Nanocomposites based on epoxy resin and silicon dioxide particles

The cure of an epoxy resin (3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate) in the presence of silica nanoparticles modified by 3-(triethoxysilyl)propylsuccinic anhydride has been studied. Optimal conditions for the preparation of optically transparent polymer nanocomposites with increased glass transition temperatures are determined. The glass transition temperatures of the above nanocomposites are 50–70°C higher than those of the unfilled epoxy resin synthesized under the same conditions (100°C).     

Syntheses and characterizations of thermally degradable epoxy resins. III

In flip‐chip technology, the development of reworkable underfill materials has been one of the keys to the recovery of highly integrated and expensive board assembly designs through the replacement of defective chips. This article reports the syntheses, formulations, and characterizations of two new diepoxides, one containing secondary ester linkages and the other containing tertiary ester linkages, that are thermally degradable below 300 °C. The secondary and tertiary ester diepoxides were synthesized in three and two steps, respectively. Both compounds were characterized with NMR and Fourier transform infrared spectroscopy and formulated into underfill materials with an anhydride as the hardener and an imidazole as the catalyst. A dual‐epoxy system was also formulated containing the tertiary ester diepoxide and a conventional aliphatic diepoxide, 3,4‐epoxy cyclohexyl methyl‐3,4‐epoxycyclohexyl carboxylate (ERL‐4221E), with the same hardener and catalyst. The curing kinetics of the formulas were studied with differential scanning calorimetry (DSC). Thermal properties of cured samples were characterized with DSC, thermogravimetric analysis, and thermomechanical analysis. The dual‐epoxy system showed a viscosity of 18.7 and 0.87 P at 25 and 100 °C, respectively. The cured secondary, tertiary, and dual‐epoxy formulas showed decomposition temperatures around 265, 190, and 220 °C, glass‐transition temperatures around 120–140, 110–157, and 140–157 °C, and coefficients of thermal expansion of 70, 72, and 64 ppm/°C below their glass‐transition temperatures, respectively. The shear strength of the cured dual‐epoxy system decreased quickly with aging at 230 °C. The reworkability test showed that the removal of a chip underfilled with this material from the board was quite easy, and the residue on the board could be thoroughly removed with a mechanical brush without obvious damage to the solder mask. In summary, the synthesized tertiary epoxide can be used as a reworkable underfill for flip‐chip applications. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1796–1807, 2002     

Surface modification of cellulose nanowhiskers for application in thermosetting epoxy polymers

Cellulose nanowhiskers (CNWs) were chemically modified with dodecenyl succinic anhydride to obtain hydrophobic CNWs called DCNWs. Surface modification was confirmed by infrared spectroscopy, transmission electron microscopy, and X-ray diffraction. The surface substitution degree determined by X-ray photoelectron spectroscopy was 0.30. Nanocomposites were prepared by incorporating different amounts of DCNWs pre-dispersed in a small amount of acetone into an epoxy matrix. Scanning electron microscope demonstrated that DCNWs dispersed well in the epoxy matrix. A strong interaction was proved between the DCNWs and epoxy matrix, as results of which the nanocomposites exhibited an obvious increase in T _g by about 30 °C, simultaneous increases in tensile strength, Young’s modulus, and strain at break; and an improvement in the hydrothermal properties. Compared with the neat epoxy, the nanocomposite containing 3.5 wt% of DCNWs exhibited an increase in tensile strength by 82 %, Young’s modulus by 21 %, and a strain at break by 198 %.     

Adhesives and coatings based on phenolic/epoxy resins

Low molecular weight epoxy resin based on bis (4‐hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol–, cresol–, resorcinol–and salicylic acid–formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol–or cresol–formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol–or salicylic acid–formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints. Copyright © 1999 John Wiley & Sons, Ltd.     

Effect of surface modification of montmorillonite on the properties of aromatic polyamide/clay nanocomposites

The surface modification of montmorillonite clay was carried out through ion‐ exchange reaction using p‐phenylenediamine as a modifier. This modified clay was employed to prepare aromatic polyamide/organoclay nanocomposite materials. The dispersion behavior of clay was examined in the polyamide matrix. Polyamide chains were synthesized from 4‐aminophenyl sulfone and isophthaloyl chloride (IPC) in dimethylacetamide. These amide chains were suitably end‐capped with carbonyl chloride end groups to interact chemically with modified montmorillonite clay. The resulting nanocomposite films containing 2–20 wt% of organoclay were characterized by TEM, X‐ray diffraction (XRD), thin‐film tensile testing; thermogravimetric analysis (TGA), differential scanning calorimetric (DSC) and water absorption measurements. Mechanical testing revealed that modulus and strength improved up to 6 wt% organoclay loading while elongation and toughness of nanocomposites decreased with the addition of clay content in the matrix. Thermal decomposition temperatures of the nanocomposites were in the range 225–450 °C. These nanocomposites expressed increase in the glass‐transition temperature values relative to pure polyamide describing interfacial interactions among the phases. The percent water uptake of these composites reduced upon the addition of modified layered silicate depicting improved barrier properties. Copyright © 2008 John Wiley & Sons, Ltd.     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Influence of substrate chemistry and the network homogeneity of ultra‐thin cross‐linked polymer films cured at their surface on the main relaxations temperatures probing by microthermal analysis

Thin 200‐nm epoxy–amine mixtures were cured on silicon wafers with different surface chemistry to quantify the effect of the chemistry on the glass transition temperature evolution in ultra‐thin thermosetting films. Two surface treatments were investigated: the first one only consisted in the activation of the silanols groups at the silicon surface, whereas the second one consisted in the grafting 3‐aminopropyltrimethoxysilane (APTMS) monolayer on the silicon wafers. The epoxy films were deposited on these chemistry modified wafers by spin coating a toluene solution of DGEBA–amine mixture at stoichiometric ratio. The same cure processing was used for both samples. Thin films were analysed not only using microthermal and thermomechanical analysis to determine the relaxation transitions temperatures of these films but also using FTIR in infrared reflection absorption spectroscopy mode to determine the curing rate of these networks. It was found that all these thin films showed two different glass transitions, the first one at 96 °C and was independent of the surface treatments, whereas the second one increasing from 142 °C for the oxidised wafers surface to 167 °C for the aminosilane grafted on the silicon wafer. The substrate chemistry extent on the film network structure, the interfacial bonds and interactions are discussed. This work also illustrates the interest in using microthermal analysis to obtain relevant temperature glass transition of thin film at sub‐micrometre scale, strongly dependant of local structure and chemistry composition. Copyright © 2009 John Wiley & Sons, Ltd.     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Thermal properties and flame retardancy of novel epoxy based on phosphorus‐modified Schiff‐base

Through addition reaction of Schiff‐base terephthalylidene‐bis‐(p‐aminophenol) ( DP‐1 ) and diethyl phosphite (DEP), a novel phosphorus‐modified epoxy, 4,4'‐diglycidyl‐(terephthalylidene‐bis‐(p‐aminophenol))diphosphonate ether ( EP‐2 ), was obtained. An modification reaction between EP‐2 and DP‐1 resulted in an epoxy compound, EP‐3 , possessing both phosphonate groups and C?N imine groups. The structure of EP‐2 was characterized by Fourier transform infrared (FTIR), elemental analysis (EA), ¹H, ¹³C, and ³¹P NMR analyses. The thermal properties of phosphorus‐modified epoxies cured with 4,4'‐diaminodiphenylmethane (MDA) and 4,4'‐diaminodiphenyl ether (DDE) were studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The activation energies of dynamic thermal degradation (E_d) were calculated using Kissinger and Ozawa's methods. The thermal degradation mechanism was characterized using thermogravimetric analysis/infrared spectrometry (TG‐IR). In addition, the flame retardancy of phosphorus‐modified epoxy thermosets was evaluated using limiting oxygen index (LOI) and UL‐94 vertical test methods. Via an ingenious design, phosphonate groups were successfully introduced into the backbone of the epoxies; the flame retardancy of phosphorus‐modified epoxy thermosets was distinctly improved. Due to incorporation of C?N imine group, the phosphorus‐modified epoxy thermosets exhibited high thermal stabilities; the values of glass‐transition temperatures (T_gs) were about 201–210°C, the values of E_d were about 220–490 kJ/mol and char yields at 700°C were 49–53% in nitrogen and 45–50% in air. These results showed an improvement in the thermal properties of phosphorus‐modified epoxy by the incorporation of C?N imine groups. Copyright © 2010 John Wiley & Sons, Ltd.     

Exploitation of introducing of catalytic centers into layer galleries of layered silicates and related epoxy nanocomposites. I. Epoxy nanocomposites derived from montmorillonite modified with catalytic surfactant‐bearing carboxyl groups

Montmorillonite (MMT) was modified with the acidified cocamidopropyl betaine (CAB) and the resulting organo‐montmorillonite (O‐MMT) was dispersed in an epoxy/methyl tetrahydrophthalic anhydride system to form epoxy nanocomposites. The intercalation and exfoliation behavior of the epoxy nanocomposites were examined by X‐ray diffraction and transmission electron microscopy. The curing behavior and thermal property were investigated by in situ Fourier transform infrared spectroscopy and DSC, respectively. The results showed that MMT could be highly intercalated by acidified CAB, and O‐MMT could be easily dispersed in epoxy resin to form intercalated/exfoliated epoxy nanocomposites. When the O‐MMT loading was lower than 8 phr (relative to 100 phr resin), exfoliated nanocomposites were achieved. The glass‐transition temperatures (T_g's) of the exfoliated nanocomposite were 20 °C higher than that of the neat resin. At higher O‐MMT loading, partial exfoliation was achieved, and those samples possessed moderately higher T_g's as compared with the neat resin. O‐MMT showed an obviously catalytic nature toward the curing of epoxy resin. The curing rate of the epoxy compound increased with O‐MMT loading. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1192–1198, 2004     

Synthesis and characterization of soluble polyimides derived from 2,2′‐Bis(3,4‐dicarboxyphenoxy)‐9,9′‐spirobifluorene dianhydride

The synthesis of aromatic poly(ether imide)s containing spirobifluorene units in the polymer backbone is described. 2,2′‐Bis(3,4‐dicarboxyphenoxy)‐9,9′‐spirobifluorene dianhydride, which was used as a new monomer, was synthesized with 2,2′‐dihydroxy‐9,9′‐spirobifluorene as the starting material. In the spiro‐segment, the rings of the connected bifluorene were orthogonally arranged. This bis(ether anhydride) monomer was employed in reactions with a variety of aromatic diamines to furnish poly(ether imide)s, involving an initial ring‐opening polycondensation and subsequent chemically induced cyclodehydration. Excellent solubility in common organic solvents at room temperature, good optical transparency, and high thermal stability are the prominent characteristic features of these new polymers, which can be attributed to the presence of spiro‐fused orthogonal bifluorene segments along the polymer chain. The glass‐transition temperatures of the polyimides were 240–293 °C, and the 5% weight‐loss temperatures were greater than 500 °C. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 262–268, 2002     

Syntheses and properties of organosoluble poly(ether imide)s from 1,1‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]cyclohexane dianhydride and aromatic diamines

A bis(ether anhydride) monomer, 1,1‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]cyclohexane dianhydride ( IV‐A ), was synthesized from the nitro displacement of 4‐nitrophthalodinitrile by the phenoxide ion of 1,1‐bis(4‐hydroxyphenyl)cyclohexane ( I‐A ), followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and dehydration of the resulting bis(ether acid). A novel series of organosoluble poly(ether imide)s ( VI _a–i )(PEIs) bearing cyclohexylidene cardo groups was prepared from the bis(ether anhydride) IV‐A with various aromatic diamines V _a–i via a conventional two‐stage process. The PEIs had inherent viscosities in the range of 0.48–1.02 dL/g and afforded flexible and tough films by solution‐casting because of their good solubilities in organic solvents. Most PEIs showed yield points in the range of 89–102 MPa at stress‐strain curves and had tensile strengths of 78–103 MPa, elongations at breaks of 8–62%, and initial moduli of 1.8–2.2 GPa. The glass‐transition temperatures (T_g's) of these PEIs were recorded between 200–234 °C. Decomposition temperatures of 10% weight loss all occurred above 490 °C in both air and nitrogen atmospheres, and their residues were more than 43% at 800 °C in nitrogen atmosphere. The cyclohexane cardo‐based PEIs exhibited relatively higher T_g's, better solubilities in organic solvents, and better tensile properties as compared with the corresponding Ultem® PEI system. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 788–799, 2001     

Film‐formation property of vinylidene chloride‐methyl methacrylate copolymer latex. II. Effect of latex storage temperature

Changes in the minimum film‐formation temperature (MFFT) of 91:9 wt % vinylidene chloride (VDC)‐methyl methacrylate (MMA) latex prepared by the seeded batch process during storage at 5, 20, and 40 °C were investigated. MFFT of the latex rose the fastest at 20 °C. Infrared absorption of fresh and stored latexes and wide‐angle X‐ray diffraction of powder polymers obtained by lyophilization of fresh and stored latexes indicated a much greater increase in polymer crystallinity during latex storage at 20 °C than at 5 and 40 °C. Observed increases in MFFT during latex storage correlated with increases in polymer crystallinity. Infrared absorption of polymer stored at 5–60 °C in the dry state, such as lyophilized polymer and coating film, indicated that a polymer crystallinity increase was greater during storage at higher temperatures. These results showed that crystallization behavior of 91:9 wt% VDC‐MMA copolymer latex differed from that of VDC‐MMA copolymer in the dry state. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 948–953, 2002     

Synthesis of autophotosensitive hyperbranched polyimides based on 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride and 1,3,5‐tris(4‐aminophenoxy)benzene via end capping of the terminal anhydride groups by ortho‐alkyl aniline

Benzophenone‐containing, anhydride‐terminated hyperbranched poly(amic acid)s were end‐capped by ortho‐alkyl aniline in situ and then chemically imidized, yielding autophotosensitive hyperbranched polyimides. The polyimides were soluble in strong polar solvents, such as N‐methyl‐2‐pyrrolidone, N‐dimethylformamide, dimethylacetamide, and dimethyl sulfoxide. Thermogravimetric analysis revealed their excellent thermal stability, with a 5 wt % thermal loss temperature in the range of 527–548 °C and a10 wt % thermal loss temperature in the range of 562–583 °C. The strong absorption of the polyimide films in ultraviolet–visible spectra at 365 nm indicated that the hyperbranched polyimides were patternable. Highly resolved images with a line width of 6 μm were developed by ultraviolet exposure of the polymer films. A well‐defined image with lines as thin as 3 μm was also patterned, but the lines were rounded at the edges. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2026–2035, 2003     

Properties of methyltetrahydrophthalic anhydride‐cured epoxy resin modified with MITU

Methylimidazole‐terminated chain‐extended urea (MITU) containing polypropylene oxide spacer was synthesized and employed to modify epoxies composed of a diglycidyl ether of bisphenol‐A (E‐51) and methyltetrahydrophthalic anhydride (MTHPA). The curing behavior, viscoelastic property, impact response, and fracture surface morphology of the curing systems were systematically investigated. Differential scanning calorimeter (DSC) analysis reveals that the curing reactivity of the epoxy system is greatly enhanced with the addition of MITU. From the dynamic mechanical analysis, besides the low‐temperature β relaxation, shoulder at higher temperature side appears for the MITU‐modified systems. Meanwhile, the addition of MITU leads to the increase of loss factor (tan δ) over the temperature range of 0–75°C. Impact tests show that the modifier can be effective in toughening the epoxy resin at relatively low loading, and the scanning electron microscope (SEM) images of the fracture surface for the modified systems display signs of ductility. Copyright © 2008 John Wiley & Sons, Ltd.     

Surface modification of carbonyl iron powders with silicone polymers in supercritical fluid to get higher dispersibility and higher thermal stability

The surface of carbonyl iron powder (CIP) was modified in supercritical fluid with silicone polymers containing reactive Si‐OCH₃ groups. Fourier‐transformed infrared spectroscopy, X‐ray photoelectron spectroscopy, X‐ray diffraction, and thermo gravimetric analysis were adopted to characterize CIP. The dispersibility of CIP in epoxy resin matrix was evaluated by castor oil absorption factor, dynamic viscosity, Mooney viscosity, and scanning electric micrograph. The electromagnetic reflectivity of the CIP‐filled epoxy resin coatings was also checked. It was confirmed that comparing with those treated at atmosphere, the supercritical treated CIP presented higher surface carbon content, higher dispersibility, higher thermal stability, and its original crystalline structure did not change greatly. Even though it experienced a high temperature and a high pressure (250 °C, 7.8 Mpa) during supercritical treatment, it was not oxidized, and its electromagnetic reflectivity did not decrease. Copyright © 2016 John Wiley & Sons, Ltd.     

Crosslinked poly(ester anhydride)s based on poly(ε‐caprolactone) and polylactide oligomers

Resorbable poly(ester anhydride) networks based on ε‐caprolactone, L ‐lactide, and D,L ‐lactide oligomers were synthesized. The ring‐opening polymerization of the monomers yielded hydroxyl telechelic oligomers, which were end‐functionalized with succinic anhydride and reacted with methacrylic anhydride to yield dimethacrylated oligomers containing anhydride bonds. The degree of substitution, determined by ¹³C NMR, was over 85% for acid functionalization and over 90% for methacrylation. The crosslinking of the oligomers was carried out thermally with dibenzoyl peroxide at 120 °C, leading to polymer networks with glass‐transition temperatures about 10 °C higher than those of the constituent oligomers. In vitro degradation tests, in a phosphate buffer solution (pH 7.0) at 37 °C, revealed a rapid degradation of the networks. Crosslinked polymers based on lactides exhibited high water absorption and complete mass loss in 4 days. In ε‐caprolactone‐based networks, the length of the constituent oligomer determined the degradation: PCL5‐AH, formed from longer poly(ε‐caprolactone) (PCL) blocks, lost only 40% of its mass in 2 weeks, whereas PCL10‐AH, composed of shorter PCL blocks, completely degraded in 2 days. The degradation of PCL10‐AH showed characteristics of surface erosion, as the dimensions of the specimens decreased steadily and, according to Fourier transform infrared, labile anhydride bonds were still present after 90% mass loss. © 2003 The Authors. Journal of Polymer Science Part A: Polymer Chemistry Published by Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3788–3797, 2003     

Synthesis and properties of poly(ether imide)s based on a benzonorbornane bis(ether anhydride)

A novel bis(ether anhydride) monomer, 3,6‐bis(3,4‐dicarboxyphenoxy)benzonorbornane dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile with 3,6‐dihydroxybenzonorbornane in the presence of potassium carbonate, followed by the alkaline hydrolysis of the intermediate bis(ether dinitrile) and the cyclodehydration of the resulting bis(ether diacid). A series of poly(ether imide)s bearing pendant norbornane groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were 0.81–1.81 dL/g. The poly(ether imide) with m‐phenylenediamine as a diamine showed good organosolubility. Most of the cast poly(ether imide) films have had high tensile strengths and moduli. The glass‐transition temperatures of these poly(ether imide)s, except for those from rigid p‐phenylenediamine and benzidine, were recorded between 211 and 246 °C by differential scanning calorimetry. The softening temperatures of all the poly(ether imide) films stayed within 210–330 °C according to thermomechanical analysis. No polymers showed significant decomposition before 500 °C in a nitrogen or air atmosphere. A comparative study of the properties with the corresponding poly(ether imide)s without pendant substituents was also made. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1712–1725, 2002     

Sulfonated silica‐based electrolyte nanocomposite membranes

New functionalized particles were prepared by attaching sulfonated aromatic bishydroxy compounds onto fumed silica surface. First, a bromophenyl group was introduced onto the silica surface by reaction of bromophenyltrimethoxysilane with fumed silica. Then, sulfonated bishydroxy aromatic compounds were chemically attached to the silica surface by nucleophilic substitution reactions. The structure of the modified silica was characterized by elemental analysis: ¹³C‐NMR, ²⁹Si‐NMR, and FTIR. Afterward, novel inorganic–organic electrolyte composite membranes based on sulfonated poly(ether ether ketone) have been developed using the sulfonated aromatic bishydroxy compounds chemically attached onto the fumed silica surface. The composite membrane prepared using silica with sulfonated hydroxytelechelic, containing 1,3,4‐oxadiazole units, has higher proton conductivity values in all range of temperatures (40–140 °C) than the membrane containing only the plain electrolyte polymer, while the methanol permeability determined by pervaporation experiment was unchanged. A proton conductivity up to 59 mS cm^?1 at 140 °C was obtained. The combination of these effects may lead to significant improvement in fuel cells (fed with hydrogen or methanol) at temperatures above 100 °C. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 2278–2298, 2006