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1.
A novel positive‐working and aqueous‐base‐developable photosensitive poly(imide benzoxazole) precursor based on a poly(amic acid hydroxyamide) bearing phenolic hydroxyl groups and carboxylic acid groups, a diazonaphthoquinone (DNQ) photosensitive compound, and a solvent was developed. Poly(amic acid hydroxyamide) was prepared through the polymerization of 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane, trimellitic anhydride chloride, and 4,4′‐oxydibenzoyl chloride. Subsequently, the thermal cyclization of the poly(amic acid hydroxyamide) precursor at 350 °C produced the corresponding poly(imide benzoxazole). The inherent viscosity of the precursor polymer was 0.17 dL/g. The cyclized poly(imide benzoxazole) showed a high glass‐transition temperature of 372 °C and 5% weight loss temperatures of 535 °C in nitrogen and 509 °C in air. The structures of the precursor polymer and the fully cyclized polymer were characterized with Fourier transform infrared and 1H NMR. The photosensitive polyimide precursor containing 25 wt % DNQ photoactive compound showed a sensitivity of 256 mJ/cm2 and a contrast of 1.14 in a 3‐μm film with a 0.6 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from this composition. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5990–5998, 2004  相似文献   

2.
A new bis(o‐aminophenol) with a crank and twisted noncoplanar structure and ether linkages, 2,2′‐bis(4‐amino‐3‐hydroxyphenoxy)biphenyl, was synthesized by the reaction of 2‐benzyloxy‐4‐fluoronitrobenzene with biphenyl‐2,2′‐diol, followed by reduction. Biphenyl‐2,2′‐diyl‐containing aromatic poly(ether benzoxazole)s with inherent viscosities of 0.52–1.01 dL/g were obtained by a conventional two‐step procedure involving the polycondensation of the bis(o‐aminophenol) monomer with various aromatic dicarboxylic acid chlorides, yielding precursor poly(ether o‐hydroxyamide)s, and subsequent thermal cyclodehydration. These new aromatic poly(ether benzoxazole)s were soluble in methanesulfonic acid, and some of them dissolved in m‐cresol. The aromatic poly(ether benzoxazole)s had glass‐transition temperatures of 190–251 °C and were stable up to 380 °C in nitrogen, with 10% weight losses being recorded above 520 °C. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2656–2662, 2002  相似文献   

3.
A novel bis(ether anhydride) monomer, 3,6‐bis(3,4‐dicarboxyphenoxy)benzonorbornane dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile with 3,6‐dihydroxybenzonorbornane in the presence of potassium carbonate, followed by the alkaline hydrolysis of the intermediate bis(ether dinitrile) and the cyclodehydration of the resulting bis(ether diacid). A series of poly(ether imide)s bearing pendant norbornane groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were 0.81–1.81 dL/g. The poly(ether imide) with m‐phenylenediamine as a diamine showed good organosolubility. Most of the cast poly(ether imide) films have had high tensile strengths and moduli. The glass‐transition temperatures of these poly(ether imide)s, except for those from rigid p‐phenylenediamine and benzidine, were recorded between 211 and 246 °C by differential scanning calorimetry. The softening temperatures of all the poly(ether imide) films stayed within 210–330 °C according to thermomechanical analysis. No polymers showed significant decomposition before 500 °C in a nitrogen or air atmosphere. A comparative study of the properties with the corresponding poly(ether imide)s without pendant substituents was also made. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1712–1725, 2002  相似文献   

4.
A novel bis(ether anhydride) monomer, 2′,5′‐bis(3,4‐dicarboxyphenoxy)‐p‐terphenyl dianhydride, was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide ion of 2′,5′‐dihydroxy‐p‐terphenyl, followed by alkaline hydrolysis of the intermediate bis(ether dinitrile) and cyclodehydration of the resulting bis(ether diacid). A series of new poly(ether imide)s bearing laterally attached p‐terphenyl groups were prepared from the bis(ether anhydride) with various aromatic diamines via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by thermal or chemical imidization to the poly(ether imide)s. The inherent viscosities of the poly(amic acid) precursors were in the range of 0.62–1.26 dL/g. Most of the poly(ether imide)s obtained from both routes were soluble in polar organic solvents, such as N,N‐dimethylacetamide. All the poly(ether imide)s could afford transparent, flexible, and strong films with high tensile strengths. The glass‐transition temperatures of these poly(ether imide)s were recorded as between 214 and 276 °C by DSC. The softening temperatures of all the poly(ether imide) films stayed in the 207–265 °C range according to thermomechanical analysis. For all the polymers significant decomposition did not occur below 500 °C in nitrogen or air atmosphere. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 1008–1017, 2004  相似文献   

5.
A new adamantane‐based bis(ether anhydride), 2,2‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]adamantane dianhydride, was prepared in three steps starting from nitrodisplacement of 4‐nitrophthalonitrile with the potassium phenolate of 2,2‐bis(4‐hydroxyphenyl)adamantane. A series of adamantane‐containing poly(ether imide)s were prepared from the adamantane‐based bis(ether anhydride) and aromatic diamines by a conventional two‐stage synthesis in which the poly(ether amic acid)s obtained in the first stage were heated stage‐by‐stage at 150–270°C to give the poly(ether imide)s. The intermediate poly(ether amic acid)s had inherent viscosities between 0.56 and 1.92 dL/g. Except for those from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all the poly(ether amic acid) films could be thermally converted into transparent, flexible, and tough poly(ether imide) films. All the poly(ether imide)s showed limited solubility in organic solvents, although they were amorphous in nature as evidenced by X‐ray diffractograms. Glass transition temperatures of these poly(ether imide)s were recorded in the range of 242–317°C by differential scanning calorimetry and of 270–322°C by dynamic mechanical analysis. They exhibited high resistance to thermal degrdation, with 10% weight loss temperatures being recorded between 514–538°C in nitrogen and 511–527°C in air. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1619–1628, 1999  相似文献   

6.
A new one‐pot procedure for imide–acid monomer synthesis and polymerization is reported for four new poly(amide–imide)s. Bisphenol A dianhydride (BPADA) was reacted with twice the molar amount of 3‐aminobenzoic acid (3ABA) or 3‐amino‐4‐methylbenzoic acid (3A4MBA) in 1‐methyl‐2‐pyrrolidinone (NMP) and toluene mixture, and the amic acid intermediates cyclized in solution to give two diimide‐containing dicarboxylic acid monomers. Without isolation, the diacid monomers were then polymerized with either 1,3‐diaminomesitylene (DAM) or 1,5‐diaminonaphthalene (1,5NAPda) using triphenyl phosphite‐activation to give a series of four soluble poly(amide–imide)s, PAI. Isolation and purification of the dicarboxylic acid monomers was not necessary for formation of high molecular weight polymers as indicated by intrinsic viscosities of 0.64–1.04 dL/g determined in N,N‐dimethylacetamide (DMAc). All of the PAI were soluble in polar aprotic solvents such as NMP, DMAc, and dimethyl sulfoxide (DMSO). Glass transition temperatures ranged from 243 to 279°C by DSC, and 5% weight loss temperatures were above 400°C in both air and nitrogen. Flexible films cast from DMAc were light yellow, transparent, and tough. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1183–1188, 1999  相似文献   

7.
Two series of novel fluorinated poly(ether imide)s (coded IIIA and IIIB ) were prepared from 2,6‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride and 2,7‐bis(3,4‐dicarboxyphenoxy)naphthalene dianhydride, respectively, with various trifluoromethyl‐substituted aromatic bis(ether amine)s by a standard two‐step process with thermal or chemical imidization of the poly(amic acid) precursors. These fluorinated poly(ether imide)s showed good solubility in many organic solvents and could be solution‐cast into transparent, flexible, and tough films. These films were nearly colorless, with an ultraviolet–visible absorption edge of 364–386 nm. They also showed good thermal stability with glass‐transition temperatures of 221–298 °C, 10% weight loss temperatures in excess of 489 °C, and char yields at 800 °C in nitrogen greater than 50%. The 2,7‐substituted IIIB series also showed better solubility and higher transparency than the isomeric 2,6‐substituted IIIA series. In comparison with nonfluorinated poly (ether imide)s, the fluorinated IIIA and IIIB series showed better solubility, higher transparency, and lower dielectric constants and water absorption. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5909–5922, 2006  相似文献   

8.
Two new bis(ether acyl chloride)s, 1,1‐bis[4‐(4‐chloroformylphenoxy)phenyl]‐1‐phenylethane and 1,1‐bis[4‐(4‐chloroformylphenoxy)phenyl]‐1‐phenyl‐2,2,2‐trifluoroethane, were prepared from readily available reagents. Aromatic polybenzoxazoles with both ether and phenylethylidene or 1‐phenyl‐2,2,2‐trifluoroethylidene linkages between phenylene units were obtained by a conventional two‐step procedure including the low‐temperature solution polycondensation of the bis(ether acyl chloride)s with three bis(o‐aminophenol)s, yielding poly(o‐hydroxyamide) precursors, and subsequent thermal cyclodehydration. The intermediate poly(o‐hydroxyamide)s exhibited inherent viscosities of 0.39–0.98 dL/g. All of the poly(o‐hydroxyamide)s were amorphous and soluble in polar organic solvents such as N,N‐dimethylacetamide, and most of them could afford flexible and tough films via solvent casting. The poly(o‐hydroxyamide)s exhibited glass‐transition temperatures (Tg's) of 129–194 °C and could be thermally converted into corresponding polybenzoxazoles in the solid state at temperatures higher than 300 °C. All the polybenzoxazoles were amorphous and showed an enhanced Tg but a dramatically decreased solubility with to respect to their poly(o‐hydroxyamide) precursors. They exhibited Tg's of 216–236 °C through differential scanning calorimetry and were stable up to 500 °C in nitrogen or air, with 10% weight‐loss temperatures being recorded between 538 and 562 °C in nitrogen or air. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 914–921, 2003  相似文献   

9.
A novel series of colorless and highly organosoluble poly(ether imide)s were prepared from 3,3‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]phthalide dianhydride with various fluorinated aromatic bis(ether amine)s via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by cyclodehydration to produce the polymer films. The poly(ether imide)s showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents, in ether‐type solvents, and even in chlorinated solvents. Their films had a cutoff wavelength between 358 and 373 nm, and the yellowness index ranged from 3.1 to 9.5. The glass‐transition temperatures of the poly(ether imide) series were recorded between 237 and 297 °C, the decomposition temperatures at 10% weight loss were all above 494 °C, and the residue was more than 54% at 800 °C in nitrogen. These films showed high tensile strength and also were characterized by higher solubility, lighter color, and lower dielectric constants and moisture absorption than an analogous nonfluorinated polyimide series. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3140–3152, 2006  相似文献   

10.
A series of poly(amide–imide)s IIIa–m containing flexible isopropylidene and ether groups in the backbone were synthesized by the direct polycondensation of 4,4′‐[1,4‐phenylenebis(isopropylidene‐1,4‐phenyleneoxy)]dianiline (PIDA) with various bis(trimellitimide)s IIa–m in N‐methyl‐2‐pyrrolidone (NMP) using triphenyl phosphite and pyridine as condensing agents. The resulting poly(amide–imide)s had inherent viscosities in the range of 0.80–1.36 dL/g. Except for those from the bis(trimellitimide)s of p‐phenylenediamine and benzidine, all the polymers could be cast from DMAc into transparent and tough films. They exhibited excellent solubility in polar solvents. The 10% weight loss temperatures of the polymers in air and in nitrogen were all above 495°C, and their Tg values were in the range of 201–252°C. Some properties of poly(amide–imide)s III were compared with those of the corresponding poly(amide–imide)s V prepared from the bis(trimellitimide) of diamine PIDA and various aromatic diamines. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 69–76, 1999  相似文献   

11.
A series of new poly(imide‐hydrazide)s and poly(amide‐imide‐hydrazide)s were obtained by the direct polycondensation of N‐[p‐(or m‐)carboxyphenyl]trimellitimide (p‐ or m‐CPTMI) with terephthalic dihydrazide (TPH), isophthalic dihydrazide (IPH), and p‐aminobenzhydrazide (p‐ABH) by means of diphenyl phosphite and pyridine in the N‐methyl‐2‐pyrrolidone (NMP) solutions containing dissolved CaCl2. The resulting hydrazide‐containing polymers exhibited inherent viscosities in the 0.15–0.96 dL/g range. Except for that derived from p‐CPTMI with TPH or p‐ABH, the other hydrazide copolymers were readily soluble in polar solvents such as NMP and dimethyl sulfoxide (DMSO). As evidenced by X‐ray diffraction patterns, the hydrazide copolymer obtained from TPH showed a moderate level of crystallinity, whereas the others were amorphous in nature. Most of the amorphous hydrazide copolymers formed flexible and tough films by solvent casting. The amorphous hydrazide copolymers had glass‐transition temperatures (Tg) between 187 and 233 °C. All hydrazide copolymers could be thermally converted into the corresponding oxadiazole copolymers approximately in the region of 250–400 °C, as evidenced by the DSC thermograms. The oxadiazole copolymers showed a significantly decreased solubility when compared to their respective hydrazide precursors. They exhibited Tg's of 264–302 °C and did not show dramatic weight loss before 400 °C in air or nitrogen. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1599–1608, 2000  相似文献   

12.
Biodegradable poly(tert‐butyl acrylate)–poly[(R)‐3‐hydroxybutyrate]–poly (tert‐butyl acrylate) triblock copolymers based on bacterial poly[(R)‐3‐hydroxybutyrate] (PHB) were synthesized by atom transfer radical polymerization. The chain architectures of the triblock copolymers were confirmed by 1H NMR and 13C NMR spectra. Gel permeation chromatography analysis was used to estimate the molecular weight characteristics and lengths of the PHB and poly(tert‐butyl acrylate) blocks of the copolymers. The thermal properties of the copolymers were studied by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). TGA showed that the triblock copolymers underwent stepwise thermal degradation and had better thermal stability than their respective homopolymers, whereas DSC analyses showed that a microphase‐separation structure was formed only in the triblock copolymers with the longer PHB block. As a similar result, from wide‐angle X‐ray diffraction experimentation, the crystalline phase of PHB could not be seen evidently in the triblock copolymers with the shorter PHB block. The enzymatic hydrolysis of the copolymer films was carried at 37 °C and pH 7.4 in a potassium phosphate buffer with an extracellular PHB depolymerase from Penicillum sp. The biodegradability of the triblock copolymers increased with an increase in the PHB block content. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4857–4869, 2005  相似文献   

13.
A spirobichroman structure-containing diether anhydride (SBCDA), 6,6′-bis(3,4-dicarboxyphenoxy)-4,4,4′,4′,7,7′-hexamethyl-2,2′-spirobichroman dianhydride, was prepared by the nucleophilic nitrodisplacement of 4-nitrophthalonitrile with the phenolate ion of 6,6′-dihydroxy-4,4,4′,4′,7,7′-hexamethyl-2,2′-spirobichroman, followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetraacid. A series of high molecular weight poly(ether imide)s with inherent viscosities between 0.45 and 1.28 dL/g were synthesized from SBCDA and various aromatic diamines via a conventional two-stage procedure that included ring-opening polyaddition in N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclization to poly(ether imide)s. The intermediate poly(amic acid)s had inherent viscosities of 0.70–1.50 dL/g. Except for the poly(ether imide) obtained from p-phenylenediamine, the other poly(ether imide)s were soluble in various organic solvents and could be solution-cast into transparent, flexible, and tough films. These poly(ether imide)s had glass transition temperatures in the range 175–262°C and showed no significant decomposition below 420°C, with 10% weight loss being recorded above 446°C in nitrogen or air. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 2801–2809, 1997  相似文献   

14.
A novel bis(ether anhydride) monomer, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride (4), was synthesized from the nitrodisplacement of 4‐nitrophthalonitrile by the bisphenoxide ion of 9,9‐bis(4‐hydroxyphenyl)fluorene (1), followed by alkaline hydrolysis of the intermediate tetranitrile and dehydration of the resulting tetracarboxylic acid. A series of poly(ether imide)s bearing the fluorenylidene group were prepared from the bis(ether anhydride) 4 with various aromatic diamines 5a–i via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s 6a–i followed by thermal cyclodehydration to the polyimides 7a–i. The intermediate poly(amic acid)s had inherent viscosities in the range of 0.39–1.57 dL/g and afforded flexible and tough films by solution‐casting. Except for those derived from p‐phenylenediamine, m‐phenylenediamine, and benzidine, all other poly(amic acid) films could be thermally transformed into flexible and tough polyimide films. The glass transition temperatures (Tg) of these poly(ether imide)s were recorded between 238–306°C with the help of differential scanning calorimetry (DSC), and the softening temperatures (Ts) determined by thermomechanical analysis (TMA) stayed in the range of 231–301°C. Decomposition temperatures for 10% weight loss all occurred above 540°C in an air or a nitrogen atmosphere. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1403–1412, 1999  相似文献   

15.
A series of poly(trimethylenecarbonate‐ε‐caprolactone)‐block‐poly(p‐dioxanone) copolymers were prepared with varying feed rations by using two step polymerization reactions. Poly(trimethylenecarbonate)(ε‐caprolactone) random copolymer was synthesized with stannous‐2‐ethylhexanoate and followed by adding p‐dioxanone monomer as the other block. The ring opening polymerization was carried out at high temperature and long reaction time to get high molecular weight polymers. The monofilament fibers were obtained using conventional melting spun methods. The copolymers were identified by 1H and 13C NMR spectroscopy and gel permeation chromatography (GPC). The physicochemical properties, such as viscosity, molecular weight, melting point, glass transition temperature, and crystallinity, were studied. The hydrolytic degradation of copolymers was studied in a phosphate buffer solution, pH = 7.2, 37 °C, and a biological absorbable test was performed in rats. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2790–2799, 2005  相似文献   

16.
A series of poly(ether imide)s (PEIs), III a–k , with light color and good physical properties were prepared from 1,4‐bis(3,4‐dicarboxypheoxy)‐2,5‐di‐tert‐butylbenzene dianhydride ( I ) with various aromatic diamines ( II a–k ) via a conventional two‐stage procedure that included a ring‐opening polyaddition to yield poly(amic acid)s (PAA), followed by thermal imidization to the PEI. The intermediate PAA had inherent viscosities in the range of 1.00–1.53 dL g?1. Most of the PEIs showed excellent solubility in chlorinated solvents such as dichloromethane, chloroform, and m‐cresol, but did not easily dissolve in dimethyl sulfoxide and amide‐type polar solvents. The III series had tensile strengths of 96–116 MPa, an elongation at break of 7–8%, and initial moduli of 2.0–2.5 GPa. The glass‐transition temperatures (Tg) and softening temperatures (Ts's) of the III series were recorded between 232 and 285 °C and 216–279 °C, respectively. The decomposition temperatures for 10% weight loss all occurred above 511 °C in nitrogen and 487 °C in air. The III series showed low dielectric constants (2.71–3.54 at 1 MHz), low moisture absorption (0.18–0.66 wt %), and was light‐colored with a cutoff wavelength below 380 nm and a low yellow index (b*) values of 7.3–14.8. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 1270–1284, 2005  相似文献   

17.
A series of new poly(amide–imide)s (PAIs, series III ) with good processability and characteristics was synthesized by utilizing organosoluble polyimide (PI, 6FDA–PI series) to improve poor‐solubility polyamide (PA, PTPA series), which used terephthalic acid (TPA) as a monomer. The III series PAIs were synthesized starting from the 2 : 1 molar ratio of aromatic diamines ( I ) and 6FDA to prepare imide ring‐preformed diamines ( II ) and then reacted with equimolar amount of TPA by direct polycondensation. Furthermore, by adjustment of the stoichiometry of the I , II, and TPA monomers, PAIs IV having various components were prepared. Most of the resulting PAIs having inherent viscosities between 0.70 and 1.74 dL/g were obtained in quantitative yields, and they were readily soluble in polar solvents such as N,N‐dimethylacetamide, N‐methyl‐2‐pyrrolidone, dimethylformamide, and dimethyl sulfoxide. All of the soluble PAIs afforded transparent, flexible, and tough films. The glass‐transition temperatures of PAIs III were in the range of 236–256 °C, and the 10% weight loss temperatures were recorded at 522–553 °C in nitrogen. The char yields of the III series polymers in nitrogen atmosphere were all higher than 56% even at 800 °C. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 93–104, 2001  相似文献   

18.
To prepare thermally stable and high‐performance polymeric films, new solvent‐soluble aromatic polyamides with a carbamoyl pendant group, namely poly(4,4′‐diamino‐3′‐carbamoylbenzanilide terephthalamide) (p‐PDCBTA) and poly(4,4′‐diamino‐3′‐carbamoylbenzanilide isophthalamide) (m‐PDCBTA), were synthesized. The polymers were cyclized at around 200 to 350 °C to form quinazolone and benzoxazinone units along the polymer backbone. The decomposition onset temperatures of the cyclized m‐ and p‐PDCBTAs were 457 and 524 °C, respectively, lower than that of poly(p‐phenylene terephthalamide) (566 °C). For the p‐PDCBTA film drawn by 40% and heat‐treated, the tensile strength and Young's modulus were 421 MPa and 16.4 GPa, respectively. The film cyclized at 350 °C showed a storage modulus (E′) of 1 × 1011 dyne/cm2 (10 GPa) over the temperature range of room temperature to 400 °C. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 775–780, 2000  相似文献   

19.
A series of novel aromatic poly(ether imide)s (PEI) containing ortho‐catenated phenylene rings and pendant trifluoromethyl group have been prepared from 1,2‐bis(3,4‐dicarboxyphenoxy)benzene dianhydride (1) with seven trifluoromethyl‐substituted aromatic bis(ether amine)s ( 2a‐g ) via a conventional two‐stage process that included ring‐opening polyaddition to form the poly(amic acid)s followed by chemical imidization to the polyimides. These PEIs had inherent viscosities in the range of 0.45–1.17 dL/g that corresponded to weight–average and number–average molecular weights (by gel‐permeation chromatography) of 42,000–102,000 and 28,500–67,500, respectively. All the PEIs were readily soluble in many organic solvents and could be solution‐cast into transparent, flexible, and strong films. These films were essentially colorless; they had a very low yellowness index of 4.34–6.55 and an UV–vis absorption cut‐off wavelength at 361–370 nm. The PEIs exhibited moderate‐to‐high glass‐transition temperatures (Tg) in the range of 185–270 °C, softening temperatures (Ts) in the range of 184–275 °C, and 10% weight loss temperatures higher than 466 °C in nitrogen or in air. They also showed low moisture absorptions of 0.49–0.70% and low dielectric constants of 2.78–3.26 (measured at 10 kHz). © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3092–3102, 2006  相似文献   

20.
Benzoxazine monomer (Ba) was blended with soluble poly(imide‐siloxane)s in various weight ratios. The soluble poly(imide‐siloxane)s with and without pendent phenolic groups were prepared from the reaction of 2,2′‐bis(3,4‐dicarboxylphenyl)hexafluoropropane dianhydride with α,ω‐bis(aminopropyl)dimethylsiloxane oligomer (PDMS; molecular weight = 5000) and 3,3′‐dihydroxybenzidine (with OH group) or 4,4′‐diaminodiphenyl ether (without OH group). The onset and maximum of the exotherm due to the ring‐opening polymerization for the pristine Ba appeared on differential scanning calorimetry curves around 200 and 240 °C, respectively. In the presence of poly(imide‐siloxane)s, the exothermic temperatures were lowered: the onset to 130–140 °C and the maximum to 210–220 °C. The exotherm due to the benzoxazine polymerization disappeared after curing at 240 °C for 1 h. Viscoelastic measurements of the cured blends containing poly(imide‐siloxane) with OH functionality showed two glass‐transition temperatures (Tg's), at a low temperature around ?55 °C and at a high temperature around 250–300 °C, displaying phase separation between PDMS and the combined phase consisting of polyimide and polybenzoxazine (PBa) components due to the formation of AB‐crosslinked polymer. For the blends containing poly(imide‐siloxane) without OH functionalities, however, in addition to the Tg due to PDMS, two Tg's were observed in high‐temperature ranges, 230–260 and 300–350 °C, indicating further phase separation between the polyimide and PBa components due to the formation of semi‐interpenetrating networks. In both cases, Tg increased with increasing poly(imide‐siloxane) content. Tensile measurements showed that the toughness of PBa was enhanced by the addition of poly(imide‐siloxane). Thermogravimetric analysis showed that the thermal stability of PBa also was enhanced by the addition of poly(imide‐siloxane). © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2633–2641, 2001  相似文献   

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