Ga segregation during Czochralski-Si crystal growth with Ge codoping

The segregation of Ga during the growth of Czochralski-Si crystals with Ge codoping was investigated. The effective segregation coefficient of Ga in Ga/Ge-codoped Si crystal growth was nearly constant over a wide Ge concentration range, even at high Ge concentrations of about 10²¹ cm⁻³. In contrast, the effective segregation coefficient increased at high B concentrations in Ga/B-codoped CZ-Si crystal growth. The segregation behavior of Ga in Ga/Ge- and Ga/B-codoped CZ-Si crystal growth was theoretically compared. The difference in the segregation coefficients of Ga as a function of the codoped impurity (Ge or B) between the two Si crystals was attributed to a difference in the excess enthalpy due to impurity incorporation into the Si crystal between Ga–Ge pairs and Ga–B pairs     

Crystal structure, carrier concentration and IR-sensitivity of PbTe thin films doped with Ga by two different methods

The comparison of the results of chemical composition, crystal structure, electronic properties and infrared photoconductivity investigations of PbTe/Si and PbTe/SiO₂/Si heterostructures doped with Ga atoms by two different techniques is presented in this work. One of these techniques is principally based on the vapour-phase doping procedure of PbTe/Si and PbTe/SiO₂/Si heterostructures, which were previously formed by the modified “hot wall” technique. The second method of PbTe(Ga)/Si and PbTe(Ga)/SiO₂/Si heterostructure preparation is based upon the fabrication of lead telluride films, which have been doped with Ga atoms in the layer condensation process directly. The lattice parameter and charge carrier density evolutions with the Ga impurity concentration show principally the different character of PbTe(Ga)/Si films prepared by these techniques. It has been proposed that complicated amphoteric (donor or acceptor) behaviour of Ga atoms may be explained by different mechanisms of substitution or implantation of impurity atoms in the crystal structure of lead telluride.     

Crystallization kinetics of the borax decahydrate

The growth and dissolution rates of borax decahydrate have been measured as a function of supersaturation for various particle sizes at different temperature ranges of 13 and 50 °C in a laboratory-scale fluidized bed crystallizer. The values of mass transfer coefficient, K, reaction rate constant, k_r and reaction rate order, r were determined. The relative importances of diffusion and integration resistance were described by new terms named integration and diffusion concentration fraction. It was found that the overall growth rate of borax decahydrate is mainly controlled by integration (reaction) steps. It was also estimated that the dissolution region of borax decahydrate, apart from other materials, is controlled by diffusion and surface reaction. Increasing the temperature and particle size cause an increase in the values of kinetic parameters (K_g, k_r and K). The activation energies of overall, reaction and mass transfer steps were determined as 18.07, 18.79 and 8.26 kJmol⁻¹, respectively.     

Growth of large dimension BaWO4 crystal by the Czochralski method

In this paper, polycrystalline materials of BaWO₄ were synthesized by solid-state phase method, and a single crystal of BaWO₄ was successfully grown along a and c-axis direction by using the Czochralski method. Up to 20×22×80 mm³ BaWO₄ crystal was obtained, and X-ray powder diffraction results show that the as-grown BaWO₄ crystal belongs to the scheelite structure. The effective segregation coefficients of Ba and W of the BaWO₄ crystal were measured by the X-ray fluorescence method, and the effective segregation coefficients of Ba and W were near 1. The rocking curve from (2 0 0) diffraction plane of as-grown BaWO₄ single crystal was measured on the High-resolution X-ray diffractometer D5005, and the full-width at half-maximum value was found to be 26.64′′ The density and hardness of the BaWO₄ crystal was measured, the measured density was in agreement with the calculated result, and the Mohs hardness was about 4.     

Compositional variation in Si-rich SiGe single crystals grown by multi-component zone melting method using Si seed and source crystals

The effect of the supply of depleted Si solute elements on the compositional variation in the Si-rich SiGe bulk crystals was studied using the method which was used to grow Ge-rich SiGe single crystals with a uniform composition. By selecting the proper pulling rate, we can obtain Si-rich Si_1−xGe_x bulk crystals with uniform composition of x=0.1 without using the supply mechanism of depleted Si solute elements. When the supply mechanism of Si solute elements was used, the initial composition in Si-rich SiGe crystals can be much more easily determined by controlling the growth temperature than that in Ge-rich crystals because the Si seed crystal is not melted down. The supply of Si solute elements is very effective to change the compositional variation even for Si-rich SiGe crystals.     

Oscillation of Y2BaCuO5 particle concentration in the melt-grown YBaCuO bulk superconductors

The oscillation of Y₂BaCuO₅ (2 1 1) particle concentration in form of bands parallel to the growth front was observed in top-seeded melt-grown (TSMG) single-grain YBa₂Cu₃O₇/Y₂BaCuO₅ bulk superconductors. The formations of these bands have been associated with temperature fluctuations at the growth front, which induce the fluctuation of the growth rate of the YBa₂Cu₃O₇ (123) crystal and consequently also the fluctuation of the amount of trapped 211 particles. We have shown that the oscillation of 211-particle concentration does not occur when the growth front is horizontal and the crystal solidifies from below upwards. In the a-growth sector (a-GS) the oscillation was observed only in the nests with very small 211 particles.     

Improved growth of PbI2 single crystals

The phase equilibrium and the crystallization process of lead iodide (PbI₂) melt have been primarily investigated according to the lead–iodine phase diagram. It is found that the iodine evaporation and the segregated lead deposition are the two important factors that affect the PbI₂ crystal quality. The new method of Pulling U-type quartz growth ampoule has been made to impede the decomposition of PbI₂ and the vaporization and condensation of iodine. An orange and translucent PbI₂ single crystal of large size was obtained by the improved growth method, i.e. U-type ampoule pulling. Resistivity of the as-grown crystal is up to 4×10¹¹ Ω cm, and IR transmission is up to 45% in the region from 7800 to 450 cm⁻¹. Therefore, the improved growth method is a promising convenient new method for the growth of high quality PbI₂ crystals.     

Influence of oxygen, hydrogen, helium, argon and vacuum on the surface behavior of molten InSb, other semiconductors, and metals on silica

Sessile drop experiments were performed on molten indium antimonide on clean quartz (fused silica) surfaces. A cell was constructed through which argon, helium, oxygen, hydrogen or a mixture of these was flowed at 600 °C. Some of the InSb was doped with 0.1% Ga. The surface tension σ of oxide-free molten InSb was smaller in Ar than in He, may have increased with increasing O₂ in the gas, and was not influenced by Ga or H₂. The contact angle θ on silica was higher in the presence of Ar, was lowered by O₂, and was not influenced by H₂ or Ga. The work of adhesion W and the surface energy σ_sv of the silica were higher in He than in Ar. The surface remained free of solid oxide only in flowing gas containing 0.8 ppm O₂. This behavior is attributed to reaction of O₂ at the surface of the melt to form In₂O gas. When solid oxide formed on Ga-doped material, it was strongly enriched in Ga, with the Ga/In ratio increasing with the concentration of O₂ in the gas.

Examination of published sessile-drop results for liquid metals and semiconductors on silica revealed that W and σ_sv were highest for reactive melts, in which SiO₂ dissolves. For non-reactive melts, W and σ_sv were lower and θ higher in a gas than in a vacuum, regardless of whether the experiments had been carried out in sealed ampoules, a flowing gas, or dynamic vacuum. The implication is that the surface of silica was different in a vacuum than in a gas at 1 bar.     

Crystal growth rate limited by step length — the case of oxygen-deficient TiO2 exposed to oxygen

We study how an oxygen-deficient crystal of TiO₂ crystal grows when exposed to O₂. While the O flux is external to the crystal, the Ti flux necessary for growth comes from internal (bulk) interstitials (Phys. Rev. Lett. 76 (1996) 791). We address where the reaction between O and Ti to form new crystal takes place in the regime of pure step flow (i.e., surface steps advancing without new-layers nucleating). The detailed partitioning of the growth flux among individual surface steps is studied using low-energy electron microscopy for two geometries on the (110) surface—an array of islands on a terrace and an island stack generated from a dislocation source. For both geometries, the areas of islands larger than the critical size grow at rates strictly proportional to their perimeter length, independent of the local step configuration. In addition, we find that the growth rate is proportional to the O₂ pressure. The step flow represents a simple limiting case of crystal growth (Phil. Trans. R. Soc. A. 243 (1951) 299)—only the growth species near a step edge becomes incorporated into the crystal. That is, only Ti and O reactions near the step edge lead to crystal growth. This case is in marked contrast to crystal growth controlled by species attaching to terraces and diffusing to steps, for which the growth rates depend upon the local step environment. Indeed, simulating the island array as if the growth flux was partitioned among the individual islands by concentration gradients (i.e., diffusion-controlled growth) totally failed to reproduce the experimental rates.     

Growth and characterization of KY(WO4)2 crystals

Single-crystal growth of KY(WO₄)₂ (KYW) by top-seeded solution growth technique has been investigated. The effects of seed orientation, temperature gradient experienced by the growing crystal and rate of crystallization on crystal quality are reported. The best results are obtained when the growth is seeded along the 0 1 0 direction. Minute deviations from this growth direction are found to be detrimental to crystal perfection. The differential thermal analysis shows that the amount of super-cooling required for dissolution and crystallization of KYW in the flux is only 5° and this promotes an easy formation of tiny crystallites in the solution. Consequently, the crystal rotation and the solution cooling rates are found to have pronounced effects on the growth of KYW crystal.     

Growth of SiGe bulk crystals with uniform composition by utilizing feedback control system of the crystal–melt interface position for precise control of the growth temperature

We developed an automatic feedback control system of the crystal–melt interface position to keep the temperature at the interface constant during growth, and demonstrate its successful application to grow Ge-rich SiGe bulk crystals with uniform composition. In this system, the position of the crystal–melt interface was automatically detected by analyzing the images captured using in situ monitoring system based on charge-coupled-devices camera, and the pulling rate of the crucible was corrected at every 1 min. The system was found to be effective to keep the crystal–melt interface position during growth even when the variation of the growth rate is quite large. Especially, the interface position was kept for 470 h during growth of Ge-rich SiGe bulk crystal when we started with a long growth melt of 80 mm. As a result, a 23 mm-long Si_0.22Ge_0.78 bulk crystal with uniform composition was obtained thanks to the constancy of the growth temperature during growth through the control of the interface position. Our technique opens a possibility to put multicomponent bulk crystal in a practical use.     

Effect of seeded surface area on crystal size distribution in glycine batch cooling crystallization: a seeding methodology

In batch cooling crystallization, if the seeding process is not carefully carried out, the crystal size distribution (CSD) is dispersed. The aim of this work is to determine the optimal conditions for seeding operations. Results show that the CSD is controlled if the seed surface area reaches a specific value called critical surface S_c. Nevertheless, S_c is not the only parameter to be considered. The mean crystal size of the product obtained actually depends on the size of the seeds used because of the growth rate distribution. In fact, seeds behave differently according to their crystal sizes, which accounts for the difference in crystal growth rates. Rules are proposed for seeding with the view to obtain a uni-modal CSD and a final product size predefined by the seed crystals.     

Czochralski-growth of germanium crystals containing high concentrations of oxygen impurities

Oxygen-containing germanium (Ge) single crystals with low density of grown-in dislocations were grown by the Czochralski (CZ) technique from a Ge melt, both with and without a covering by boron oxide (B₂O₃) liquid. Interstitially dissolved oxygen concentrations in the crystals were determined by the absorption peak at 855 cm⁻¹ in the infrared absorption spectra at room temperature. It was found that oxygen concentration in a Ge crystal grown from melt partially or fully covered with B₂O₃ liquid was about 10¹⁶ cm⁻³ and was almost the same as that in a Ge crystal grown without B₂O₃. Oxygen concentration in a Ge crystal was enhanced to be greater than 10¹⁷ cm⁻³ by growing a crystal from a melt fully covered with B₂O₃; with the addition of germanium oxide powder, the maximum oxygen concentration achieved was 5.5×10¹⁷ cm⁻³. The effective segregation coefficients of oxygen in the present Ge crystal growth were roughly estimated to be between 1.0 and 1.4.     

Fabrication of 2D ordered arrays of cobalt silicide nanodots on (0 0 1)Si substrates

Two-dimensional (2D) periodic arrays of Co metal and Co silicide nanodots were successfully fabricated on (0 0 1)Si substrate by using the polystyrene (PS) nanosphere lithography (NSL) technique and thermal annealing. The epitaxial CoSi₂ was found to start growing in samples after annealing at 500 °C. The sizes of the Co silicide nanodots were observed to shrink with annealing temperature. From the analysis of the selected-area electron diffraction (SAED) patterns, the crystallographic relationship between the epitaxial CoSi₂ nanodots and (0 0 1)Si substrates was identified to be [0 0 1]CoSi₂//[0 0 1]Si and (2 0 0)CoSi₂//(4 0 0)Si. By combining the planview and cross-sectional TEM examination, the epitaxial CoSi₂ nanodots formed on (0 0 1)Si were found to be heavily faceted and the shape of the faceted epitaxial CoSi₂ nanodot was identified to be inverse pyramidal. The observed results present the exciting prospect that with appropriate controls, the PS NSL technique promises to offer an effective and economical patterning method for the growth of a variety of large-area periodic arrays of uniform metal and silicide nanostructures on different types of silicon substrates.     

Charge transfer in CdTe at 200 and 300 K

Using a perfect single crystal sample of CdTe grown using PVT method, the electronic charge transfer in the II–VI compound semiconductor CdTe at 200 and 300 K has been evaluated using two different approaches: (1) by solving a quadratic equation involving the observed structure factors of h+k+l=4n+2 type reflections; and (2) by a graphical approach in which the observed and calculated atomic form factors are extrapolated to sinθ/λ=0, to determine the transferred charge. Precise X-ray structure factors collected using MoK radiation have been used for the analysis. The results obtained are reasonable and clearly indicate the ionicity by which charge is transferred from Cd to Te in CdTe.     

Growth of low defect density GaP layers on Si substrates within the critical thickness by optimized shutter sequence and post-growth annealing

We have developed a growth procedure for realizing a low defect density GaP layer on an Si substrate. The growth procedure consists of two parts. One is the post-growth annealing for the annihilation of stacking faults (SFs). We have investigated an annihilation mechanism with molecular beam epitaxy grown GaP layers. 1-monolayer-thick SFs typically generate from the GaP/Si interface in a non-annealed GaP layer. In a 700 °C annealed GaP layer, generation points of these SFs tend to shift toward the GaP surface. In a 730 °C annealed GaP layer, SFs density is effectively decreased. These results suggest that SFs are annihilated through the climb motion of two partial dislocations during the post-growth annealing. Another one is the optimized shutter sequence for migration enhanced epitaxy. We have revealed that it is effective for the suppression of both three-dimensional growth and melt-back etching to increase in a stepwise manner the number of supplied Ga atoms per cycle. As a result, the generation of threading dislocations and pits is remarkably suppressed. A root mean square surface roughness of 0.13 nm is obtained within the critical thickness. We have estimated etch pit density (EPD) to be ∼7×10⁵ cm⁻² with a GaPN/GaP/Si structure. To the best of our knowledge, this value is same as that of commercially available GaP substrates and is the lowest one in the EPD of GaP/Si heteroepitaxy.     

Effect of molecular weight of polystyrensulfonic acid sodium salt polymers on the precipitation kinetics of sodium bicarbonate

This paper analyzes the effect of polystyrensulfonic acid sodium salt (NaPSS), obtained by kinetic precipitation from solutions of polymers of molecular weight 245 000 and 38 000 g mol⁻¹ in sodium bicarbonate (NaHCO₃) itself precipitated from synthetic brine. Crystal size, shape and the additive adsorbed are reported. X shaped and hexagonal prisms crystals with different aspect ratios were obtained. The results show that with increasing polymer concentration the crystal size decreases, from 0.27 to 0.48 mm. Additionally, the higher molecular weight polymer shows both higher adsorption capacity and higher crystal habit modification. Crystal shape patterns were similar for both polymers; however, the higher molecular weight material induced changes at lower concentration. It was observed that the precipitation rate reached a minimum with increasing additive concentration.     

Agglomeration control during the selective epitaxial growth of Si raised sources and drains on ultra-thin silicon-on-insulator substrates

We have studied the impact of several Si selective epitaxial growth (SEG) process on the agglomeration of ultra-thin, patterned silicon-on-insulator (SOI) layers. Through a careful analysis of the effects of the in situ H₂ bake temperature (that followed an ex situ “HF-last” wet cleaning) and of the silicon growth temperature on the SOI film quality, we have been able to develop a low-temperature SEG process that allows the growth of Si on patterned SOI layers as thin as 3.4 nm without any agglomeration or Si moat recess at the Si window/shallow trench isolation edges. This process consists of an in situ H₂ bake at 650 °C for 2 min, followed by a ramping-up of the temperature to 750 °C, then some SEG of Si at 750 °C using a chlorinated chemistry (i.e. SiH₂Cl₂+HCl).     

Growth and morphology of ruby crystals with unusual chromium concentration

Single crystals of ruby have been obtained from fluxed melts based on the systems Li₂O–MoO₃, Li₂O–WO₃, Na₂O–WO₃, 2PbO–3V₂O₅, PbO–V₂O₅–WO₃, PbF₂–Bi₂O₃ and Na₃AlF₆ by both the TSSG method and spontaneous crystallization at the temperatures 1330–900 °C. Al₂O₃ solubility has been measured for the flux composition of 2Bi₂O₃–5PbF₂ in the temperature range 1200–1000 °C and dissolution enthalpy has been defined as 29.4 KJ/Mol. The composition of grown crystals was studied by electron microprobe analysis. The synthetic ruby contains from 0.51 to 6.38 at% of chromium admixture depending on the crystal growth conditions. Experimental results on growth conditions, composition and morphology of grown crystals are presented for each flux and temperature interval.     

Growth, dielectric, ferroelectric and optical properties of Ca0.28Ba0.72Nb2O6 single crystals

Calcium barium niobate Ca_0.28Ba_0.72Nb₂O₆ (CBN-28) crystals were grown by the Czochralski method. The effective segregation coefficients of Ca, Ba, Na elements in CBN-28 crystal growth were measured, and the rocking curve from 0 0 2 reflection of CBN-28 wafer was also measured by the high-resolution X-ray diffractometer D5005, and the full-width at half-maximum value was measured to be 70.6″. The measured dependence of dielectric constants on temperature showed the Curie temperature of the CBN-28 crystals is between 246.8 and 260 °C. Typical polarization–electric field (P–E) hysteresis loops were measured at room temperature. Ferroelectric 180° domains were observed by scanning electron microscopy (SEM) on the etched (0 0 1) surface of the CBN-28 crystals. The transmittance of [0 0 1]-oriented CBN-28 crystals was measured and the result shows that optical properties of CBN-28 crystal are almost the same as those of SBN for wavelengths between 2500 and 7500 nm.