Partially bio‐based aromatic polyimides derived from 2,5‐furandicarboxylic acid with high thermal and mechanical properties

Two novel bio‐based diamines are synthesized through introduction of renewable 2,5‐furandicarboxylic acid (2,5‐FDCA), and the corresponding aromatic polyimides (PIs) are then prepared by these diamines with commercially available aromatic dianhydrides via two‐step polycondensation. The partially bio‐based PIs possess high glass transition temperatures (T_gs) in the range from 266 to 364 °C, high thermal stability of 5% weight loss temperatures (T_5%s) over 420 °C in nitrogen and outstanding mechanical properties with tensile strengths of 79–138 MPa, tensile moduli of 2.5–5.4 GPa, and elongations at break of 3.0–12.3%. Some colorless PI films (PI‐1‐b and PI‐1‐c) with the transmittances at 450 nm over 85% are prepared. The overall properties of 2,5‐FDCA‐based PIs are comparable with petroleum‐based PI derived from isophthalic acid, displaying the potential for development of innovative bio‐based materials. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 1058–1066     

High solubility,low‐dielectric constant,and optical transparency of novel polyimides derived from 3,3′,5,5′‐tetramethyl‐4,4′‐diaminodiphenyl‐4″‐isopropyltoluene

A series of novel polyimides (PIs) ( 3a–d ) were prepared from 3,3′,5,5′‐tetramethyl‐4,4′‐diaminodiphenyl‐4 ″ ‐isopropyltoluene ( 1 ) with four aromatic dianhydrides via a one‐step high temperature polycondensation procedure. The obtained PIs showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents and chlorinated solvents. Their films were nearly colorless and exhibited high‐optical transparency, with the UV cutoff wavelength in the range of 328–353 nm and the transparency at 450 nm >80%. They also showed low‐dielectric constant (2.49–2.94 at 1 MHz) and low‐water absorptions (0.44–0.65%). Moreover, these PIs possessed high‐glass transition temperatures (T_g) beyond 327 °C and excellent thermal stability with 10% weight loss temperatures in the range of 530–555 °C in nitrogen atmosphere. In comparison with some fluorinated poly(ether imide)s derived from the trifluoromethyl‐substituted bis(ether amine)s, the resultant PIs 3a–d showed better solubility, lower cutoff wavelength, and higher T_g. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3309–3317, 2009     

Approaches to improve the film ductility of colorless cycloaliphatic polyimides

This study described approaches for improving the film ductility of colorless cycloaliphatic polyimides (PIs). An unexpected toughening effect was observed when a PI derived from pyromellitic dianhydride (PMDA) and 4,4′‐methylenebis(cyclohexylamine) was modified by copolymerization with a low isophoronediamine (IPDA) content of 5 to 30 mol%, despite there being no film‐forming ability in the homo PMDA/IPDA system. For example, at an IPDA content of 20 mol%, the copolymer showed significantly improved film toughness (maximum elongation at break, ε_{b max} = 57%), excellent optical transparency (light transmittance at 400 nm, T₄₀₀ = 83.7%), and a high glass transition temperature (T_g = 317°C). This toughening effect can be interpreted on the basis of the concept of chain slippage. In this study, the PIs derived from bicyclo[2.2.2]octane‐2,3,5,6‐tetracarboxylic dianhydride (H‐BTA) with various diamines were also systematically investigated to evaluate the potential of H‐BTA‐derived systems. The combinations of H‐BTA with ether‐containing diamines led to highly tough PI films (ε_{b max} > 100%) with very high T_gs, strongly contrasting with the results of an earlier study. The observed excellent properties are related to the steric structure of H‐BTA. Our interest also extended to the solution processability. A copolyimide derived from H‐BTA with a sulfone‐containing diamine and an ether‐containing diamine achieved a very high optical transparency (T₄₀₀ = 86.8%), a very high T_g (313°C), and good ductility (ε_{b max} = 51%) while maintaining solution processability. Thus, these approaches enabled us to dramatically improve the ductility of cycloaliphatic PI films that have, to date, been considered brittle.     

Synthesis and characterization of high nitrile content polyimides as dielectric films for electrical energy storage

Three new isomeric diamines containing three, oxy‐linked benzonitriles (3BCN), one of which is asymmetric (meta, para, or m, p), are synthesized in a 3‐step sequence. Polycondensation of these diamines and four common dianhydrides (6FDA, OPDA, BTDA, and PMDA) in N,N‐dimethylacetamide via poly(amic acid) precursors and thermal curing at temperatures up to 300 °C lead to three series of tough, creasable polyimide (PI) films (tensile moduli = 1.63 ? 2.86 GPa). Among these PIs, two PMDA‐based PIs possess relatively high crystallinity and two OPDA‐based PIs, low crystallinity, whereas all 6FDA‐ and BTDA‐based PIs, and m,m‐3BCN‐OPDA‐PI are amorphous, readily soluble in common polar aprotic solvents. Thermally stable and having high T_g (216 ? 341 °C), these PIs lose 5% weight around 493–503 °C in air and 463–492 °C in nitrogen. Dielectric properties have been evaluated by broadband dielectric spectroscopy (BDS) and electric displacement‐electric‐field (D‐E) loop measurements. D‐E loop results show an increase in high temperature permittivity (at 190 °C/1 kHz) from 2.9 (for parent PI CP2 with no nitrile group) to as high as 4.9 for these PIs, while keeping their dielectric loss relatively low. Thus, an increase in dipole moment density by the presence of three neighboring CN per repeat unit can increase the overall permittivity, which could be further enhanced by sub‐T_g mobility of para‐phenylene linkages (BDS results). Published 2014. J. Polym. Sci., Part A: Polym. Chem. 2014 J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 422–436     

Synthesis and characterization of hyperbranched polyimides with good organosolubility and thermal properties based on a new triamine and conventional dianhydrides

A triamine monomer, 1,3,5‐tris(4‐aminophenoxy)benzene (TAPOB), was synthesized from phloroglucinol and 4‐chloronitrobenzene, and it was successfully polymerized into soluble hyperbranched polyimides (HB PIs) with commercially available dianhydrides: 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA), and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA). Different monomer addition methods and different monomer molar ratios resulted in HB PIs with amino or anhydride end groups. From ¹H NMR spectra, the degrees of branching of the amino‐terminated polymers were estimated to be 0.65, 0.62, and 0.67 for 6FDA–TAPOB, ODPA–TAPOB, and BTDA–TAPOB, respectively. All polymers showed good thermal properties with 10% weight‐loss temperatures (T₁₀'s) above 505 °C and glass‐transition temperatures (T_g's) of 208–282 °C for various dianhydrides. The anhydride‐terminated HB PIs showed lower T₁₀ and T_g values than their amino‐terminated counterparts. The chemical conversion of the terminal amino or anhydride groups of the 6FDA‐based polyimides into an aromatic imido structure improved their thermal stability, decreased their T_g, and improved their solubility. The HB PIs had moderate molecular weights with broad distributions. The 6FDA‐based HB PIs exhibited good solubility even in common low‐boiling‐point solvents such as chloroform, tetrahydrofuran, and acetone. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3804–3814, 2002     

Bio-based benzoxazine from renewable L-tyrosine: Synthesis,polymerization, and properties

Developing thermosets derived from renewable sources is of great importance. In this work, a fully bio-based benzoxazine monomer, 3,6-bis((3-(furan-2-ylmethyl)-3,4-dihydro-2H-benzo[e][1,3]oxazin-6-yl)methyl)piperazine-2,5-dione (TCDPF), is conveniently synthesized from L-tyrosine cyclic dipeptide (TCDP), furfurylamine and paraformaldehyde. The chemical structure of TCDPF is confirmed by nuclear magnetic resonance spectroscopy and Fourier transform infrared spectroscopy (FT-IR) techniques. The curing behavior of TCDPF is investigated by differential scanning calorimetry and in situ FT-IR techniques. After temperature-programmed curing, the thermomechanical property and thermal stability of the resulting TCDPF polymer (PTCDPF) are evaluated by dynamic mechanical analysis and thermogravimetric analysis techniques, respectively. It is found that PTCDPF have excellent comprehensive performance such as high glass transition temperature (T_g = 322 °C), high thermal degradation temperature (T_5% = 342 °C, T_10% = 395 °C in N₂ atmosphere), and high char yield (CY = 51.3% at 800 °C in N₂ atmosphere). The results demonstrate that L-tyrosine is a promising bio-based raw material for preparing high performance polybenzoxazines.     

Poly(silarylene–siloxane)polyimides from allyl‐terminated oligoimides and hydride‐functional silarylene–siloxanes via hydrosilylation polymerization

This research was focused on the design and execution of new synthetic routes to low‐temperature‐curable poly(silarylene–siloxane)polyimides. The synthesis of individual oligoimide and silarylene–siloxane blocks was followed by hydrosilylation polymerization to produce crosslinked copolymers. The silarylene–siloxane and polyimide blocks were structurally characterized by IR and ¹H NMR spectroscopy and size exclusion chromatography. The high‐temperature resistance of the copolymers was evaluated through the measurement of heat distortion temperatures (T_HD's) via thermomechanical analysis and by the determination of the weight loss at elevated temperatures via thermogravimetric analysis. Glass‐transition temperatures (T_g's) of the silarylene–siloxane segments were measured by differential scanning calorimetry. Hydrosilylation curing was conducted at 60 °C in the presence of chloroplatinic acid (H₂PtCl₆). The copolymers displayed both high‐temperature resistance and low‐temperature flexibility. We observed T_g of the silarylene–siloxane segment as low as ?77 °C and T_HD of the polyimide segment as high as 323 °C. The influence of various oligoimide molecular weights on the properties of copolymers containing the same silarylene–siloxane was examined. The effect of various silarylene–siloxane molecular weights on the properties of copolymers containing the same oligoimide was also examined. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4922–4932, 2005     

Syntheses and properties of organosoluble polyamides and polyimides based on the diamine 3,3‐bis[4‐(4‐aminophenoxy)‐3‐methylphenyl]phthalide derived from o‐cresolphthalein

Diamine 3,3‐bis[4‐(4‐aminophenoxy)‐3‐methylphenyl]phthalide (BAMP) was derived from the o‐cresolphthalein, and then it was polycondensated with various aromatic dicarboxylic acids and dianhydrides to synthesize polyamides (PAs) and polyimides (PIs), respectively. PAs have inherent viscosities of 0.78–2.24 dL/g. Most of the PAs are readily soluble in a variety of solvents such as DMF, DMAc, and NMP and afforded transparent and tough films from DMAc solutions. The cast films have tensile strengths of 75–113 MPa as well as initial moduli of 1.71–2.97 GPa. These PAs have glass transition temperatures (T_gs) in the range of 242–325°C, 10% weight loss temperatures occur up to 473°C, and char yields are between 57 and 64% at 800°C in nitrogen. PIs were first synthesized to form polyamic acids (PAAs) by a two‐stage procedure that included a ring‐opening reaction, followed by thermal or chemical conversion to polyimides. Inherent viscosities of PAAs are between 0.71 and 1.63 dL/g. Most of the PIs obtained through the chemical cyclodehydration procedure are soluble in NMP, o‐chlorophenol, m‐cresol, etc., and they have inherent viscosities of 0.58–1.32 dL/g. T_gs of these PIs are in the range of 270–305°C and show 10% weight loss temperatures up to 477°C. PIs obtained through the thermal cyclodehydration procedure have tensile strengths of 72–142 MPa, elongations at break of 8–19%, and initial moduli of 1.80–2.72 GPa. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 455–464, 1999     

Hydrolytic stability and high Tg of polyimides derived from the novel 4,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]‐diamantane dianhydride

This work reports the synthesis and characterization of diamantane‐based polyimides obtained from 4,9‐bis[4(3,4‐dicarboxyphenoxy)phenyl]diamantane dianhydride and various aromatic diamines. Interestingly, the diamantane‐based polyimides were very stable to hydrolysis. This novel polyimide exhibits a low dielectric constant (2.65–2.77), low moisture absorption (<0.67%), good solubility, high T_g and unusually high thermal stability. Dynamic mechanical analysis (DMA) reveals that the diamantane‐based polyimides have high T_g ranging from 281 to 379 °C. The high‐temperature β₁ subglass transition around 285 °C was observed in polyimide 6a derived from 2,2′‐bis(trifluoromethyl)benzidine. This class of novel diamantane‐based polyimide is very promising for electronic applications, because of its good mechanical properties, good thermal stability, low dielectric constant, excellent hydrolytic resistance, and low moisture absorption. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 1673–1684, 2009     

Effect of multiple H‐bonding on the properties of polyimides containing the rigid rod groups

To investigate the influence of hydrogen bonding on the properties of polyimides (PIs) containing rigid rod‐like groups, five symmetrical diamines containing benzimidazole, benzoxazole, and hydroxy group were synthesized, and then a series of PIs were prepared. Results showed that hydroxyl‐containing poly(benzoxazole imide)s possess higher glass transition temperature (T_g) and dimensional stabilities than their corresponding poly(benzoxazole imide)s. Moreover, the corresponding poly(benzimidazole imide)s presented the best performances, such as the highest T_g, the highest char yield and the highest dimensional stabilities. The influence of hydrogen bonding of benzimidazole on the properties of PIs was stronger than that of hydroxyl groups. Hydroxyl‐containing poly(benzoxazole imide)s were formed in crosslinking structures after heat treatment at 400 °C. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 570–581     

Heat-resistant polyimides with low CTE and water absorption through hydrogen bonding interactions

A novel diamine, 1H,1′H-(2,2′-bibenzimidazole)-5,5′-diamine (DPABZ), containing bisbenzimidazole unit was successfully synthesized, and used to prepare a series of copolyimides BPDA:(ODAm/DPABZn) by polycondensation with 4,4-diaminodiphenyl ether (ODA) and 4,4-biphthalic anhydride (BPDA). For comparison, a series of copolyimides BPDA:(ODAm/PABZn) based on another benzimidazole diamine 5-amino-2-(4-aminobenzene)-benzimidazole (PABZ) was also prepared. As a result, with the increase of PABZ or DPABZ content, the heat resistance (T_g and T_d) and mechanical properties (σ and E) of the resulting polyimide (PI) films increased, while the coefficient of thermal expansion (CTE) decreased. Overall, the DPABZ-based PIs showed higher T_g values and much lower CTE values than PABZ. As the content of PABZ increased, the water absorption of PABZ-based PIs increased obviously, but no significant change in DPABZ-based PIs. The intramolecular hydrogen bonding in DPABZ-based PIs caused by the diamine DPABZ was believed to be the reason for the aforementioned differences. The BPDA: DPABZ film with low-water adsorption of 2.1%, high-T_g value of 436°C and low-CTE value of 5.4 ppm/°C could be a promising new generation of flexible display substrates.     

Ultra-high Tg and ultra-low coefficient of thermal expansion polyimide films based on hydrogen bond interaction

To tolerate high processing temperature during the fabrication of low-temperature polycrystalline silicon thin-film transistors (LTPS–TFT) in flexible OLED devices, the polyimide (PI) films, which are used as substrate, should have ultra-high glass transition temperature (T_g > 450°C) and ultra-low coefficient of thermal expansion (CTE at 0–5 ppm K⁻¹). In this paper, two novel heterocyclic monomers, namely, N,N'-(xanthone-2,7-diyl)bis(4-aminobenzamide) (p-DAXBA) and N,N'-(xanthone-2,7-diyl)bis(3-aminobenzamide) (m-DAXBA), which contain a xanthone moiety, are prepared and polycondensed with pyromellitic dianhydride (PMDA), respectively. PI films (PIa and PIb) with intrinsic high T_g and low CTE are designed from the perspective of rigid conjugate xanthone structure and hydrogen bonding interaction. It is found that the PIa films prepared by p-DAXBA have better linear structure of molecular chains and show relatively higher T_g and lower CTE. The T_g of PIa-40 is greater than 450°C, and CTE can reach as low as 2.7 ppm K⁻¹, tensile strength of 179 MPa, modulus of 5.67 GPa, indicating potential application prospect as a flexible OLED substrate.     

Development and characterization of fully bio‐based polybenzoxazine‐silica hybrid composites for low‐k and flame‐retardant applications

In the present work, new classes of bio‐based polybenzoxazines were synthesized using eugenol as phenol source and furfurylamine and stearylamine as amine sources separately through solventless green synthetic process routes and were further reinforced with varying percentages (1, 3, 5, and 10 wt%) of silica (from rice husk) to attain hybrid composites. The molecular structure, cure behaviour, thermal stability, dielectric properties, and flame‐retardant behaviour of both benzoxazine monomers and benzoxazine composites were characterized using appropriate modern analytical techniques. The eugenol‐based benzoxazines synthesized using furfurylamine (FBz) and stearylamine (SBz) were cured at 223°C and 233°C, respectively. The differential scanning calorimetry (DSC) data reveal the glass transition temperatures (T_g) of FBz and SBz were 157°C and 132°C, respectively, and the maximum decomposition temperature (T_max) as obtained from thermogravimetric analysis (TGA), were found to be 464°C and 398°C for FBz and SBz, respectively. The dielectric constants for FBz and SBz obtained at 1 MHz were 3.28 and 3.62, respectively. Furthermore, varying weight percentages (1, 3, 5, and 10 wt%) of 3‐mercaptopropyltrimethoxysilane (3‐MPTMS) functionalized bio‐silica reinforced the composite materials as evidenced by their improved thermal stability and lower dielectric constant. Data obtained from thermal and dielectric studies suggested that these polybenzoxazines could be used in the form of adhesives, sealants, and composites for high performance inter‐layer low‐k dielectric applications in microelectronics.     

Thermal properties of poly(methyl methacrylate-co-butyl acrylate-co-acrylic acid) modified with divinyl benzene and vinyltrimethoxysilane

The effect of butyl acrylate (BA), divinyl benzene (DVB) and vinyltrimethoxysilane (TMVS) on the thermal properties of poly(methyl methacrylate-co-butyl acrylate-co-acrylic acid) was investigated. Glass transition temperature (T_g), melting temperature (T_m) and specific heat capacity of the copolymers were investigated using Differential Scanning Calorimetry. Thermal stability of the copolymers which is associated with the degradation temperature (T_d) was studied by Thermogravimetric Analysis. Polyacrylates with T_g ranges between -19°Cand 19°C were obtained. With the incorporation of >7 wt% of DVB, the T_g of the copolymer increases from about ?17°C to ?10°C even though they have not undergone UV irradiation. Gel content results prove that crosslinking has occurred in the copolymers. With increasing amount of TMVS from 0 wt% to 7 wt%, the T_m of the copolymers prepared at acidic pH is about 40-60°C higher than that at the alkaline pH. However, the addition of TMVS gives no significant effect to the T_g and T_d of the copolymer films. The thermal stability of the copolymer has improved with increasing amount of BA and DVB, with DVB being more effective. The highest T_d of 425°C with 8% of DVB has been obtained. Consequently, a polyacrylate copolymer with a T_g of about ?13°C, a T_m of 170 °C and a T_d of about 424°C has been successfully synthesized. Hence, the soft polyacrylate with its relatively high T_m and T_d could serve as a superb material especially to be applied in the areas that require high melting temperature and good thermal stability.     

Polyimides with low coefficient of thermal expansion derived from diamines containing benzimidazole and amide: Synthesis,properties, and the N-substitution effect

Three novel diamines, incorporating benzimidazole and amide moieties, namely 4-amino-N-(5-amino-benzimidazol-2-yl)-benzamide (6a), 4-amino-N-(5-amino-1- methyl-benzimidazol-2-yl)-benzamide (6b), and 4-amino-N-(5-amino-1-phenyl -benzimidazol-2-yl)-benzamide (6c), were designed and synthesized. A series of poly(benzimidazole-amide-imide) (PBIAI) films were prepared from the resulting diamines and 4,4-biphthalic dianhydride (BPDA). These flexible polyimides (PIs) showed high glass transition temperatures (T_g = 353–379°C), low coefficients of thermal expansion (CTE = 3.7–12.3 ppm K⁻¹) and good mechanical properties (σ = 152–207 MPa and E = 4.5–7.7 GPa), promising candidates for applications in flexible-display substrates. Furthermore, the data guided a feasible method to enhance T_g and reduce CTE by introducing benzimidazole and amide units into PI main chains, and the effect of different N-substituents on performance was revealed.     

Novel Non‐Coplanar and Tertbutyl‐Substituted Polyimides: Solubility,Optical, Thermal and Dielectric Properties

A novel aromatic diamine monomer bearing tertbutyl and 4‐tertbutylphenyl groups, 3,3′‐ditertbutyl‐4,4′‐diaminodiphenyl‐4′′‐tertbutylphenylmethane (TADBP), was prepared and characterized. A series of non‐coplanar polyimides (PIs) were synthesized via a conventional one‐step polycondensation from TADBP and various aromatic dianhydrides including pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (OPDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′‐(hexafluoroisopropylidene)dipthalic anhydride (6FDA). All PIs exhibit excellent solubility in common organic solvents such as N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), dimethyl sulfoxide (DMSO), chloroform (CHCl₃), tetrahydrofuran (THF), and so on. Furthermore, the obtained transparent, strong and flexible polyimide films present good thermal stability and outstanding optical properties. Their glass transition temperatures (T_gs) are in the range of 298 to 347°C, and 10% weight loss temperatures are in excess of 490°C with more than 53% char yield at 800°C in nitrogen. All the polyimides can be cast into transparent and flexible films with tensile strength of 80.5–101 MPa, elongation at break of 8.4%–10.5%, and Young's modulus of 2.3–2.8 GPa. Meanwhile, the PIs show the cutoff wavelengths of 302–356 nm, as well as low moisture absorption (0.30% –0.55%) and low dielectric constant (2.78–3.12 at 1 MHz).     

Improvement of thermoplasticity for s‐BPDA/PDA by copolymerization and blend with novel asymmetric BPDA‐based polyimides

Asymmetric biphenyl type polyimides (PI) derived from 2,3,3′,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA) and p‐phenylenediamine (PDA) or 4,4′‐oxydianiline (ODA) show higher T_gs, and much better thermoplasticity than the corresponding isomeric PIs from symmetric 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA). In addition, a‐BPDA‐derived PIs are completely amorphous owing to their bent chain structures and highly distorted conformations, whereas the PIs from s‐BPDA are semicrystalline. a‐BPDA‐derived PIs possessing these properties or the a‐BPDA monomer were used as a flexible blend component or a comonomer to improve the insufficient thermoplasticity of semirigid s‐BPDA/PDA homo polymer. The blends composed of s‐BPDA/PDA (80%) with a‐BPDA‐derived PIs (20%), as well as the s‐BPDA/PDA‐based copolymer containing 20% a‐BPDA, showed a certain extent of thermoplasticity above the T_gs without causing a decrease in T_g. In addition, these blends and copolymer provided comparatively low thermal expansion coefficient (ca. 18 ppm). The improved film properties for the blends are related to good blend miscibility. On the other hand, when s‐BPDA/ODA was used as a flexible matrix polymer instead of a‐BPDA‐derived PIs, the 80/20 blend film annealed at 400°C exhibited no prominent softening at the T_g. This result arises from annealing‐induced crystallization of the flexible s‐BPDA/ODA component. Thus, these results revealed that a‐BPDA‐derived PIs are promising candidates as matrix polymers for semirigid s‐BPDA/PDA for the present purpose. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2499–2511, 1999     

Synthesis and characterization of fluorinated benzoxazole polymers with high Tg and low dielectric constant

Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Efforts have focused on the synthesis and analysis of new polymers with the goals of high thermal stability [degradation temperature (T_d) > 400 °C, low glass‐transition temperature (T_g) > 350 °C], low water uptake (<1%), solubility in selected organic solvents, dielectric constant less than 2.5, and low thermal expansion coefficient. These stringent combined goals have been largely achieved with flexible aromatic benzoxazole polymers. Intramolecular hydrogen bonding between pendant hydroxyl groups and the double‐bond nitrogen of the benzoxazole has been exploited to increase the polymer T_g, whereas the incorporation of perfluoroisopropyl units effectively decreases the dielectric constant. Out‐of‐plane impedance measurements on films of materials in this family (38–134 μm thick) have resulted in typical dielectric values of 2.1–2.5 at 1 MHz, depending on copolymer ratios and functionalizations. Results have been correlated with optical waveguide measurements of films 4‐μm thick to determine film anisotropy and the high‐frequency dielectric constant, and have been corroborated by in‐plane interdigitated electrode dielectric measurements on samples 0.75 μm thick. Candidate materials exhibited extremely low water uptake (0.2%) even after submersion in boiling water for several days. Dynamic mechanical analysis of the polymers enabled the determination of the influence of intermolecular hydrogen bonding on the T_g and loss tangent magnitude. Finally, the coefficient of thermal expansion has been examined and correlated with copolymer constitution. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1991–2003, 2000     

Organosoluble and thermally stable polyimides derived from a new diamine containing bulky-flexible triaryl pyridine pendent group

A novel kind of aromatic diamine,N-(4-(4-(2,6-diphenyl pyridine-4-yl)phenoxy)phenyl)-3,5-diaminobezamide (DPDAB),was synthesized via aromatic nucleophilic substitution of 3,5-dinitrobenzoylchloride with 4-(4-(2,6- diphenylpyridine-4-yl)phenoxy)aniline(DPPA),followed by palladium-catalyzed hydrazine reduction.This monomer was used to prepare polyimides(PIs)based on reaction with several commerically avaiable tetracarboxylic dianhydrides such as pyromellatic dianhydride(PMDA),benzophenone tetracarboxylic acide dianhydride(BTDA)and bicycle[2.2.2]oct-7-enc- 2,3,5,6-tetracarboxylic dianhydride(BCDA).These PIs had inherent viscosity in the range of 0.34-0.76 dL/g and showed good solubility in various aprotic polar solvents.The glass-transition tempratures(T_gs)of the PIs were in the range of 184-302℃,and showed high thermal stability with 10%weight loss in the temperature range of 360-500℃under nitrogen atmosphere.     

Synthesis and properties of thermoplastic polyimides with ether and ketone moieties

A series of polyimides containing ether and ketone moieties were synthesized from 1,3‐bis(4‐fluorobenzoyl) benzene and several commercially available dianhydrides via a conventional two‐step polymerization. The inherent viscosities of Polyamide acids ranged from 0.46 to 0.73 dL/g. Thermal properties, mechanical properties, and thermalplasticity of the obtained polimide films were investigated by focusing on the chemical structures of their repeat units. These films were amorphous, flexible, and transparent. All films displayed low T_gs (184–225 °C) but also excellent thermal stability, the 5% weight loss temperature was up to 542 °C under nitrogen. The films showed outstanding mechanical properties with the modulus up to 3.0 GPa and the elongation at break in the range of 8–160%. The uniaxial stretching of PI‐a at high temperature was studied owing to its excellent flexibility. The PI‐a had an elongation at break up to 1600% at 245 °C and the uniaxially stretched film exhibited a much higher modulus (3.9 GPa) and strength (240 MPa) than undrawn film. The results indicated that PI‐a can potentially be used to prepare materials such as fiber, ultra‐thin film or ultra‐high modulus film. All the obtained films also demonstrated excellent thermoplasticity (drop of E′ at T_g > 10³) which made the polyimides more suitable for melt processing. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2878–2884, 2010