Boundary Integral Analysis of the Symmetric Dynamic Problem for an Infinite Bimaterial Solid with an Embedded Crack

The symmetric frequency domain problem for two ideally bonded elastic half-spaces with a perpendicular plane crack is considered. It is reduced to the boundary integral equation (BIE) with integration over the limited crack region. The contact conditions on the bimaterial interface are satisfied identically in the initial stage of obtaining the equation. After boundary element solution of the equation, the stress concentration in the vicinity of a penny-shaped crack under time-harmonic loading of constant amplitude is studied. The mode I stress intensity factors as functions of angular coordinate of a crack front point and wave number for various relations between the material parameters are computed. The crack depth relative to the bimaterial interface is determined, when the effect of the material dissimilarity on the crack can be neglected.     

Antiplane crack at the interface of two bonded dissimilar graded piezoelectric materials

The problem of an antiplane crack situated in the interface of two bonded dissimilar graded piezoelectric half-spaces is considered under the permeable crack assumption. The mechanical and electrical properties of the half-spaces are considered for a class of functional forms for which the equilibrium equation has analytic solutions. By using an integral transform technique, the problem is reduced to dual integral equations which are transformed into a Fredholm integral equation by introducing an auxiliary function. The stress intensity factors are obtained in explicit form in terms of auxiliary functions. By solving the Fredholm integral equation numerically, the numerical results for stress intensity factors are obtained which have been displayed graphically to show the influence of the graded piezoelectric materials.     

Electro-mechanical pre-fracture zones for an electrically permeable interface crack in a piezoelectric bimaterial

A plane strain problem for two piezoelectric half-spaces adhered by a very thin isotropic interlayer with a crack under the action of remote mixed mode mechanical loading and electrical flux is considered. The crack is situated either at an interface or in the interlayer. It is assumed that the substrates are much stiffer than the intermediate layer. Therefore, pre-fracture zones (plastic or damage) arise at the crack continuations. Normal and shear stresses are assumed to be constant in this zones and to satisfy some material equation, which can be taken from theory or derived experimentally. Modeling the pre-fracture zones by the crack continuations with unknown cohesive stresses on their faces reduces the problem to elastic interface crack analysis leading to a Hilbert problem. This problem is solved exactly. The pre-fracture zone lengths and stresses in these zones are found from algebraical and transcendental equations. The latter are derived from the conditions of stress finiteness at the ends of pre-fracture zones and the material equations. The electrical displacement at any point of the pre-fracture zones is found in closed form as well. Particular cases of symmetrical loading and of equivalent properties of the upper and lower bimaterial components are considered. Numerical results corresponding to certain material combinations and interlayer material equations are presented and analysed. In the suggested model, any singularities connected with the crack are eliminated, i.e., all mechanical and electrical characteristics are limited in the near-crack tip region.     

剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力分析

本文利用波函数展开法和奇异积分方程技术研究了ＳＨ型反平面剪切波作用下埋藏刚性椭圆柱与周围介质部分脱胶时的动力特性．将脱胶区看作表面不相接触的椭圆弧形界面裂纹，利用波函数（Ｍａｔｈｉｅｕ函数）展开法，并引人裂纹面的位错密度函数为未知量，将问题归结为奇异积分方程，通过数值求解积分方程获得了远场和近场物理参量，并讨论了共振特性和各参数对共振的影响．     

DYNAMIC ANALYSIS OF A BURIED RIGID ELLIPTIC CYLINDER PARTIALLY DEBONDED FROM SURROUNDING MATRIX UNDER SHEAR WAVES

This paper investigates the dynamic behavior of a buried rigid ellipticcylinder partially debonded from surrounding matrix under the action of anti-planeshear waves (SH waves). The debonding region is modeled as an elliptic arc-shapedinterface crack with non-contacting faces. By using the wave function (Mathieufunction) expansion method and introducing the dislocation density function as anunknown variable, the problem is reduced to a singular integral equation which issolved numerically to calculate the near and far fields of the problem. The resonanceof the structure and the effects of various parameters on the resonance are discussed.     

Effect of the compliant interlayer on the dynamic stress intensity factor in a piecewise-homogeneous solid with a circular crack

The dynamic behavior of a circular crack in an elastic composite consisting of two dissimilar half-spaces connected by a thin compliant interlayer is studied. One half-space contains a defect aligned perpendicular to the interlayer; the defect surfaces are loaded by normal harmonic forces, which ensures the symmetry of the stress-strain state. The thin interlayer is modeled by conditions of a nonideal contact of the half-spaces. The problem is reduced to a boundary integral equation with respect to the function of dynamic opening of the defect. The numerical solution of this equation yields frequency dependences of the mode I stress intensity factor in the vicinity of the crack for different values of interlayer thickness and relations between the moduli of elasticity of the composite components. __________ Translated from Prikladnaya Mekhanika i Tekhnicheskaya Fizika, Vol. 49, No. 3, pp. 197–207, May–June, 2008.     

Contact zone assessment for a fast growing interface crack in an anisotropic bimaterial

Summary A plane strain problem for a crack with a frictionless contact zone at the leading crack tip expanding stationary along the interface of two anisotropic half-spaces with a subsonic speed under the action of various loadings is considered. The cases of finite and infinite-length interface cracks under the action of a moving concentrated loading at its faces are considered. A finite-length crack for a uniform mixed-mode loading at infinity is considered as well. The associated combined Dirichlet-Riemann boundary value problems are formulated and solved exactly for all above-mentioned cases. The expressions for stresses and the derivatives of the displacement jumps at the interface are presented in a closed analytical form for an arbitrary contact zone length. Transcendental equations are obtained for the determination of the real contact zone length, and the associated closed form asymptotic formulas are found for small values of this parameter. It is found that independently of the types of the crack and loading, an increase of the crack tip speed leads to an increase of the real contact zone length and the correspondent stress intensity factor. The latter increase significantly for an interface crack tip speed approaching the Ragleigh wave speed.     

The Anti-plane Dynamic Fracture Analysis of Functionally Graded Materials with Arbitrary Spatial Variations of Material Properties

Anti-plane dynamic fracture analysis is presented for functionally graded materials (FGM) with arbitrary spatial variations of material properties. The FGM with the material properties varying continuously in an arbitrary manner is modeled as a multi-layered medium with the elastic modulus and mass density varying linearly in each sub-layer and continuous at the interfaces between two adjacent sub-layers. With this linearly inhomogeneous multi-layered model, the problem of a crack in a graded interfacial zone bonded to two homogeneous half-spaces or in a coating bonded to a homogeneous half-space subjected to the anti-plane shear impact load is investigated. Laplace and Fourier transforms and transfer matrix are applied to reduce the associated mixed boundary value problem to a Cauchy singular integral equation which is solved numerically in the Laplace transformed domain. The dynamic stress intensity factors (DSIF) are obtained by using the numerical technique of Laplace inversion.     

Fracture analysis of mode-II crack perpendicular to imperfect bimaterial interface

The problem of a mode-II crack close to and perpendicular to an imperfect interface of two bonded dissimilar materials is investigated.The imperfect interface is modelled by a linear spring with the vanishing thickness.The Fourier transform is used to solve the boundary-value problem and to derive a singular integral equation with the Cauchy kernel.The stress intensity factors near the left and right crack tips are evaluated by numerically solving the resulting equation.Several special cases of the mode-II crack problem with an imperfect interface are studied in detail.The effects of the interfacial imperfection on the stress intensity factors for a bimaterial system of aluminum and steel are shown graphically.The obtained observation reveals that the stress intensity factors are dependent on the interface parameters and vary between those with a fully debonded interface and those with a perfect interface.     

Integral Identities for a Semi-infinite Interfacial Crack in 2D and 3D Elasticity

The paper is concerned with the problem of a semi-infinite crack at the interface between two dissimilar elastic half-spaces, loaded by a general asymmetrical system of forces distributed along the crack faces. On the basis of the weight function approach and the fundamental reciprocal identity (Betti formula), we formulate the elasticity problem in terms of singular integral equations relating the applied loading and the resulting crack opening. Such formulation is fundamental in the theory of elasticity and extensively used to solve several problems in linear elastic fracture mechanics (for instance various classic crack problems in homogeneous and heterogeneous media).     

Analysis of a mode-I crack perpendicular to an imperfect interface

The elastostatic problem of a mode-I crack embedded in a bimaterial with an imperfect interface is investigated. The crack is in proximity to and perpendicular to the imperfect interface, which is governed by linear spring-like relations. The Fourier transform is applied to reduce the associated mixed-boundary value problem to a singular integral equation with Cauchy kernel. By numerically solving the resulting equation, stress intensity factors near both crack tips are evaluated. Obtained results reveal that the stress intensity factors in the presence of the imperfect interface vary between that with a perfect interface and that with a completely debonding interface. Moreover, an increase in the interface parameters decreases the stress intensity factors. In particular, when crack approaches to the weakened interface closer, the stress intensity factors become larger for a sliding interface, and become larger or smaller for a Winkler interface, depending on the crack lying in a stiffer or softer material. The influences of the imperfection of the interface on the stress intensity factors for a bimaterial composed of aluminum and steel are presented graphically.     

On the anti-plane shear of an elliptic nano inhomogeneity

The elastic field of an elliptic nano inhomogeneity embedded in an infinite matrix under anti-plane shear is studied with the complex variable method. The interface stress effects of the nano inhomogeneity are accounted for with the Gurtin–Murdoch model. The conformal mapping method is then applied to solve the formulated boundary value problem. The obtained numerical results are compared with the existing closed form solutions for a circular nano inhomogeneity and a traditional elliptic inhomogeneity under anti-plane. It shows that the proposed semi-analytic method is effective and accurate. The stress fields inside the inhomogeneity and matrix are then systematically studied for different interfacial and geometrical parameters. It is found that the stress field inside the elliptic nano inhomogeneity is no longer uniform due to the interface effects. The shear stress distributions inside the inhomogeneity and matrix are size dependent when the size of the inhomogeneity is on the order of nanometers. The numerical results also show that the interface effects are highly influenced by the local curvature of the interface. The elastic field around an elliptic nano hole is also investigated in this paper. It is found that the traction free boundary condition breaks down at the elliptic nano hole surface. As the aspect ratio of the elliptic hole increases, it can be seen as a Mode-III blunt crack. Even for long blunt cracks, the surface effects can still be significant around the blunt crack tip. Finally, the equivalence between the uniform eigenstrain inside the inhomogeneity and the remote loading is discussed.     

Intensity factors for subinterface cracks in dissimilar anisotropic piezoelectric media

Summary A subinterface crack paralleling an interface between two dissimilar piezoelectric solids is considered. When the distance between the interface and the crack is small compared to all other in-plane lengths, the problem can be analyzed as an asymptotic problem for a semi-infinite crack lying at some distance away from the interface. An integral equation for the asymptotic subinterface crack is derived, and a solution of the integral equation for small-generalized Dundurs parameters is obtained. Relations between the intensity factors for the subinterface crack and interface intensity factors of the corresponding interface crack are obtained for a conducting crack as well as for an insulating one.This work was supported by the Brain Korea 21 Project in 2000.     

Electroelastic Analysis of an Internal Interface Crack in a Half-Plane Consisting of Two Bonded Dissimilar Piezoelectric Quarter-Planes

The problem of an interface crack in a half-plane consisting of two bonded dissimilar piezoelectric quarters is considered under antiplane shear and inplane electric loading. The problem is solved under the electrically permeable assumption for a crack. The integral transform technique is employed to reduce the problem to triple integral equations, which is further converted to a hypersingular integral equation for the crack sliding displacement. By solving the resulting equation analytically, the electroelastic field along the interface and the energy release rate are obtained in explicit form, respectively. Several examples are given to illustrate the influence of the material properties and the crack position on the energy release rate.     

Opening-Function Simulation of the Three-Dimensional Nonstationary Interaction of Cracks in an Elastic Body

Integral relations between three-dimensional dynamic displacements (stresses) in an infinite elastic body with arbitrarily located plane cracks and discontinuities in the displacements of the opposite crack faces are presented. The influence of opening cracks on each other is considered in the problem on crack faces loaded by pulse forces. This problem is reduced to a system of boundary integral equations of the wave-potential type in a time domain. The dynamic mode I stress intensity factors are determined for two coplanar elliptic cracks under forces in the form of the Heaviside function     

Heat flow disturbed by periodic array of insulated interface cracks

The thermal effects of an interface crack between two dissimilar half-spaces is considered. The interface cracks are partially or fully insulated, and spaced in a periodic array. Using the complex variable technique, the temperature and fluxes are found in closed form, and the interactions between heat flows due to nearby cracks are determined.     

Dynamic investigation of a functionally graded layered structure with a crack crossing the interface

The dynamic response of a functionally graded layered structure with a crack crossing the interface is analyzed. The in-plane impact loading condition is considered. By using the Laplace and Fourier integral transforms, singular integral equation method and residue theory, the present problem is reduced to a singular integral equation in the Laplace transform domain. The influences of Young’s modulus ratio, thickness ratio, and crack length and location on the dynamic stress intensity factors (DSIFs) are investigated. Particularly, the DSIFs corresponding to different crack locations are shown in the case when the crack center moves from one layer to another layer through the interface. The peak and static values and overshoot characteristics of the DSIFs are analyzed. It is found that these values typically exhibit kinking behavior when the crack tips arrive at the interface. This study is different from previous other investigations in the following respects: (1) the dynamic response of a crack crossing the interface of a functionally graded structure is studied analytically, which has hardly been done in the past and (2) the present model can be reduced to some important problems, such as a functionally graded coating-substrate structure with a crack in the graded coating or homogeneous substrate or one intersecting the interface.     

Mixed-mode stress intensity factors of 3D interface crack in fully coupled electromagnetothermoelastic multiphase composites

This contribution presents an extended hypersingular intergro-differential equation (E-HIDE) method for modeling the 3D interface crack problem in fully coupled electromagnetothermoelastic anisotropic multiphase composites under extended electro-magneto-thermo-elastic coupled loads through theoretical analysis and numerical simulations. First, based on the extended boundary element method, the 3D interface crack problem is reduced to solving a set of E-HIDEs coupled with extended boundary integral equations, in which the unknown functions are the extended displacement discontinuities. Then, the behavior of the extended singular stress indices around the interface crack front terminating at the interface is analyzed by the extended main-part analysis. The extended stress intensity factors near the crack front are defined. In addition, a numerical method for a 3D interface crack problem subjected to extended loads is proposed, in which the extended displacement discontinuities are approximated by the product of basic density functions and polynomials. Finally, the radiation distribution of extended stress intensity factors at the interface crack surface are calculated, and the results are presented toward demonstrating the applicability of the proposed method.     

The scattering of general SH plane wave by interface crack between two dissimilar viscoelastic bodies

The scattering of general SH plane wave by an interface crack between two dissimilar viscoelastic bodies is studied and the dynamic stress intensity factor at the crack-tip is computed. The scattering problem can be decomposed into two problems: one is the reflection and refraction problem of general SH plane waves at perfect interface (with no crack); another is the scattering problem due to the existence of crack. For the first problem, the viscoelastic wave equation, displacement and stress continuity conditions across the interface are used to obtain the shear stress distribution at the interface. For the second problem, the integral transformation method is used to reduce the scattering problem into dual integral equations. Then, the dual integral equations are transformed into the Cauchy singular integral equation of first kind by introduction of the crack dislocation density function. Finally, the singular integral equation is solved by Kurtz's piecewise continuous function method. As a consequence, the crack opening displacement and dynamic stress intensity factor are obtained. At the end of the paper, a numerical example is given. The effects of incident angle, incident frequency and viscoelastic material parameters are analyzed. It is found that there is a frequency region for viscoelastic material within which the viscoelastic effects cannot be ignored. This work was supported by the National Natural Science Foundation of China (No.19772064) and by the project of CAS KJ 951-1-20     

Stress intensity factor for an edge crack in two bonded dissimilar materials under convective cooling

The transient thermal stress crack problem for two bonded dissimilar materials subjected to a convective cooling on the surface containing an edge crack perpendicular to the interface is considered. The problem is solved using the principle of superposition and the uncoupled quasi-static thermoelasticity. The crack problem is formulated by applying the transient thermal stresses obtained from the uncracked medium with opposite sign on the crack surfaces to be the only external loads. Fourier integral transform is used to solve the perturbation problem resulting in a singular integral equation of Cauchy type in which the derivative of the crack surface displacement is the unknown function. The numerical results of the stress intensity factors are calculated for both the edge crack and the crack terminating at the interface using two different composite materials and illustrated as a function of time, crack length, coefficient of heat transfer, and the thickness ratio.