Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Epoxy resins from novel monomers with a bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐) substituent

A new diepoxide and a new diamine, both bearing bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐)‐substituted methylene linkages, were prepared through the reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide with benzophenone derivatives via a simple addition reaction followed by a dehydration reaction. These two compounds were used as monomers for preparing cured epoxy resins with high phosphorus contents. The resultant epoxy resins showed high glass‐transition temperatures (between 131 and 196 °C). All of the cured epoxy resins exhibited high thermal stability, with 5% weight loss temperatures over 316 °C, and excellent flame retardancy, with limited oxygen index values of 37–50. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 359–368, 2002     

Flame‐retardant epoxy resins: An approach from organic–inorganic hybrid nanocomposites

Phosphorus‐containing epoxy‐based epoxy–silica hybrid materials with a nanostructure were obtained from bis(3‐glycidyloxy)phenylphosphine oxide, diaminodiphenylmethane, and tetraethoxysilane in the presence of the catalyst p‐toluenesulfonic acid via an in situ sol–gel process. The silica formed on a nanometer scale in the epoxy resin was characterized with Fourier transform infrared, NMR, and scanning electron microscopy. The glass‐transition temperatures of the hybrid epoxy resins increased with the silica content. The nanometer‐scale silica showed an enhancement effect of improving the flame‐retardant properties of the epoxy resins. The phosphorus–silica synergistic effect on the limited oxygen index (LOI) enhancement was also observed with a high LOI value of 44.5. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 986–996, 2001     

Poly(silarylene–siloxane)polyimides from allyl‐terminated oligoimides and hydride‐functional silarylene–siloxanes via hydrosilylation polymerization

This research was focused on the design and execution of new synthetic routes to low‐temperature‐curable poly(silarylene–siloxane)polyimides. The synthesis of individual oligoimide and silarylene–siloxane blocks was followed by hydrosilylation polymerization to produce crosslinked copolymers. The silarylene–siloxane and polyimide blocks were structurally characterized by IR and ¹H NMR spectroscopy and size exclusion chromatography. The high‐temperature resistance of the copolymers was evaluated through the measurement of heat distortion temperatures (T_HD's) via thermomechanical analysis and by the determination of the weight loss at elevated temperatures via thermogravimetric analysis. Glass‐transition temperatures (T_g's) of the silarylene–siloxane segments were measured by differential scanning calorimetry. Hydrosilylation curing was conducted at 60 °C in the presence of chloroplatinic acid (H₂PtCl₆). The copolymers displayed both high‐temperature resistance and low‐temperature flexibility. We observed T_g of the silarylene–siloxane segment as low as ?77 °C and T_HD of the polyimide segment as high as 323 °C. The influence of various oligoimide molecular weights on the properties of copolymers containing the same silarylene–siloxane was examined. The effect of various silarylene–siloxane molecular weights on the properties of copolymers containing the same oligoimide was also examined. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4922–4932, 2005     

Preparation and properties of novel benzoxazine and polybenzoxazine with maleimide groups

A benzoxazine compound with a maleimide group, 3‐phenyl‐3,4‐dihydro‐2H‐6‐(N‐maleimido)‐1,3‐benzoxazine (HPM‐Ba), was prepared from N‐(4‐hydroxyphenyl)maleimide, formaldehyde, and aniline. The chemical structure of HBM‐Ba was identified by FT‐IR, ¹H‐NMR, and elemental analysis. HPM‐Ba showed a melting point of 52–55 °C and good solubility in common organic solvents. HPM‐Ba showed a two‐stage process of thermal polymerization. The first stage arose from the polymerization of maleimide groups, and the second one was the ring‐opening reaction of benzoxazine groups. Fusible polymaleimides with a Tg of around 100 °C could be obtained by thermally polymerizing HPM‐Ba at 130 °C. Further polymerizing the polymaleimides at 240 °C resulted in a completely cured resin showing a Tg at 204 °C. Good thermal stability and self‐extinguishing behavior was observed with the cured polybenzoxazine resins. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5954–5963, 2004     

Preparation and characterization of multifunctional maleimide macromonomers and their cured resins

Multifunctional compounds with pendent and terminal maleimide groups were prepared through the reaction of 4‐maleimidobenzoic acid and 5‐maleimidoisophthalic acid with diglycidyl ether of bisphenol A. The ratios of the pendent maleimide groups to the terminal maleimide groups in the obtained compounds were varied to tailor the chain length and properties of the maleimide compounds. The maleimide group ratios, determined from differential scanning calorimetry, showed good coincidence with the values calculated from the charged monomer amounts. The good solubility and low softening points of the maleimide compounds indicated their good processability. High glass‐transition temperatures (220 °C) were observed for the cured resins because of the relatively high crosslinking density. The curing reaction, thermal stability, and degradation behavior of the resins were also studied with differential scanning calorimetry and thermogravimetric analysis. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3178–3188, 2004     

Preparation of ABC miktoarm star terpolymer containing poly(ethylene glycol), polystyrene,and poly(tert‐butylacrylate) arms by combining diels–alder reaction,atom transfer radical,and stable free radical polymerization routes

The ABC type miktoarm star terpolymer was prepared utilizing “core‐in” and “core‐out” methods via combination of Diels–Alder reaction (DA), stable free radical polymerization (SFRP), and atom transfer radical polymerization (ATRP). First, in DA reaction, poly(ethylene glycol)‐maleimide (PEG‐maleimide) precursor was reacted with succinic acid anthracen‐9‐ylmethyl ester 3‐(2‐bromo‐2‐methyl‐propionyloxy)‐2‐methyl‐2‐[2‐phenyl‐2‐(2,2,6,6‐tetramethyl‐piperidin‐1‐yloxy)‐ethoxy‐carbonyl]‐propyl ester, 8 , to give DA adduct, 9 , which has appropriate functional groups for SFRP and ATRP. Second, a previously obtained 9 was used as a macroinitiator for SFRP of styrene at 125 °C. As a third step, this PEG‐polystyrene (PEG‐PSt) precursor with a bromine functionality in the core was employed as a macroinitiator for ATRP of tert‐butylacrylate (tBA) in the presence of Cu(I)Br and pentamethyldiethylenetriamine at 80 °C to give ABC type miktoarm star terpolymer (PEG‐PSt‐PtBA) with controlled molecular weight and low polydispersity (M_w/M_n < 1.27). The obtained polymers were characterized by gel permeation chromatography and ¹H NMR. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 499–509, 2006     

Phenolic resins bearing maleimide groups: Synthesis and characterization

Novel phenolic novolac resins, bearing maleimide groups and capable of undergoing curing principally through the addition polymerization of these groups, were synthesized by the polymerization of a mixture of phenol and N‐(4‐hydroxy phenyl)maleimide (HPM) with formaldehyde in the presence of an acid catalyst. The polymerization conditions were optimized to get gel‐free resins. The resins were characterized by chemical, spectral, and thermal analyses. Differential scanning calorimetry and dynamic mechanical analysis revealed an unexpected two‐stage curing for these systems. Although the cure at around 275°C was attributable to the addition polymerization reaction of the maleimide groups, the exotherm at around 150 to 170°C was ascribed to the condensation reaction of the methylol groups formed in minor quantities on the phenyl ring of HPM. Polymerization studies of non‐hydroxy‐functional N‐phenyl maleimides revealed that the phenyl groups of these molecules were activated toward an electrophilic substitution reaction by the protonated methylol intermediates formed by the acid‐catalyzed reaction of phenol and formaldehyde. On a comparative scale, HPM was less reactive than phenol toward formaldehyde. The presence of the phenolic group on N‐phenyl maleimide was not needed for its copolymerization with phenol and formaldehyde. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 641–652, 2000     

High performance thermosets from a curable Diels–Alder polymer possessing benzoxazine groups in the main chain

A high‐molecular‐weight polymer (PBz) possessing reactive benzoxazine groups in the main chain was prepared through the Diels–Alder reaction using bis(3‐furfuryl‐3,4‐dihydro‐2H‐1,3‐benzoxazinyl)isopropane (BPA‐FBz) and bismaleimide (BMI) as monomers. The chemical structure of PBz is characterized with FTIR and ¹H NMR. The polymer PBz was further thermally reacted with a high performance polymer (PBz‐R) through the ring‐opening addition reaction of benzoxazine groups and the addition reaction of maleimide groups. PBz‐R exhibit a high glass transition temperature of 242 °C, good thermal stability, high flame retardancy, high mechanical strength, and great flexibility. Another crosslinked polymer (PBz‐BR) curing from the mixture of BPA‐FBz and BMI was also prepared. The properties of PBz‐BR are also attractive but, however, not as good as what observed with PBz‐R. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 6509–6517, 2008     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Healable network polymers bearing flexible poly(lauryl methacrylate) chains via thermo‐reversible furan‐maleimide diels–alder reaction

A new ATRP initiator containing two furyl rings, namely, bis(furan‐2‐ylmethyl) 2‐bromopentanedioate was synthesized starting from commercially available l ‐glutamic acid as a precursor. Well‐defined bisfuryl‐terminated poly(lauryl methacrylate) macromonomers with molecular weight and dispersity in the range 5000–12,000 g mol^?1 and 1.30–1.37, respectively, were synthesized employing the initiator by atom transfer radical polymerization (ATRP). Independently, 1,1′,1″‐(nitrilotris(ethane‐2,1‐diyl))tris(1H‐pyrrole‐2,5‐dione) was synthesized as a tris‐maleimide counterpart for furan‐maleimide click reaction. Thermo‐reversible network polymer bearing flexible poly(lauryl methacrylate; (PLMA) chains was obtained by furan‐maleimide Diels–Alder click reaction of bisfuryl‐terminated PLMA with 1,1′,1″‐(nitrilotris(ethane‐2,1‐diyl))tris(1H‐pyrrole‐2,5‐dione). The prepared network polymer showed retro‐Diels–Alder reaction in the temperature range 110–170 °C as determined from DSC analysis. The presence of low Tg (–40 °C) PLMA chains induced chain mobility to the network structure which led to the complete scratch healing of the coating at 60 °C in five days due to furan‐maleimide adduct formation. The storage modulus of the network polymer was found to be 3.7 × 10⁴ Pa at the constant angular frequency of 5 rad/sec and strain of 0.5%. The regular reversal of storage (G ′) and loss modulus (G ″) was observed with repeated heating (40 to 110 °C) and cooling cycles (110 to 40 °C) at constant angular frequency and strain. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55 , 2700–2712     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Dynamic mechanical properties of epoxy‐phenolic mixtures

The dynamic‐mechanical properties of different mixtures formed by an epoxy resin (DGEBA type) and a phenolic resin (resole type) cured by trietylenetetramine and/or p‐toluensulphonic acid at different concentrations have been studied by means of dynamic mechanical thermal analysis (DMTA). All samples were cured by pressing at 90 °C during 6 h. The mechanical studies were performed between ?100 to 300 °C at a heating rate of 2 °C/min. This study was also carried out for the epoxy‐TETA and phenolic‐p‐toluensulphonic acid systems. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1548–1555, 2005     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

Structure and properties of PBO–PEO diblock copolymer modified epoxy

Amphiphilic poly(n‐butylene oxide)‐b‐poly(ethylene oxide) (PBO–PEO) diblock copolymers of various compositions were synthesized and studied as modifiers for epoxy resins. In blends of PBO–PEO, epoxy resin, and curing agent, the copolymers formed well‐defined microstructures that persisted upon curing of the epoxy. The resulting morphologies were vesicles, worm‐like micelles, and spherical micelles (in order of increasing size of PEO block), as well as transitional morphologies. Addition of 5% by weight of these block copolymers improved the fracture toughness of the epoxy by as much as 19 times with relatively small reduction in the elastic modulus. The highest level of toughness was measured in a system containing branched worm‐like micelles. Close examination of the fracture surfaces of these compositions suggests that although all the dispersed morphologies played a similar role to inclusions in particle‐toughened thermosets, crack deflection toughening contributed to the significantly higher levels of toughness in the worm‐like micelle systems. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Chem 43: 1950–1965, 2005     

Synthesis and characterization of core–shell‐type polymeric micelles from diblock copolymers via reversible addition–fragmentation chain transfer

A method was developed to enable the formation of nanoparticles by reversible addition–fragmentation chain transfer polymerization. The thermoresponsive behavior of polymeric micelles was modified by means of micellar inner cores and an outer shell. Polymeric micelles comprising AB block copolymers of poly(N‐isopropylacrylamide) (PIPAAm) and poly(2‐hydroxyethylacrylate) (PHEA) or polystyrene (PSt) were prepared. PIPAAm‐b‐PHEA and PIPAAm‐b‐PSt block copolymers formed a core–shell micellar structure after the dialysis of the block copolymer solutions in organic solvents against water at 20 °C. Upon heating above the lower critical solution temperature (LCST), PIPAAm‐b‐PHEA micelles exhibited an abrupt increase in polarity and an abrupt decrease in rigidity sensed by pyrene. In contrast, PIPAAm‐b‐PSt micelles maintained constant values with lower polarity and higher rigidity than those of PIPAAm‐b‐PHEA micelles over the temperature range of 20–40 °C. Structural deformations produced by the change in the outer polymer shell with temperature cycles through the LCST were proposed for the PHEA core, which possessed a lower glass‐transition temperature (ca. 20 °C) than the LCST of the PIPAAm outer shell (ca. 32.5 °C), whereas the PSt core with a much higher glass‐transition temperature (ca. 100 °C) retained its structure. The nature of the hydrophobic segments composing the micelle inner core offered an important control point for thermoresponsive drug release and the drug activity of the thermoresponsive polymeric micelles. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3312–3320, 2006     

N‐methylolmaleimide–benzene photoadduct: A novel monomer for the synthesis of functionally modified polyimides

A novel polycyclic dihydroxy diimide monomer was synthesized through the photocycloaddition of N‐methylolmaleimide to benzene and the reaction of maleimide–benzene photoadduct with formaldehyde. The monomer, which evolved formaldehyde at about 165 °C, was subsequently used to prepare low molecular weight polyamineimides and polyurethaneimides. Soluble polyamineimides, prepared with three different aromatic diamine monomers, exhibited initial decomposition temperatures between 277 and 329 °C and glass‐transition temperatures between 180 and 219 °C. An aliphatic polyamineimide prepared from 1,6‐hexanediamine was insoluble and had glass‐transition and initial decomposition temperatures of 225 °C and 294 °C, respectively, with prior loss of formaldehyde from end groups. Polyurethaneimides prepared with two aromatic diisocyanates showed loss of formaldehyde in the approximate range of 160–169 °C followed by loss of CO₂ and glass‐transition temperatures of 219 and 233 °C. Attempts to prepare polyamideimides resulted in oligomers with a low nitrogen content. Attempts to prepare polyesterimides were unsuccessful. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2645–2651, 2000     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006