共查询到6条相似文献,搜索用时 15 毫秒
1.
基于对制作在n-GaN上的肖特基二极管的变温I-V测试和C-V测试,采用表面势垒减薄模型对肖特基二极管的电流输运特性进行了研究.试验结果表明,肖特基接触的电流输运机理非常复杂,在不同的温度条件和偏压条件下有着不同的电流输运机理.在此基础上对肖特基接触I-V特性方程进行了修正,得到了很好的拟合曲线.试验表明,高温I-V法提取的势垒高度与常温C-V法提取的势垒高度接近于根据金属功函数得出的理论势垒高度值.
关键词:
氮化镓
肖特基二极管
表面势垒减薄模型
热电子场发射 相似文献
2.
基于对制作在n-GaN上的肖特基二极管的变温,I-V测试和C-V测试,采用表面势垒减薄模型对肖特基二极管的电流输运特性进行了研究.试验结果表明,肖特基接触的电流输运机理非常复杂,在不同的温度条件和偏压条件下有着不同的电流输运机理.在此基础上对肖特基接触,I-V特性方程进行了修正,得到了很好的拟合曲线.试验表明,高温I-V法提取的势垒高度与常温C-V法提取的势垒高度接近于根据金属功函数得出的理论势垒高度值. 相似文献
3.
氮化镓材料具有大的禁带宽度(3.4 eV)、高的击穿场强(3.3 MV/cm),在高温、高压等方面有良好的应用前景.尤其是对于铝镓氮/氮化镓异质结构材料而言,由极化效应产生的高面密度和高迁移率二维电子气在降低器件导通电阻、提高器件工作效率方面具有极大的优势.由于缺乏高质量、大尺寸的氮化镓单晶衬底,常规氮化镓材料均是在蓝宝石、硅和碳化硅等异质衬底上外延而成.较大的晶格失配和热失配导致异质外延过程中产生密度高达10~7—1010 cm–2的穿透位错,使器件性能难以进一步提升.本文采用基于自支撑氮化镓衬底的铝镓氮/氮化镓异质结构材料制备凹槽阳极结构肖特基势垒二极管,通过对欧姆接触区域铝镓氮势垒层刻蚀深度的精确控制,依托单步自对准凹槽欧姆接触技术解决了低位错密度自支撑氮化镓材料的低阻欧姆接触技术难题,实现了接触电阻仅为0.37Ω·mm的低阻欧姆接触;通过采用慢速低损伤刻蚀技术制备阳极凹槽区域,使器件阳极金属与氮化镓导电沟道直接接触,实现了高达3×107开关比的高性能器件,且器件开启电压仅为0.67 V, 425 K高温下,器件反向漏电仅为1.6×10... 相似文献
4.
Lateral Schottky barrier diodes (SBDs) on A1GaN/GaN heterojunctions are fabricated and studied. The characteristics of the fabricated SBDs with different Schottky contact diameters and different Schottky-Ohmic contact spacings are investigated. The breakdown voltage can be increased by either increasing the Schottky-Ohmie con- tact spacing or increasing the Schottky contact diameter. However, the specific on-resistance is increased at the same time. A high breakdown voltage of 1400 V and low reverse leakage current below 20nA are achieved by the device with a Schottky contact diameter of 100 μm and a contact spacing of 40 μm, yielding a high V^2BR/ RoN,sp value of 194 MW.cm^-2. 相似文献
5.
Comparison of electrical characteristic between AIN/GaN and AIGaN/GaN heterostructure Schottky diodes 下载免费PDF全文
Ni/Au Schottky contacts on A1N/GaN and A1GaN/GaN heterostructures are fabricated. Based on the measured current-voltage and capacitance-voltage curves, the electrical characteristics of AlN/GaN Schottky diode, such as Schottky barrier height, turn-on voltage, reverse breakdown voltage, ideal factor, and the current-transport mechanism, are analyzed and then compared with those of an A1GaN/GaN diode by self-consistently solving Schrodinger's and Poisson's equations. It is found that the dislocation-governed tunneling is dominant for both AlN/GaN and AlGaN/GaN Schottky diodes. However, more dislocation defects and a thinner barrier layer for AlN/GaN heterostrncture results in a larger tunneling probability, and causes a larger leakage current and lower reverse breakdown voltage, even though the Schottky barrier height of AlN/GaN Schottky diode is calculated to be higher that of an A1GaN/GaN diode. 相似文献
6.
Breakdown characteristics of AIGaN/GaN Schottky barrier diodes fabricated on a silicon substrate 下载免费PDF全文
In this work, the breakdown characteristics of AlGaN/GaN planar Schottky barrier diodes (SBDs) fabricated on the silicon substrate are investigated. The breakdown voltage (BV) of the SBDs first increases as a function of the anodeto-cathode distance and then tends to saturate at larger inter-electrode spacing. The saturation behavior of the BV is likely caused by the vertical breakdown through the intrinsic GaN buffer layer on silicon, which is supported by the post-breakdown primary leakage path analysis with the emission microscopy. Surface passivation and field plate termination are found effective to suppress the leakage current and enhance the BV of the SBDs. A high BV of 601 V is obtained with a low on-resistance of 3.15 mΩ·cm^2. 相似文献