Thermal Degradation of Tetrafunctional/Phenol Novalac Epoxy Mixture Cured with a Diamine

The effect of thermal degradation on the mechanical behaviour of a system containing both tetraglycidyl-4-4′-diaminodiphenylmethane (TGDDM) and a multifunctional novolac glycidyl ether (EPN) resins, cured with 4,4′-diaminodiphenylsulphone (DDS) has been studied using dynamic mechanical analysis (DMA) and tensile tests. Different curing paths using the isothermal time-temperature-transformation (TTT) diagram for this system were designed, obtaining thermosetting materials with different conversions. The influences of the degree of cure and of the aging temperature were also studied. The results showed different trends in the dynamic mechanical properties and an increase in the stiffness of the material with increasing aging time. Changes were faster and more intense with the higher temperature. This revised version was published online in August 2006 with corrections to the Cover Date.     

Hybrid epoxy-based thermosets based on polyhedral oligosilsesquioxane: Cure behavior and toughening mechanisms

Polyhedral oligosilsesquioxane (POSS)-reinforced thermosets based on octaglycidyl epoxy polyhedral oligosilsesquioxane cured with 4,4′-diaminodiphenyl sulfone (DDS) were prepared and studied for their cure, thermomechanical, and microstructural characteristics. Particular attention was paid to nanometer-scale deformation processes responsible for toughening, as revealed by transmission electron microscopy (TEM) in conjunction with the thermal properties. A cure analysis investigated with calorimetry and rheometry showed a significant dependence of the cure mechanism and kinetics on the DDS content, but all hybrid thermosets reacted completely below 300 °C into rigid solids. A dynamic mechanical analysis of this hybrid resin system showed that increasing the DDS concentration used during cure increased the dynamic storage modulus in the glassy (temperature < glass-transition temperature) and rubbery (temperature > glass-transition temperature) states, simply through an increase in the crosslink density. The phase structures revealed by TEM with selective POSS staining were drastically affected by the DDS concentration and manifested as altered nanomechanical deformation structures. It was qualitatively found that the main toughening mechanism in the studied POSS-reinforced thermosets was void formation at the nanometer scale, possibly templated by limited POSS aggregation. As the crosslinking density increased with the DDS concentration, microshear yielding between voids prevailed, providing a balance of stiffness, strength, and toughness. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 3299–3313, 2003     

DSC study of cure kinetics of DGEBA-based epoxy resin with poly(oxypropylene) diamine

Summary A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric and sub-stoichiometric mixtures were performed. The kinetics of cure was described successfully by empirical models in wide temperature range. System with sub-stoichiometric content of amine showed evidence of two separate reactions, second of which was presumed to be etherification reaction. Catalytic influence of hydroxyl groups formed by epoxy-amine addition was determined.     

TMDSC and Dynamic Rheometry,Gelation, Vitrification and Autoacceleration in the Cure of an Unsaturated Polyester Resin

The free radical cross-linking copolymerization of an unsaturated polyester resin with styrene is studied in isothermal conditions using temperature modulated differential scanning calorimetry (TMDSC) and dynamic rheometry. The dynamic rheometry measurements show that gelation occurs at a conversion below 5%, while TMDSC measurements show that an important autoacceleration starts near 60% conversion, giving rise to a maximum cure rate closely before the (partial) vitrification of the system near 80%. This indicates that the autoacceleration is not due to the sharp increase in bulk viscosity at gelation, but rather to a change in molecular mobilities at higher conversion.This revised version was published online in November 2005 with corrections to the Cover Date.     

热塑性/热固性聚合物共混体系研究——乙炔端基砜/聚砜共混物的动态固化动力学

近年来,半互穿聚合物网络(SIPN)概念被用来研制能结合热塑性聚合物的加工性和热固性聚合物的高温性能的大分子体系,用于复合材料耐高温树脂基体。例如:乙炔端基酰亚胺低聚物与热塑性聚酰亚胺基SIPN,线性聚酰亚胺与热固性双马来酰亚胺基SIPN以及热塑性树脂与双腈基SIPN已有报道。研究结果表明共混物起到协同作用,易于加工并具有优异的性能。乙炔端基砜(ATS)树脂具有与聚砜树脂相类似的结构,被认为在将来代替环氧用于高性能粘合剂和复合材料树脂基体的候选者之一。其另     

热塑性/热固性聚合物共混体系研究——乙炔端基砜/聚砜共混物的动态固化动力学

The dynamic cure kinetics of thermosetting acetylene-terminated sulfone (ATS) and two blends prepared by the ATS and thermoplastic bisphenol A polysulfone (PSF), polyary-lethersulfone with cardo group (PES-C) were determinated by differential scanning calori-metry (DSC). The addition of polysulfone's resin increases the temperature of initial reaction and decreases the activation energy of cure reaction(E), pre-exponnential factor (LnA), and heat of cure reaction (AH). The temperature of reaction peak and final reaction and the reaction order(n) have been no effect.     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Evolution of structure and properties of a liquid crystalline epoxy during curing

The evolution of structure, and thermal and dynamic mechanical properties of a liquid crystalline epoxy during curing has been studied with differential scanning calorimetry (DSC), polarized optical microscopy, x-ray scattering, and dynamic mechanical analysis. The liquid crystalline epoxy was the diglycidyl ether of 4,4′-dihydroxy-α-methylstilbene (DGEDHMS). Two curing agents were used in this study: a di-functional amine, the aniline adduct of DGEDHMS, and a tetra-functional sulfonamido amine, sulfanilamide. The effects of curing agent, cure time, and cure temperature have been investigated. Isothermal curing of the liquid crystalline epoxy with the di-functional amine and the tetra-functional sulfonamido amine causes an increase in the mesophase stability of the liquid crystalline epoxy resin. The curing also leads to various liquid crystalline textures, depending on the curing agent and cure temperature. These textures coarsen during the isothermal curing. Moreover, curing with both curing agents results in a layered structure with mesogenic units aligned perpendicular to the layer surfaces. The layer thickness decreases with cure temperature for the systems cured with the tetra-functional curing agent. The glass transition temperature of the cured networks rises with increasing cure temperature due to the increased crosslink density. The shear modulus of the cured networks shows a strong temperature dependence. However, it does not change appreciably with cure temperature. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35 : 2363–2378, 1997     

Characterization and properties of carbon/PMR-15 composites

PMR (polymerization of monomer reactants) -15 was formulated to use as a matrix resin for high performance carbon fiber-reinforced composite materials. Monomers for the PMR-15 were characterized using Fourier transform infrared spectroscopy. Molecular weight change during cure was investigated using gel permeation chromatography. Thermal analysis was carried out to investigate glass transition and thermal degradation. Cure behavior of a glass/PMR-15 prepreg was investigated using a dynamic mechanical analyzer. Flexural strength of a cured carbon/PMR-15 composite was affected by cure temperature and pressure. The morphology of the cured carbon/PMR-15 was affected by cure conditions as well as by the surface conditions of the carbon fibers. A scanning electron micrograph of the composite made of untreated carbon fibers showed a void-trapped morphology.     

Cure behavior of epoxy resin/MMT/DETA nanocomposite

The Flory's gelation theory, non-equilibrium thermodynamic fluctuation theory and Avrami equation have been used to predict the gel time t _g and the cure behavior of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposites at various temperatures and organo-montmorillonite loadings. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method, and the results show that the addition of organo-montmorillonite reduces the gelation time t _gand increases the rate of curing reaction, the value of k, and half-time of cure after gelation point t_1/2 decreases with the increasing of cure temperature, and the value of n is ~2 at the lower temperatures (<60°C) and decreases to ~1.5 as the temperature increases, and the addition of organo-montmorillonite decreases the apparent activation energy of the cure reaction before gelation point, but has no apparent effect on the apparent activation energy of the cure reaction after gelation point. There is no special curing process required for the formation of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposite. This revised version was published online in July 2006 with corrections to the Cover Date.     

Study of the reaction mechanism of the copper chelate with DGEBA using DSC

The reaction mechanism of metal-containing and complex compound with epoxy oligomer of diglycidyl ether of bisphenol A (DGEBA) was studied using dynamic DSC technique. It is shown that cure reaction of the epoxy oligomers with copper acetate proceeds at two stages: through coordination of cation with the epoxy group, and through ionic polymerization at high temperatures. Mechanism of curing of DGEBA with copper chelate depends on equilibrium process of dissociation of the chelate which, in turn, depends not only on temperature of curing but also on concentration of the hardener. At the dissociation temperature of the hardener, polymerization proceeds according to ionic mechanism. Hardening of the epoxy oligomers due to interaction of epoxy groups with unconnected amine groups predominate at higher temperatures or at higher concentrations of the hardener. At low temperatures and small concentrations of the hardener, polymerization proceeds according to catalytic ionic mechanism. This revised version was published online in July 2006 with corrections to the Cover Date.     

Study on phenomenological curing model of epoxy resin for prediction of degree of cure

Curing course of Huntsman 1564/3486 epoxy resin system was studied under dynamic and isothermal curing conditions by differential scanning calorimetry technique. The autocatalytic cure kinetic model was established to describe the curing behaviour. A new modified phenomenological curing model based on the Olivier??s model was proposed to predict the relationship between the degree of cure and the couple of time and temperature. Then, the degree of cure was calculated by both the kinetic model and the modified Olivier??s model. A comparison of the results calculated with the experimental data show that the modified Olivier??s model is more accurate in the later stage of the curing course, especially at high temperatures. The modified Olivier??s model is simple and easy to use, could be applied to predict the degree of cure at isothermal temperatures well in engineering.     

Characterisation of Polyurethane Coatings Using Thermoanalytical Techniques

A two-pack polyurethane coating was analyzed using thermoanalytical techniques. The curing reaction, monitored using pressure differential calorimetry (PDSC), rheometry and dynamic mechanical analysis (DMA) shows the temperature dependency of activation energy and hence rate of curing. In-situ ATR-FTIR shows the formation of urethane linkage over time. The decomposition behavior carried out under non-isothermal mode using thermogravimetric analysis (TGA) shows bimodal behavior. The activation energies of the initial step (10% decomposition) from both iso and non-isothermal experiments are in very good agreement with each other. The use of dynamic mechanical analysis (DMA) shows the difference in glass transition behavior (T_g) and elastic modulus (E') due to the different state of cure. Also the coating exhibits a very broad loss modulus peak (E') indicating higher energy dissipation with deformation.This revised version was published online in November 2005 with corrections to the Cover Date.     

Thermal characterization of polyester–melamine coating matrices prepared under nonisothermal conditions

Thermal analysis methods (differential scanning calorimetry, thermogravimetric analysis, and dynamic mechanical thermal analysis) were used to characterize the nature of polyester–melamine coating matrices prepared under nonisothermal, high‐temperature, rapid‐cure conditions. The results were interpreted in terms of the formation of two interpenetrating networks with different glass‐transition temperatures (a cocondensed polyester–melamine network and a self‐condensed melamine–melamine network), a phenomenon not generally seen in chemically similar, isothermally cured matrices. The self‐condensed network manifested at high melamine levels, but the relative concentrations of the two networks were critically dependent on the cure conditions. The optimal cure (defined in terms of the attainment of a peak metal temperature) was achieved at different oven temperatures and different oven dwell times, and so the actual energy absorbed varied over a wide range. Careful control of the energy absorption, by the selection of appropriate cure conditions, controlled the relative concentrations of the two networks and, therefore, the flexibility and hardness of the resultant coatings. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1603–1621, 2003     

Cure state detection for pre-cured carbon-fibre epoxy prepreg (CFC) using Temperature-Modulated Differential Scanning Calorimetry (TMDSC)

Carbon-fibre prepregs have found widespread use in lightweight applications. They are based on a carbon-fibre fabric impregnated with reactive epoxy resin. Prepreg materials are generally pre-cured so that they have a higher molecular weight than typical resins in order to reduce resin flow, which facilitates storage and later processing properties.The measurements were carried out using commercially available materials and follow the published DMA investigations of the same material [1]. TMDSC was used to find the correlation between curing conditions, the degree of cure and glass transition temperature. TMDSC has the advantage over standard DSC that it enables better determination of the glass transition temperature, which is often accompanied by an exothermic curing reaction, and thus overshadowed. The influence of the amplitude of temperature modulation was tested in preliminary experiments. For non-cured material a glass transition temperature of approximately 0 °C was determined; whereas for the totally cured material it was approximately 230 °C. The changes in degree of cure, temperature of actual glass transition and post-reaction are given as a function of curing time at 180 °C. The correlation between actual glass transition temperature and degree of cure is derived.     

Rheological and dielectric changes during isothermal epoxy-amine cure

Dynamic viscosity and ionic conductivity were measured simultaneously during the cure of a digylcidyl ether of bisphenol-A (DGEBA) epoxy resin with diamino-diphenyl sulfone (DDS) by mounting a microdielectric sensor into the plates of a rheometer. Two different cure temperatures were examined. Periodically, throughout the cure, samples were removed from the plates of the rheometer, quenched, and analyzed for the glass transition temperature and epoxide conversion. The relationship between conductivity and viscosity appeared to be independent of cure temperature. A linear relation with a slope of ?1 was observed between the natural logarithms of conductivity and viscosity during the cure up to approximately 85% cure conversion. It was hypothesized that the reaction rate was hindered by diffusion at this stage in the polymerization. A free volume relationship was used to successfully correlate conductivity with viscosity up to the diffusion limited region. ©1995 John Wiley & Sons, Inc.     

Thermal behaviour of urea-formaldehyde resins during curing

Urea-formaldehyde (UF) resins are the most widely used polycondensation resins today in manufacturing particleboards. The performance of UF resins in their processing is greatly influenced by curing characteristics. The cure process has been monitored by TG-DTA technique on a Setaram labsysTM instrument in dynamic heating conditions at different heating rates. Commercial UF resins from different suppliers used in Estonian particleboard factories were selected for TG-DTA measurements. Experiments were carried out without and with catalysts. Ammonium chloride and ammonium sulphate were used. Curing characteristics were evaluated both for fresh and aged resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

基于松香酸酐的环氧树脂体系固化动力学及TTT图绘制

研制了基于松香酸酐固化剂的生物质环氧树脂体系,采用全动态DSC法研究了树脂体系的固化反应动力学,通过半经验的唯象模型拟合得到了固化反应参数,活化能Ea为59.68 kJ/g,指前因子A0为1.28×1015s-1,反应级数n为2.483,由此建立了体系固化温度/时间/固化度间的关系;采用恒温DSC及DMA方法测试玻璃化转变温度,应用DiBenedetto经验方程拟合得到了玻璃化转变温度与固化度间的关系.应用锥板旋转黏度计测试了树脂体系不同温度下的凝胶时间,通过线性回归分析得到了凝胶时间与温度之间的关系.由唯象模型和DiBenedetto方程分别计算得到凝胶时的固化度为0.386,玻璃化转变温度为26.22°C.由上述工作绘制了基于松香酸酐生物质树脂体系的TTT(time-temperature-transition diagram)固化图,可确定树脂体系在不同温度任意时间下的状态.     

Direct Measurement of Cure‐Induced Stress in Thermosetting Materials by Means of a Dynamic Mechanical Analyzer

Summary: Significant stresses develop during cure in functional and structural applications of polymeric materials ranging from glass fiber composites to advanced functional polymers used in microelectronics, optoelectronics, and biomaterials applications. These stresses arise from a combination of chemical shrinkage and stiffness buildup in a confined geometry. In this paper, a new method for direct measurement of cure‐induced stresses during curing of thermosetting materials by using the iso‐strain mode of a dynamic mechanical analyzer (DMA) has been developed. A thermal tape was used to facilitate maintaining a constant strain and initiate the iso‐strain measurement. Two quartz rods with a small gap were used to contain the material. The top of the quartz rod and one side of the thermal tape were secured by the fixed clamp, while the bottom quartz rod and the other side of the thermal tape were clamped with the moveable force probe. The cure force was thereby directly measured by the probe during the curing process. The cure stress buildup was observed to occur after a certain duration that corresponds to the gel point. Experimental results clearly show that curing at lower temperature could lead to higher cure stress due to the earlier onset of vitrification. An investigation of the stress buildup as a function of degree of cure indicates that a majority of the cure stress was generated in the vitrification regime. The methodology proposed herein provides an accurate experimental approach to investigate the cure‐induced stress generated in a thermosetting material in applications ranging from microelectronics and optoelectronics packaging to biomaterials amongst others.

Evolution of cure force and heat flow measured by means of DMA and DSC, respectively, at cure temperature 100 °C.     

TTT Cure Diagram

Curing reactions of the epoxy system consisting of a diglycidyl ether of bisphenol A (BADGE n=0) and m-xylylenediamine (m-XDA) were studied to calculate time-temperature-transformation (TTT) isothermal cure diagram for this system. Gel times were measured as a function of temperature using solubility test. Differential scanning calorimetry (DSC) was used to calculate the vitrification times. DSC data show a one-to-one relationship between T _g and fractional conversion, a independent of cure temperature. As a consequence, T _g can be used as a measure of conversion. The activation energy for the polymerization overall reaction was calculated from the gel times obtained using the solubility test (41.5 kJ mol^-1). This value is similar to the results obtained for other similar epoxy systems. Isoconversion contours were calculated by numerical integration of the best fitting kinetic model. This revised version was published online in July 2006 with corrections to the Cover Date.