PBX炸药动态Brazilian试验及数值模拟研究

 开展了PBX炸药的动态Brazilian试验,获得了不同加载应变率条件下的拉伸强度;通过高速摄影,获得了PBX炸药试样表面裂纹的产生发展过程;采用数字散斑相关方法,获得了试样出现裂纹前的应变场分布。利用离散元方法,开展了考虑PBX炸药细观结构的动态Brazilian数值模拟,获得了损伤演化发展、并形成裂纹的全过程,模拟结果能初步再现PBX炸药的损伤破坏过程。     

数字散斑技术在混凝土单轴压缩试验中的应用

数字散斑技术作为一种新兴的测量方法,它具有非接触、全场量测、精度高、操作简单等特点,随着计算机技术的迅猛发展,数字散斑技术得到了广泛的应用与研究。针对混凝土在外荷载作用下具有明显的非均匀变化的特征,借助传统的测量方法很难得到混凝土表面的全场变形结果的问题,结合数字散斑相关方法测量技术,开展了混凝土单轴压缩试验,拍摄了混凝土表面在单轴压缩过程中的位移与应变矢量场,为分析混凝土试件的损伤区域奠定了基础;与电测法测量结果进行了对比,其测量结果表明,这两种测量方法误差相对较小,且数字散斑技术能更早的发现混凝土表面的破坏,验证了数字散斑相关方法的准确性和可靠性。借助数字散斑技术可以更加方便准确的得到材料表面的变形场,这也将在一定程度上促进土木工程领域的发展,具有广阔的应用前景。     

基于卷积神经网络的散斑图像位移场测量方法

提出了一种基于卷积神经网络(CNN)的数字散斑图像位移场测量方法.采用给定多种变形模式的精确位移场系列数字散斑图像构建数据集,提出了一种数字散斑图像位移场识别CNN模型.模拟散斑图像的验证实验表明,所提方法对随机变形、轴向均匀变形、剪切变形等模式具有良好的计算效率和测试精度.硅胶单轴拉伸验证实验表明,所提方法也可以精确测试真实实验散斑图像位移场并具有较高的计算效率.所提深度CNN能够高效、精确地测试数字散斑图像位移场,在材料变形测试中具有良好的应用前景.     

PBX炸药含各向异性损伤的黏弹性统计微裂纹本构模型初步研究

建立含损伤本构模型是研究炸药动态力学响应规律的基础。基于PBX炸药材料的宏观黏弹性特征和细观上微裂纹面的方向性,建立了含各向异性损伤的黏弹性统计微裂纹(Aniso-Visco SCRAM)本构模型,简化后得到单轴应力加载下的本构方程。利用数值计算程序,以PBX9501为例,分析了微裂纹扩展的各向异性、PBX炸药破坏强度及临界应变的拉压异性和应变率相关性,考察了微裂纹数密度、初始微裂纹尺寸、微裂纹面摩擦系数及断裂表面能4个主要参数的敏感性及影响规律。结果表明,它们对微裂纹的扩展演化有较大影响,进而导致材料表现出不同的力学响应。     

压缩加载下三种含能材料细观破坏特征观察

 通过扫描电镜,对三种含能材料在不同应变率压缩条件下回收的试样断面进行了细观观察,得到了三种含能材料的细观破坏特征,并对其破坏机理进行了分析。同时结合高聚物粘结炸药（PBX炸药）和压装B炸药组分的比较,分析了两种炸药在高应变率条件下的不同破坏模式。     

数字散斑法在局域剪切带三维变形研究中的应用

在适当的温度、应变率和预变形下,合金材料的拉伸试验中,将会出现伴随应力锯齿形跌落的雪崩式剪切变形带,即波特文-勒夏特利埃(Portevin-Le Chatelier,PLC)效应。利用高速数字摄像系统(分辨力1000 frames/s)并结合数字散斑干涉法(Digital speckle pattern interferometry,DSPI)和数字散斑相关法设计了一套光学变形测量系统,实现了拉伸试验中对试件表面三维变形的实时、精确测量。利用该光学系统对铝铜合金试件在拉伸试验中产生的跳跃传播的局域剪切带瞬态成核过程进行捕捉。通过结合数字散斑相关法得到的面内变形定量结果和数字散斑干涉法得到的表现离面变形的条纹图,再现了剪切变形带成核和传播瞬间的三维变形过程。     

频域数字散斑相关法对双材料界面裂纹的研究

本文将数字散斑相关方法与显微放大技术相结合,对铜、钢双材料界面裂纹试作进行了研究,提出了频率城数字散斑相关法,该方法在频率域中利用物体变形前后散斑图对应子区域的相关搜索来测量物体的变形位移,该方法与常用的空间域数字相关法相比,避免了相关识别中的反复搜索,极大地提高了信息提取速度,并且具有更高的定位精度和测量精度。文章最后给出了实验结果。     

基于数字散斑相关法的岩石材料力学性能的测试

岩石在外力作用下会发生形变,发现和了解岩石材料的形变、应力分布等对避免灾害会起到重要的预警作用。采用高精度的数字散斑相关技术,对岩石材料形变、应力和应变进行了非接触式测量。为验证实验结果的有效性,电阻应变计贴附于采集区附近并且实验结果与电测结果吻合较好。表明数字散斑相关测量技术能够用于岩石等材料的形变检测,预报变形信息,结果可以定量和定性显示。     

数字散斑相关方法及其在碳纤维复合材料压力容器变形测量中的应用

提出了一种新的基于图像灰度梯度迭代的数字散斑相关方法(DSCM,digital speckle correlation method)。通过使用DSCM测量碳纤维复合材料压力容器在水压下的局部区域的位移场和应变场,分析了复合材料压力容器的轴向和环向的变形特征,为碳纤维复合材料压力容器的优化设计提供了理论和实验依据。     

无机玻璃动态压缩破坏的离散元模拟

利用离散元软件PFC~(2D)(Particle Flow Code)建立了分离式霍普金森压杆(SHPB)系统,模拟了无机玻璃圆柱和圆盘试件在冲击压缩下的动态力学行为和失效破坏模式。结果表明:无机玻璃作为典型的脆性材料,其抗压强度具有明显的应变率效应,而杨氏模量则对应变率不敏感;无机玻璃圆柱的破坏过程受纵向压力、端面摩擦力以及横向惯性力的影响,初期微裂纹呈三角状分布,随着纵向应力水平的提高,出现明显的泊松效应,产生横向张应力,致使微裂纹沿纵向扩展,最终试件发生沿轴向的劈裂断裂;摩擦系数和泊松比对试件破坏模式及强度有一定影响。将建立的SHPB数值实验平台用于模拟无机玻璃巴西圆盘试验,揭示了圆盘发生中心开裂的拉伸特征及拉伸强度的应变率相关性。     

Experimental study on the micromechanical behavior of a PBX simulant using SEM and digital image correlation method

The micro-scale mechanical behavior of a polymer-bonded explosive (PBX) simulant was experimentally studied using a scanning electron microscope (SEM) imaging system and digital image correlation (DIC) method. The semi-circular bend (SCB) test was chosen for the study. During the testing, a series of SEM images of the specimen was acquired in situ. The natural micro-structural features of the specimen were used as random speckle pattern for DIC analysis. The displacement and strain fields at the area of interest were obtained by DIC. The deformation and damage of PBX were analyzed. Heterogeneous strain fields demonstrated the damage evolution underneath the specimen surface and predicted possible micro-crack growth. Based on the contour plots of the correlation coefficient, the formation and extension of microscopic cracks were quantitatively analyzed.     

Damage and fracture prediction of plastic-bonded explosive by digital image correlation processing

By digital correlation processing of Scanning electronic microscopy (SEM) images, the paper presents the deformation and damage analysis of an energetic material—the plastic-bonded explosive (PBX) on mesoscopic scale. The analysis is made by observing the deformation field resulted from the digital image correlation (DIC) processing of the images corresponding to the loading steps and comparing with the surface profiles of the composite material so as to visualize the matter damage near a preset crack. The results show that the local deformation disturbance can reveal the material damage even happened underneath the specimen surface. The strain distribution in the front of the preset crack, can be used to predict the propagating route of the microcrack initiated from the tip of the pre-crack, which is related to the splitting fracture of the granular-based composite under compressive loading.     

Effect of microstructure on fracture in age hardenable Al alloys

ABSTRACT

In the present study, the fracture behaviour of AA6016 alloy was investigated during bending deformation. Wrap-bend tests were conducted and the material was subjected to different bend angles to study crack propagation. The average grain size of the as-received material is approximately 45?μm. The aspect ratio of the grains was changed from 0.53 to 0.40 during bending. The presence of deformation bands was observed during bending in both tensile and compressive regions of the sample. No orientation correlation was observed between the deformation band and its corresponding parent grain. The Schmid factor inside the deformation bands was higher than that of the parent grain, which indicates that the deformation bands accommodate strain during bending. The crystallographic texture evolved significantly during bending deformation. The strength of cube texture component decreases with increasing bend angle and new texture components formed during bending. These new texture components favour either single slip or duplex slip. A mixture of intra-granular and inter-granular fracture occurs during bending. It is observed that inter-granular crack propagation is predominantly favoured along high-angle boundaries, and grain boundary de-cohesion occurs in regions where the misorientation angle is greater than 40°. The formation of deformation-induced coincidence lattice site (CSL) boundaries is also observed during bending and it is shown that the volume fraction of CSL boundaries of Σ3 type increases with increasing bend angle. The current study shows that the formation of deformation-induced CSL boundaries of Σ3 type in AA6016 alloy can improve its inherent resistance to crack propagation during bending.     

某PBX炸药的动态力学性能研究

 PBX炸药作为现代武器的主装药,它的力学行为决定着武器的生存能力。为了研究PBX炸药的动态力学特性,采用分离式霍普金森压杆（Split Hopkinson Pressure Bar,SHPB）作为加载手段,结合半导体应变片测试技术和压电晶体监测技术,保证了实验数据的有效性。利用SHPB加载波整形技术,实现了材料两端应力平衡和常应变率加载,得到了不同应变率（90~410 s^-1）下材料的应力-应变曲线。根据材料的模量、破坏强度和破坏应变随应变率的变化规律,采用粘性修正的Sargin模型,得到了该PBX炸药在单轴压缩下的唯象本构模型,模拟结果与实验曲线符合较好。     

一种高聚物粘结炸药和B炸药的本构关系研究

 利用万能材料试验机对一种高聚物粘结炸药（简称PBX炸药）和压装B炸药进行了准静态压缩实验,得到了两种炸药在不同应变率下的应力应变曲线。通过两种炸药在不同应变率下力学性能的研究,建立了两种炸药含应变率效应的本构方程。结果表明,建立的本构方程能较好地描述两种炸药在弹性阶段和强化阶段的力学性能。     

Mixed mode I/II fracture investigation of Perspex based on the averaged strain energy density criterion

In this work, some recent mixed mode I/II fracture toughness results obtained from Perspex (or polymethylmethacrylate (PMMA)) with four simple cracked specimens subjected to the conventional three-point bend loading are reanalysed based on local energy concept. Although all the mentioned samples have been tested under the same and similar mode mixities, different fracture toughness envelopes were obtained for mixed mode I/II fracture of PMMA. The averaged strain energy density (SED) criterion has been applied in the past for different types of notched specimens (including U, V, O and keyhole notches). It is shown that the mixed mode tensile-in plane shear fracture toughness data obtained from the semicircular and triangular crack type specimens are successfully predicted for sharp cracked PMMA samples using the SED criterion.     

Application of nondestructive testing methods to electronic industry using computer-aided optical metrology

A novel application of NDT to the electronic industry using computer-aided optical metrology that includes Electronic Speckle Pattern Interferometer (ESPI), Electronic Shearing Speckle Pattern Interferometer (ESSPI) and Digital Speckle Correlation Method (DSCM) was described. The theoretical analysis based on interferometry and the deformation theory was presented and the relationship between fringe-distribution and defect-geometry was given. An important technique—computer-controlled polarization phase shifting—was developed for improving the fringe quality and the sensitivity of ESPI and ESSPI. In order to improve the sensitivity for NDT of small object like electronic elements, a new NDT method using DSCM was first introduced. Two key techniques, the cross-search algorithm and double-lens optical arrangement, were developed to provide the possibility of high processing speed and small object measurement. These new techniques will make DSCM the most powerful NDT tool in electronic engineering.Several applications are presented as examples in this paper; they include the electrosound elements, miniaturized multilayer ceramic capacitor (MLC), compact disk (CD) and optical fibers. The findings have demonstrated that computer-aided optical metrology is a powerful tool for NDT applications in electronic engineering.     

New aspects of the plastic deformation of silicon – prerequisites for the reshaping of silicon microelements

New shapes of silicon microelements which can be partially situated outside the wafer plane can be created by the combination of wet anisotropic etching and plastic deformation at high temperatures. Therefore new applications become possible. In order to characterize the plastic behaviour of the silicon microelements bending tests in the 3-point manner were carried out at monocrystalline, differently orientated beams with variation of temperature, bending rate and maximum bending. Additionally the fracture strength at room temperature of deformed and undeformed beams was determined. The dislocation content introduced during the deformation was analysed by the etch pit technique. The deformation is characterized by the formation of dislocations, a pronounced yield point effect, and an orientation-dependent strengthening. The yield points depend strongly on temperature. Because of the strong dependence on the deformation parameters it is possible to create the same amount of irreversible deformation at different stages of the stress–bend diagrams resulting in different dislocation contents and therefore different properties. The analysis of the fracture strength values by means of the Weibull statistics shows a slightly decreased average fracture strength of the deformed material in comparison to the undeformed silicon but a strongly increased Weibull modulus. Received: 22 September 1998 / Accepted: 29 January 1999 / Published online: 28 April 1999     

Application of an improved subpixel registration algorithm on digital speckle correlation measurement

Digital speckle correlation method (DSCM) has been widely used in experimental mechanics to obtain the surface deformation fields. One of the challenges in practical applications is how to obtain the high accuracy with far less computation complexity. To determine the subpixel registration of the DSCM, a high efficient gradient-based algorithm is developed in this paper. The principle is described and four different modes of the algorithm are given. Based on computer-simulated images, the optimal mode of the algorithm is verified through the comparison of computation time, optimal subset-region size and sensitivity of the four modes. The influences of speckle-granule size and speckle-granule density on accuracy are studied and a quantitative estimation of the optimal speckle-granule size range is obtained. As the applications of this method, the practical deformation measurements with the rigid body translation and rotation as well as an experiment on biomechanics are presented to certify the feasibility and the validity of the algorithm.