硅基上Si1-xGex合金的外延生长及性能研究

硅基上高质量的异质外延生长是实现高性能微电子器件的基础,本文通过低温分子束外延技术在Si衬底上实现了全组分的Si1-x Gex(0相似文献   

氮化物宽禁带半导体的MOCVD大失配异质外延

以氮化镓(GaN)、AlN(氮化铝)为代表的Ⅲ族氮化物宽禁带半导体是研制短波长光电子器件和高频、高功率电子器件的核心材料体系.由于缺少高质量、低成本的同质GaN和AlN衬底,氮化物半导体主要通过异质外延,特别是大失配异质外延来制备.由此导致的高缺陷密度、残余应力成为当前深紫外发光器件、功率电子器件等氮化物半导体器件发展的主要瓶颈,严重影响了材料和器件性能的提升.本文简要介绍了氮化物半导体金属有机化学气相沉积(MOCVD)大失配异质外延的发展历史,重点介绍了北京大学在蓝宝石衬底上AlN、高Al组分AlGaN的MOCVD外延生长和p型掺杂、Si衬底上GaN薄膜及其异质结构的外延生长和缺陷控制等方面的主要研究进展.最后对Ⅲ族氮化物宽禁带半导体MOCVD大失配异质外延的未来发展做了简要展望.     

在Si和GaAs衬底上分子束外延CdTe的晶格应变

本文利用高分辨率多重晶多重反射X射线衍射技术对分子束外延CdTe(211)B/ Si(211)与CdTe(211)B/GaAs(211)B材料的CdTe外延薄膜进行了倒易点二维扫描,并通过获得的倒易点二维图,对CdTe缓冲层的应力和应变状况进行了分析.研究显示,对于一定厚度的CdTe外延薄膜,在从生长温度280℃降至室温20℃的过程中,由于和衬底存在热膨胀系数的差异,将在外延薄膜中产生热应力,使外延薄膜发生应变,并且这种应变取代了失配应变,在晶格畸变中占据主导地位.对于Si衬底,热应变表现为张应力;对于GaAs衬底,热应变表现为压应力.该研究结果对于进一步优化在大失配的异质衬底上外延同Hg1-xCdxTe材料晶格匹配的Cd1-yZnyTe材料的Zn组分具有指导意义.     

Si和GaAs衬底上的ZnTe、CdTe分子束外延材料的晶向倾角

本文采用X射线双晶衍射二次测量法对φ76mm Si(211)和GaAs(211)B衬底上生长的ZnTe和CdTe外延层的晶向倾角进行了测量,发现对于Si和GaAs衬底,外延层的[211]均绕外延层与衬底的[0-11]复合轴朝[111]倾斜,其晶向倾角与晶格失配呈线性关系;通过实际测量验证了在外延层探测到的[133]峰代表[211]关于[111]旋转180°的[255]孪晶向.     

石墨烯上远程外延Ge纳米柱

远程外延能够突破传统外延中晶格匹配、热匹配等限制,近年来得到了广泛的关注。Ⅲ-Ⅴ族和Ⅲ-氮化合物半导体已经成功在石墨烯上远程外延生长,但Ⅳ族半导体的远程外延很少被报道。本文首次借助于分子束外延技术在石墨烯上远程外延制备了半导体Ge纳米柱,研究了其生长特性及剥离转移。结果表明:远程外延生长的Ge纳米柱为[111]c晶向,集中分布在石墨烯的褶皱以及衬底Cu-Ni原子台阶处;随着生长温度的提高,Ge纳米柱的高度和密度逐渐下降,但直径差别不大,约为55~65 nm;此外,自组织生长的Ge纳米棒显示无应变的生长状态;引入少量Sn形成GeSn纳米柱,能够显著提升Ge纳米柱的面密度。同时,生长的Ge纳米柱可实现剥离,有望实现异质集成,应用于先进光电子器件等领域。     

热丝CVD法在单晶硅衬底上低温外延生长Si和Ge薄膜的研究

采用热丝CVD法在单晶Si衬底上进行了Si和Ge 薄膜的低温外延生长,用XRD和Raman谱对其结构性能进行了分析.结果表明:在衬底温度200 ℃时,Si(111)单晶衬底上外延生长出了Raman峰位置为521.0 cm-1;X射线半峰宽(FWHM)为5.04 cm-1.结晶质量非常接近于体单晶的(111)取向的本征Si薄膜;在衬底温度为300 ℃时,在Si(100)单晶衬底上异质外延,得到了Raman峰位置为300.3 cm-1的Ge薄膜,Ge薄膜的晶体取向为Ge(220).研究表明热丝CVD是一种很好的低温外延薄膜的方法.     

硅基片上异质外延SiC的机理研究

本文利用低压高温MOCVD系统,成功地在Si(111)基片上外延出了具有高质量的SiC薄膜,并对其反应机理做了一些初步的研究.大部分观点认为,SiC/Si的异质外延,其最初的状态应该为Si衬底中Si的扩散.但是,本文通过在不同流量比的条件下,SiC薄膜在Si基片以及Al2O3基片上外延的比较,发现在SiC/Si的异质外延过程中起重大作用的并非Si衬底中Si的扩散,而是很大程度上作用于C向Si衬底的扩散.同时,还发现反应速率的快慢受SiH4流量所限制.当SiH4流量增加时,反应速率会明显加快,但是结晶质量会相对变差.     

半导体所在Si衬底上生长Ga基半导体纳米线研究中取得进展

正Si是现代CMOS工艺不可或缺的材料,而Ⅲ-Ⅴ族半导体广泛应用于光电子、超高速微电子和超高频微波等器件中。长期以来,科学家们试图在Si衬底上外延高质量Ⅲ-Ⅴ族半导体。但由于晶格不匹配会导致生长的Ⅲ-Ⅴ族半导体质量较差。当材料降低到纳米尺度,由于应力可以得到有效释放,上述困难得以缓解。     

p型掺杂晶体硅的低温液相(001)外延生长研究

为寻求以低成本制备n型太阳电池的pn结,进行了Al-17.6wt;Si合金熔体中(001)n型单晶硅衬底上液相外延生长p型掺杂硅实验.所用方法为垂直浸渍法,实验了过冷恒温生长与回熔处理后连续冷却生长两种模式,过程中体系以流动高纯氩保护.对所得外延生长晶体结构、形貌及所得pn结开路电压进行了分析和测定.结果显示,合金熔体中硅晶体(001)液相外延生长能够实现,但一般呈离散分布的金字塔型岛状生长;只有衬底回熔处理后原位连续降温生长模式可获得连续外延薄膜,之后在其上出现岛状生长,呈现Stranski-Krastanov生长模式.所得连续外延薄膜形成的pn结开路电压比恒温生长所得的提升约100 mV;连续外延薄膜形成后期出现的岛状生长使开路电压明显下降;生长速度提高会使连续降温外延生长pn结开路电压略有降低.     

热壁外延制备InAs/Si(211)薄膜及其电学性能研究

采用热壁外延(Hot Wall Epitaxy,HWE)沉积系统在单晶Si(211)衬底表面制备了InAs薄膜,研究了不同生长温度(300℃、350℃、400℃、450℃和500℃)对薄膜材料结构及其电学性能的影响.通过X射线衍射(XRD)、扫描电子显微镜(SEM)、原子力显微镜(AFM)、霍尔(Hall)测试等,对InAs/Si(211)薄膜的晶体结构、表面形貌及电学参数进行了测试分析.结果表明:采用HWE技术在Si(211)衬底表面成功制备了InAs薄膜,薄膜具有闪锌矿结构并沿(111)方向择优生长.随着生长温度从300℃升高到500℃,全峰半高宽(FWHM)先减小后增大,生长温度为400℃时薄膜的晶粒尺寸最大为73.4 nm,载流子浓度达到1022 cm-3,霍尔迁移率数值约为102 cm2/(V·s),说明优化生长温度能够降低InAs薄膜的缺陷复合,使薄膜结晶质量和电学性能得到提高.SEM及AFM的测试结果显示由于较高的晶格失配及Si衬底斜切面(211)的特殊取向,在Si(211)衬底上生长的InAs薄膜主要为三维层加岛状(S-K)生长模式,表面粗糙度(Ra)随温度的升高先减小后增大,400℃时薄膜的平均表面粗糙度Ra为48.37 nm.     

Growth of epitaxial thin films of scandium nitride on 100-oriented silicon

A series of 100-oriented ScN films was grown under N-rich conditions on 100-oriented Si using different Sc fluxes. The ScN films grew in an epitaxial cube-on-cube orientation, with [0 0 1]_ScN//[0 0 1]_Si and [1 0 0]_ScN//[1 0 0]_Si, despite the high (11%) lattice mismatch between ScN and Si. The film grain size increases and the film ω-FWHM decreases with increasing Sc flux, but the film roughness increases. Films grown under similar conditions on 111-oriented Si resulted in mixed 111 and 100 orientations, indicating that the 100 orientation is favoured both due to texture inheritance from the substrate and due to the growth conditions used.     

大气开放式MOCVD氧化镁薄膜的生长及表征

以2,4-乙酰丙酮化镁为前驱体,衬底温度为480℃,采用MOCVD工艺,分别在玻璃、氧化铝陶瓷、单晶Si(111)和Si(100)衬底上生长了取向生长的氧化镁薄膜。X射线衍射结果表明,无论是采用玻璃、氧化铝、单晶Si(111)和Si(100)衬底,氧化镁薄膜都是沿着(100)晶面取向生长。通过扫描电镜观察得到,在单晶Si(100)衬底上生长的氧化镁薄膜表面平整致密。模拟卢瑟福背散射结果显示,沉积时间超过70min时,界面处发生硅向氧化镁层少量扩散现象。     

The injected carbon impurities in intermixed GaAs/AlAs multiple quantum wells during thermal treatment

Photoluminescence (PL) measurements were performed in order to investigate the carbon impurity effects on the intermixing behavior of GaAs/AlAs multiple quantum wells (MQWs) grown by molecular beam epitaxy. The GaAs/AlAs MQWs were annealed with a carbon source in a furnace annealing system. The PL spectra show that the magnitude of the intermixing of Al and Ga induced by thermal annealing in GaAs/AlAs MQWs increases with depth. The nonuniformity of the intermixing as a function of the depth originated from the carbon impurities which were injected during thermal treatment.     

MOCVD growth of GaN on Si(1 1 1) substrates using an ALD-grown Al2O3 interlayer

GaN thin films have been grown on Si(1 1 1) substrates using an atomic layer deposition (ALD)-grown Al₂O₃ interlayer. This thin Al₂O₃ layer reduces strain in the subsequent GaN layer, leading to lower defect densities and improved material quality compared to GaN thin films grown by the same process on bare Si. XRD ω-scans showed a full width at half maximum (FWHM) of 549 arcsec for GaN grown on bare Si and a FWHM as low as 378 arcsec for GaN grown on Si using the ALD-grown Al₂O₃ interlayer. Raman spectroscopy was used to study the strain in these films in more detail, with the shift of the E₂(high) mode showing a clear dependence of strain on Al₂O₃ interlayer thickness. This dependence of strain on Al₂O₃ thickness was also observed via the redshift of the near bandedge emission in room temperature photoluminescence (RT-PL) spectroscopy. The reduction in strain results in a significant reduction in both crack density and screw dislocation density compared to similar films grown on bare Si. Screw dislocation density of the films grown on Al₂O₃/Si substrates approaches that of typical GaN layers on sapphire. This work shows great promise for the use of oxide interlayers for growth of GaN-based LEDs on Si.     

Influence of substrate and film thickness on structural,optical and electrical properties of ZnO thin films

Transparent Zinc Oxide (ZnO) thin films have been grown on Si (100) and Sapphire (0001) substrates by RF magnetron sputtering for different growth time intervals (10, 30 and 60 min) to study the substrate and thickness effects. All the films have been grown at a substrate temperature of 450 °C. It has been found that the average growth rate on Si (100) substrate (8.6 nm/min) is higher than that on Sapphire (0001) substrate (2.6 nm/min) in an identical growth condition which clearly shows the virtual role of substrates. The lower growth rate on Sapphire (0001) suggests that the increasingly ordered and uniform growth due to less lattice mismatch. The grown films have been characterized by X‐ray diffraction (XRD), Reflectance, Photoluminescence (PL) and Hall measurements. The XRD result (FWHM) reveals that for lower growth time, the films grown on Si (100) is better than on Sapphire (0001). Conversely, for higher growth time, the films grown on Sapphire (0001) is better than on Si (100). The variation of strain behavior due to thickness on both substrates has been justified by UV‐Vis reflectance, photoluminescence and Hall effect measurements. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of arsenic flow on the crystal structure of epitaxial GaAs grown at low temperatures on GaAs (100) and (111)<Emphasis Type="Italic">A</Emphasis> substrates

The influence of arsenic flow in a growth chamber on the crystal structure of GaAs grown by molecular-beam epitaxy at a temperature of 240°C on GaAs (100) and (111)A substrates has been investigated. The flow ratio γ of arsenic As4 and gallium was varied in the range from 16 to 50. GaAs films were either undoped, or homogeneously doped with silicon, or contained three equidistantly spaced silicon δ-layers. The structural quality of the annealed samples has been investigated by transmission electron microscopy. It is established for the first time that silicon δ-layers in “low-temperature” GaAs serve as formation centers of arsenic precipitates. Their average size, concentration, and spatial distribution are estimated. The dependence of the film structural quality on γ is analyzed. Regions 100–150 nm in size have been revealed in some samples and identified (by X-ray microanalysis) as pores. It is found that, in the entire range of γ under consideration, GaAs films on (111)A substrates have a poorer structural quality and become polycrystalline beginning with a thickness of 150–200 nm.     

Heavily carbon-doped GaAs grown on various oriented GaAs substrates by MOMBE

Heavily carbon-doped GaAs epitaxial layers have been grown simultaneously on (100), (111)A, (111)B, (411)A, (411)B and (711)A semi-insulating (SI) GaAs substrates by metalorganic molecular beam epitaxy (MOMBE) using trimethylgallium (TMG) and elemental As (As₄). The hole concentration and surface flatness strongly depend on the substrate orientation. The highest carbon incorporation was observed for the layers grown on a (411)A substrate with a hole concentration of 1.0 × 10²¹ cm^{− 3} and a lattice mismatch of Δd/d = −0.48%. Atomic force microscope (AFM) images reveal that the epilayers grown on (411)A substrates exhibit extremely flat surfaces, although these layers contain the highest carbon concentration.     

Transmission electron microscopy observation of GaAs/Al0.3Ga0.7As T-shaped quantum well structure fabricated by glancing angle molecular beam epitaxy on GaAs(100) reverse-mesa etched substrates

GaAs/Al_0.3Ga_0.7As multi-layer structures were grown on GaAs (100) reverse-mesa etched substrates by glancing angle molecular beam epitaxy (GA-MBE). A(111)B facet was formed as a side-facet. Surface migration of Ga and Al atoms from the (100) flat region to the (111)B side-facet region has been investigated to fabricate T-shaped GaAs/AlGaAs quantum wells (QWs) under the condition that Ga and Al atoms impinge only an the (100) flat region and do not impinge on the (111)B side-facet. Observation of T-shaped GaAs/AlGaAs quantum wires (QWRs) by cross-sectional transmission electron microscopy (TEM) revealed that there is no migration of Al atoms from the (100) to the (111)B facet region at a substrate temperature (T_s) as high as 630°C, under a V/III ratio of 28 (in pressure ratio). On the other hand, very thin GaAs epitaxial layers grown on the (111)B side-facet region owing to the Ga migration were observed for substrate temperatures of 600 and 630°C. It was found that the mass flow of Ga atoms from the (100) region to the (111)B side-facet region increases, with the thermal activation energy of 2.0 eV, as the substrate temperature increases from 570 to 630°C. The GA-MBE growth on a reverse-mesa etched GaAs substrate at a low temperature 570°C or lower is desirable to fabricate a nm-scale GaAs/AlGaAs QWR structure with nm-scale precision.