Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces

Ultrasonic wire bonding is a method applied in electronic packaging to fabricate interconnections between two devices at ambient temperature. In order to investigate the material diffusion during this process, the occurring thermal and mechanical mechanisms at and around the interface of the formed bond were studied by means of coupled thermo-mechanical FE simulations. Within the framework of material forces the local jump of the Eshelby tensor was compared with the thickness of the formed intermetallic phase for various bonding parameters. This allows us to predict an effective diffusion constant which takes temperature and mechanical driving forces into account. After this relation has been established a subsequent objective of our investigations is to optimize the growth of the Au8Al3 intermetallic phase in terms of bonding parameters. (© 2012 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

A thermomechanical analysis of interfaces between the mating parts in ultrasonic wire bonding

Ultrasonic welding (USW) is an alternative solution for the bonding process especially in automotive industry. Ultrasonic welding of metals is a joining technique as a combination of applying pressure and frictional vibrations within the range of ultrasonic frequencies. In automotive industry, ultrasonic welding is often used for wired connections. As an alternative for crimping technology of multi-strand aluminum cables in wire bonding, ultrasonic welding is used. This work presents a thermomechanical analysis of the interface between two mating parts in USW. For this reason, the temperature distribution at bonding locations inside a wire bundle due to frictional vibrations and pressure is investigated using the finite element method (FEM). The obvious difference in microsections from different welding samples, which originates from different local temperature rises, was the motivation for this study to further investigate the thermomechanical aspects of the USW by use of finite element simulations. (© 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Experimental and Numerical Investigations of Al/Mg Compounds

Al/Mg compounds produced by hydrostatic extrusion exhibit unique characteristics regarding high strength and low weight, which are required by safety part applications in lightweight constructions. Between the two materials an interface in form of a brittle intermetallic phase consisting of Al₂Mg₃ and Al₁₂Mg₁₇ arises during the production process. However, a certain plastic deformability of the semi-finished product is essential for further forming processes. Even under multi-axle load during a radial upsetting process, the interface maintains a full material joint although a fragmentation and a new secondary interface between the fragments can be observed. Due to the evaluations of light microscopy images and Eulerian Hencky strain values at the interface, which are obtained with the help of the Digital Image Correlation, a relation between the strain and the boundary layer's appearance seems reasonable. (© 2014 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Hamilton体系下层合板弱粘接模型的应用

层合板的层间粘接模型对整个层合板的结构有重要影响．运用Hamilton正则方程对层合板层间的不同类型的粘接模型进行了分析．结合弹性材料修正后的Hellinger Reissner变分原理和插值函数,构建了直角坐标系下8节点层合板的每一层的线性方程;考虑到脱层板的连接界面处应力和位移的关系,改进了现有的常用弱粘接模型,建立不同粘接模型的控制方程;最后通过求解整个板的控制方程,得到层合板的层间应力和位移．数值算例验证了该模型的正确性,并研究了层间界面为线性和非线性时的问题．结果表明:应用改进后的弱粘接模型,能够更好地模拟层合板的弱界面失效过程．     

A finite element analysis of effects of ultrasonic welding parameters on the temperature distribution in wire bonding

Wire bonding is an essential process in the automotive industry. Multi-strand flexible aluminium cables are used for connection of different electronic components and electrical centres in cars. As an alternative for crimping technology in wire bonding, ultrasonic welding (USW) is applied, which is a rapid manufacturing process used to create solid joints between mating materials at low energy consumption compared to the known welding processes, such as oxy-fuel welding and arc welding. An ultrasonic welding machine consists of different parts, such as pneumatic cylinder, piezoelectric converter, booster, welding sonotrode and anvil. Despite of the simplicity of the USW process, choosing the right machine and process parameters, like pressure of the pneumatic cylinder, welding time as well as vibration amplitude of the piezo-converter, is a tricky and complicated task for obtaining an adequate bond. Experimental investigations done in this area are extremely time-consuming and require a lot of effort. Therefore, some new approaches must be developed to understand the process in more detail. The present study focuses on the influence of the ultrasonic welding parameters, such as sonotrode pressure and vibration amplitude, on the temperature distribution at interfaces of two mating pieces in wire bonding [1,2]. Investigations are done by means of FEM simulations as well as by experiments. The results are then extended to thermo-mechanical analysis of multi-strand models. (© 2016 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

A bioactive interface approach for the simulation of mechanically stimulated osseointegration of hip joint endoprostheses

In this contribution, an approach on the mechanically stimulated osseointegration of hip joint endoprostheses considering load cases of daily movements is presented. The mechanical behavior of the bone-implant interface is modeled with a material model adopted from computational plasticity. Under consideration of a detailed analysis of the interface conditions, limiting factors for the osseointegration process are identified and the bone ingrowth prediction is performed. (© 2010 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Elastic antiplane contact problem with adhesion

We study a mechanical problem modeling the antiplane shear deformation of a linearly elastic body in adhesive contact with a foundation. The material is assumed to be homogeneous and isotropic and the process is quasistatic. The adhesion process on the contact surface is modeled by a surface internal variable, the bonding field, and the tangential shear due to the bonding is included. We establish the existence of a unique weak solution for the problem, by construction of an appropriate mapping which is shown to be a contraction on a Banach space.     

Modeling the hydrogen material interaction as parametric instability of the continuum

The hydrogen is contained in any material. Its concentration inside the materials leads to mechanical properties degradation. The two-continuum model of solid allows one to describe the influence of small concentration of hydrogen on the mechanical properties of materials in terms of changing the bonding energy of the second continuum, the latter being responsible for the hydrogen concentration. The application of this model to fatigue task give the hydrogen concentration that are critical for material destruction. Such fatigue destruction has a nature of parametric instability during the cyclic redistribution of the hydrogen under the cyclic loading. (© 2011 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Analysis of interface cracks in layered piezoelectric composites by a SGBEM

Piezoelectric materials offer many possibilities in advanced engineering structures due to their inherent coupling effects between mechanical and electrical fields and are widely applied in smart devices and structures like transducers, actuators and sensors [2]. An important application of piezoelectric materials is related to layered or laminated composites because they can be optimized to satisfy the high-performance requirements according to different in-service conditions. Beside cracks inside homogeneous domains, one of the most dominant failure mechanisms in layered or laminated composites is the interface failure. Interface cracks and interface debonding may be induced by the mismatch of the mechanical, electrical and thermal properties of the material constituents during the manufacturing process and the in-service loading conditions. This paper presents a hypersingular symmetric Galerkin boundary element method (SGBEM) for crack analysis in two-dimensional (2D), layered and linear piezoelectric solids. (© 2011 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Numerical investigations in structures with imperfect material interfaces and cracks

Natural fiber reinforced bio-polymers are in the focus of many research projects to understand and improve the mechanical behavior subjected to different process parameters during production. To provide safe and reliable light weight constructions, special interest is directed towards the damage and fracture behavior of such composite materials. Here, the material's behavior at the imperfect material interface between fiber and matrix plays an essential role and governs inelastic effects at the interfaces on the one hand, and the behavior of growing cracks on the other. The reduction of the elastic potential is related to both energy consuming processes in the system and in general is going along with a reduction of the crack tip loading and a shift of the crack growth direction. In this paper, the crack tip loading analysis in structures with perfect and imperfect material interfaces is presented and applied to different specimens. (© 2016 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Multiscale modeling of multiphase "in situ" composite

The elastic-plastic behaviour of rapidly solidified Al based (FeSi)-enriched alloys containing intermetallic compounds is considered. A new multilevel mechanical model for the “in situ” composite is proposed considering the aluminium matrix as a micropolar elastic plastic Cosserat material and the hardening phases as pure elastic ones. A two steps homogenization procedure is applied to obtain the overall properties of the multiphase “in situ“ composite, taking into account the existence of different sizes of intermetallic inclusions. A variational approach is applied to evaluate the equivalent stress on macro level at the transition from micro to macro scale. The model is developed using information provided by microstructural investigations and EDX analysis. The multistage bulk material manufacturing process from rapid solidified powders or ribbons is simulated using the Finite Element Method. The model is implemented as user subroutines into the FE code MARC. Numerical simulations are provided, corresponding to different values of metal forming parameters. The influence of the different inclusions sizes on the hardening behavior is discussed. (© 2010 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Delamination of Grain-Interfaces in Silicon Nitride

Intergranular cracking due to delamination of grain interfaces along with the development of bridging grains is the most important mechanism for the high fracture toughness of silicon nitride. In this line, an interface behavior, which is extending the Coulomb friction concept into the tensile domain has been implemented into a thermodynamical consistent frame work of Helmholtz free energy and dissipation. The model is used to describe the fracture process in a simple model geometry with a β-Si₃N₄ grain embedded into a precracked matrix of oxynitride glass. The material model considers the thermoelastic anisotropy of the grain and the thermal residual stresses, which evolve during the cooling of the model from the glass transition temperature to room temperature. (© 2011 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Packaging technology used in liquid crystal displays (LCDs) faces the critical issues such as high density interconnects, thinner packaging size, and environmental safety. In order to reduce the packaging size, driver integrated circuit (IC) chips are directly attached to LCD panels using flip chip technology with adhesives, which is called chip on glass (COG) packaging processes. To investigate the effects of the bonding force and bonding temperature on the flip chip thermal-compression packaging, this study established a compression model to analyze the flip chip packaging processes with non-conductive adhesives (NCAs). The plastic deformation of bumps and the NCA flow dynamics between chip and substrate were taken into account in this model. The gap height, bump deformation, bump contact area, and residual stresses after bonding can be estimated with this model.According to the simulation in this work, the best tactic for the flip chip packaging process using NCA is bonded at a lower temperature. This reduces the maximum warpage and only slightly decreases the average compressive residual stress in the bottom of bumps. A larger bonding force results in a larger bump contact area with the substrate, but has a lower compressive residual stress at the contact areas. The bonding force during the flip chip thermal bonding process will affect the contact resistance and reliability of packaging at the same time.     

Numerical analysis of quenching – Heat conduction in metallic materials

Metallic materials present a complex behavior during heat treatment processes. In a certain temperature range, change of temperature induces a phase transformation of metallic structure, which alters physical properties of the material. Indeed, measurements of specific heat and conductivity show strong temperature-dependence during processes such as quenching of steel. Several mathematical models, as solid mixtures and thermal–mechanical coupling, for problems of heat conduction in metallic materials, have been proposed. In this work, we take a simpler approach without thermal–mechanical coupling of deformation, by considering the nonlinear temperature-dependence of thermal parameters as the sole effect due to those complex behaviors. The above discussion of phase transformation of metallic materials serves only as a motivation for the strong temperature-dependence as material properties. In general, thermal properties of materials do depend on the temperature, and the present formulation of heat conduction problem may be served as a mathematical model when the temperature-dependence of material parameters becomes important. For this mathematical model we present the error estimate using the finite element method for the continuous-time case.     

The Effect of an Active Diluent on the Properties of Epoxy Resin and Unidirectional Carbon-Fiber-Reinforced Plastics

The influence of an active diluent on the properties of an epoxy matrix and carbon-fiber-reinforced plastics (CFRP) is investigated. The physicomechanical properties of an ED-20 epoxy resin modified with diglycidyl ether of diethylene glycol (DEG-1), the adhesion strength at the epoxy matrix–steel wire interface, and the mechanical properties of unidirectional CFRP are determined. The concentration of DEG-1 was varied from 0 to 50 wt.%. The properties of the matrix, the interface, and the composites are compared. It is stated that the matrix strength affects the strength of unidirectional CFRP in bending and not their strength in tension, compression, and shear. The latter fact seems somewhat unexpected. The interlaminar fracture toughness of the composites investigated correlates with the ultimate elongation of the binder. A comparison between the concentration dependences of adhesion strength and the strength of CFRP shows that the matrices utilized provide such a high interfacial strength that the strength of CFRP no longer depends on the adhesion of its constituents.     

Electro-thermo-mechanical behaviors of FGPM spheres using analytical method and ANSYS software

A hollow sphere made from functionally graded piezoelectric material (FGPM) such as PZT_4 has been considered. One-dimensional analytical method for electro-thermo-mechanical response of symmetrical spheres is used. For asymmetric three-dimensional analysis, ANSYS finite element software is employed in this study. Loading is combination of internal and external pressures, a distributed temperature field due to steady state heat conduction and a constant electric potential difference between its inner and outer surfaces for analytical solution. In three-dimensional solutions closed and open spheres with different boundary conditions subjected to an internal pressure and a uniform temperature field are studied. All mechanical, thermal and piezoelectric properties except the Poisson’s ratio are assumed to be power functions of radius. It has been found from analytical solution that the induced radial and circumferential stresses of an imposed electric potential is similar to the residual stresses locked in the homogeneous sphere during the autofrettage process of these vessels. It has been concluded from the three-dimensional analysis that the magnitudes of effective stresses at all node points are higher for the clamped-clamped boundary condition and are lower for the simply-simply supported condition.     

Temperature gradient in wood during grinding

Grinding is a commonly used method for producing pulps for papermaking, but its rather poor energy efficiency is a drawback. This paper focuses on developing a model dealing with temperature rise in wood during grinding. The model paves the way for the development of theoretical methods which can be used for reducing the energy consumption of the process. In grinding, wood is loaded by grits, which cause stress waves in the wood matrix. The stress waves fatigue the wood and ultimately separate fibres from the matrix, but because of wood’s viscoelasticity, part of the mechanical energy of waves is converted into heat. In order to understand the wood temperature increase in this process, a mechanistic model is developed here. The model is based on three hypotheses: a flux of mechanical energy occurs through the wood, the magnitude of the flux can be derived from the contact mechanics of the grits, and the rise in wood temperature can be determined from the dissipation of the flux. A temperature distribution in the actual grinding process was simulated with the model. The simulated temperatures were compared with a measured temperature profile obtained from the literature. The modelled and measured temperatures matched quite well. The simulations show that an increase in grit size results higher temperatures, whereas an increase in the distance between grits gives lower temperatures. The main result of the study is that the Hertz theory of contact mechanics can be considered an adequate method for analysing the effect of grits in the grinding process. The result shows that the Hertz theory is applicable when fatigue models are developed; these models can then be used to reduce the energy consumption of the process.     

Homogenization Approach Based on Laminates

In this work, a homogenization approach for the modeling of the material behavior of two-phase composites motivated by modeling a thin-layer-type microstructure is presented. The basic idea here is to idealize the thin-layered microstructure as a first-order laminate. In particular, a jump in deformation state across the phase interface is modeled constitutively via a rank-one connection of habit-plane type. In the material framework, the value for the jump as well as its direction remain as independent constitutive variables. However, in the case of laminates and an ideal plain interface, the direction is given and stays in a first approach constant. We assume that their values are determined by mechanical and configurational equilibrium in the two-phase composite at the interface. This yields to a set of implicit equations which lead to the corresponding response of the structure. (© 2010 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)     

Damage and Failure of Metal/Fibre-Reinforced Polymer Tensile Specimens with Inelastic Interface

Hybrid specimens of metal and fibre-reinforced polymer are applied in automotive and aerospace industry. The simulation and analysis of damage of such engineering structures is the focus of this research. The investigation includes a computation of the extension of single lap tensile specimen, produced by ultrasonic metal welding. The specimen is manufactured from CF-PA66 - fibre-reinforced polymer and AlMg3 (AA5754), which is used as a metallic joining partner. The aluminium substrate is treated as an elastoplastic material. The polymer composite generally shows an orthotropic elastic behaviour. The interface material has been numerically modeled as an elastoplastic material with linear hardening, coupled with Lemaitre-type damage. The finite element method is used for the investigation of so-called interface elements. The geometry of the interface is a consequence of the welding sonotrode geometry. The behaviour of specimens with square and ring interface geometry are analysed. The influence of the interface geometry on the mechanical properties of the joint is shown. The increase of the damage parameter and the development of failure are described for both cases. (© 2010 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim)