直流电弧等离子体喷射法制备氮化碳薄膜研究

以H2、N2和CF4气体为前驱体,用直流电弧等离子体喷射设备在不同基底温度条件下于钼/金刚石过渡层基底上制备了氮化碳薄膜.利用扫描电子显微镜(SEM)、能谱仪(EDS)、X射线衍射仪(XRD)对表面形貌和组织成分进行了表征.结果表明,当基底温度为900℃时,所沉积材料已初具晶型;所沉积材料含有α-C3N4和β-C3N4相成分.同时,提出在金刚石表面制备氮化碳时金刚石相刻蚀和氮化碳相生长同时进行的模型,较好地解释了不同基底温度条件下的膜材料沉积现象.     

热丝辅助射频CVD C3N4薄膜

采用热丝辅助射频等离子体增强化学气相沉积(CVD)方法直接在Si(100)衬底上制备了多晶C3N4薄膜.X射线衍射(XRD)测试表明薄膜同时含有α-C3N4和β-C3N4晶相以及未知结构.傅立叶变换红外吸收谱(FTIR)表明薄膜内的C-N, C＝N和 C≡N 键的吸收峰分别位于1237,1625和2191cm-1.利用扫描电子显微镜(SEM)观测到线度约为2μm、横截面为六边形的β-C3N4晶粒.纳米压痕法测得薄膜的硬度最高可达72.66GPa.     

结晶β-C3N4薄膜的制备和特性研究

用电子回旋共振等离子体化学汽相沉积(ECR CVD)法, 在单晶硅(100)衬底上沉积生长出了具有{221}结构特性的连续的结晶态β-C3N4薄膜.使用扫描电镜(SEM)观测了沉积薄膜的形态;采用X射线光电子光谱(XPS),X射线衍射(XRD)和拉曼散射表征薄膜的结构.研究表明,沉积结晶态β- C3N4薄膜具有{221}结构特性.     

类石墨氮化碳薄膜的电化学沉积

用1:1.5的三聚氯氰和三聚氰胺的饱和乙腈溶液为沉积液,在Si(100)衬底上室温常压下电化学沉积了CNx薄膜.用X射线光电子能谱(XPS)、傅立叶转换红外光谱(FTIR)、X射线衍射图谱(XRD)对沉积的CNx薄膜进行了测试和分析.XRD的衍射峰的结构数据与文献计算的类石墨相氮化碳的结构数据较为吻合.XPS结果表明沉积的薄膜中主要元素为C、N,且N/C=0.81,C1s和N1s的结合能谱中287.84eV的碳和400.00eV的氮是样品中碳氮的主体,以C3N3杂环的形式存在.FTIR光谱中在800cm-1、1310cm-1和1610cm-1的吸收峰也表明薄膜中存在C3N3环,和XPS能谱的分析结果一致.Teter和Hemley预言的g-C3N4在结构形式上和三聚氰胺的完美脱胺缩聚物是一样的,红外光谱和X射线光电子能谱表明在样品中存在三嗪环(C3N3),支持XRD的实验结果.这说明CNx薄膜中有类石墨相的C3N4晶体存在.     

热熔还原法制备超硬复合相氮化碳及其工艺探索

本文采用热熔还原法,以聚氯乙烯、氯化铵、氧化铁为原料制备复合超硬相氮化碳(α/β-C3 N4).采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)以及透射电子显微镜(TEM)对样品进行表征.在此基础上分析了不同温度和原料配比下合成复合相C3 N4的物相组成及形貌变化.结果表明样品形貌随着原料配比的不同在颗粒、棒状、纳米线之间转变.当C、N和Fe之间摩尔比为3:4:0.4时,所制备出的样品呈纳米线状,纳米线的直径约为15 nm,结晶性良好.而在其它配比下,只能获得棒状或颗粒状α/β复合相C3 N4.     

反应温度和锆英石添加量对石英碳热还原氮化产物的影响

本研究中选用石英和焦炭为原料、天然锆英石为添加剂,采用XRD、SEM和EDS等分析方法,研究了反应温度和锆英石添加量对石英碳热还原氮化产物影响.研究结果表明:在0.13 MPa的流动氮气气氛中,反应温度在1450～1550℃时,石英的碳热还原氮化产物中含有Si2N2O、β-SiC和β-Si3N4物相;当反应温度为1600℃时,石英的碳热等在1600℃条件下,石英碳热还原氮化产物主要含有柱状β-Si3N4和少量纤维状β-SiC物相;当添加10wt;的天然锆英石时,产物的主要成分为β-Si3N4 、ZrN以及少量βSiC物相;当锆英石添加量为20wt;到50wt;时,产物中不仅含有β-Si3N4和ZrN物相,还存在c-ZrO2,m-ZrO2,Si2N2O及β-SiC等物相.     

AlN/Si(100)上CVD SiC薄膜的光致发光谱

本工作用化学气相淀积方法在AlN/Si(100)复合衬底上生长SiC薄膜.外延生长过程中,采用C4H4和SiH4作为反应气源,H2作为载气.样品的X-射线衍射谱和拉曼散射谱显示,所得到的外延层为六角对称的SiC薄膜.俄歇电子能谱及X-射线光电子能谱的测量结果表明,在外延膜中存在来自衬底的Al和N元素.样品的光致发光测量显示,所有的样品均可在室温下观察到位于3.03eV和3.17eV处的发光峰,这分别相应于4H-SiC能带中电子从导带到Al受主能级之间的辐射跃迁和电子从N施主能级到价带之间的辐射跃迁,从而表明所得的外延薄膜的多形体为4H-SiC.     

不同碳硅比稻壳对原位制备多孔Si3N4陶瓷的影响

以不同C/SiO2的碳化稻壳为硅源、碳源和成孔剂,添加α-Si3N4和少量烧结助剂,利用碳热还原氮化法原位制备多孔氮化硅陶瓷,研究了不同C/SiO2和烧结温度对多孔陶瓷相组成、显气孔率、抗弯强度和微观结构等性能的影响.结果表明:当选用碳化稻壳C/SiO2(质量比)为0.5和0.7时,在1450 ～ 1500℃的试样中有α-Si3N4和β-Si3N4,在1550℃的试样中只有β-Si3N4.C/SiO2为0.7、1450～1550℃下制备出多孔氮化硅陶瓷,其气孔率为52.53; ～38.48;,抗弯强度为44.07～83.40MPa;1550℃制备的多孔β-Si3N4陶瓷中孔隙分布均匀,孔径约为2μm,β-Si3N4呈团簇状生长,长径比约为6～8.     

碳热还原氮化法制备β-Sialon粉体的研究

采用山西大同土为主要原料,利用碳热还原氮化法(CRN)制备了β-Sialon材料,并利用SEM、XRD等检测手段对其进行了检测分析.研究了温度、N2流量、保温时间以及配碳量等因素对制备β-Sialon的影响,采用正交设计的方法确定了反应的最佳工艺参数,并在此基础上讨论了α-Si3N4晶种对生成产物的影响.实验结果表明,烧结温度为1500℃,氮气流量为1 L/min,保温时间为2 h,配碳量为0.8化学计量时可以生成较多的β-Sialon相.SEM微观形貌表明具有一定长径比的β-Sialon柱状晶呈均匀分布.此外,加入3;的晶种α-3N4可促使晶粒大小均匀并获得高品质细密结构的粉体.     

介孔石墨相氮化碳制备及其催化应用研究进展

石墨相氮化碳(g-C3N4)是一种新型的非金属半导体光催化剂,具有良好的热稳定性和化学稳定性.近年来,许多研究聚焦于在g-C3N4基体中构建介孔结构.此类介孔石墨相氮化碳(mpg-C3N4)具有较大比表面积,并在催化领域得到广泛应用.本文综述了mpg-C3N4的结构、制备方法,并详细介绍了mpg-C3N4在催化领域的应用.未来,构建有序介孔结构及提高其光催化性能依然是mpg-C3N4领域的研究重点.     

Gadolinium nitride films deposited using a PEALD based process

Gadolinium nitride films have been deposited on Si(100) using a plasma-enhanced ALD (PEALD) based process. The deposition was carried out using tris(methylcyclopentadienyl)gadolinium {Gd(MeCp)₃} and remote nitrogen plasma, separated by argon pulses. Films were deposited at temperatures between 150 and 300 °C and capped with tantalum nitride to prevent post-deposition oxidation. Film composition was initially assessed using EDX and selected samples were subsequently depth profiled using medium energy ion scattering (MEIS) or AES. X-ray diffraction appears to show that the films are effectively amorphous. Films deposited at 200 °C were found to have a Gd:N ratio close to 1:1 and a low oxygen incorporation (～5%). Although the growth was affected by partial thermal decomposition of the Gd(MeCp)₃, it was still possible to obtain smooth (Ra.=～0.7 nm) films with good thickness uniformity (97%). Less successful attempts to deposit gadolinium nitride using thermal ALD with ammonia or mono-methyl-hydrazine are also reported.     

High-density silicon and silicon nitride cones

High-density cone-shaped silicon and silicon nitride have been synthesized on Si(1 0 0) substrates via plasma-assisted hot-filament chemical vapor deposition using a gas mixture of nitrogen, hydrogen and methane. Aligned silicon cones containing 3–10 at% C and N have been formed with less than 1 h growth. Further growth can lead to the increase of cone size and density, as well as to the formation of polycrystalline silicon nitride films on the tip and surface. The formation of these materials is thought to be due to the remodification of Si substrates under the effect of plasma and active C and N species. Different nucleation and growth styles were obtained under different growth conditions and reactive gas mixtures.     

Correlation between nitrogen incorporation and structural modification of hydrogenated carbon nitride films

The growth and microstructure of hydrogenated carbon nitride a-CN_x:H (0 ? x ? 0.10) films deposited by PECVD have been studied. Upon the analysis of FTIR spectra, Raman spectra and XPS, it is concluded that π doping could take place even at a very low percentage of nitrogen, which favors the formation of sp² carbon clusters. The C 1s peak shifts toward higher binding energy while the N 1s peak remains constant as the nitrogen content in the film increases, which can be considered as a result of the chemical shifts on charge transfer due to the strong electronegativity of the N atom. 3D profile measurements show that there were a great number of particles formed when nitrogen is incorporated in to the films and the particles coalescence when the nitrogen content increases due to enhanced surface diffusion. The stress of the films converts from compressive to tensile stress gradually with increased N content. The elimination of grain boundaries and annihilation of excess vacancies, due to columnar structure increasing by diffusion leads to volume shrinkage of the film, thus causing tensile stress. These analyses were fairly consistent to help understand the effects of nitrogen in hydrogenated carbon films.     

1H-1,2,3-triazole,a promising precursor for chemical vapor deposition of hydrogenated carbon nitride

Well-crystallized hydrogenated carbon nitride thin films have been prepared by microwave plasma enhanced chemical vapor deposition (MWPECVD). 1H-1,2,3-triazole+N₂ and Si (1 0 0) were used as precursor and substrate, respectively. Substrate temperature during the deposition was recorded to be 850 °C. The synthesized samples were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and X-ray photo-electron spectroscopy (XPS) analyses. The plasma compositions were checked by optical emission spectroscopy (OES). XRD observation strongly suggests that the films contain polycrystalline carbon nitride with graphitic structure of (1 0 0), (0 0 2), (2 0 0) and (0 0 4). XPS peak quantification reveals that the atomic ratio of the materials C:N:O:Si is 32:41:18:9. X-ray photo-electron peak deconvolution shows that the most dominant peak of C (1s) and N (1s) narrow scans correspond to sp² hybrid structure of C₃N₄. These observations indicate that 1H-1,2,3-triazole favors the formation of hydrogenated carbon nitride with graphitic phase by CVD method and thus is in good agreement with XRD results. SEM of surface and OES of plasma also support the formation of polycrystalline carbon nitride films from 1H-1,2,3-triazole+N₂ by CVD.     

Dielectric properties of Zr-Sn-Ti-O thin films prepared by pulsed laser deposition

Zr_0.26Sn_0.23Ti_0.51O₂ (ZSTO) films with a dielectric constant of about 40 have been prepared directly on silicon substrates by pulsed laser deposition at 600 °C. TEM observation showed that the as-deposited films are amorphous. Differential thermal analysis showed that the ZSTO films crystallize at about 620 °C. Capacitance-voltage (C-V) characteristics of metal-oxide-semiconductor (MOS) composed of Pt/ZSTO/Si prepared at different deposition temperature have been measured. The EOT of the MOS structures with the same ZSTO physical thickness increased slightly when the deposition temperature increased. The EOT is about 4.2 nm for the 40 nm ZSTO deposited at 600 °C. The leakage current characteristics of ZSTO films for the as deposited, post-annealed in oxygen ambient and post-annealed in nitrogen ambient by rapid thermal annealing have been studied comparatively. The films post-annealed in nitrogen ambient have the lowest leakage current and the as-deposited films have the largest leakage current characteristics. It is proposed that amorphous Zr-Sn-Ti oxide stabilized at 600 °C is a potential dielectric material for dynamic random access memory and high k dielectric gate applications.     

Effect of deposition pressure on microstructure and properties of hydrogenated carbon nitride films prepared by DC-RF-PECVD

Hydrogenated carbon nitride (a-CN:H films) were deposited on n-type (1 0 0) silicon substrates making use of dual direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), at working pressure of 2–20 Pa, using a mixed gas of CH₄ and N₂ as the source gas. The growth rate, composition, bonding structure of the deposited films were characterized by means of XPS and FTIR, and the mechanical properties of the deposited films were investigated by nano-indentation test. It was found that the parameters for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The growth rate of the deposited films increased at first with increasing deposition pressure, then saturated with further increase of the deposition pressure. The N/C ratio inside the deposited films increased with increasing working pressure except that it was as much as 0.50 at a working pressure of 5.0 Pa. The nano-hardness of the films decreased with increasing deposition pressure. CN radicals were remarkably formed in the deposited films at higher pressures, and their contents are related to the nitrogen concentrations in the deposited films.     

Effect of N2/CH4 flow ratio on microstructure and composition of hydrogenated carbon nitride films prepared by a dual DC-RF plasma system

Hydrogenated carbon nitride (a-CN:H) films were deposited on n-type (1 0 0) silicon substrates making use of direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), using a gas mixture of CH₄ and N₂ as the source gas in range of N₂/CH₄ flow ratio from 1/3 to 3/1 (sccm). The deposition rate, composition and bonding structure of the a-CN:H films were characterized by means of X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectrometry (FTIR). The mechanical properties of the deposited films were evaluated using nano-indentation test. It was found that the parameter for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The deposition rate of the films decreased clearly, while the N/C ratio in the films increased with increasing N₂/CH₄ flow ratio. CN radicals were remarkably formed in the deposited films at different N₂/CH₄ flow ratio, and their contents are related to the nitrogen concentrations in the deposited films. Moreover, the hardness and Young’s modulus of the a-CN:H films sharply increased at first with increasing N₂/CH₄ flow ratio, then dramatically decreased with further increase of the N₂/CH₄ flow ratio, and the a-CN:H film deposited at 1/1 had the maximum hardness and Young’s modulus. In addition, the structural transformation from sp³-like to sp²-like carbon-nitrogen network in the deposited films also was revealed.