displayed shifts in the N? H stretching band, thereby providing evidence for specific interactions related to the miscibility of these two polymers.     

Colorless poly(ester imide)s derived from hydrogenated trimellitic anhydride

Tetracarboxylic dianhydrides were synthesized from hydrogenated trimellitic anhydride (HTA) and some diols to obtain novel poly(ester imide)s (PEsIs). The HTA-derived tetracarboxylic dianhydrides showed much higher reactivity with various diamines than conventional cycloaliphatic tetracarboxylic dianhydrides and led to PEsI precursors with high molecular weights (M_w). The results can be explained in terms of a spacer effect. The PEsI films were essentially colorless regardless of diol and diamine components owing to inhibited charge-transfer interactions. The HTA-derived PEsIs also exhibited excellent combined properties: relatively high glass transition temperatures (T_g), relatively low water absorption (W_A), and relatively low dielectric constants. The outstanding processability (thermoplasticity and solubility) observed for the HTA-derived PEsIs was discussed on the basis of a non-planar/bent structure at the HTA-based imide units. The use of a fluorene-containing diol component was effective for enhancing T_g’s by restricted internal rotation and for reducing W_A by a decreased imide group content. On the other hand, the use of 4,4′-biphenol as another diol gave rise to a prominent toughening effect without sacrificing other target properties. One of the HTA-derived PEsI systems can be a promising candidate as plastic substrates because of its excellent combined properties: a high T_g close to 300 °C, high optical transparency, significant toughness (elongation at break > 100%), and good thermo- and solution-processability.     

Room temperature processable heat‐resistant epoxy‐oxazolidone‐based syntactic foams

Syntactic foams based on oxazolidone‐modified epoxy resin using glass microballoons as reinforcing filler with varying densities were processed. The influence of various grades of microballoons and their concentration on the mechanical, thermal, thermomechanical, and flammability characteristics were investigated. The effect of temperature on the compressive strength with density was monitored in detail. By incorporating the microballoons, T_g of the syntactic foam increased from 90 °C to 115 °C. Thermal conductivity was found to decrease from (0.064 to 0.056 W/(m·K)) in conjunction with decreasing resin to filler ratio. In the case of composites filled with K25 alone, the creation of large voids due to less effective packing between the microballoons led to lower thermal conductivity. The specific heat of the different composites was in the range of 0.32 to 0.44 cal/g/°C, and the coefficient of thermal expansion was in the range of 13.2 to 17.4 × 10⁻⁶/°C with limiting oxygen index of 28% to 33%.     

High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities

To improve the processability and thermal stability of polyimide, a series of novel phenylethynyl-endcapped oligoimides(PEPA-oligoimides) with calculated molecular weights(M_nC) were successfully prepared from thermal imidization of 4,4'-(9-fluorenylidene) dianiline(BAFL) as fluorenyl diamine, 4,4′-oxy-diphthalic anhydride(ODPA) as aromatic dianhydride and 4-phenylethynylphthalic anhydride(4-PEPA) acted as reactive end-capping reagent at elevated temperatures. Experiment results indicated that the oligoimides were the mixtures of PEPA-endcapped oligomers with different degrees of polymerization characterized by MALDI-TOF mass spectra. The influence of chemical structures on the melt processabilities of the oligoimides, the thermal, dielectric and mechanical properties of the thermoset resins was studied. The typical oligoimide resin owned minimum melt viscosity of 0.2 Pa·s at around 310 °C and wide melting processing window, suitable for resin transfer molding(RTM). Besides, its corresponding thermal-cured polyimide resin possessed glass transition temperature(T_g) as high as 514 °C. The dielectric constants of polyimide resins decreased from 3.15 to 2.80 by reducing the M_nC. The mechanical properties of the polyimide neat resins were improved gradually with increasing MnC. Finally, the carbon fiber/polyimide(C_f/PI) composite laminates showed excellent mechanical strength retention rate at 350 °C, might be long-term served at extremely high temperature in aerospace and aviation field.     

Synthesis and characterization of high-barrier polyimide containing rigid planar moieties and amide groups

A high-performance polyimide was prepared by the dipolymerization of 4,4'-diaminobenzanilide (DABA) and pyromellitic dianhydride (PMDA). Due to the introduction of rigid planar moieties and amide groups, the polyimide shows outstanding properties, such as high glass transition temperatures (435 °C), excellent thermal stability (T_d5%, 542 °C, coefficient of thermal expansion, −3.2 ppm K⁻¹), and superior mechanical properties. Most importantly, the polyimide exhibits excellent barrier properties, with oxygen transmission rate (OTR) and water vapor transmission rate (WVTR) low to 7.9 cm³ (m² day)⁻¹ and 5.1 g (m² day)⁻¹, respectively. Wide angle X-ray diffractograms (WAXD), positron annihilation lifetime spectroscopy (PALS) and molecular dynamics simulations reveal that the excellent barrier properties are mainly attributed to the high crystallinity, high extent of in-plane crystalline orientation, and low free volume, which are resulted from the rigid planar structure and strong interchain hydrogen bonding. The high-barrier and thermally stable polyimide has an attractive potential application prospect in the fields of micro-electronics encapsulation and high grade packaging industry.     

Diglycidyl ether of bisphenol-A epoxy resin–polyether sulfone/polyether sulfone ether ketone blends: phase morphology, fracture toughness and thermo-mechanical properties

The properties of diglycidyl ether of bisphenol-A epoxy resin toughened with poly(ether sulfone ether ketone) (PESEK) and poly(ether sulfone) (PES) polymers were investigated. PESEK was synthesised by the nucleophilic substitution reaction of 4,4’-difluorobenzophenone with dihydroxydiphenylsulfone using sulfolane as solvent and potassium carbonate as catalyst at 230 °C. The T _g–composition behaviour of the homogeneous epoxy resin/PESEK blend was modelled using Fox, Gordon–Taylor and Kelley–Bueche equations. A single relaxation near the glass transition of epoxy resin was observed in all the blend systems. From dynamic mechanical analysis, the crosslink density of the blends was found to decrease with increase in the thermoplastic concentration. The storage modulus of the epoxy/PESEK blends was lower than that of neat resin, whilst it is higher for epoxy/PES blends up to glass transition temperature, thereafter it decreases. Scanning electron microscopic studies of the blends revealed a homogeneous morphology. The homogeneity of the blends was attributed to the similarity in chemical structure of the modifier and the cured epoxy network and due to the H-bonding interactions between the blend components. The fracture toughness of epoxy resin increased on blending with PESEK and PES. The increase in fracture toughness was due to the increase in ductility of the matrix. The thermal stability of the blends was comparable to that of neat epoxy resin.     

Thermal characterization of dental composites by TG/DTG and DSC

Dental composites can be improved by heat treatment, as a possible way to increase mechanical properties due to additional cure (post-cure). Direct dental composites are essentially similar to the indirect ones, supposing they have the same indication. Therefore, to establish a heat treatment protocol for direct composites, using as indirect (photoactivated by continuous and pulse-delay techniques), a characterization (TG/DTG and DSC) is necessary to determine parameters, such as mass loss by thermal decomposition, heat of reaction and glass transition temperature (T _g). By the results of this study, a heat treatment could be carried out above 160 °C (above T _g, and even higher than the endset exothermic event) and under 180 °C (temperature of significant initial mass loss).     

Toughening of poly(lactic acid) by ethylene-co-vinyl acetate copolymer with different vinyl acetate contents

The well-known bio-based and biocompostable poly(lactic acid), PLA, suffers from brittleness and a low heat distortion temperature. In this paper, we address a possible route to make PLA tough(er) by blending with ethylene-co-vinyl acetate (EVA) with different vinyl acetate contents. The compatibility and phase morphology of the PLA/EVA blends was controlled by the ratio of vinyl acetate and ethylene in the random copolymers. Tough PLA/EVA blends with increased impact toughness, up to a factor of 30, were obtained with a maximum toughness at a vinyl acetate content of approximately 50 wt.%. The local deformation mechanism was well studied by TEM, SAXS and SEM. It revealed that internal rubber cavitation in combination with matrix yielding is the dominant toughening mechanism for the PLA/EVA blends under both impact and tensile testing conditions.     

The influence of matrix crystallinity,filler grain size and modification on properties of PLA/calcium carbonate composites

Thermal and mechanical properties of polylactide (PLA) composites with different grades of calcium carbonate, 40 nm and 90 nm nanoparticles, and also with submicron particles, unmodified and modified with calcium stearate or stearic acid, obtained by melt mixing, were compared. Films with amorphous and crystalline matrices were prepared and examined.T_g of PLA in the composites remained unaffected whereas its cold crystallization was enhanced by the fillers and predominantly depended on filler content. Filling decreased thermal stability of the materials but their 5% weight loss temperatures well exceeded 250 °C, evidencing stability in the temperature range of PLA processing. The amorphous nanocomposites with modified nanoparticles exhibited improved drawability and toughness without a significant decrease of tensile strength; nearly two-fold increase of the elongation at break and tensile toughness was achieved at 5 wt% content of the modified nanofiller. Lack of surface modification of the filler, larger grain size with an average of 0.9 μm, and matrix crystallinity had a detrimental effect on the drawability. However, the presence of nanofillers and crystallinity improved tensile modulus of the materials by up to 15% compared to neat amorphous PLA.     

Poly (vinyl chloride)/poly (α‐methylstyrene–acrylonitrile)/acrylic resin ternary blends with enhanced toughness and heat resistance

In this study, tough and high heat‐resistant poly (vinyl chloride) (PVC)/poly (α‐methylstyrene–acrylonitrile) (α‐MSAN) blends (70/30) containing acrylic resin (ACR) as a toughening modifier was prepared. With the addition of ACR, heat distortion temperature increased slightly, which corresponded with the increase in glass transition temperature measured by differential scanning calorimetry and dynamic mechanical thermal analysis. Thermogravimetric analysis showed that addition of ACR improved the thermal stability. With regard to mechanical properties, tough behavior was observed combined with the decrease in tensile strength and flexural strength. A brittle‐ductile transition (BDT) in impact strength was found when ACR content increased from 8 to 10 phr. The impact strength was increased by 34.8 times with the addition of 15 phr ACR. The morphology correlated well with BDT in impact strength. It was also suggested from the morphology that microvoids and shear yielding were the major toughening mechanisms for the ternary blends. Our present study offers insight on the modification of PVC, since combination of α‐MSAN and ACR improves the toughness and heat resistance of pure PVC simultaneously. Copyright © 2011 John Wiley & Sons, Ltd.     

Determining crystal growth rate-type of curves in glasses by differential thermal analysis

A crystal growth rate vs. temperature (U vs. T)-type of curve for a Li₂O.2SiO₂ glass was determined up to a temperature of 690 °C using a differential thermal analysis (DTA) method. As determined from this (U vs. T)-type of curve, the temperature corresponding to the onset of crystal growth was 570±3 °C which is in excellent agreement with the same value determined by the conventional method. The complete range of temperature where crystal growth can occur and the temperature (T_max) where the crystal growth rate is a maximum for this glass could not be determined. It is concluded that for temperatures <T_max, the DTA method can delineate only a small, initial portion of the (U vs. T)-type of curve, where the crystal growth rate is sufficiently low so that the glass does not totally crystallize after the required (for at least 5 min) isothermal heat treatment at these temperatures. For temperatures >T_max, the curve cannot be determined by the DTA method if the temperature for isothermal heat treatment is approached by heating the glass from room temperature. For determining the curve for temperatures >T_max, the desired temperature (>T_max) for isothermal heat treatment of the glass is suggested to be approached from the melting temperature of the glass.     

Thermogravimetric and FTIR studies of chitosan blends

Results of spectrophotometric and thermogravimetric studies of chitosan (CH) blends with polyvinyl alcohol (PVAL), starch (S) and hydroxypropylcellulose (HPC) obtained by casting from solutions in the form of transparent films containing 0–1.0 weight fraction of CH were discussed. Blends containing S are homogeneous only in the case of low-weight fraction of S (to 0.3).On the basis of results of thermodegradation in dynamic and isothermal conditions, thermal stability of the tested systems was estimated. Thermogravimetric measurements in dynamic conditions were carried out in the temperature range of 100–450 °C at constant heating rate 15 °C/min. From thermogravimetry (TG) and DTG curves the activation energy and characteristic parameters of degradation of the tested blends were determined. The observed growth of activation energy and T_p—temperature of initial weight loss, T_max—temperature of maximal rate and C_e—degree of conversion at the end of the measurement (at temperature 450 °C) along with the increase of polymer fraction (HPC and S) in the CH blend provides an evidence of improved thermal stability of the systems tested.Investigations in isothermal conditions in air at temperature from 100 to 200 °C confirmed appreciable improvement of CH thermal stability in the blends being tested.Infrared spectroscopic analysis of the blends showed a distinct stabilization of the process of chain scission. In the band at 1080 cm⁻¹ associated with absorption in –C–O–C– group during degradation of the blends at temperature 200 °C much smaller decrease due to molecular scission were observed than in the case of pure CH.     

Mechanical and morphological investigations of reactive polysulfone toughened epoxy networks

The diglycidyl ether of bisphenol-A (DGEBA) epoxy resin was toughened by aminophenyl functional reactive polyethersulfones (R-PES) or by t-butyl terminated non-reactive polyethersulfones (T-PES). The molecular weights of PES were controlled to afford 5,000 to 20,000 g/mole and loadings were also varied from 5 to 30 wt.%. Epoxy networks cured with 4, 4'-diaminodiphenylsulfone (DDS) were subjected to Tg determinations, plane strain fracture toughness (K_1C) measurements, chemical resistance tests and morphological studies by SEM. Very significantly improved K_1C fracture toughness was obtained with reactive PES toughening without loss of chemical resistance, while non-reactive PES blended epoxy resins exhibited only slightly improved fracture toughness but poor chemical resistance. It was possible to load up to 30 wt.% of PES without utilizing solvent and the maximum K_1C fracture toughness with R-PES was around 2.2 MPa-m 0.5, which was equivalent to the neat thermoplastic resin. Ductile fracture of the PES phase is suggested as a major toughening mechanism and this is highly dependent of the excellent adhesion developed between the PES and epoxy phases due to the chemical bonds. The systems demonstrated that chemical resistance of thermosets can be combined with the tough characteristics of thermoplastics.