Effect of substrate temperature and annealing temperature on the structural, electrical and microstructural properties of thin Pt films by rf magnetron sputtering

Influence of both substrate temperature, T_s, and annealing temperature, T_a, on the structural, electrical and microstructural properties of sputtered deposited Pt thin films have been investigated. X-ray diffraction results show that as deposited Pt films (T_s = 300, 400 °C) are preferentially oriented along (1 1 1) direction. A little growth both along (2 0 0) and (3 1 1) directions are also noticed in the as deposited Pt films. After annealing in air (T_a = 500-700 °C), films become strongly oriented along (1 1 1) plane. With annealing temperature, average crystallite size, D, of the Pt films increases and micro-strain, e, and lattice constant, a₀, decreases. Residual strain observed in the as deposited Pt films is found to be compressive in nature while that in the annealed films is tensile. This change in the strain from compressive to tensile upon annealing is explained in the light of mismatch between the thermal expansion coefficients of the film material and substrate. Room temperature resistivity of Pt films is dependant on both the T_s and T_a of the films. Observed decrease in the film resistivity with T_a is discussed in terms of annihilation of film defects and grain-boundary. Scanning electron microscopic study reveals that as the annealing temperature increases film densification improves. But at an annealing temperature of ∼600 °C, pinholes appear on the film surface and the size of pinhole increases with further increase in the annealing temperature. From X-ray photoelectron spectroscopic analysis, existence of a thin layer of chemisorbed atomic oxygen is detected on the surfaces of the as deposited Pt films. Upon annealing, coverage of this surface oxygen increases.     

Effect of annealing temperature for Si0.8Ge0.2 epitaxial thin films

This study investigates the effect of annealing temperature on the Si_0.8Ge_0.2 epitaxial layers. The Si_0.8Ge_0.2 epitaxial layers were deposited by using ultrahigh vacuum chemical vapor deposition (UHVCVD) with different annealing temperatures (400-1000 °C). Various measurement technologies, including high-resolution X-ray diffraction (HRXRD), atomic force microscopy (AFM) and interfacial adhesion tester, were used to characterize the materials properties of the SiGe epilayers. The experimental results showed that the SiGe epilayers gradually reduced lattice-mismatch to the underlying substrate as annealing temperature increased (from 400 to 800 °C), which resulted from a high temperature enhancing interdiffusion between the epilayers and the underlying substrate. In addition, the average grain size of the SiGe films increased from 53.3 to 58 nm with increasing annealing temperature. The surface roughness in thin film annealed at 800 °C was 0.46 nm. Moreover, the interfacial adhesion strength increased from 476 ± 9 to 578 ± 12 kg/cm² with increasing the annealing temperature.     

Magnetic and optical properties of self-organized InMnAs quantum dots

Ten layers of self-assembled InMnAs quantum dots with InGaAs barrier were grown on high resistivity (1 0 0) p-type GaAs substrates by molecular beam epitaxy (MBE). The presence of ferromagnetic structure was confirmed in the InMnAs diluted magnetic quantum dots. The ten layers of self-assembled InMnAs quantum dots were found to be semiconducting, and have ferromagnetic ordering with a Curie temperature, T_C=80 K. It is likely that the ferromagnetic exchange coupling of sample with T_C=80 K is hole mediated resulting in Mn substituting In and is due to the bound magnetic polarons co-existing in the system. PL emission spectra of InMnAs samples grown at temperature of 275, 260 and 240 °C show that the interband transition peak centered at 1.31 eV coming from the InMnAs quantum dot blueshifts because of the strong confinement effects with increasing growth temperature.     

The influence of substrate temperature and annealing on the properties of pulsed laser-deposited YIG films on fused quartz substrate

Yttrium iron garnet (YIG) thin films were deposited on fused quartz substrate at different substrate temperatures (T_s) varying from room temperature (RT) to 850 °C using pulsed laser deposition (PLD) technique. All the films in the as-deposited state were X-ray amorphous and non-magnetic at RT. The film deposited at RT after annealing at temperatures T_a?700 °C showed both X-ray peaks and the magnetic order. The films deposited at higher T_s (500–850 °C) and then annealed at 700 °C resulted in better-quality films with higher 4πM_s value. The highest value of magnetization was for the sample deposited at 850 °C and annealed at 700 °C, which is 68% of the bulk 4πM_s value.     

Magnetic behavior of MnAs precipitates in Ga1−xMnxAs diluted magnetic semiconductor

Ferromagnetic Ga_1−xMn_xAs layers (where x≈4.7–5.5%) were grown on (1 0 0) GaAs substrates by molecular beam epitaxy. These p-type (Ga,Mn)As films were revealed to have a ferromagnetic structure and ferromagnetism is observed up to a Curie temperature of 318 K, which is ascribed to the presence of MnAs secondary magnetic phases within the film. It is highly likely that the phase segregation occurs due to the high Mn cell temperature around 890–920 °C, as it is well established that GaMnAs is unstable at such a high temperature. The MnAs precipitate in the samples with x≈4.7–5.5% has a Curie temperature T_c≈318 K, which was characterized from field-cooled and zero-field-cooled magnetization curves.     

Possible origin of room-temperature ferromagnetism in undoped GaN epilayers implanted with Mn ions

Manganese ions were implanted into unintentionally doped GaN epilayers grown by metal organic chemical vapor deposition (MOCVD). The (Ga,Mn)N and Ga_xMn_y phases were formed after Mn-implanted undoped GaN epilayers annealed at 700 and 800 °C. The samples showed ferromagnetic behavior at room temperature with the highest magnetization obtained in the sample annealed at 800 °C. Ferromagnetic signal reduces as annealing temperature increased above 900 °C. It is believed that the room-temperature ferromagnetic property of Mn-implanted undoped GaN epilayers are mainly from (Ga_,Mn)N. The Ga_xMn_y phases play a critical role in providing holes and also contribute to increasing the ferromagnetic property.     

Observation of oxygen contamination at ZnSe/GaAs interfaces using SIMS

ZnSe epilayers were grown on GaAs (1 0 0) substrates using MBE. The native contamination (oxide and carbon) was removed in situ from the substrate surfaces by conventional thermal cleaning and by exposure to atomic hydrogen. A maximum substrate temperature of 600 °C was required for the thermal cleaning process, while a substrate temperature of 450 °C was sufficient to clean the substrate using hydrogen. ZnSe epilayers were also grown on As capped GaAs epilayers, which were decapped at a maximum temperature of 350 °C. SIMS profiles showed the existence of oxygen at the interface for all of the substrate preparation methods. The oxygen surface coverage at the interface was found to be 0.03% for the atomic hydrogen cleaned substrate and 0.7% for the thermally cleaned substrate.     

Underlayer diffusion-induced enhancement of coercivity in high anisotropy FePt thin films

The L1₀ ordered FePt films have been prepared at 300 °C with a basic structure of CrRu/MgO/FePt, followed by a post-annealing process at temperatures from 200 to 350 °C. The magnetic properties and the microstructure of the films were investigated. It is found that coercivity of FePt films increases greatly from 3.57 to 9.1 kOe with the increasing annealing temperature from 200 to 350 °C. The loop slope of the M–H curves decreases with the increasing annealing temperature, which is due to the grain isolation induced by MgO underlayer diffusion during the annealing process. The underlayer diffusion could be a useful approach to prepare the FePt-based composite films for high-density recording media.     

Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: Annealing effects

This study elucidates the thermal stability and quasi ohmic contact characteristics of Cu(RuTaN_x) fabricated on a barrierless GaAs substrate. Cu(RuTaN_x) was prepared by cosputtering Cu, Ta, Ru, and N. The resistivity of the Cu(RuTaN_x)/GaAs structure annealed at 500 °C for 30 min was lower than that of the as-deposited structure, and the former was thermally stable up to 500 °C after 30 min of annealing. Further, the Cu(RuTaN_x)/GaAs structure exhibited electrical rectifying properties upon annealing at 550 °C for 10 min and revealed a quasi ohmic contact, as determined by the circular transmission line model (CTLM). The formation of quasi ohmic contact is further confirmed by transmission electron microscopy and energy dispersive X-ray spectroscopy.     

Control of a- and c-plane preferential orientations of ZnO thin films

We report orientation-controllable growth of ZnO thin films and their orientation-dependent electrical characteristics. ZnO thin films were deposited on single-crystalline (1 0 0) LaAlO₃ and (1 0 0) SrTiO₃ substrates using pulsed laser deposition (PLD) at different substrate temperatures (400-800 °C). It was found that the orientation of ZnO films could be controlled by using different substrates of single-crystalline (1 0 0) LaAlO₃ and (1 0 0) SrTiO₃. The a-plane () and c-plane (0 0 0 2) oriented ZnO films are formed on LaAlO₃ and SrTiO₃, respectively. In both cases, the degree orientation increased with increasing deposition temperature T_s. Both the surface free energy and the degree of lattice mismatch are ascribed to play an important role for the orientation-controllable growth. Further characterization show that the grain size of the films with both orientations increases for a substrate temperature increase (i.e. from T_s = 400 °C to T_s = 800 °C), whereas the electrical properties of ZnO thin films depend upon their crystalline orientation, showing lower electrical resistivity values for a-plane oriented ZnO films.     

Synthesis and magnetic study on Mg-substituted Li-Mn spinel oxides

LiMn_2−xMg_xO₄ (X<0.5) cubic spinel oxide was synthesized by the sol-gel technique using Li-nitrate, Mn-acetate and Mg-acetate salts. The gel precursors were decomposed at 300 °C in air and then annealed at temperatures ranging from 500 to 850 °C in an oxygen flow. For a fixed annealing temperature of 700 °C, the lattice constant decreased with an increase in the substitution degree X and a discontinuity was found around X=0.3. With a further increase in X>0.3, the space group of the crystal structure was converted from Fd3m to P4₃32 by the cation ordering in the octahedral site. The low-temperature magnetization increased with X, and the Weiss constant moved in the positive direction and changed its sign from negative to positive around X=0.3. In the case of X=0.5, all the specimens showed P4₃32 structure and ferromagnetic character. The maximum Curie temperature (T_c=23 K) and the maximum magnetization (M_s=4.68 μ_B per the chemical formula unit) were attained simultaneously for the specimen obtained around 700 °C. The Mn valence state was sensitive not only to the substitution but also to the preparation conditions. Hence, it was possible to explain these variations by considering the magnetic interactions between transition metal ions.     

High-temperature ferromagnetism in laser-deposited layers of silicon and germanium doped with manganese or iron impurities

The paper reports on the results of a study of the synthesis conditions effects on magnetic and transport properties of nanosized layers of high-T_c diluted magnetic semiconductors (DMS), such as Ge:Mn, Si:Mn and Si:Fe, fabricated by laser-plasma deposition over a wide range of the growth temperature, T_g=(20-550) °C on single-crystal GaAs or Al₂O₃ substrates. Ferromagnetism of the layers was detected by measurement data of the magneto-optical Kerr effect, anomalous Hall effect, negative magnetoresistance and ferromagnetic resonance (FMR) at 5-500 K. The optimum growth temperature, T_g, for Si:Mn/GaAs layers with T_c≈400 K is shown to be about 400 °C. The Si:Mn/Al₂O₃ layers with 35% of Mn have the metal-type of conductivity with manifestation of magnetization up to room temperature. Different types of uniformly doped structures and digital alloys have been investigated. In contrast to GaSb:Mn films, Si-based ferromagnetic layers have strongly different magnetic and electric properties in case of uniformly doped structures and digital alloys. Positive results of the Fermi level variation effect on the improvement of Si- and Ge-based DMS layers have been gained on the use of additional doping with shallow acceptor Al impurity which contributes to the increase of the hole concentration and the RKKY exchange interaction of 3d-ions. The Ge:(Mn, Al)/GaAs or Ge (Mn, Al)/Si layers grown at 20 °C feature surprising extraordinary angular dependence of FMR.     

Surface morphology of metal films deposited on mica at various temperatures observed by atomic force microscopy

Thin films of eight metals with a thickness of 150 nm were deposited on mica substrates by thermal evaporation at various temperatures in a high vacuum. The surface morphology of the metal films was observed by atomic force microscopy (AFM) and the images were characterized quantitatively by a roughness analysis and a bearing analysis (surface height analysis). The films of Au, Ag, Cu, and Al with the high melting points were prepared at homologous temperatures T/T_m = 0.22-0.32, 0.40, and 0.56. The films of In, Sn, Bi, and Pb with the low melting points were prepared at T/T_m = 0.55-0.70, where T and T_m are the absolute temperatures of the mica substrate and the melting point of the metal, respectively. The surface morphology of these metal films was studied based on a structure zone model. The film surfaces of Au, Ag, and Cu prepared at the low temperatures (T/T_m = 0.22-0.24) consist of small round grains with diameters of 30-60 nm and heights of 2-7 nm. The surface heights of these metal films distribute randomly around the surface height at 0 nm and the morphology is caused by self-shadowing during the deposition. The grain size becomes large due to surface diffusion of adatoms and the film surfaces have individual characteristic morphology and roughnesses as T increases. The surface of the Al film becomes very smooth as T increases and the atomically smooth surface is obtained at T/T_m = 0.56-0.67 (250-350 °C). On the other hand, the atomically smooth surface of the Au film is obtained at T/T_m = 0.56 (473 ± 3 °C). The films of In, Sn, Bi, and Pb prepared at T/T_m = 0.55-0.70 also show the individual characteristic surface morphology.     

Investigation of hard magnetic properties in the Fe-Pt system by combinatorial deposition of thin film multilayer libraries

The magnetic properties of annealed Fe-Pt multilayer thin films with a broad composition range were investigated in order to identify the effects of composition and annealing temperature on the achievable coercive field, and to identify its maximum at low processing temperatures. Two types of multilayer systems were deposited as materials libraries to vary the composition from Fe₂₀Pt₈₀ to Fe₇₅Pt₂₅. The first type of multilayer was comprised of alternating opposing wedges, whereas the second type consisted of repeated uniform Fe and Pt layers interspersed periodically with Fe wedge layers. It was found that coercive fields μ₀H_C > 0.7 T can be achieved at an annealing temperature of about 300 °C (60 min) for both types of multilayers as long as the composition is close to 50:50. Higher annealing temperatures are needed for films, which deviate from this composition. Increasing the annealing temperature up to 700 °C leads to increased coercivity values. Multilayers with additional Fe layers showed increased remanence but reduced coercive fields.     

Strain relaxation of epitaxial SiGe layer and Ge diffusion during Ni silicidation on cap-Si/SiGe/Si(0 0 1)

Strain relaxation of the epitaxial SiGe layer and Ge diffusion during nickel silicidation by rapid thermal annealing the structure of Ni(≅14 nm)/cap-Si(≅26 nm)/Si_0.83Ge_0.17/Si(0 0 1) at the elevated annealing temperatures, T_A, were investigated by X-ray diffraction analyses of high-resolution ω-2θ scan and reciprocal space mapping. The analyses showed a much larger strain relaxation at a lower T_A and a reduction in Ge content in the SiGe layer of Ni/SiGe/Si(0 0 1) after thermal annealing compared to the case of cap-Si/SiGe/Si(0 0 1). The results indicate that the strain relaxation of the SiGe layers in NiSi/SiGe/Si(0 0 1) is related to the phenomena of NiSi agglomeration and penetration into the SiGe layer during silicidation at elevated anneal temperatures ≥750 °C. At elevated T_A ≥ 750 °C, Ge diffused into the intact cap-Si area during silicidation.     

Solution processed amorphous InGaZnO semiconductor thin films and transistors

Amorphous indium gallium zinc oxide (a-IGZO) semiconductor thin films and transistors were deposited on alkali-free glasses by the sol–gel route. The atomic ratio of In:Ga:Zn in the solution was 0.7:0.3:1. In this study, the effects of annealing temperature on the structural, surface condition, optical transmittance, and electrical resistivity of a-IGZO semiconductor thin films were investigated. GIXRD measurements and TEM-NBD analysis indicated that all annealed IGZO thin films had an amorphous phase structure. The dried IGZO sol–gel films annealed at a temperature higher than 425 °C had a flat surface and exhibited high transparency (>89%) in the visible region. According to results from TGA, FT-IR and XPS, the residual organic compounds in the dried IGZO sol–gel films were completely removed at the annealing temperatures higher than 450 °C. Therefore, we chose the 450 °C annealed thin film as the active channel layer in the bottom-gate, bottom-contact (BGBC) thin-film transistor (TFT) in the present study. Current–voltage (I–V) characteristics of the 450 °C annealed a-IGZO TFT revealed that it operated in n-type behavior with a positive threshold voltage (enhancement mode).     

The influence of the substrate temperature on the photovoltaic properties of spray-deposited CdS:In thin films

Polycrystalline and highly transparent CdS:In thin films were produced by the spray pyrolysis (SP) technique at different substrate temperatures ranging from 350 to 490 °C on glass substrates. The effect of the substrate temperature on the photovoltaic properties of the films was investigated by studying the transmittance measurements, X-ray diffraction (XRD) patterns, scanning electron microscope (SEM) observations and the I-V plots. The transmittance measurements were used to estimate the band gap energy by the linear fit of (αhν)² versus hν. The band gap energy was found to be slightly increasing with the substrate temperature. XRD diffractograms show that a phase transition from the cubic to the hexagonal phase occurs by increasing the substrate temperature, beside more orientation of crystal growth. Also they show that complex cadmium compounds are still present till T_s ≈ 460 °C after which they practically disappear. From the linear I-V plots the resistivity was estimated and found to be strongly decreasing with the substrate temperature.     

The impact of annealing temperature and time on the electrical performance of Ti/Pt thin films

In this study, we focus on the influence of annealing time t_PDA (i.e. 30 min and 630 min) on the room-temperature resistivity of electron-beam-evaporated titanium/platinum thin films when exposed to thermal loads up to temperatures T_PDA of 700 °C. The titanium has a fixed thickness of 5 nm and serves as an adhesion layer. The thickness d_f,Pt of the platinum top layer is varied between 21 and 97 nm. Up to annealing temperatures of 450 °C, the film resistivity of the bi-layer system is linearly correlated with the reciprocal platinum film thickness independent of t_PDA, as expected from the size effect. At t_PDA = 30 min, the change in intrinsic film stress dominates the electrical behavior in this annealing regime, predominantly at large d_f,Pt values. Compared to t_PDA = 630 min, however, the increase in resistivity especially at low platinum film thickness is substantially larger demonstrating that titanium starts to diffuse at these long annealing times even at moderate temperatures. At T_PDA = 600 °C, the diffusion of titanium into the top layer leads to an enhanced increase in film resistivity ρ_f, especially at low platinum thicknesses and low annealing times, as the mean penetration depth of diffused titanium is under these conditions in order of d_f,Pt. Above T_PDA = 600 °C, ρ_f is slightly increased at t_PDA = 30 min. At t_PDA = 630 min, however, the film resistivity is decreased at d_f,Pt < 58 nm. This is attributed to grain growth and re-crystallization effects. Furthermore, the mean penetration depths of titanium substantially exceed d_f,Pt resulting predominantly in Ti_xO_y formation on the top film surface and hence, having low impact on ρ_f.     

XPS analysis of surface chemistry of near surface region of epiready GaAs(1 0 0) surface treated with (NH4)2Sx solution

In this work we analyze the effect of (NH)₂S_x wet treatment on the GaAs(1 0 0) covered with “epiready” oxide layer without any pretreatment in order to check the removal of oxides and carbon-related contamination, and the formation of sulfur species. The sulfidation procedure consisted of epiready sample dipping (at room and 40 °C temperatures) in an ammonium polysulfide solution combined with a UHV flash annealing up to 500 °C.The inspection of the XPS As 2p_3/2 and Ga 2p_3/2 spectra taken at surface sensitive mode revealed: (i) the temperature-dependent reduction of the amount of GaAs oxides and carbon contamination after sulfidation, and almost their complete removal after subsequent annealing, (ii) the creation of sulfur bonds with both Ga and As, with more thermally stable Ga-S bonds, and (iii) the slight reduction in elemental arsenic amount.     

Annealing effect on tunneling magnetoresistance in MgO-based magnetic tunnel junctions with FeMn exchange-bias layer

MgO-based magnetic tunnel junctions were fabricated, with a thin pinned CoFeB layer in the unbalanced synthetic antiferromagnet part of the stack FeMn/CoFe/Ru/CoFeB. Inverted and normal tunneling magnetoresistance (TMR) values occur at low and high annealing temperatures (T_a), respectively. The TMR ratio remains inverted up to T_a=300 °C and it becomes normal around T_a=350 °C. The exchange bias of FeMn disappears at high T_a. The sign reversal of the TMR ratio is mainly attributed to the disappearance of the exchange bias due to manganese diffusion during the annealing process.