Optical and structural proprieties of nc-Si:H prepared by argon diluted silane PECVD

Using argon as a diluent of Silane, hydrogenated amorphous and nanorocrystalline silicon films Si:H were prepared by radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD). The deposition rate and crystallinity varying with the deposition pressure and rf power, were systematically studied. Structural analysis (Raman scattering spectroscopy and X-ray diffraction), combined with optical measurements spectroscopy were used to characterize the films. The argon dilution of silane for all samples studied was 95% by volume, and the substrate temperature was 200 °C. The deposition pressure was varied from 400 mTorr to 1400 mTorr and varying rf power from 50 to 250 W. The structural evolution studies, shows that beyond 200 W of rf power, an amorphous-nanocrystalline transition was observed, with an increase in crystalline fraction by increasing rf power and working pressure. The films were grown at high deposition rates. The deposition rates of the films near the amorphous-nanocrystalline phase transition region were found in the range 6–10 Å/s. A correlation between structural and optical properties has been found and discussed.     

Transparent thin film transistors based on indium oxide semiconductor

Indium oxide films were deposited by radio-frequency plasma enhanced reactive thermal evaporation (rf-PERTE). The combined use of rf power and oxygen pressure allowed the control of the crystallite size in the film, changing the optical and electrical properties. The films obtained have electrical resistivity ranging from 13.7 to 1.7 × 10⁷ Ω cm. Transparent TFTs made with those films as semiconducting and conducting layers, respectively, present threshold voltages near 2 V and on/off ratios of 10⁴.     

Preparation of indium tin oxide thin films without external heating for application in solar cells

Indium tin oxide (ITO) films were grown without external heating in an ambient of pure argon by RF-magnetron sputtering method. The influence of argon ambient pressure on the electro-optical properties of as-deposited ITO films was investigated. The morphology, structural and optical properties of ITO films were examined and characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), atomic force microscopy (AFM) and UV–VIS transmission spectroscopy. The deposited ITO films with a thickness of 300 nm show a high transparency between 80% and 90% in the visible spectrum and 14–120 Ω/□ sheet resistance under different conditions. The ITO films deposited in the optimum argon ambient pressure were used as transparent electrical contacts for thin film Cu(In,Ga)Se₂ (CIGS) solar cells. CIGS solar cells with efficiencies of the order of 7.0% were produced without antireflective films. The results have demonstrated that the developed ITO deposition technology has potential applications in thin film solar cells.     

Structural and optical properties of ZnO thin films deposited onto ITO/glass substrates

ZnO films were prepared by post deposition thermal oxidation in the ambient atmosphere of metallic Zn films (d = 100–170 nm) vacuum evaporated onto unheated indium tin oxide (ITO)-coated glass substrates. To study the effect of the substrate position during the Zn film deposition on the microstructure and optical properties (transmittance, reflectance and absorbance) of as obtained ZnO films, two set of Zn samples simultaneously deposited onto horizontally and obliquely arranged substrates were prepared. The as obtained ZnO films had a polycrystalline wurtzite structure, those obtained from normally deposited Zn films having a higher c-axis preferred orientation and a lower optical transmittance in the visible wavelength range. The optical band-gap was found to be of 3.14 eV for oxidized normally deposited virgin Zn films and of 3.16 eV for those obliquely deposited.     

Characteristics of ITO films fabricated on glass substrates by high intensity pulsed ion beam method

Transparent conductive oxides such as indium tin oxide (ITO) are interesting materials due to their wide-band gaps, high visible light transmittance, high infrared reflectance, high electrical conductivity, hardness and chemical inertness. ITO films were fabricated on soda lime glass substrates by using high-intensity pulsed ion beam (HIPIB) technique. The as-deposited films comprised of partially crystallized In₂O₃ and after annealing at 500 °C for 1 h the film changed to polycrystalline phase. After annealing carrier concentration and Hall mobility increased while specific resistance and sheet resistance decreased quickly; and this trend was also observed when film thickness increased up to 300 nm for the post-annealed samples. Further increase in thickness of the film changed the electrical properties slightly. Atomic force microscopy (AFM) revealed that roughness decreased after 500 °C annealing for 1 h in air, except for the film of 65 nm thick. The thickness of the film which relates to the carrier concentration and mobility, degree of crystallization, size of the grain, and connections among grains in film are main factors to determine film’s electrical properties.     

InOx semiconductor films deposited on glass substrates for transparent electronics

Transparent undoped semiconductor indium oxide films were deposited by radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) of indium at low substrate temperature. It was experimentally verified that the variation of rf power density has a strong influence on the electrical and structural properties of the films. The thickness of the InO_x films is of about 100 nm. Results show that InO_x films show an average visible transmittance of about 85% and energy gap of about 2.6 eV. Structural and electrical conductivity measurements show that films are polycrystalline and there exists a linear variation of conductivity logarithm vs reciprocal of temperature. Electrical conductivity variation of 17.6 to 5.8 × 10⁻³ (Ω cm)⁻¹ for films produced at rf power densities ranging from 3.9 to 78.1 mW cm⁻³ was obtained. This controllable semiconductor behavior can therefore satisfy the requirement of a particular application for these type of films.     

Fabrication and characterization of transparent conductive ZnO:Al thin films prepared by direct current magnetron sputtering with highly conductive ZnO(ZnAl2O4) ceramic target

Using a highly conductive ZnO(ZnAl₂O₄) ceramic target, c-axis-oriented transparent conductive ZnO:Al₂O₃ (ZAO) thin films were prepared on glass sheet substrates by direct current planar magnetron sputtering. The structural, electrical and optical properties of the films (deposited at different temperatures and annealed at 400°C in vacuum) were characterized with several techniques. The experimental results show that the electrical resistivity of films deposited at 320°C is 2.67×10⁻⁴ Ω cm and can be further reduced to as low as 1.5×10⁻⁴ Ω cm by annealing at 400°C for 2 h in a vacuum pressure of 10⁻⁵ Torr. ZAO thin films deposited at room temperature have flaky crystallites with an average grain size of ∼100 nm; however those deposited at 320°C have tetrahedron grains with an average grain size of ∼150 nm. By increasing the deposition temperature or the post-deposition vacuum annealing, the carrier concentration of ZAO thin films increases, and the absorption edge in the transmission spectra shifts toward the shorter wavelength side (blue shift).     

Investigations on Sn-doped Ni oxide thin films and their use as optical sensor devices

Tin-doped NiO thin films (5.0, 7.4, and 9.3 at.% Sn) have been prepared by thermal oxidation of vacuum deposited films of pure Ni and Sn elements on glass and silicon substrates. The prepared films were comprehensively characterised by X-ray fluorescence, X-ray diffraction, UV–VIS-NIR absorption spectroscopy, and electrical (ac and dc) measurements. Experimental data indicate that Sn⁴⁺ doping slightly stress the host NiO crystalline structure and change the optical and electrical properties. The electrical and optical behaviours of the Sn-doped NiO films show that they are wide-band semiconductors with band gap 3.69–3.76 eV and have insulating properties. The ac and dc electrical measurements show that it is possible to use Sn-doped NiO as an optical-sensitive oxide in metal-oxide-silicon configurations.     

Study of the morphological change of amorphous ITO films after temperature–humidity treatment

Amorphous indium tin oxide (ITO) thin films have been deposited on silicon and Corning 7059 glass substrates at room temperature (RT) and at 75 °C by direct-current magnetron sputtering method. After exposure of the two kinds of samples to the temperature–humidity (T–H) test, we find that there are two different types of circular structures are formed. RT ITO films are composed of granules, and 75 °C ITO films are composed of several different parts which have different Sn and In concentrations. Metallic ion concentration corrosion cells are used to explain the phenomena.     

Amorphous tungsten-doped In2O3 transparent conductive films deposited at room temperature from metallic target

Amorphous tungsten-doped In₂O₃ (IWO) films were deposited from a metallic target by dc magnetron sputtering at room temperature. Both oxygen partial pressure and sputtering power have significant effects on the electrical and optical properties of the films. The as-deposited IWO films with the optimum resistivity of 5.8 × 10^?4 Ω·cm and the average optical transmittance of 92.3% from 400 to 700 nm were obtained at a W content of 1 wt%. The average transmittance in the near infrared region (700–2500 nm) is 84.6–92.8% for amorphous IWO prepared under varied oxygen partial pressure. The mobility of the IWO films reaches its highest value of 30.3 cm² V^?1 s^?1 with the carrier concentration of 1.6 × 10²⁰ cm^?3, confirming their potential application as transparent conductive oxide films in various flexible devices.     

Growth of pure ZnO thin films prepared by chemical spray pyrolysis on silicon

Structural, morphological, optical and electrical properties of ZnO thin films prepared by chemical spray pyrolysis from zinc acetate (Zn(CH₃COO)₂ 2H₂O) aqueous solutions, on polished Si(1 0 0), and fused silica substrates for optical characterization, have been studied in terms of deposition time and substrate temperature. The growth of the films present three regimes depending on the substrate temperature, with increasing, constant and decreasing growth rates at lower, middle, and higher-temperature ranges, respectively. Growth rate higher than 15 nm min⁻¹ can be achieved at T_s=543 K. ZnO film morphological and electrical properties have been related to these growth regimes. The films have been characterized by X-ray diffraction, scanning electron microscopy and X-ray photoelectron spectroscopy.     

Evaluation of structural and mechanical properties of aluminum oxide thin films deposited by a sol–gel process: Comparison of microwave to conventional anneal

Thin films of Al₂O₃ have been deposited on polished silica glass substrates at room temperature by sol–gel dip coating technique followed by two different exposure methods. One set was annealed at different temperatures ranging from 200 °C to 800 °C for 10 h and a second set was exposed to microwave (2.45 MHz) radiation at different powers for 10 min. The lower temperature and shorter time with microwave irradiation might be ascribed to the activating and facilitating effect of microwaves on solid phase diffusion. Unlike other preparation methods, microwave heating is generally quite faster, and energy efficient. X-ray diffraction (XRD) and scanning electron microscopy (SEM), energy dispersive X-ray analysis techniques have been employed to characterize structural, morphological and elemental compositions of the films. Adhesion strength failure measurements on films performed by scratch test in progressive loading sequence have shown critical loads up to 25 N (partial perforation) for both annealed films and films exposed to microwave irradiation. Nanohardness indentation tests of the films exposed (800 W) to microwave have shown hardness of 8.3 GPa with elastic modulus of 120 GPa compared to the conventional annealed film (800°) of 4.5 GPa with elastic modulus of 90 GPa.     

Crystallization behavior of e-beam evaporated Ga5Ge15Te80 thin films

Ga₅Ge₁₅Te₈₀ thin films have been deposited by e-beam evaporation method. The chemical composition of the deposited films was identified using energy dispersive X-ray spectrometry. The electrical conductivity, σ of the deposited films during heating/cooling cycles was investigated in the temperatures 298–570 K. The conductivity curve showed two sudden upward trends during the first heating cycle. The first upward trend occurs in the temperature range 408–430 K and was attributed to the amorphous-to-crystalline phase transformation. While the second is in the temperature range 470–495 K, and can be attributed to the crystallization process. However, for second heating cycle the conductivity curve becomes reversible. The optical band gap of the as-deposited and annealed film at annealing temperature 423 K was determined from the recorded transmittance and reflectance spectra. The obtained results were confirmed throughout the X-ray and transmission electron microscope studies.     

Role of oxygen in structural properties of annealed CuAlO2 films

CuAlO₂ films were sputtered on quartz substrates at different oxygen partial pressures (OPP) and carried out the annealing at 900 °C for 5 h in N₂ ambient. The structural properties of these films have been studied in detail by X-ray diffraction, Raman spectroscopy, and atomic force microscopy. Annealed CuAlO₂ films are grown along the (0 0 1) preferential orientation. The film deposited at 20% OPP demonstrates the excellent crystalline behavior and the smallest electrical resistivity (41.8 Ω cm). At higher OPP, the crystalline behavior begins to degenerate up to the amorphous state at 60% OPP, and some micro-caves presented in the film surface become larger and deeper with the increase in OPP. We believe that the negative thermal expansion behavior associated with excess oxygen atoms is the primary responsibility for the change in structural properties.     

I–V Characteristics of tris(2,4-pentanedionato)manganese(III) thin films

Amorphous thin films of tris(acetylacetonate)manganese(III) were deposited on Si(P) substrates by thermal sublimation in vacuum. The deposited films were probed with X-ray fluorescence. Their electrical properties were studied as insulators for Al/Mn(acac)₃/Si(P) metal–insulator–semiconductor devices. Those devices were characterized by the measurement of the gate-voltage dependence of their capacitance, from which the relative permittivity (RP) and density of the charges in the insulator were determined. It was found that values of the RP of tris(acetylacetonate)manganese(III) films grown on Si(P) wafers were in the range of 30–40, which can be find applications in gate related technological uses. The dc-electrical conduction in the complex film was studied at room temperature and in temperature range of (293–325 K). It was found that the data of the as-deposited films follow the trap-charge-limited space-charge-limited conductivity (TCL-SCLC) mechanism, while the data of the annealed sample in vacuum of about 10⁻³ Pa at about 100 °C for 10 min obey the Richardson–Schottky (RS) mechanism. The parameters of both mechanisms were determined. It was concluded that the density of charged defects in the insulating film is critically determined the mechanism of the current-transfer.     

Influence of oxygen partial pressure on the properties of undoped InOx films deposited at room temperature by rf-PERTE

Transparent and conductive/semiconductive undoped indium oxide (InO_x) thin films were deposited at room temperature. The deposition technique used is the radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) of indium (In) in the presence of oxygen. The influence of oxygen partial pressure on the properties of these films is presented. The oxygen partial pressure varied between 3 × 10^?2 and 1.3 × 10^?1 Pa. Undoped InO_x films, 100 nm thick, deposited at the oxygen partial pressure of 6 × 10^?2 Pa show a conductive behaviour, exhibit an average visible transmittance of 81%, a band gap around 2.7 eV and an electrical conductivity of about 1100 (Ω cm)^?1. For oxygen pressures greater than 6 × 10^?2 Pa, semiconductive films are obtained, maintaining the visible transmittance. Films deposited at lower pressures are conductive but dark. From XPS data, films deposited at an oxygen partial pressure of 6 × 10^?2 Pa show the highest amount of oxygen in the film surface and the lowest ratio between oxygen in the oxide crystalline and amorphous phases.     

Effect of annealing temperature on the optical and electrical properties of aluminum doped ZnO films

Aluminum doped ZnO thin films were successfully deposited on the silicon substrates by spin coating method. The effects of an annealing temperature on electrical and optical properties were investigated for 1.5 at.% of aluminum. Refractive index profile has been obtained for the film annealed at 350 °C using ellipsometry and it has shown minimum refractive index of 1.95 and maximum value of 2.1. Thickness profile shows quite good uniformity of the film having minimum thickness value of 30.1 nm and maximum value of 34.5 nm. Maximum conductivity value obtained was 4.63 Ω^?1-cm^?1 for the film annealed at 350 °C. Maximum carrier density of 2.20 × 10¹⁷ cm^?3 was deduced from the Hall measurement and Fourier transform infrared spectroscopy clearly reveals major peak at 407 cm^?1 in the spectra associated with the ZnO bond.     

Plasma enhanced chemical vapor deposition of ZnO thin films

Zinc oxide thin films were deposited on silicon and corning-7059 glass substrates by plasma enhanced chemical vapor deposition at different substrate temperatures ranging from 36 to 400 °C and with different gas flow rates. Diethylzinc as the source precursor, H₂O as oxidizer and argon as carrier gas were used for the preparation of ZnO films. Structural and optical properties of these films were investigated using X-ray diffraction, reflection high energy electron diffraction, atomic force microscopy and photoluminescence. Highly oriented films with (0 0 2) preferred planes were obtained on silicon kept at 300 °C with 50 ml/min flow rate of diethylzinc without any post annealing. Reflection high energy electron diffraction pattern also showed the crystalline nature of these films. A textured surface with rms roughness ∼28 nm was observed by atomic force microscopy for the films deposited at 300 °C. A sharp peak at 380 nm in the PL spectra indicated the UV band-edge emission.     

Fabrication and ionic conductivity of amorphous Li–Al–Ti–P–O thin film

Li⁺ ion conducting Li–Al–Ti–P–O thin films were fabricated on ITO-glass substrates at various temperatures from 25 to 400 °C by RF magnetron sputtering method. When the substrate temperature is higher than 300 °C, severe destruction of ITO films were confirmed by XRD (X-ray diffraction) and the abrupt transformation of one semi-circle into two semi-circles on the impedance spectra. These as-deposited Li–Al–Ti–P–O solid state electrolyte thin films have an amorphous structure confirmed by XRD and a single semicircle on the impedance spectra. Good transmission higher than 80% in the visible light range of these electrolyte thin films can fulfill the demand of electro-chromic devices. Field emission scanning electron microscopy and atomic force microscopy showed the denser, smoother and more uniform film structure with the enhanced substrate temperature. Measurements of impedance spectra indicate that the gradual increased conductivity of these Li–Al–Ti–P–O thin films with the elevation of substrate temperature from room temperature to 300 °C is originated from the increase of the pre-exponential factor (σ₀). The largest Li-ion conductivity can come to 2.46 × 10^? 5 S cm^? 1. This inorganic solid lithium ion conductor film will have a potential application as an electrolyte layer in the field such as lithium batteries or all-solid-state EC devices.     

Undoped and arsenic-doped low temperature (∼165 °C) microcrystalline silicon for electronic devices process

Microcrystalline silicon films are deposited at 165 °C by plasma enhanced chemical vapor deposition (PECVD) from silane, highly diluted in hydrogen–argon mixtures. Ar addition during the deposition allows to increase the crystallinity from 24% to 58% for 20 nm thick films. The final crystallinity for 350 nm thick films reaches 72% with an increase in the grain size. A further increase, still 80%, is provided by substrate pre-treatment using hydrogen plasma before the deposition process. Arsenic doped μc-Si films, deposited on previous optimized (5 W power and 1.33 mbar pressure) undoped films without stopping the plasma between the deposition of both layers, show high electrical conductivity up to 20 S cm⁻¹.