碳化硅邻晶面外延生长机制的动力学蒙特卡罗模拟

用动力学蒙特卡罗方法研究了3C-SiC(111)邻晶面的外延生长机制.生长温度、沉积速率和平台宽度对邻晶面外延生长模式有着重要的影响.模拟结果显示:在温度较低的情况下,晶体表面离散的分布着数量众多的晶核,其生长模式为二维岛核生长模式.当生长温度升高时,岛核主要分布于台阶边缘,晶体生长方式则转变为台阶推进与岛核成长共生的生长模式.其次,在沉积速率较低时,晶体主要生长方式为台阶推进模式,随着沉积速率增加,晶体生长模式则转变为二维岛核生长模式.最后,岛核密度随平台宽度的增加而增加,在较低温度下,平台宽度对岛核密度的影响更加明显.     

过剩压法合成金刚石的表面特征与体缺陷的形成原因分析

利用不同的高温高压条件在石墨-Ni70Mn25Co5体系中合成出金刚石晶体.借助于多功能光学显微镜的明场和暗场观察,分析了金刚石几种常见晶面的表面特征和内部缺陷.实验观察到一些有规律性的生长现象:当过剩压力太大时,较低的合成温度容易形成骸晶;当过剩压力适度时,较低的合成温度会使金刚石产生大量的包裹体并形成枝蔓状的粗糙表面,而较高的合成温度导致金刚石形成生长台阶;当压力有明显的波动时,金刚石晶体出现层状结构甚至间断生长.在此基础上,提出了合成优质金刚石的必要条件.     

快速生长KH2PO4晶体的缺陷和{100}生长表面形貌研究（英文）

利用原子力显微镜和光学显微镜观测了快速生长KH2PO4晶体的表面形貌。发现在较高生长温度下的{100}生长表面容易出现二维成核生长机制,在本文的实验条件下,{100}生长表面上的宏观台阶平均高度为2.34nm,而宏观台阶平台宽度的尺寸各不相同。在{100}生长表面上观察到了由杂质阻碍作用引起的台阶聚并和台阶弯曲,并讨论了杂质和生长台阶之间的相互作用机理。利用同步辐射白光形貌术分析了快速生长KDP晶体内部的位错缺陷。     

微波等离子体同质外延修复金刚石的研究

用微波等离子体化学气相沉积法同质外延生长了有缺陷的金刚石颗粒.在同质外延之前,研究了温度因素对金刚石生长表面形貌的影响,研究表明适宜金刚石同质外延的温度范围非常窄,在1030℃左右;温度低于920℃,大尺寸的金刚石单晶颗粒就很难得到,二次形核现象变的很严重.在实验得出的优化温度条件下,对表面有缺陷的天然金刚石进行了同质外延生长,用扫描电子显微镜(SEM)观察发现,原来金刚石表面的裂缝被修复,外延生长速率达到10.3μm/h.     

PVT法氮化铝晶体铝面、氮面生长对比分析

在氮气环境下用PVT方法生长氮化铝过程中,氮面和铝面由于表面化学性质不同,生长的主要化学反应速度存在差异。原子在生长表面的迁移能力不同造成单晶表面生长方式差异较大。在基本相同条件下(生长温度、生长温差、生长气压、类似的籽晶、同一台生长设备)进行了铝、氮面氮化铝单晶晶体生长。为了更明显地表现铝氮面的差异,将同一片籽晶分为两半,翻转其中一半让铝氮面同时生长。铝面生长较好的区域形成了明显的晶畴,而氮面生长时生长较好的部分出现了明显的生长台阶,并出现了晶畴边界被生长台阶湮灭的生长现象,进一步通过AFM观测到铝面生长台阶平整但被缺陷所阻隔,晶畴发育明显为各晶畴独立生长。氮面生长台阶没有铝面规则但连续性较强,在原来晶畴边界位置也出现了连续的生长台阶(或台阶簇)。所以籽晶质量不高时氮面生长更容易提高晶体质量,后续的XRD测量结果也证明了氮面生长后的晶体质量明显高于铝面生长的晶体质量。     

温度对SiO2表面上磁控溅射制备Ge纳米点的生长模式和尺寸的影响

采用磁控溅射技术在SiO2/Si(100)表面上制备了一系列不同生长温度的Ge纳米点样品.原子力显微镜(AFM)的实验结果表明:不同衬底温度下Ge纳米点在SiO2薄膜上的生长模式和尺寸分布有所不同.当衬底生长温度达到500 ℃时,SiO2开始与Ge原子发生化学反应,并形成"Ge纳米点的Si窗口".在此温度条件下,外延生长实验可获得尺寸均匀且密度高达3.2×1010 cm-2的Ge纳米点.     

基于正交实验的100 mm4°偏轴SiC衬底外延均匀性研究

采用行星热壁式SiC外延炉对100 mm 4°偏轴4H-SiC衬底外延工艺进行了研究.分析了氢气预刻蚀工艺对4°偏轴衬底外延材料表面形貌的影响.采用双指标正交实验,通过极差分析的方法研究了C/Si比、Cl/Si比、主氢流量、生长温度、三路气体比等工艺参数对SiC外延厚度和掺杂浓度均匀性指标影响的主次顺序,并给出了优化的外延参数.采用该工艺条件制得的无台阶聚集形貌的SiC外延片片内厚度均匀性和浓度均匀性分别是1.23;和3.32;.     

6H-SiC晶片的退火处理

本文在背景Ar气压力为8×104Pa、温度为1800～2000℃的条件下,对升华法生长SiC单晶的籽晶进行了原位退火处理,利用原子力显微镜和光学显微镜对退火后的6H-SiC晶片表面进行了观察,研究了退火温度和时间对晶片表面的影响.发现经过退火处理后的籽晶表面存在规则的生长台阶,有助于侧面生长模式的发展,进一步有助于台阶流生长模式的发展.通过对籽晶的退火处理,降低了螺旋生长中心的密度,从而减少多型夹杂、小角度晶界和微管等缺陷的出现,提高了晶体质量.     

晶体生长的台阶列运动的一个基本特点

本文介绍了用实时观察方法研究水溶液中晶体生长长机制的实验。通过对水溶液中ＣｄＩ２晶体的生长台阶运动的实时观察研究，首次提出了在过饱和度较小的条件下生长台阶列的间距和生长界面上环境相的过饱和度成反比的结论。本文还给出了在一定的限制条件下，台阶列运动的这一特点的理论推导。     

不同pH值下ZTS晶体(100)面台阶生长动力学规律和位错缺陷的研究

通过利用光学显微镜,对不同pH值下ZTS晶体(100)面的台阶推移过程进行了实时观察,发现在同一过饱和度下,调高生长溶液的pH值会导致台阶推移速率降低;而调低pH值时,台阶的平均推移速率增大,当pH =4.2时,(100)面生长速度最快.计算出不同pH值下的台阶动力学系数βl和台阶活化能E的数值.对不同pH值下生长出的ZTS晶体的(100)面进行了位错缺陷观察,发现pH =4.2时,位错密度较低,有利于晶体生长质量的提高.     

Effects of phosphorous beam equivalent pressure on GaInAsP/GaAs grown by solid source molecular beam epitaxy with a valve phosphorous cracker cell

We report the growth and characterization of GaInAsP films on GaAs substrates by solid source molecular beam epitaxy (SSMBE) using a valve phosphorous cracker cell at varied white phosphorous beam equivalent pressure (BEP). It is found that the GaInAsP/GaAs can be easily grown with the solid sources, and the incorporated phosphorous composition as a function of the beam equivalent pressure ratio, R=f_P/(f_P+f_As), can be well described by a parabolic relationship. With the increase of the incorporated phosphorous composition, the GaP-, InP-, InAs- and GaAs-like phonon modes shift towards opposite directions and their emission intensities also change. The first three modes shift to larger wave numbers while the last one shifts to smaller wave number. The lattice mismatch, Δa/a, of the materials grown with varied phosphorous BEP follows a linear relationship. Photoluminescence (PL) measurements reveal that as the phosphorous BEP ratio increases, the peak position or energy band gap of the material shifts towards higher energy; the full-width at half-maximum (FWHM) becomes narrower, and the luminescence intensity becomes higher. In addition, the materials also show smooth surfaces that do not change significantly with phosphorous beam equivalent pressure.     

固态源MBE系统生长高质量的调制掺杂GaAs结构材料和InP/InP外延材料的兼容性研究

通过固态源的分子束外延系统生长了调制掺杂AlGaAs/GaAs结构材料和InP/InP外延材料.在生长含磷材料之后,生长条件(真空状态)变差;我们通过采取合理的工艺方法和生长工艺条件的优化,获得了电子迁移率为1.86×105cm2/Vs(77K)调制掺杂AlGaAs/GaAs结构材料和电子迁移率为2.09×105cm2/Vs(77K)δ-Si掺杂AlGaAs/GaAs结构材料.InP/InP材料的电子迁移率为4.57×104 cm2/Vs(77K),该数值是目前国际报道最高迁移率值和最低的电子浓度的InP外延材料.成功地实现了在一个固态源分子束外延设备交替生长高质量的调制掺杂AlGaAs/GaAs结构材料和含磷材料.     

RHEED studies of the growth of Si(001) by gas source MBE from disilane

The growth of Si(001) from a gas source molecular beam epitaxy system (Si-GSMBE) using disilane (Si₂H₆) was investigated using reflection high-energy electron diffraction (RHEED). The surface reconstructions occurring between 100 and 775°C were studied as a function of both substrate temperature and surface coverage. We report the first observation of (2x2) and c(4x4) reconstructions during growth at substrate temperatures near 645°C using Si₂H₆. All growth was found to be initiated by the formation of three-dimensional (3D) islands which coalesced at substrate temperatures above 600°C. The surface reconstruction was found to change from a disordered to an ordered (2x1)+(1x2) structure at 775°C via intermediate (2x2) and c(4x4) phases. Thereafter, growth was found to proceed in a 2D layer-by-layer fashion, as evidenced by the observation of RHEED intensity oscillations. This technique has been used, for the first time, to calibrate growth rates during Si-GSMBE. The intensity oscillations were measured as a function of both substrate temperature and incident beam flux. Strong and damped oscillations were observed between 610 and 680°C, in the two-dimensional growth regime. At higher temperatures, growth by step propagation dominated while at lower temperatures, growth became increasingly three-dimensional and consequently oscillations were weak or absent. Similarly, there was a minimum flux limit ( <0.16 SCCM), below which no oscillations were recorded.     

Stress control by micropits density variation in strained AlGaN/GaN/SiN/AlN/Si(111) heterostructures

AlGaN/GaN heterostructures were deposited on Si utilizing in‐situ SiN masking layer as a mean to decrease stress present in the final heterostructures. Structures were grown under different V/III ratio using metalorganic vapour phase epitaxy (MOVPE). Additional approach was applied to obtain crack‐free heterostructures which was deposition of 15 nm low temperature AlN interlayer. Each of the heterostructure contained GaN layer of 2.4 μm total thickness. In‐situ SiN masking layer were obtained via introduction of SiH4 precursor into reactor under high temperature growth conditions for 100 s. In that manner, few monolayers of SixNx masking layer were deposited, which due to the partial coverage of AlN, played role of a mask leading to initial 3D growth mode enhancing longer coalescence of GaN buffer layer. To study surface morphology AFM images were observed. Three methods were used in order to obtain basal plane stress present in multilayer structures ‐ MicroRaman spectroscopy, XRD studies and optical profilometry. It was found that varying V/III precursors ratio during GaN layer growth characteristic for structures with the SiN mask approach formation of triangular micropits can be minimized. Outcomes for three different methods turned out to be coherent. It was found that certain amount of micropits on the surface can be advantageous lowering stress introduced during cooling after process to the AlGaN/GaN/SiN/AlN/Si(111) structure.     

Surface chemistry and transport effects in GaN hydride vapor phase epitaxy

A simple quasi-thermodynamic model of surface chemistry in GaN hydride vapor phase epitaxy (HVPE) is presented. The model is coupled with the detailed 3D simulations of species transport in a horizontal-tube reactor and validated by the comparison with the data on the GaN growth rate obtained by laser reflectometry. Parametric study of the growth rate as a function of temperature and species flow rates has been performed over a wide range of growth conditions. The important role of species transport in an HVPE reactor is demonstrated. In particular, a strong effect of the natural concentration convection resulting in the formation of recirculation zones and in a non-uniform vapor composition is revealed by modeling. The impact of these effects on the GaN growth rate and V/III ratio on the growth surface is discussed in detail.     

Low temperature GaAs grown by gas source molecular beam epitaxy

Low temperature growth of GaAs by gas source molecular beam epitaxy (GSMBE) is investigated. Reflection high energy electron diffraction is used to monitor the low temperature buffer (LTB) growth and anneal conditions. Growth at low temperatures with dimeric arsenic is more sensitive to the V/III flux ratios and substrate temperatures than with As₄ used in solid source MBE. Temperature dependent conductivity and deep level transient spectroscopy measurements are presented to observe trap outdiffusion from the LTB into subsequently grown FET channels. Low temperature photoluminescence spectra show degradation of quantum well properties when LTBs are grown with increasing V/III flux ratios.     

Effects of growth temperature and V/III ratio on surface structure and ordering in Ga0.5In0.5P

Surface photoabsorption (SPA) measurements were used to clarify the CuPt ordering mechanism in Ga_0.5In_0.5P layers grown by organometallic vapor phase epitaxy. The CuPt ordering is known to be strongly affected by the growth temperature and the input partial pressure of the phosphorus precursor, i.e. the V/III ratio. The SPA peak at 400 nm was found to be a measure of the concentration of [ 10]-oriented phosphorus dimers on the surface, which are characteristic of the (2 × 4) reconstruction. Both ordering, measured using the low temperature photoluminescence peak energy, and the SPA signal difference due to P dimers were studied versus the growth temperature and V/III ratio. The degree of order decreases markedly with increasing growth temperature above 620°C at a constant V/III ratio of 40. This corresponds directly to a decrease of the [ 10]-oriented P dimer concentration on the surface determined using SPA. Below 620°C, the degree of order decreases as the growth temperature decreases, even though the concentration of P dimers increases. The presence of an isotropic “excess P” phase observed in the SPA spectrum at 480 nm might be responsible for the decrease of CuPt ordering, although it has previously been attributed to the slow rearrangement of adatoms. The degree of order is found to decrease monotonically with decreasing V/III ratio in the range from 160 to 8 at 670°C and from 40 to 8 at 620°C. This also corresponds directly to the decrease of the P dimer concentration on the surface measured using SPA. At 620°C and a V/III ratio of 160, the degree of order decreased despite an increase of the P dimer concentration. This may also be due to the formation of the isotropic “excess P” phase on the surface. The direct correlation of the [ 10]-oriented P dimer concentration and the degree of order with changes in temperature ( ≥ 620°C) and V/III ratio (≤ 160 at 670°C and ≤ 40 at 620°C) suggests that, in this range of growth parameters, the (2 × 4) surface reconstruction is necessary to form the CuPt structure, in agreement with published theoretical studies.     

The kinetics of parasitic growth in GaAs MOVPE

Gallium arsenide (GaAs) deposition was carried out in a horizontal quartz reactor tube with trimethylgallium (TMGa) and arsine (AsH₃) as precursors, using a hydrogen (H₂) carrier gas. Temperatures were in the range 400–500 °C, where surface reactions limit deposition rate. Nucleation time and deposition rate were monitored using laser interferometry, optimum reflectance was gained by aligning a quartz wafer to back reflect the incident beam. The 980 nm infrared laser beam was sufficiently long in wavelength to be able to penetrate the wall deposit. Results showing the effect of temperature and V/III ratio on the nucleation time and deposition rate are presented, where with temperature the nucleation delay was observed to reduce and the growth rate to increase. The nucleation delay is consistent with a thermally activated surface nucleation for the parasitic GaAs. A theoretical growth rate model, based on a restricted set of reaction steps was used to compare with the experimental growth rates. Without any free parameters, the growth rates from theoretical calculation and experiment agreed within a factor of two and showed the same trends with V/III ratio and temperature. The non-linearity of the theoretical growth rates on an Arrhenius plot indicates that there is more than one dominant reaction step over the temperature range investigated. The range of experimental activation energies, calculated from Arrhenius plots, was 17.56–23.59 kJ mol⁻¹. A comparison of these activation energies and minimum deposition temperature with the literature indicates that the wall temperature measurement on an Aixtron reactor is over 100 °C higher than previously reported.     

CBE growth of InGaAsP/InP multiple quantum wells for optical modulator applications

The incorporation of group III and group V in the chemical beam epitaxy of InGaAsP/InP multiple quantum well structures has been studied in the temperature range of 470 to 550°C. Both Ga/In and P/As composition ratios are found to be strongly dependent on the growth temperature. The enhancement of phosphorus incorporation at high temperature is identified for the first time, which has a profound impact on the incorporation of group III, in particular the adsorption/pyrolysis of triethygallium. With accurate growth temperature control, high quality InGaAsP/InP superlattices with a large number of periods can be grown under continuous growth mode. Clear quantum confined Stark effect near 1.5 μm has been observed in a p-i-n test modulator structure.     

Growth and MBMS studies of reaction mechanisms for InxGa1−xAs CBE

The reaction mechanism involved in the growth of In_xGa_1−xAs lattice matched to InP by chemical beam epitaxy (CBE) was investigated using growth and modulated beam mass spectrometry studies. Emphasis was placed on elucidating how variations in substrate temperature, indium composition and arsenic overpressure influence growth kinetics and how sensitive changes in experimental conditions bring about deviations in the ideal stoichiometry (In_0.53Ga_0.47As) required for lattice matching to InP. Our observations indicate that the compositional variations in the InGaAs stoichiometry at high temperatures (> 485°C) arise because of the changes in the DEG decomposition: desorption branching ratio which is controlled by a temperature- and arsenic pressure-dependent surface population of indium atoms. The low temperature behaviour is governed by the availability of metal surface sites for triethylgallium decomposition which is increased by the presence of surface indium atoms.