A Well-Defined Cyclotriphosphazene-Based Epoxy Monomer and Its Application as A Novel Epoxy Resin: Synthesis,Curing Behaviors,and Flame Retardancy

Abstract

A novel cyclotriphosphazene-based epoxy monomer, hexa-[4-(glycidyloxycarbonyl) phenoxy]cyclotriphosphazene (HGCP), was synthesized via a four-step synthetic route, and fully characterized by ¹H, ¹³C, and ³¹P NMR spectroscopy, high-resolution mass spectrometry, and elemental analysis. Thermosetting systems based on HGCP with three curing agents, for example, 4,4′-diaminodiphenylsulfone (DDS), 4,4′-diaminodiphenylmethane (DDM), and dicyandiamide (DICY), were used for making a comparison of their thermal curing behaviors. The curing behaviors were measured by differential scanning calorimetry. Moreover, flame retardancy of HGCP thermosetting systems was estimated by Limiting Oxygen Index (LOI) and Vertical Burning Test (UL-94). The resulting HGCP thermosetting systems exhibited better flame retardancy than the common epoxy resins diglycidyl ether of bisphenol A (DGEBA) and the regular brominated bisphenol A epoxy resin (TBBA) cured by DDS, respectively. When HGCP was cured by DDS, its thermosetting system gave the most char residues, met the UL-94 V-0 classification, and had a limiting oxygen index value greater than 35.     

Syntheses,structure, reactivity,and thermal properties of new cyclic phosphine oxide epoxy resins cured by diamines

A new type of epoxy resin which contained cyclic phosphine oxide group in the main chain was synthesized. The structure of the new type of epoxy resin was confirmed by elemental analyses (EA), infrared spectroscopy (IR), and ¹H-NMR and ¹³C-NMR spectroscopies. In addition, compositions of the new synthesized cyclic phosphine oxide epoxy resin (EPCAO) with three curing agents, e.g., bis(3-aminophenyl)methylphosphine oxide (BAMP), 4,4′-diamino-diphenylmethane (DDM), and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardancy with that of Epon828 and DEN438. The reactivities were measured by differential scanning calorimetry (DSC). Through the evaluation of thermal gravimetric analysis (TGA), those polymers which were obtained through the curing reactions between the new epoxy resin and three curing agents (BAMP, DDM, DDS) also demonstrated excellent thermal properties as well as a high char yield. © 1996 John Wiley & Sons, Inc.     

A novel halogen‐free co‐curing agent with linear multi‐aromatic rigid structure as flame‐retardant modifier in epoxy resin

A novel halogen‐free 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO)‐containing co‐curing agent, 6,6′‐(1,4‐phenylenebis(((4‐(phenylamino)phenyl)amino)methylene))bis(dibenzo[c,e][1,2]oxaphosphinine 6‐oxide) (DPN) was synthesized via a simple 1‐pot or 2‐step procedure with yield of 86.2% and 70.8%, respectively. The molecular structures of 4,4′‐((1,4‐phenylenebis(methanylylidene))bis(azanylylidene))bis(N‐phenylaniline) (DPN intermediate) and DPN are characterized by FTIR, NMR, and MS. TGA tests show that the char yield of DPN/EP composites raises to 30.9% when the molar ratio of DPN to 4,4‐diaminodiphenyl methane(DDM) is 20:80. T_g values of DPN/EP composites tested by DSC and DMA are similar to neat epoxy resin (EP), which is due to the secondary amine in DPN that participates in the cross‐linking reaction of epoxy resin. The storage modulus in the rubber stage (E′‐190 °C) of flame‐retardant epoxy resin is close to that of neat EP, while their tanδ's are lower, which indicates the similarity of samples' cross‐linking density due to the participation of DPN in the cross‐linking reaction. The results show that when the molar ratio of DPN and DDM is 5:95, the epoxy has a higher T_g value and better mechanical properties than other samples. The introduction of DPN efficiently improves the flame‐retardant properties of epoxy resin with V‐0 rating of UL‐94 vertical burning test, non‐dripping, 41% of limit oxygen index (LOI) value, low peak heat release rate (PHRR), and total heat release (THR).     

Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin

Hexakis(4-hydroxyphenoxy)-cyclotriphosphazene (PN-OH) was synthesized through nucleophilic substitution of the chloride atoms of hexachlorocyclotriphosphazene and reduction of the aldehyde groups, and its chemical structure was characterized by elemental analysis, ¹H and ³¹P NMR, and Fourier transform infrared (FTIR) spectroscopy. A new phosphazene-based epoxy resin (PN-EP) was successfully synthesized through the reaction between diglycidyl ether of bisphenol-A (DGEBA) and PN-OH, and its chemical structure was confirmed by FTIR and gel permeation chromatography. Four PN-EP thermosets were obtained by curing with 4,4′-diaminodiphenylmethane (DDM), dicyandiamide (DICY), novolak and pyromellitic dianhydride (PMDA). The reactivity of PN-EP with the four curing agents presents an increase in the order of DDM, PMDA, novolak and DICY. An investigation on their thermal properties shows that the PN-EP thermosets achieve higher glass-transition and decomposition temperatures in comparison with the corresponding DGEBA ones while their char yields increase significantly. The PN-EP thermosets also exhibit excellent flame retardancy. The thermosets with novolak, DICY and PMDA achieve the LOI values above 30 and flammability rating of UL94 V-0, whereas the one with DDM reaches the V-1 rating. The nonflammable halogen-free epoxy resin synthesized in this study has potential applications in electric and electronic fields in consideration of the environment and human health.     

Synthesis and properties of a phosphorus-containing flame retardant epoxy resin based on bis-phenoxy (3-hydroxy) phenyl phosphine oxide

A reactive phosphorus-containing compound, bis-phenoxy (3-hydroxy) phenyl phosphine oxide (BPHPPO) was first successfully synthesized to produce the phosphorus-containing flame retardant epoxy resin (BPHPPO-EP). The chemical structures were characterized from FTIR, MS, NMR spectra and elemental analyses. Thermal degradation behaviors and flame retardant properties of the cured epoxy resins were investigated from the thermogravimetric analysis (TGA) and the limiting oxygen index (LOI) test using 4,4′-diaminodiphenylsulfone (DDS) as curing agent. The high char yields and the high limiting oxygen index values were found to certify the great flame retardancy of this phosphorus-containing epoxy resin.     

Flame retardant epoxy resins based on diglycidyloxymethylphenylsilane

Silicon‐containing epoxy resins were prepared from diglycidyloxymethylphenyl silane (DGMPS) and diglycidylether of bisphenol A (DGEBA) by crosslinking with 4,4′‐diaminodiphenylmethane (DDM). Several DGMPS/DGEBA molar ratios were used to obtain materials with different silicon contents. Their thermal, dynamomechanical, and flame‐retardant properties were evaluated and related to the silicon content. The weight loss rate of the silicon‐containing resins is lower than that of the silicon free resin. Char yields under nitrogen and air atmospheres increase with the silicon content. The LOI (limited oxygen index) values increased from 24 for a standard commercial resin to 36 for silicon‐containing resins, demonstrating improved flame retardancy. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5580–5587, 2006     

Immobilization of flame retardant onto silica nanoparticle surface and properties of epoxy resin filled with the flame retardant‐immobilized silica

To prepare silica nanoparticle having flame retardant activity, the immobilization of flame retardant onto hyperbranched poly(amidoamine) (PAMAM)‐grafted silica was investigated. Grafting of PAMAM onto a silica surface was achieved in a solvent‐free dry‐system using PAMAM dendrimer synthesis methodology. The immobilization of bromine flame retardant, poly(2,2′,6,6′‐tetrabromobisphenol‐A) diglycidyl ether (PTBBA), was successfully achieved by the reaction of terminal amino groups of PAMAM‐grafted silica (Silica‐PAMAM) with epoxy groups of PTBBA. The immobilization of PTBBA was confirmed by FTIR and thermal decomposition GC‐MS. The amount of PTBBA immobilized onto Silica‐PAMAM was determined to be 60 wt %. PTBBA‐immobilized Silica‐PAMAM (Silica‐PAMAM‐PTBBA) was dispersed uniformly in a epoxy resin, and the epoxy resin was cured in the presence of hexamethylenediamine. Flame retardant activity of the epoxy resin filled with Silica‐PAMAM‐PTBBA was estimated by limiting oxygen index (LOI). The LOI of epoxy resin filled with Silica‐PAMAM‐PTBBA was higher than that filled with untreated silica and free PTBBA. It was confirmed that the flame retardant activity of epoxy resin was improved by the addition of the Silica‐PAMAM‐PTBBA. The elimination of PTBBA from the epoxy resin filled with Silica‐PAMAM‐PTBBA into boiling water was hardly observed by immobilization of PTBBA onto silica surface. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 6145–6152, 2009     

Synthesis and characterization of aromatic cyclolinear phosphazene polyetherketones containing bis‐Spiro‐substituted cyclotriphosphazene unit

A novel monomer, 2,2‐bis‐(4′‐fluorobenzoylphenoxy)‐4,4,6,6‐bis[spiro‐(2′,2″‐dioxy‐1′, 1′‐biphenylyl)] cyclotriphosphazene, was synthesized and polymerized with 4,4′‐difluorobenzophenone as a comonomer and 4,4′‐isopropylidenediphenol or 4,4′‐(hexafluoroisopropylidene) diphenol in N,N‐dimethylacetamide at 162 °C for 4 h to give two series of aromatic cyclolinear phosphazene polyetherketones containing bis‐spiro‐substituted cyclotriphosphazene groups. The structure of the monomer was confirmed by ¹H, ¹³C, and ³¹P NMR. The effect of the incorporation of the bis‐spiro‐substituted cyclotriphosphazene group on the thermal properties of these polymers was investigated by DSC and thermogravimetric analysis. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2993–2997, 2001     

Synthesis of a novel phosphorus‐containing curing agent and its effects on the flame retardancy,thermal degradation and moisture resistance of epoxy resins

A novel phosphorus‐containing compound diphenyl‐(1, 2‐dicarboxylethyl)‐phosphine oxide defined as DPDCEPO was synthesized and used as a flame retardant curing agent for epoxy resins (EP). The chemical structure of the prepared DPDCEPO was well characterized by Fourier transform infrared spectroscopy, and ¹H, ¹³C and ³¹P nuclear magnetic resonance. The DPDCEPO was mixed with curing agent of phthalic anhydride (PA) with various weight ratios into epoxy resins to prepare flame retardant EP thermosets. The flame retardant properties, combustion behavior and thermal analysis of the EP thermosets were respectively investigated by limiting oxygen index (LOI), vertical burning tests (UL‐94), cone calorimeter measurement, dynamic mechanical thermal analysis and thermogravimetric analysis (TGA) tests. The surface morphologies and chemical compositions of the char residues for EP thermosets were respectively investigated by scanning electron microscopy and X‐ray photoelectron spectroscopy (XPS). The water resistant properties of the cured EP were evaluated by putting the samples into distilled water at 70°C for 168 hr. The results revealed that the EP/20 wt% DPDCEPO/80 wt% PA thermosets successfully passed UL‐94 V‐0 flammability rating and the LOI value was as high as 33.2%. The cone test results revealed that the incorporation of DPDCEPO effectively reduced the combustion parameters of the epoxy resin thermosets, such as heat release rate and total heat release. The dynamic mechanical thermal analysis test demonstrated that the glass transition temperature (Tg) decreased with the increase of DPDCEPO content. The TGA results indicated that the incorporation of DPDCEPO promoted the decomposition of epoxy resin matrix ahead of time and led to a higher char yield and thermal stability at high temperatures. The surface morphological structures and analysis of the XPS of the char residues of EP thermosets revealed that the introduction of DPDCEPO benefited the formation of a sufficient, compact and homogeneous char layer with rich flame retardant elements on the epoxy resin material surface during combustion. The mechanical properties and water resistance of the cured epoxy resins were also measured. After water resistance tests, the EP/20 wt% DPDCEPO/80 wt% PA thermosets retained excellent flame retardancy, and the moisture adsorption of the EP thermosets decreased with the increase of DPDCEPO content in EP thermosets because of the existence of the P–C bonds and the rigid aromatic hydrophobic structure in DPDCEPO. Copyright © 2015 John Wiley & Sons, Ltd.     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Thermally stable and flame‐retardant aromatic phosphate and cyclotriphosphazene‐containing polyurethanes: synthesis and properties

A novel flame retardant (4‐diphenylphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene (PPPZ) was prepared and characterized by FT‐IR, ³¹P‐NMR and ¹H‐NMR spectroscopy. Polyurethanes that contained aromatic phosphate groups attached to cyclotriphosphazene, with various phosphorus contents, were prepared from PPPZ, poly(propylene glycol), 1,4‐butanediol, and 2,4‐toluene diisocyanate by one‐step polymerization. The polymers prepared were characterized by FT‐IR, thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and oxygen index (LOI) measurements. The effect of the concentration of PPPZ on the thermal behavior of the polyurethane was studied. The results indicated that the glass transition temperature (T_g) of the polyurethane increased with the concentration of PPPZ. The PPPZ‐containing polyurethanes exhibited slightly higher temperatures of degradation and higher char yields than PPPZ‐free polyurethanes. Moreover, the LOI of the polyurethanes increased with increasing PPPZ content. Also studied was the possible mechanism of the flame retardancy. Copyright © 2005 John Wiley & Sons, Ltd.     

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. II. Generated morphologies

Epoxy–aromatic diamine formulations are simultaneously modified with two immiscible thermoplastics (TPs), poly(ether imide) (PEI) and polysulfone (PSF), in concentrations ranging from 5 to 15 wt %. The epoxy monomer is based on diglycidyl ether of bisphenol A and the aromatic diamines (ADs) are either 4,4′‐diaminodiphenylsulfone (DDS) or 4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline) (MCDEA). Using phase diagrams developed in Part I of this series, thermal cycles are selected to generate different morphologies. It is found that, whatever the AD employed, a particulate morphology is obtained when curing blends that are initially homogeneous. In the case of DDS‐cured blends, a unimodal particle size distribution of PSF and PEI dispersed in a continuous epoxy‐rich phase is observed. By contrast, the MCDEA‐cured blends show a bimodal particle size distribution for all PSF/PEI relations that are analyzed. A completely different morphology, characterized by a distribution of irregular TP‐rich domains dispersed in an epoxy‐rich phase (double phase morphology), is obtained when curing blends that are initially immiscible. An X‐ray analysis of the different phases makes it possible to determine their qualitative composition. The dynamic mechanical behavior of fully cured blends is also discussed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3964–3975, 2004     

含亚胺结构新型磷-氮协效阻燃化合物的合成及对环氧树脂的阻燃作用

采用醛胺缩合反应,以4-(5,5-二甲基-1,3-二氧杂环己内磷酰基)苯甲醛(PCHO)分别与对苯二胺、乙二胺反应合成两种磷酸酯-亚胺双官能化合物阻燃剂(FR:N¹,N⁴-二[4-(5,5-二甲基-1,3-二氧杂环己内磷酰氧基)苯基亚甲基]-1,4-苯二胺(PNB)和N¹,N²-二[4-(5,5-二甲基-1,3-二氧杂环己内磷酰氧基)苯基亚甲基]-1,2-乙二胺(PNE)),研究了FR对4,4'-二氨基二苯砜(DDS)固化双酚A二缩水甘油醚型环氧树脂(DGEBA)体系的阻燃作用及阻燃机理。 研究发现FR的引入显著提高了DGEBA/DDS在700 ℃时的残炭率(R_c),同时提升了材料的阻燃性能,其中以乙二胺合成的PNE阻燃性能显著优于以苯二胺合成的PNB。 当磷添加质量分数为1.5%时,PNE-1.5/DGEBA/DDS在N₂气下的R_c为35.1%,在空气下的R_c为14.4%,极限氧指数(LOI)为33.2%,并可达阻燃等级UL-94最高阻燃级别V-0级。 同时,PNE-1.5/DGEBA/DDS相较于DGEBA/DDS保持了弯曲强度和76%以上的冲击强度,机械性能显著优于PNB-1.5/DGEBA/DDS。 通过阻燃机理分析FR在DGEBA/DDS体系中具有凝聚相、气相及磷-氮协效共同作用的阻燃特点。 磷酸酯-亚胺双官能团化合物FR对环氧树脂体系具有良好的阻燃作用,其中PNE阻燃效率高、机械性能负面影响小,具有潜在应用价值。     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Thermal and flame retardant properties of epoxy resin cured by a novel phosphorus-containing 4,4′-bisphenol novolac curing agent

A novel flame retardant curing agent for epoxy resin (EP), i.e., a DOPO (9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide)-containing 4,4'-bisphenol novolac (BIP-DOPO) was synthesized and characterized by Fourier transform infrared (FTIR), ¹H NMR, ³¹P NMR spectroscopy, and gel permeation chromatography. The epoxy resin cured by BIP-DOPO itself or its mixture with a commonly used bisphenol A-formaldehyde novolac resin (NPEH720) was prepared. The flame retardancy of the cured EP thermosets were studied by limiting oxygen index (LOI), UL 94 and cone calorimeter test (CCT), and the thermal properties by thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results show that the cured epoxy resin EPNP/BI/3/1, which contains 2.2% phosphorus, possesses a value of 26.2% and achieves the UL 94 V-0 rating. The data from cone calorimeter test demonstrated that the peak release rate, average heat release rate, total heat release decline sharply for the flame retarded epoxy resins, compared with those of pure ones. DSC results show that the glass-transition temperatures of cured epoxy resins decrease with increasing phosphorus content. TGA indicates that the incorporation of BIP-DOPO promotes the decomposition of epoxy resin matrix ahead of time and leads to higher char yield. The surface morphological structures of the char residues reveal that the introduction of BIP-DOPO benefits to the formation of a continuous and solid char layer on the epoxy resin material surface during combustion.     

Synthesis and characterization of P/Si flame retardant and its application in epoxy systems

In this report, a novel phosphorus/silicon‐containing reactive flame retardant, hexa(3‐triglycidyloxysilylpropyl)triphosphazene (HGPP), was synthesized and characterized by Fourier transform infrared spectrometry and nuclear magnetic resonance spectra (¹H, ³¹P, and ²⁹Si), respectively. To prepare cured epoxy, HGPP had been co‐cured with diglycidyl ether of bisphenol‐A (DGEBA) via 4,4‐diaminodiphenylsulfone as a curing agent. The mechanical, thermal, and flame retardant properties of the cured epoxy were evaluated by dynamic mechanical analysis, thermogravimetric analysis, and limiting oxygen index (LOI). According to these results, it could be found that incorporation of HGPP in the cured epoxy system showed good thermal stability, high LOI values, and high char yield at high temperature. As moderate loading of HGPP in the epoxy system, its storage modulus and glass transition temperature were higher than those of neat DGEBA. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis of a new hyperbranched‐linear‐hyperbranched triblock copolymer and its use as a chemical modifier for the cationic photo and thermal curing of epoxy resins

A new hyperbranched‐linear‐hyperbranched polymer was prepared in a one pot process by reaction of 4,4‐bis(4‐hydroxyphenyl)valeric acid and poly(ethylene glycol) (HPH). After characterization by ¹H and ¹³C NMR, SEC, DSC, and TGA, this polymer was used, in proportions of 5, 10, and 15 phr, as a chemical modifier in the UV and thermal cationic curing of 3,4‐epoxycyclohexylmethyl‐3′,4′‐epoxycyclohexyl carboxylate epoxy resin. The curing process was studied by calorimetry, demonstrating the accelerating effect of the hydroxyl groups present in HPH's structure. The morphology of the resulting thermosets depended on the curing system used, as demonstrated by FE‐SEM microscopy, but in both cases phase separation occurred. Thermosets obtained by thermal curing presented lower thermal stability than UV‐cured materials. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Carbonyldiimidazole‐accelerated efficient cure of epoxidized soybean oil with dicyandiamide

This study investigates the curing of epoxidized soybean oil (ESO) using dicyandiamide (DICY) and combinations of DICY with several accelerators as curing agents. The differential scanning calorimetry (DSC) results indicated that carbonyldiimidazole (CDI) is a highly efficient accelerator for the ESO‐DICY curing system. CDI accelerated ESO‐DICY curing system can gel within a short period of 13 min at 190 °C. The activation energies of the ESO‐DICY curing systems with and without CDI are 95 and 121 kJ mol^?1, respectively. Similar acceleration effect was observed in the ESO‐diglycidyl ether of biphenyl A (DGEBA) blending formulations. When the molar part of the glycidyl epoxy groups of DGEBA was equal to the internal epoxy groups of ESO in the mixture, gelation of the DICY curing system accelerated by CDI was achieved in 3 min at 160 °C. Furthermore, the DSC results with FTIR analysis suggest that the stoichiometric curing molar ratio was 3 ESO epoxy units per 1 DICY molecule. Two epoxy units reacted with DICY to give secondary alcohols, while the other one linked to the nitrile group. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 375–382     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Synthesis and characterization of a novel liquid‐crystalline epoxy resin combining biphenyl and aromatic ester‐type mesogenic units

A novel liquid‐crystalline epoxy resin combining biphenyl and aromatic ester‐type mesogenic units, diglycidyl ether of 4,4′‐bis(4‐hydroxybenzoyloxy)‐3,3′,5,5′‐tetramethyl biphenyl, was synthesized. Its spectroscopic structure, thermal properties, and phase structures were investigated with NMR, differential scanning calorimetry (DSC), and polarized light microscopy (PLM), respectively. The curing agent, diaminodiphenylsulfone, was chosen to investigate the curing behavior by means of DSC and PLM during isothermal and nonisothermal processes. Only one exothermal peak appeared in the isothermal DSC curves. Birefringence was also observed during the curing processes and preserved after postcuring. Compared with short rigid‐rod and flexible epoxies, the cured liquid‐crystalline epoxy resin that was obtained displayed special thermal stability according to thermogravimetric analysis because of its long rigid‐rod mesogenic unit and bulky methyl groups. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 727–735, 2007