Cross-sectional TEM study on Ni-mediated crystallization of amorphous silicon

Structural characteristics of polycrystalline silicon (poly-Si) made by Ni-mediated crystallization of amorphous silicon (a-Si) were investigated by cross-sectional transmission electron transmission (XTEM) according to various a-Si thickness. The Ni area density of ∼10¹⁴ cm⁻² was deposited onto a-Si and it was annealed at 500 °C in the presence of an electric field of 10 V/cm. It is found that NiSi₂ precipitates form at the top and bottom interfaces of a-Si during annealing. After reaching its critical size the crystallization proceeds from the top and bottom interfaces. The growth of needle-like Si crystallites has been seen, showing a migration of NiSi₂ precipitates through the a-Si network. 1700 nm thick a-Si can be crystallized within 30 min which is longer than that (10 min) of 50 nm thick a-Si. However, the quality of 50 nm thick poly-Si is better than that of 300 nm or 1700 nm thick poly-Si.     

Electrical properties of annealed a-SiC:H thin films

In the present work the dependence of electrical properties of a-SiC:H thin films on annealing temperature, T_a, has been extensively studied. From the measurements of dark dc electrical conductivity, σ_D, in the high temperature range (from 283 up to 493 K), was found that the conductivity activation energy, E_a, is invariant for T_a ⩽ 673 K and equal to 0.64 eV, whereas for T_a from 673 up to 873 K, E_a increases at about 0.2 eV reaching to a maximum value 0.85 eV at T_a = 873 K, suggesting the optimum material quality. This behavior of E_a as a function of T_a is mainly attributed to relaxation of the strain in the amorphous network, which is possibly combined with weak hydrogen emission for temperatures up to 873 K. For further increase of T_a (>873 K) the phenomenon of hydrogen emission, causes rapid decrease of E_a down to 0.24 eV at T_a = 998 K, deteriorating the material quality. These results are also supported by the measurements of dark dc electrical conductivity in the low temperature range (from 133 up to 283 K), where the dependence of the density of gap states at the Fermi level, N(E_F), on annealing temperature presents the minimum value at T_a = 873 K. The Meyer–Nelder rule was found to hold for the a-SiC:H thin films for annealing temperatures up to 873 K. Finally, the dependence of dark dc electrical conductivity at room temperature, σ_DRT, on T_a showed to reflect directly the dependence of E_a on T_a.     

Spectroscopic ellipsometry study of nickel induced crystallization of a-Si

The aim of this work is to present a spectroscopic ellipsometry study focused on the annealing time effect on nickel metal induced crystallization of amorphous silicon thin films. For this purpose silicon layers with 80 and 125 nm were used on the top of which a 0.5 nm Ni thick layer was deposited. The ellipsometry simulation using a Bruggemann Effective Medium Approximation shows that films with 80 nm reach a crystalline fraction of 72% after 1 h annealing, appearing to be full crystallized after 2 h. No significant structural improvement is detected for longer annealing times. On the 125 nm samples the crystalline volume fraction after 1 h is only around 7%, requiring 5 h to get a similar crystalline fraction than the one achieved with the thinner film. This means that the time required for full crystallization will be strongly determined by the Si layer thickness. Using a new fitting approach the Ni content within the films was also determined by SE and related to the silicon film thickness.     

Characteristics of ITO films fabricated on glass substrates by high intensity pulsed ion beam method

Transparent conductive oxides such as indium tin oxide (ITO) are interesting materials due to their wide-band gaps, high visible light transmittance, high infrared reflectance, high electrical conductivity, hardness and chemical inertness. ITO films were fabricated on soda lime glass substrates by using high-intensity pulsed ion beam (HIPIB) technique. The as-deposited films comprised of partially crystallized In₂O₃ and after annealing at 500 °C for 1 h the film changed to polycrystalline phase. After annealing carrier concentration and Hall mobility increased while specific resistance and sheet resistance decreased quickly; and this trend was also observed when film thickness increased up to 300 nm for the post-annealed samples. Further increase in thickness of the film changed the electrical properties slightly. Atomic force microscopy (AFM) revealed that roughness decreased after 500 °C annealing for 1 h in air, except for the film of 65 nm thick. The thickness of the film which relates to the carrier concentration and mobility, degree of crystallization, size of the grain, and connections among grains in film are main factors to determine film’s electrical properties.     

Comparative study of electroluminescence from annealed amorphous SiC single layer and amorphous Si/SiC multilayers

Si quantum dots (Si QDs) films were prepared by annealing amorphous SiC single layer and amorphous Si/SiC multilayers fabricated in plasma enhanced chemical vapor deposition system. The microstructures were characterized by Raman spectroscopy as well as Fourier transforms infrared spectroscopy for both samples. It was found that Si QDs with average size of 2.7 nm were formed after annealing and the electroluminescence (EL) band centered at 650 nm can be observed at room temperature. The EL intensity from the Si/SiC multilayers was obviously improved by one order of magnitude and the corresponding EL band width was reduced compared with that from SiC single layer film. The improved electroluminescence behavior can be attributed to the formation of the denser Si QDs, good size distribution and the strong confinement effect of carriers in multilayerd structures.     

Spatially localized current-induced crystallization of amorphous silicon films

Field-enhanced metal-induced solid phase crystallization (FE-MISPC) at room temperature is employed to create microscopic crystalline regions at predefined positions in hydrogen-rich amorphous silicon (a-Si:H) films. Electric field is applied locally using a sharp conductive tip in atomic force microscope (AFM) and nickel electrode below the a-Si:H film. The process is driven by a constant current of ?50 pA to ?500 pA while controlling the amount of transferred energy (1–300 nJ) as a function of time. Passing current leads to a formation of nanoscale pits in the a-Si:H films. Depending on the energy amount and rate the pits exhibit lower or orders of magnitude higher conductivity as detected by current-sensing AFM. High conductivity is attributed to a local crystallization of the films. This is confirmed by micro-Raman spectroscopy.     

InOx semiconductor films deposited on glass substrates for transparent electronics

Transparent undoped semiconductor indium oxide films were deposited by radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) of indium at low substrate temperature. It was experimentally verified that the variation of rf power density has a strong influence on the electrical and structural properties of the films. The thickness of the InO_x films is of about 100 nm. Results show that InO_x films show an average visible transmittance of about 85% and energy gap of about 2.6 eV. Structural and electrical conductivity measurements show that films are polycrystalline and there exists a linear variation of conductivity logarithm vs reciprocal of temperature. Electrical conductivity variation of 17.6 to 5.8 × 10⁻³ (Ω cm)⁻¹ for films produced at rf power densities ranging from 3.9 to 78.1 mW cm⁻³ was obtained. This controllable semiconductor behavior can therefore satisfy the requirement of a particular application for these type of films.     

Structure and optical properties of light-emitting Si films fabricated by neutral cluster deposition and subsequent high-temperature annealing

As a new development of our previous study on the production of light-emitting amorphous Si (a-Si) films by the neutral cluster deposition (NCD) method, we have fabricated light-emitting Si films with improved emission intensity by the combined methods of NCD and subsequent high-temperature annealing. The structure of these films is best characterized by Si nanocrystals, surrounded by an interfacial a-SiO_x (x < 2) layer, embedded in an a-SiO₂ film. These improved Si films were observed by atomic force microscopy and high-resolution transmission electron microscopy, and analyzed by means of X-ray diffraction, X-ray photoelectron spectroscopy, photoluminescence (PL) and Fourier transform infrared-attenuated total reflection measurements. The PL curves of the annealed samples exhibit peaks around 600 nm, at almost the same position as the unannealed samples. Their PL intensities, however, have increased to approximately five times those of the unannealed samples. The source of the luminescence is most likely due to electron-hole recombination in the a-SiO₂/Si interfacial a-SiO_x layer.     

Characterization of chromium silicide thin layer formed on amorphous silicon films

A detailed investigation of the compositional, optical and electrical properties of a chromium silicide layer grown at room temperature on top of doped amorphous silicon films is presented. The formation of the layer is promoted only when phosphorous atoms are present in the film. The deposition of a very thin n-type doped layer (around 5 nm) on top of a p-type doped film has allowed us to achieve the chromium silicide formation also on p-type material without changing its doping properties. Angle resolved X-ray photoelectron spectroscopy measurements demonstrate the presence of chromium-oxide, chromium silicide and metallic chromium in similar percentages for both p- and n-type doped layers. From the ellipsometric analysis, the refractive index spectra have been extracted, and the layer thickness has been estimated to be 5 nm for both p- and n-type doped layers. From planar conductivity measurements, we have found that the chromium silicide promotes an activation energy reduction from 0.24 eV down to 0.017 eV for the n-type layer and from 0.36 eV down to 0.14 eV for the p-type film.     

Incipient amorphous-to-crystalline transition in HfO2 as a function of thickness scaling and anneal temperature

A series of 1.4, 1.8, and 4.0 nm thick HfO₂ films deposited on Si(1 0 0) substrates have been measured by extended X-ray absorption fine-structure prior to anneal processing, following a standard post deposition anneal of 700 °C for 60 s in NH₃ ambient, and following an additional rapid thermal anneal cycle of 1000 °C for 10 s in N₂ ambient. Analysis of the second coordination shell gives clear evidence of increased ordering with increasing film thickness at each temperature. Similarly, increased ordering with increasing anneal temperature is evident for each film thickness. Although X-ray diffraction and high resolution transmission electron microscopy indicated the 1.4 nm HfO₂ samples to be amorphous, EXAFS has distinguished nanocrystalline from amorphous states for these films.     

Influence of annealing temperature and Au concentration on the electrical properties of multilayered a-Ge/Au films

Multilayered a-Ge/Au was investigated to realize low-temperature formation of poly-Ge films on insulator. Increasing Au layer thicknesses, peak intensity of crystalline Ge–Ge TO mode increased and amorphous Ge–Ge TO mode decreased. When Au composition ratio is high, the samples are crystallized under eutectic temperature. Annealing temperature at 673 K, all samples with Au layer are crystallized. Crystalline Ge has no strain evaluated by X-ray diffraction and Raman scattering spectroscopy. However, the Au is compressed or expanded in the films with various annealing temperature. It is thought that this phenomenon changes depending on the size of the space in the film. The behavior of electrical resistivity is changed at eutectic temperature.     

Ultra-thin polycrystalline Si layers on glass prepared by aluminum-induced layer exchange

In this work, we present studies of ultra-thin polycrystalline silicon layers (5–100 nm) prepared by the aluminum-induced layer exchange process. Here, a substrate/Al/oxide/amorphous Si layer stack is annealed at temperatures below the eutectic temperature of the Al/Si system of 577 °C, leading to a layer exchange and the crystallization of the amorphous Si. We have studied the process dynamics and grain growth, as well as structural properties of the obtained polycrystalline Si thin films. Furthermore, we derive a theoretical estimate of the grain density and examine characteristic thermal activation energies of the process. The structural properties have been investigated by Raman spectroscopy. A good crystalline quality down to a layer thickness of 10 nm has been observed.     

Comparison of growth methods for Si/SiO2 nanostructures as nanodot hetero-emitters for photovoltaic applications

Two different growth mechanisms are compared for the fabrication of Si/SiO₂ nanostructures on crystalline silicon (c-Si) to be used as hetero-emitter in high-efficiency solar cells: (1) The decomposition of substoichiometric amorphous SiO_x (a-SiO_x) films with 0 < x < 1.3 and (2) the dewetting of thin amorphous silicon (a-Si) layers.The grown layers are investigated with regard to their structural properties, their passivation quality for c-Si wafer substrates and their electrical properties in order to evaluate their suitability as a nanodot hetero-emitter. While by layer decomposition, no passivating nanodots could be formed, the dewetting process allows fabricating nanodot passivation layers at temperatures as low as 600 °C. The series resistance through Ag/[Si-nanodots in SiO₂]/c-Si/Al structures for dewetting is similar to nanostructured silicon rich SiO_x films. Still, a nanodot hetero-emitter which exhibits both a satisfying passivation of the substrate and induces a high band bending by doping at the same time could not be fabricated yet.     

Structural study of undoped and (Mn, In)-doped SnO2 thin films grown by RF sputtering

Undoped and 5%(Mn, In)-doped SnO₂ thin films were deposited on Si(1 0 0) and Al₂O₃ (R-cut) by RF magnetron sputtering at different deposition power, sputtering gas mixture and substrate temperature. X-ray reflectivity was used to determine the films thickness (10–130 nm) and roughness (～1 nm). The combination of X-ray diffraction and Mössbauer techniques evidenced the presence of Sn⁴⁺ in an amorphous environment, for as-grown films obtained at low power and temperature, and the formation of crystalline SnO₂ for annealed films. As the deposition power, substrate temperature or O₂ proportion are increased, SnO₂ nanocrystals are formed. Epitaxial SnO₂ films are obtained on Al₂O₃ at 550 °C. The amorphous films are quite uniform but a more columnar growth is detected for increasing deposition power. No secondary phases or segregation of dopants were detected.     

Enhanced luminescence from Si quantum dots/SiO2 multilayers by hydrogen annealing

Si quantum dots/SiO₂ multilayers were prepared by annealing a-Si:H/SiO₂ stacked structures at 1100 °C . Photo- and electro-luminescence band around 750 nm can be observed from Si QDs/SiO₂ multilayers due to the recombination of electron-hole pairs in Si QDs/SiO₂ interfaces. The electro-luminescence intensity was obviously enhanced after post hydrogen annealing at 400 °C. Electron spin resonance measurements were used to characterize the change of the defect states after hydrogen annealing. It is found that there exists a-centers (g value = 2.006), which is related to the Si dangling bonds in Si QDs in our samples. Hydrogen annealing can significantly reduce non-luminescent a-centers and enhance the electro-luminescence intensity consequently.     

Nonlinear optical studies of lead lanthanum borate glass doped with Au nanoparticles

Synthesis, characterization and optical nonlinearity of lead lanthanum borate glass embedded with gold nanoparticles have been investigated. DSC thermogram shows characteristics glass transition temperature at T_g = 775 K. Glasses doped with Au were subjected to heat treatment at 823 K with different annealing time and then, slowly cooled to room temperature show striking ruby color. SAED and TEM analyses have confirmed that f.c.c. Au nanoparticles of ~ 40 nm size are present in these glasses. An absorption peak centered on 563 nm has been observed in heat treated samples, which is attributed to surface plasmon resonance of gold nanoparticles. Nonlinear optical studies with open aperture Z-Scan technique show saturable absorption for heat treated samples at low intensity and reverse saturable absorption in samples without heat treatment at high intensity.     

Voids in hydrogenated amorphous silicon materials

Effusion measurements of hydrogen and of implanted helium are used to characterize the presence of voids in hydrogenated amorphous silicon (a-Si:H) materials as a function of substrate temperature, hydrogen content, etc. For undoped plasma-grown a-Si:H, interconnected voids are found to prevail at hydrogen concentrations exceeding 15–20 at.%, while isolated voids which act as helium traps appear at hydrogen concentrations ≤ 15 at.%. The concentration of such isolated voids is estimated to some 10¹⁸/cm³ for device-grade undoped a-Si:H deposited at a substrate temperature near 200 °C. Higher values are found for, e.g., doped material, hot wire grown a-Si:H and hydrogen-implanted crystalline Si. The results do not support recent suggestions of predominant incorporation of hydrogen in a-Si:H in (crystalline silicon type) divacancies, since such models predict a concentration of voids (which act as helium traps) in the range of 10²¹/cm³ and a correlation between void and hydrogen concentrations which is not observed.     

MOCVD and characterization of Hf-silicate thin films using HTB and TEMAS

Hafnium silicate (HfSi_xO_y) films were deposited by metal-organic chemical vapor deposition (MOCVD) using a combination of precursors: hafnium tetra-tert-butoxide [Hf(OC(CH₃)₃)₄, HTB] and tetrakis-ethylmethylamino silane [Si(N(C₂H₅)(CH₃))₄, TEMAS]. The activation energy was independent on the ratio of precursor amounts in the surface reaction regime. The grown films showed Hf-rich characteristics and the impurity concentrations were less than 1 at.% (below detection limits). Hafnium silicate films were amorphous up to 700 °C annealing. Hf/(Hf + Si) composition ratio and dielectric constant (k) of the Hf-silicate films decreased by increasing the growth temperature above 270 °C.     

Novel properties of glass–metal nanocomposites

Nanoparticles of silver and copper were grown at the glass–crystal interfaces within a silicate glass by reducing the ion-exchanged glass–ceramic concerned. By controlling the reduction treatment a wide range of surface resistivity e.g., from 0.2 to 10¹⁰ Ω/sq. could be generated. Silver nanowires of diameter ∼40 nm were grown within the pores of a silica gel. They exhibited single electron tunneling as evidenced by conductance maxima at definite intervals of the applied voltage. Silver nanowires of diameter 0.5 nm were grown within the crystal channels of fluorophlogopite mica which were first precipitated in a silicate glass. The nanowires when broken gave giant dielectric permittivity (∼10⁷) to the composite. Copper core–copper oxide shell and iron core–iron oxide shell nanostructures respectively were generated within a silica gel. The core–shell structure exhibited electrical conductivity several orders of magnitude higher than that of the precursor gel. An interfacial amorphous phase contributed to this increase in electrical conductivity. Glass–ceramics containing BaTiO₃ and nanoparticles of silver showed a five order of magnitude decrease in electrical resistance as the relative humidity was changed from 25% to 75%. Arrays of metal nanoparticles (silver or copper) grown within a silicate glass exhibited a diode-like behavior. This was explained as arising due to formation of metal–semiconductor nanojunctions – metal particles smaller than 3 nm behaving like a semiconductor. The examples reviewed here show that exploiting the void spaces available in an oxide glass nanophases of a wide variety could be grown within and novel properties generated. This approach could be promising in imparting new functionality to conventional glasses.     

Effect of annealing temperature on the optical and electrical properties of aluminum doped ZnO films

Aluminum doped ZnO thin films were successfully deposited on the silicon substrates by spin coating method. The effects of an annealing temperature on electrical and optical properties were investigated for 1.5 at.% of aluminum. Refractive index profile has been obtained for the film annealed at 350 °C using ellipsometry and it has shown minimum refractive index of 1.95 and maximum value of 2.1. Thickness profile shows quite good uniformity of the film having minimum thickness value of 30.1 nm and maximum value of 34.5 nm. Maximum conductivity value obtained was 4.63 Ω^?1-cm^?1 for the film annealed at 350 °C. Maximum carrier density of 2.20 × 10¹⁷ cm^?3 was deduced from the Hall measurement and Fourier transform infrared spectroscopy clearly reveals major peak at 407 cm^?1 in the spectra associated with the ZnO bond.