界面润湿性及固相体积分数对颗粒粗化动力学影响的相场法研究

利用多相场模型模拟了液-固两相体系中固相颗粒的粗化过程, 分析了界面润湿性及固相体积分数对粗化指数、粗化速率及颗粒尺寸分布的影响.结果表明, 不同固相体积分数下粗化指数基本不变, 但粗化速率常数及尺寸分布与固相体积分数及界面润湿性密切相关.在完全润湿条件下, 随着固相体积分数的增加, 粗化速率常数逐渐增大; 而非完全润湿条件下, 随着固相体积分数的增加, 粗化速率常数增大速度变缓, 且当润湿性较低、 固相分数较大时, 粗化速率常数还将随体积分数的增加而下降. 此外, 模拟结果表明各种润湿条件下颗粒的尺寸分布均随着固相分数增加而变宽, 分布峰值降低, 但非完全润湿条件下峰值下降变缓.模拟结果为理解不同实验观测结果之间的分歧提供了依据. 关键词： 粗化 相转变 相场法 润湿性     

金属材料的定向退火的晶粒组织结构研究

为获得柱状晶结构的金属材料,本文对晶粒组织采取定向退火来实现。文中采用相场法,使用matlab编程模拟晶粒组织在具有一定宽度和温度均匀的热区形成柱状晶演化,并研究了热区温度、热区宽度和热区移动速率对晶粒组织材料结构形成过程的影响,为获得形成柱状晶的最佳条件进行研究。     

相场法研究Fe84Cu15Mn1合金富Cu相析出的内磁能作用机理

本文基于连续相场模型,对内磁能作用下Fe-Cu-Mn合金中富Cu相析出行为进行了研究,得到不同温度、不同Mn, Cu含量条件下的内磁能对富Cu相的平均颗粒半径、体积分数、吉布斯自由能的影响.模拟结果表明, Mn含量越低,居里温度越高,内磁能对自由能的贡献越大,且内磁能的贡献随温度升高而减小;内磁能降低了相结构转变势垒,促进了相结构转变.沉淀相体积分数随Cu含量增加而增加,通过对比有无内磁能对沉淀相体积分数的影响,内磁能作用导致沉淀相拥有更大的体积分数.因此在内磁能作用下,富Cu相具有较大的平均粒径、体积分数和较小的矫顽力,同时预测了合金硬度的变化趋势.     

Al-Zn-Mg-Cu合金时效过程的小角度x射线散射研究

通过同步辐射小角度x射线散射方法（SAXS），研究了三种Al_Zn_ Mg_Cu合金沉淀析出过程显微结构参数（析出相尺寸和体积分数），随时效温度和时效时间 的演化，同时分析了Zn含量对合金沉淀析出过程的影响.结果表明，三种合金（A，B，C） 在实验条件下析出相均属于纳米尺度，析出相的最大体积分数随Zn含量的增加而增加，最大体积分数分别为0.023—0.028，0.052—0.054和0.04.在一定时效温度下，体积分数随时效时间的变化规律，符合析出相的形核、核长大和粗化动力学过程.  关键词： 小角度x射线散射 Al_Zn_Mg_Cu合金 时效 析出相尺寸 析出相体积分数     

纳米晶粒在高压下的相转变

本文报道了晶粒尺寸对压力诱导相转变的最新进展。用热力学理论分析了造成纳米晶体材料 (纳米晶 )的相转变压力与同种大块材料不同的主要因素是体积变化比 ,表面能差和内能差。通过估算这三个因素的具体大小 ,可解释文献报道的实验结果 ,并可确定大块材料和纳米晶之间相转变压力发生差异的控制因素。在纳米晶中 ,晶粒尺寸对结构稳定性和相转变压力的影响与体系本身有关     

温度梯度对晶粒生长行为影响的相场模拟

利用相场法建立了一个可应用于研究温度梯度影响下的晶粒生长行为的二维模型,模拟了多晶材料退火过程中由温度梯度引起的非均匀晶粒生长和定向晶粒生长行为.结果表明:退火过程中,在静态温度梯度的影响下,体系的晶粒呈现不均匀生长,且从晶粒生长指数来看,不同程度地偏离了正常晶粒生长;在动态温度梯度的影响下,体系内部常出现柱状晶粒生长,柱状晶粒前端持续生长至温度最高位置;柱状晶粒生长与动态热源的移动速率密切相关,只有当动态热源的移动速率处于最小和最大晶粒生长速率之间时,柱状晶粒才会出现. 关键词： 晶粒生长 相场法 晶界迁移率 局部退火     

相场法研究Fe-Cu-Mn-Al合金富Cu相析出机制

基于Ginzburg-Landau理论采用连续相场法模拟了Fe-15%Cu-3%Mn-x Al(质量分数x=1%, 3%, 5%)合金在873 K等温时效时纳米富Cu析出相沉淀机制及Al含量对富Cu相析出的阻碍效应.通过计算成分场变量和结构序参数,研究了富Cu析出相的形貌、颗粒密度、平均颗粒半径、生长和粗化动力学.研究结果表明:在时效早期阶段,纳米富Cu相通过失稳分解机制析出,由于原子扩散速率存在差异,从而形成以富Cu相为核心的核壳结构.随着时效时间延长,富Cu相析出物结构由体心立方转变为面心立方.其中Al和Mn原子在富Cu核外偏析形成Al/Mn簇,可以将其视为阻碍富Cu析出相形成的缓冲层;在沉淀过程中,随着Al含量的增大, Al/Mn金属间相促进了缓冲层的生长,阻碍富Cu析出相的生长和粗化.     

纳米晶粒在高压下的相转变

本文报道了晶粒尺寸对压力诱导相转变的最新进展。用热力学理论分析了造成纳米晶体材料（纳米晶）的相转变压力与同种大块材料不同的主要因素是体积变化比，表面能差和内能差。通过估算这三个因素的具体大小，可解释文献报道的实验结果，并可确定大块材料和纳米晶之间相转变压力发生差异的控制因素。在纳米晶中，晶粒尺寸对结构稳定性和相转变压力的影响与体系本身有关。     

重力作用功能梯度材料一维凝固过程数值模拟

本文用数值计算的方法对重力浇铸下功能梯度材料的凝固过程进行了数值模拟,分析了各种因素对颗粒分布的影响,并与实验结果进行了比较。结果表明,在形成的凝固体上部有一颗粒体积分数近于零的区域,而在靠近底部的区域内颗粒形成一种梯度分布．高的初始过热度或高的冷却温度将会使底部梯度区内颗粒体积分数略有增大,低的颗粒初始体积分数或小的颗粒尺寸会使底部梯度区范围增大,而梯度区内颗粒体积分数减小。     

考虑固相移动的大尺寸钢锭宏观偏析数值模拟

以欧拉方法和体积元平均技术为基础,建立考虑固相移动的大尺寸钢锭宏观偏析数学模型.研究了纯自然对流和包含固相移动两种情况下宏观偏析形成的模式,分析了临界固相分数和固相密度变化对宏观偏析形成的影响.计算结果表明：无论是否考虑固相移动,A型偏析形成机理是侧壁形成的固相与底部形成的固相之间形成狭窄的补缩通道,此通道内溶质富集且流动不顺畅,最后形成了高成分区域.增大临界固相分数会导致A型偏析带和底部负偏析的加剧.固相密度的增加会引起底部负偏析和顶部正偏析的偏析程度增大,但A型偏析带的长度不随固相密度的增加而增长.将模拟结果和实验结果进行对照,验证了模型的准确性. 关键词： 宏观偏析 固相移动 A型偏析形成 数值模拟     

Elevated temperature directional recrystallization of high-purity nickel

Electron backscattered diffraction has been used to characterise the three different kinds of boundaries that occur in grains that are generated by secondary recrystallization during directional annealing of high-purity nickel. Boundaries between columnar grains (CC boundaries) can be twin boundaries, low-angle boundaries or high-angle grain boundaries. The frequency of low-angle CC boundaries dropped from 25% to 0% while the frequency of the high-angle CC boundaries increased from 19% to 67% when the annealing temperature was increased from 1000°C to 1200°C. The misorientation angles of boundaries between columnar grains and small equiaxed grains ahead of them (CE boundaries) was random at 1200°C but had a 40° rotation relationship about ?111? at 1000°C. It was found out that the character of the CC boundaries is determined by relative mobility of the CE boundaries, which is determined by the processing temperature rather than the energy of the CC boundaries themselves. The character of the island grain boundaries sometimes found with columnar grains was not affected by the annealing temperature or the drawing velocity.     

Σ3 CSL boundary distributions in an austenitic stainless steel subjected to multidirectional forging followed by annealing

The effect of processing and annealing temperatures on the grain boundary characters in the ultrafine-grained structure of a 304-type austenitic stainless steel was studied. An S304H steel was subjected to multidirectional forging (MDF) at 500–800°C to total strains of ~4, followed by annealing at 800–1,000°C for 30 min. The MDF resulted in the formation of ultrafine-grained microstructures with mean grain sizes of 0.28–0.85 μm depending on the processing temperature. The annealing behaviour of the ultrafine-grained steel was characterized by the development of continuous post-dynamic recrystallization including a rapid recovery followed by a gradual grain growth. The post-dynamically recrystallized grain size depended on both the deformation temperature and the annealing temperature. The recrystallization kinetics was reduced with an increase in the temperature of the preceding deformation. The grain growth during post-dynamic recrystallization was accompanied by an increase in the fraction of Σ3ⁿ CSL boundaries, which was defined by a relative change in the grain size, i.e. a ratio of the annealed grain size to that evolved by preceding warm working (D/D₀). The fraction of Σ3ⁿ CSL boundaries sharply rose to approximately 0.5 in the range of D/D₀ from 1 to 5, which can be considered as early stage of continuous post-dynamic recrystallization. Then, the rate of increase in the fraction of Σ3ⁿ CSL boundaries slowed down significantly in the range of D/D₀ > 5. A fivefold increase in the grain size by annealing is a necessary condition to obtain approximately 50% Σ3ⁿ CSL boundaries in the recrystallized microstructure.     

Directional excitation of surface plasmon polaritons in structure of subwavelength metallic holes

In this paper, we propose a structure formed by two subwavelength holes fabricated in a metal film to realize directional excitation of surface plasmon polaritons (SPPs). The holes are employed as SPP sources, and the relative phase of SPPs generated at the hole exit end can be adjusted by changing the dielectric material filled in holes. Using the difference in relative phase values of SPP for two holes filled with different dielectric media, the SPPs can interfere constructively along one direction while destructively along the opposite direction. Our theoretical analysis is verified by the three-dimensional finite-difference time-domain method. Moreover, the directional excitation of SPPs in two-hole array structure is also discussed. It is found that the effect of SPPs directional excitation is improved with the increase of the number of two-hole.     

Dependence of grain boundary character distribution on the initial grain size of 304 austenitic stainless steel

Abstract

In order to study the dependence of the grain boundary character distributions (GBCD) on the grain size, annealing treatment was carried out on 304 austenitic stainless steel with different initial grain sizes. The evolution of the GBCD was analysed by electron backscatter diffraction. The experimental results showed that abnormal grain growth (AGG) occurred when grain size was small. With a smaller initial grain size, the number density of abnormally large grains and the fraction of low-Σ CSL boundaries increased but the size of abnormally large grains decreased and the random boundaries presented a continuous network. With a larger initial grain size, the fraction of low-Σ CSL boundaries also increased as well as the size of abnormally large grains but the number density of abnormally large grains decreased and the connectivity of random boundary network was disrupted by low-Σ CSL boundaries, especially Σ3ⁿ (n = 1, 2, 3) boundaries. However, with a very large initial grain size, normal grain growth (NGG) occurred, which had no effect on the fraction of low-Σ CSL boundaries and the connectivity of random boundary network.     

Abnormal grain growth in Ni-5at.%W

The growth of abnormally large grains in textured Ni-5at.%W substrates for high-temperature superconductors deteriorates the sharp texture of these materials and thus has to be avoided. Therefore the growth of abnormal grains is investigated and how it is influenced by the grain orientation and the annealing atmosphere. Texture measurements and grain growth simulations show that the grain orientation only matters so far that a high-angle grain boundary exists between an abnormally growing grain and the Cube-orientated matrix grains. The annealing atmosphere has a large influence on abnormal grain growth which is attributed to the differences in oxygen partial pressure.     

Defect structure and thermomechanical stability of nano- and microcrystalline titanium obtained by different methods of intense plastic deformation

Mechanical stability under prolonged loading and thermostability under annealing have been studied for nano- and microcrystalline titanium obtained by different methods of intense plastic deformation. The effect of nanoporosity and the fraction of high angle boundaries formed due to intense plastic deformation has been revealed and analyzed. It has been established that, depending on the loading or the annealing temperature, thermomechanical stability of titanium can be affected, apart from the above structural characteristics, by either twin grain boundaries or titanium-carbide disperse particles.     

Role of columnar grain size in magnetization of La0.8MnO3 thin films grown by pulsed laser deposition

La_0.8MnO₃ thin films have been deposited on (100) SrTiO₃ substrates at different substrate temperatures by a pulsed laser deposition method. Electronic transport measurements show that a higher substrate temperature results in lower resistivity and higher insulator–metal transition temperature. Transmission electron microscope studies reveal that all the films exhibit a feature of columnar structure with the grain size decreasing with substrate temperature. We argue that the columnar grain size strongly affects the ferromagnetic transition temperature and, in turn, dominates the resistivity behavior. Based on this point, other effects, such as of annealing and film thickness, on the electronic properties are also discussed. PACS 68.55.Jk; 71.30.+h; 75.70.Ak; 75.70.Pa     

Interdiffusion in two-layer Pd/Ag films II. “Cold” homogenization mechanisms

Interdiffusion processes in thin epitaxial polycrystalline Pd/Ag films in the temperature range 20–500°C are studied by transmission electron microscopy, electron diffraction and electrical resistance methods. Homogenization is investigated both during condensation and under conditions of postcondensation annealing.The basic processes of homogenization associated with GB diffusion along migrating boundaries. It is found that in real polycrystal films with wide spectrum of grain sizes few mechanisms can occur simultaneously or subsequently: recrystallization induced diffusion, diffusion induced grain boundary migration, activation of bulk diffusion in fine grain clusters, bulk diffusion through interphase boundary. The conditions for prevailing one of them can be provided by changing condensation and postcondensation annealing temperatures or by choosing certain grain size.