Effect of grain boundary sliding on the toughness of ultrafine grain structure steel: A molecular dynamics simulation study

Molecular dynamics simulations are carried out to investigate the mechanisms of low-temperature impact toughness of the ultrafine grain structure steel. The simulation results suggest that the sliding of the {001}/{110} type and {110}/{111} type grain boundary can improve the impact toughness. Then, the mechanism of grain boundary sliding is studied and it is found that the motion of dislocations along the grain boundary is the underlying cause of the grain boundary sliding. Finally, the sliding of the grain boundary is analyzed from the standpoint of the energy. We conclude that the measures which can increase the quantity of the {001}/{110} type and {110}/{111} type grain boundary and elongate the free gliding distance of dislocations along these grain boundaries will improve the low-temperature impact toughness of the ultrafine grain structure steel.     

Asymmetrical twin boundaries and highly dense antiphase domains in BaNb0.3Ti0.7O3 thin films

Asymmetrical twin boundaries and highly dense antiphase domains were identified by means of transmission electron microscopy in a perovskite-based BaNb_0.3Ti_0.7O₃ thin film grown by laser molecular beam epitaxy on a SrTiO₃ (001) substrate. The microstructural characteristics of the BaNb_0.3Ti_0.7O₃ film were clarified in terms of lamellar {111} twins and antiphase domains, the domain boundaries of which are 1/2?110? stacking faults. It is proposed that the intersections of (111) twinning with the antiphase domain boundaries result in the asymmetrical twin boundaries.     

Low-energy sputtering events at free surfaces near anti-phase and grain boundaries in Ni3Al

Atomic recoil events on free surfaces orthogonal to two different anti-phase boundaries (APBs) and two grain boundaries (GBs) in Ni₃Al are simulated using molecular dynamics methods. The threshold energy for sputtering, E _sp, and adatom creation, E _ad, are determined as a function of recoil direction. The study is relevant to FEG STEM (a scanning transmission electron microscope fitted with a field emission gun) experiments on preferential Al sputtering and/or enhancement of the Ni–Al ratio near boundaries. Surfaces intersected by {110} and {111} APBs have minimum E _sp of 6.5?eV for an Al atom on the Ni–Al mixed (M) surface, which is close to the value of 6.0?eV for a perfect M surface. High values of E _sp of an Al atom generally occur at a large angle to the surface normal and depend strongly on the detailed atomic configuration of the surface. The mean E _sp, averaged over all recoil directions, reveals that APBs have a small effect on the threshold sputtering. However, the results for E _ad imply that an electron beam could create more Al adatoms on surfaces intersected by APBs than on those without. The equilibrium, minimum energy structures for a (001) surface intersected by either Σ5[001](210) or Σ25[001](340) symmetric tilt grain boundaries are computed. E _sp for surface Al atoms near these GBs increases monotonically with increasing recoil angle to the surface normal, with a minimum value, which is only about 1?eV different from that obtained for a perfect surface. Temperature up to 300?K has no effect on this result. It is concluded that the experimental observations of preferential sputtering are due to effects beyond those for E _sp studied here. Possible reasons for this are discussed.     

Special misorientations in localized deformation regions in Fe-3%Si alloy single crystals

Extended regions located at an angle of 20° to the rolling plane are observed inside deformation bands in a (110)[001] Fe-3%Si alloy single crystal at a high strain (～60%). These regions were interpreted earlier as shear bands. The lattice orientation in these bands is close to (110)[001], and their habit plane is parallel to the {112} planes of the deformed {111}〈112〉 matrix. The misorientations between the bands and the matrix group around special misorientations Σ9, Σ19a, Σ27a, and Σ33a, which are characterized by close angles of rotation about axis 〈110〉. During primary recrystallization, the (110)[001] grains growing from the bands retain segments of the corresponding special boundaries with the deformed matrix.     

Transformations in the Grain Boundary Ensemble of M1 Copper Subjected to Equal-Channel Angular Pressing during Recrystallization Annealing

The grain structure of M1 copper subjected to equal-channel angular pressing (ECAP) and subsequent annealing at 593K for 1 h is studied by means of transmission electron microscopy and scanning electron microscopy with the diffraction of backscattered electrons. An increase in grain size and the formation of special boundaries (Σ3 twins both coherent and incoherent) are observed, along with the migration of high-energy Σ3 twins and common grain boundaries, the splitting of Σ9 special boundaries into Σ3 twins, and the splitting of common grain boundaries into Σ9 and Σ3 special boundaries. The local transformation of common grain boundaries into special boundaries also occurs. Particles of the Cu₂O phase are present on the migrating Σ3 twins and common grain boundaries.     

Grain-boundary faceting at a = 3, [110]/{112} grain boundary in a cubic zirconia bicrystal

The atomic structure of a = 3, [110]/{112} grain boundary in a yttria-stabilized cubic zirconia bicrystal has been investigated by high-resolution transmission electron microscopy (HRTEM). It was found that the grain boundary migrated to form periodic facets, although the bicrystal was initially joined so as to have the symmetric boundary plane of {112}. The faceted boundary planes were indexed as {111}/{115}. The structure of the {111}/{115} grain boundary was composed of an alternate array of two types of structure unit: {112}- and {111}-type structure units. HRTEM observations combined with lattice statics calculations verified that both crystals were relatively shifted by (α/4)[110] along the rotation axis to form a stable grain-boundary structure. A weak-beam dark-field image revealed that there was a periodic array of dislocations along the grain boundary. The grain-boundary dislocations were considered to be introduced by the slight misorientation from the perfect = 3 orientation. The fact that the periodicity of the facets corresponded to that of the grain-boundary dislocations must indicate that the introduction of the grain-boundary dislocations is closely related to the periodicity of the facets. An atomic flipping model has been proposed for the facet growth from the initial = 3, {112} grain boundary.     

Characterization of twinning in electrodeposited Ni–Mn alloys

Twinning is ubiquitous in electroplated metals. Here, we identify and discuss unique aspects of twinning found in electrodeposited Ni–Mn alloys. Previous reports concluded that the twin boundaries effectively refine the grain size, which enhances mechanical strength. Quantitative measurements from transmission electron microscopy (TEM) images show that the relative boundary length in the as-plated microstructure primarily comprises twin interfaces. Detailed TEM characterization reveals a range of length scales associated with twinning beginning with colonies (～1000?nm) down to the width of individual twins, which is typically <50?nm. We also consider the connection between the crystallographic texture of the electrodeposit and the orientation of the twin planes with respect to the plating direction. The Ni–Mn alloy deposits in this work possess a {110}-fiber texture. While twinning can occur on {111} planes either perpendicular or oblique to the plating direction in {110}-oriented grains, plan-view TEM images show that twins form primarily on those planes parallel to the plating direction. Therefore, grains enclosed by twins and multiply twinned particles are produced. Another important consequence of a high twin density is the formation of large numbers of twin-related junctions. We measure an area density of twin junctions that is comparable to the density of dislocations in a heavily cold-worked metal.     

Characterization of {111} planar defects induced in silicon by hydrogen plasma treatments

Microstructural characterization by transmission electron microscopy of the {111} planar defects induced in Si by treatment in hydrogen plasma is discussed. The {111} defects are analyzed by conventional (TEM) and high-resolution transmission electron microscopy (HRTEM). Quantitative image processing by the geometrical phase method is applied to the experimental high-resolution image of an edge-on oriented {111} defect to measure the local displacements and strain field around it. Using these data, a structural model of the defect is derived. The validity of the structural model is checked by high-resolution image simulation and comparison with experimental images.     

强流脉冲电子束作用下纯镍表层中织构及结构缺陷的演化行为

利用强流脉冲电子束(HCPEB)装置对金属纯Ni进行轰击,采用X射线衍射及透射电子显微镜(TEM)技术详细分析了受轰击样品的变形结构和缺陷。X射线衍射分析表明,经强流脉冲电子束处理后,在{111}和{200}晶面出现了择优取向。TEM表层微观结构分析表明:强流脉冲电子束轰击1次和5次后,晶粒内部形成了大量的(111)[112]型波状条带结构,在波状条带内部包含大量平行的(200)[110]型微条带;10次轰击后,样品变形结构发生变化,除大量的条带状结构外,变形孪晶的数量明显增多。这些变形微结构不仅影响表层的织构演化行为,而且还能细化晶粒,强流脉冲电子束技术为制备表面纳米材料提供了一条有效的途径。     

Atomic structure of grain boundaries in YBa2Cu3O7-δ as observed by Z-contrast imaging

Determination of the atomic structure of grain boundaries is the key to fundamental understanding of the critical current density in polycrystalline superconductors. High-resolution images with incoherent characteristics, obtained using a high-angle annular detector on an atomic resolution scanning transmission electron microscope, are used to study the atomic arrangements of these technologically important boundaries. The incoherent Z-contrast images do not experience contrast reversals with defocus or sample thickness and display no Fresnel Fringe effects at boundaries. Observed rigid shifts of atomic columns at grain boundaries are independent of sample thickness and objective lens defocus. These characteristics allow unambiguous and intuitive interpretations of the generated images. We find the atomic structures at grain boundaries in YBa₂Cu₃O_7-δ are strongly influenced by the strong tendency of this compound to exist only as complete unit cells terminated at {001} and {100} planes. The weak-link behavior associated with high-angle grain boundaries may follow from this structure in which there is no clear connection between the {100} facets of adjacent grains. Symmetric grain boundaries where adjacent grains share a common boundary plane have also been observed in YBa₂Cu₃O_7-δ. In these boundaries partial structural coupling of the grains is maintained. There is evidence that these two boundary forms produce junctions with very different superconducting properties.     

Oxidation of tungsten single crystals in the presence of a high-electric field

The effects of high-electric fields on oxidation of tungsten single crystals in 6 × 10^?4 torr of oxygen at 1200–1500 °K were studied by field emission and transmission electron microscopy. Exposure of field emitters to oxygen in the absence of a field resulted in the build-up of emitter tips. Oxidation under the application of a negative or positive field, on the other hand, involved plane faceting and formation of oxide crystallites. Plane faceting was recognized to occur on the {111} and the {112} regions, showing the facetings of the {111} and the {112} planes into the {110} planes, whereas, crystallite formation seemed to take place selectively on the {100} regions. It was suggested by field emission microscopy that negative fields have an additional effect which causes the growth of an oxide crystal on the (110) plane. Transmission electron microscopy of an emitter oxidized in a negative field actually revealed a tiny oxide crystal with a size of ～ 300 Å grown on the developed (110) plane. The crystal exhibited a triangular shadow image strongly indicating an external pyramid-like form.     

Observation of defects and growth orientations of YBa2Cu3Ox thin films with YSZ buffer layers on Si

We have investigated defects and in-plate orientations of YBa₂Cu₃O_x thin films prepared by pulsed laser deposition (PLD) with YSZ as a buffer layer. The films showed c-axis oriented growth with the transition temperature T_co up to 87 K. Several types of defects including thermally induced cracks, grain boundaries and outgrowths were observed by scanning electron microscopy (SEM) and high resolution transmission electron microscopy (HRTEM). The grain boundary provided a favorable path for crack propagation. The outgrowths nucleated on the YSZ surface grew with stoichiometric composition. According to X-ray diffraction (XRD) and HRTEM studies the YSZ buffer layer grew with the orientation relationship, YSZ110//Si110 and YSZ(001)//Si(001) up to the YBCO/YSZ interface. The superconducting YBCO films on top grew mainly with YBCO100//Si110 and YBCO(001)//Si(001), with some minor portions of YBCO110//Si110 and YBCO(001)//Si(001).     

Grain refinement and strengthening of austenitic stainless steels during large strain cold rolling

The microstructure/texture evolution and strengthening of 316?L-type and 304?L-type austenitic stainless steels during cold rolling were studied. The cold rolling was accompanied by the deformation twinning and micro-shear banding followed by the strain-induced martensitic transformation, leading to nanocrystalline microstructures consisting of flattened austenite and martensite grains. The fraction of ultrafine grains can be expressed by a modified Johnson-Mehl-Avrami-Kolmogorov equation, while inverse exponential function holds as a first approximation between the mean grain size (austenite or martensite) and the total strain. The deformation austenite was characterised by the texture components of Brass, {011}<211>, Goss, {011}<100>, and S, {123}<634>, whereas the deformation martensite exhibited a strong {223}<110> texture component along with remarkable γ-fibre, <111>∥ND, with a maximum at {111}<211>. The grain refinement during cold rolling led to substantial strengthening, which could be expressed by a summation of the austenite and martensite strengthening contributions.     

Evolution of texture in electrodeposited Ni/Cu layered nanostructures

The objective of this research was to study the evolution of crystallographic texture in electrodeposited Ni/Cu laminated nanostructures. Thick films (14-40 µm) consisting of nickel and copper nanolayers (7-27 nm) were fabricated on annealed polycrystalline copper substrates using an electodeposition technique. The microstructure of the deposits was varied by changing the deposition time of each layer and the electrolyte temperature. X-ray diffraction, transmission electron microscopy and scanning electron microscopy were applied to characterize the deposits. Three microstructural behaviours were observed. The deposit with a very fine bilayer thickness (7 nm) was composed of coherent layers parallel to the substrate surface. This deposit replicated the cube orientation of the substrate and showed a strong ?100? texture throughout the thickness of the deposit. An increase in the bilayer thickness (17 and 27 nm) caused a change in the texture from ?100? on the substrate side to ?111? on the solution side. This change in texture is suggested to be associated with a change in the deposition front orientation from {100} to {110} and the subsequent twinning of the cube-oriented crystals. A decrease in the electrolyte temperature inhibited faceting of the interface and hence no twinning was observed.     

Electron Backscattered Diffraction of Transgranular Crack Propagation in Soft Steel

We consider the crack propagation in a soft steel sheet during the formation. The drawability is considered in relation with the structural anisotropy, the mechanical behaviour is related to both the grain morphology and the texture. The structure heterogeneity could lead to the apparition of micro-cracks. The results show the texture effect on the crack propagation and on the crack arrest in soft steel during the formation. The EBSD technique allows to show that the adjustment of the grain orientation from the initial main component {111}（112） towards the deformation orientation {111}（110） incites a trans-granular crack through a grain with initial {111}（112） orientation in a globally ductile material. It is the presence of grains with {111}（110） orientation which permits the closing of micro-cracks.     

Structure and stability of Σ3 grain boundaries in face centered cubic metals

Σ3 grain boundaries form as a result of either growth twinning or deformation twinning in face centered cubic (fcc) metals and play a crucial role in determining the mechanical and electrical properties and microstructural stability. We studied the structure and stability of Σ3 grain boundaries (GBs) in fcc metals by using topological analysis and atomistic simulations. Atomistic simulations were performed for Cu and Al with empirical interatomic potentials to reveal the influence of stacking fault energy on the morphology of the twinned grains. Three sets of tilt Σ3 GBs were studied with respect to the tilt axis parallel to ?111?, ?112?, and ?110?, respectively. We showed that Σ3{111} and Σ3{112} GBs are thermodynamically stable and the others will dissociate into terraced interfaces regardless of the stacking fault energy. The morphology of the nano-twinned grains in Cu is predicted from the above analysis and found to match with experiments.     

Direct insight into grain boundary reconstruction in polycrystalline Cu(In,Ga)SE2 with atomic resolution

This work presents results from high-resolution scanning transmission electron microscopy and electron energy-loss spectroscopy on twin boundaries (TBs) and nontwin grain boundaries (GBs) in Cu(In,Ga)Se(2) thin films. It is shown that the atomic reconstruction is different for different symmetries of the grain boundaries. We are able to confirm the model proposed by Persson and Zunger [Phys. Rev. Lett. 91, 266401 (2003)] for Se-Se-terminated Σ3 {112} TBs, showing Cu depletion and In enrichment in the two atomic planes closest to the TB. On the contrary, Cu depletion without In enrichment is detected for a cation-Se-terminated TB. At nontwin GBs, always a strong anticorrelation of Cu and In signals is detected suggesting that the formation of In(Cu) or Cu(In) antisites within a very confined region of smaller than 1 nm is an essential element in the reconstruction of these GBs.     

Microstructural evolution of AZ31 magnesium alloy subjected to sliding friction treatment

Microstructural evolution and grain refinement mechanism in AZ31 magnesium alloy subjected to sliding friction treatment were investigated by means of transmission electron microscopy. The process of grain refinement was found to involve the following stages: (I) coarse grains were divided into fine twin plates through mechanical twinning; then the twin plates were transformed to lamellae with the accumulation of residual dislocations at the twin boundaries; (II) the lamellae were separated into subgrains with increasing grain boundary misorientation and evolution of high angle boundaries into random boundaries by continuous dynamic recrystallisation (cDRX); (III) the formation of nanograins. The mechanisms for the final stage, the formation of nanograins, can be classified into three types: (i) cDRX; (ii) discontinuous dynamic recrystallisation (dDRX); (iii) a combined mechanism of prior shear-band and subsequent dDRX. Stored strain energy plays an important role in determining deformation mechanisms during plastic deformation.     

The chemical composition of a metal/ceramic interface on an atomic scale: The Cu/MgO {111} interface

The chemical composition profile across a Cu/MgO {111}-type heterophase interface, produced by the internal oxidation of a Cu(Mg) single-phase alloy at 1173 K, is measured via atom-probe field-ion microscopy with a spatial resolution of 0.121 nm; this resolution is equal to the interplanar spacing of the {222} MgO planes. In particular, we demonstrate directly that the bonding across a Cu/MgO {111}-type heterophase interface, along a <111> direction common to both the Cu matrix and an MgO precipitate, has the sequence Cu|O|Mg... and not Cu|Mg|O...; this result is achieved without any deconvolution of the experimental data. Before determining this chemical sequence, it was established, via high-resolution electron microscopy, that the morphology of an MgO precipitate in a Cu matrix is an octahedron faceted on {111} planes with a cube-on-cube relationship between a precipitate and the matrix; that is, {111}_Cu//{222}_MgO and <110>_Cu // <110>_MgO.     

Twin boundaries with 9R zone in Cu and Ag studied by quantitative HRTEM

When highly inclined against the {111} plane of the coherent twin boundary, 3 110 tilt boundaries in Cu or Ag have a complex structure. As the boundary plane approaches the symmetrical {211} orientation, the grain boundaries decompose into two phase boundaries. Between these phase boundaries the metal adopts a rhombohedral crystal structure, denoted as 9R. Not the {211}-oriented boundary, but a boundary inclined by 8° against {211} has the minimum energy in this family of grain boundaries with 9R zone. Using high resolution transmission electron microscopy, we have studied the atomistic structure of this special boundary. An iterative structure refinement based on quantitative image analysis reveals the atomistic structure of the grain boundary at a well-defined level of confidence. Comparing the refined grain boundary structure with a model obtained by molecular statics calculations exposes small, but significant discrepancies. These probably arise because in the model the stacking fault energy is too small and the short distance repulsion is too weak. Grain boundaries of equivalent geometry in Ag and Al exhibit different widths of the 9R zone. Experimental observations support a theory relating the equilibrium width of the 9R slab to the stacking fault energy and the elastic properties of the material.Presented at the Workshop on High-Voltage and High Resolution Electron Microscopy, February 21–24, 1994, Stuttgart, Germany.