共查询到17条相似文献,搜索用时 562 毫秒
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采用射频等离子体增强型化学气相沉积(RF-PECVD)技术,以H2和SiH4作为反应气体源,在不同的衬底温度下沉积了nc-Si∶H薄膜.采用Raman散射、X射线衍射、红外吸收等技术分析了薄膜的微结构和氢键合特征.结果表明,随衬底温度的升高,nc-Si∶H薄膜的沉积速率不断增大,晶化率和晶粒尺寸增加,纳米硅颗粒呈现出Si(111)晶面的择优生长趋势.键合特性显示,薄膜中的氢含量随衬底温度升高而逐渐减小,薄膜均匀性先增大后减小. 相似文献
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采用等离子体增强化学气相沉积(PECVD)法分别在玻璃衬底和p型薄膜硅衬底上制备了微晶硅薄膜。使用拉曼谱仪、紫外-可见分光光度计、傅里叶红外光谱仪等对微晶硅薄膜进行检测,重点研究了硅烷浓度、衬底温度对薄膜沉积速率和晶化率的影响。实验结果表明:两种衬底上薄膜的沉积速率均随硅烷浓度的增大、衬底温度的升高而变大。硅烷浓度对两种衬底的薄膜晶化率影响规律相同,即均随其升高而降低;但两种衬底的衬底温度影响规律存在差别:对玻璃衬底而言,温度升高,样品晶化率减小;而p型薄膜硅衬底则在温度升高时,样品晶化率先增大后减小。此外还发现,晶化率与薄膜光学性能及含氧量存在较密切关联。 相似文献
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采用热丝化学气相沉积(HWCVD)技术在低温条件下(100℃)制备超薄(~30 nm)的硼掺杂硅薄膜.系统研究了氢稀释比例RH对薄膜的微结构和电学性能的影响.当RH由55增加至115,薄膜的有序度增加,晶化率升高,载流子浓度增加,暗电导率增加;同时,薄膜的缺陷密度增加、霍尔迁移率降低.实验证实,当RH=55~70时,超薄硅薄膜开始晶化,这是薄膜由非晶到纳米晶的转化区.快速热退火工艺进一步提高了薄膜导电率.在RH=115、衬底温度为100℃沉积条件下,经过420℃、80 s退火,获得电导率为6.88 S/cm的超薄硼掺杂纳米晶硅薄膜. 相似文献
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ECR-PECVD制备n型微晶硅薄膜的研究 总被引:1,自引:1,他引:0
用电子回旋共振等离子体增强化学气相沉积(ECR-PECVD)的方法制备了磷掺杂微晶硅薄膜材料.通过Hall,Raman光谱和XRD的测试分析,研究了衬底温度和磷烷流量对掺杂薄膜组织结构和电学性能的影响.根据AFM照片分析了薄膜的表面形貌,进而推测了薄膜的内部组成.实验发现:衬底温度在250 ℃时,磷烷的加入会大大降低薄膜的晶化率.衬底温度提高到350 ℃后这种影响明显下降.薄膜的载流子浓度和电导率受薄膜晶化率影响明显,衬底温度的升高对薄膜电学性能提高有较大帮助. 相似文献
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基于PECVD制备多晶硅薄膜研究 总被引:3,自引:0,他引:3
基于PECVD以高纯SiH4为气源研究制备多晶硅薄膜,在衬底温度550℃、射频(13.56MHz)电源功率为20W直接沉积获得多晶硅薄膜.采用X射线衍射仪(XRD) 和场发射扫描电子显微镜(SEM) 对多个样品薄膜的结晶情况及形貌进行分析,薄膜结晶粒取向均为<111>、<220>、<311>晶向.对550℃沉积态薄膜在900℃、1100℃时进行高温退火处理,硅衍射峰明显加强.结果表明,退火温度越高,退火时间越长,得到多晶硅薄膜表面晶粒趋于平坦,择优取向为<111>晶向,晶粒也相对增大. 相似文献
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采用磁控共溅射沉积法,以Si靶和SiC靶为靶材,单晶Si(100)和石英为衬底,在不同衬底温度下沉积了富硅SiCx薄膜.在氮气氛下于1100 ℃退火,得到包含硅量子点的SiCx薄膜.采用傅立叶变换红外吸收光谱、拉曼光谱、掠入射X射线衍射和吸收谱对退火后的SiCx薄膜进行了表征.结果表明:当衬底温度从室温(25℃)升至300℃时,薄膜的晶化率增至71.3;,硅量子点尺寸增至8.9 nm,而光学带隙则减至2.42 eV;随着衬底温度进一步升高,薄膜的晶化率降至63.1;,硅量子点尺寸减小至7.3 nm,而光学带隙却增加至2.57 eV;当衬底温度从室温(25℃)升至400℃时,薄膜的吸收系数呈先增大后减小趋势.在本实验条件下,最佳衬底温度为300℃. 相似文献
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Hydrogenated amorphous silicon (a-Si:H) thin films grown at 250°C on (1 0 0) crystalline substrate using plasma-enhanced chemical vapor deposition (PECVD) with SiH4/H2 gas flow ratio equal to 5/1 (sccm) are investigated by transmission electron microscopy. It is found that the thin film is totally amorphous when grown on a glass substrate. But when the substrate is changed to crystalline silicon, some crystalline grains are found embedded in the amorphous structure in certain regions even if the thickness of the film reaches 600 nm. It is suggested that the amorphous silicon film grown on a crystalline silicon substrate at a temperature of 250°C without heavy H2 dilution is a mixed network of a small amount of crystalline silicon and the major portion of amorphous silicon. 相似文献
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A.G. Kazanskii Guanglin Kong Xiangbo Zeng Huiying Hao Fengzhen Liu 《Journal of Non》2008,354(19-25):2282-2285
The results of conductivity, photoconductivity and constant photocurrent method absorption measurements by DC and AC methods in hydrogenated silicon films with mixed amorphous–nanocrystalline structure are presented. A series of diphasic silicon films was deposited by very high frequency plasma enhanced chemical vapor deposition technique, using different hydrogen dilution ratios of silane. The increase of hydrogen dilution ratio results in five orders of magnitude increase of conductivity and a sharp increase of grain volume fraction. The comparison of the absorption spectra obtained by DC and AC methods showed that they are similar for silicon films with the predominantly amorphous structure and films with high grain volume fraction. However we found a dramatic discrepancy between the absorption spectra obtained by DC and AC constant photocurrent methods in silicon films deposited in the regime of the structure transition from amorphous to nanocrystalline state. AC constant photocurrent method gives higher absorption coefficient than DC constant photocurrent method in the photon energy range of 1.2–1.7 eV. This result indicates the possibility of crystalline grains contribution to absorption spectra measured by AC constant photocurrent method in silicon films with intermediate crystalline grain volume fraction. 相似文献
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Shiyong Liu Xiangbo Zeng Wenbo Peng Haibo Xiao Wenjie Yao Xiaobing Xie Chao Wang Zhanguo Wang 《Journal of Non》2011,357(1):121-125
We develop a double-layer p-type hydrogenated nanocrystalline silicon (p-nc-Si:H) structure consisting of a low hydrogen diluted i/p buffer layer and a high hydrogen diluted p-layer to improve the hydrogenated amorphous silicon (a-Si:H) n-i-p solar cells. The electrical, optical and structural properties of p-nc-Si:H films with different hydrogen dilution ratio (RH) are investigated. High conductivity, low activation energy and wide band gap are achieved for the thin films. Raman spectroscopy and high-resolution transmission electron microscopy (HRTEM) analyses indicate that the thin films contain nanocrystallites with grain size around 3-5 nm embedded in the amorphous silicon matrix. By inserting a p-nc-Si:H buffer layer at the i/p interface, the overall performance of the solar cell is improved significantly compared to the bufferless cell. The improvement is correlated with the reduction of the density of defect states at the i/p interface. 相似文献
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Chao-Yang Tsao Patrick Campbell Dengyuan Song Martin A. Green 《Journal of Crystal Growth》2010,312(19):2647-2655
To improve the properties of polycrystalline Ge thin films, which are a candidate material for the bottom cells of low cost monolithic tandem solar cells, ∼300 nm in situ hydrogenated Ge (Ge:H) thin films were deposited on silicon nitride coated glass by radio-frequency magnetron sputtering. The films were sputtered in a mixture of 15 sccm argon and 10 sccm hydrogen at a variety of low substrate temperatures (Ts)≤450 °C. Structural and optical properties of the Ge:H thin films were measured and compared to those of non-hydrogenated Ge thin films deduced in our previous work. Raman and X-ray diffraction spectra revealed a structural evolution from amorphous to crystalline phase with increase in Ts. It is found that the introduction of hydrogen gas benefits the structural properties of the polycrystalline Ge film, sputtered at 450 °C, although the onset crystallization temperature is ∼90 °C higher than in those sputtered without hydrogen. Compared with non-hydrogenated Ge thin films, hydrogen incorporated in the films leads to broadened band gaps of the films sputtered at different Ts. 相似文献
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The examination of the growth of silicon on flame fusion and Czochralski spinel prior to complete coverage of the substrate provides information on the chemical interaction between the deposition constituents and the substrate material. The flame fusion spinel appears to be eroded primarily by silicon, while the Czochralski spinel is eroded by both hydrogen and silicon. The hole mobilities in (111) silicon deposited in helium on the Czochralski spinel are similar to the mobilities in (111) silicon deposited in hydrogen on the flame fusion spinel. The semiconducting properties of silicon on the Czochralski spinel are degraded by annealing the substrate in hydrogen, and are unaffected by annealing the substrate in helium. The substrate surface work damage appears to be removed as the result of reduction of the spinel by silicon during the deposition of silicon on the Czochralski spinel in helium. Both the electrical data of 1 μm thick films and the physical nature of the deposits prior to complete coverage of the substrate lead to the conclusion that the hole mobilities in silicon on spinel are limited primarily by the impurities introduced into the deposit by reaction of the substrate with the deposition constituents, and that the impurities are incorporated into the deposit mainly prior to complete coverage of the surface and are concentrated in a thin layer in the silicon near the silicon-substrate interface. 相似文献