Growth and characterization of GaSb/AlGaSb multi-quantum well structures on Si (0 0 1) substrates

GaSb/AlGaSb multi-quantum well (MQW) structures with an AlSb initiation layer and a relatively thick GaSb buffer layer grown on Si (0 0 1) substrates were prepared by molecular beam epitaxy (MBE). Transmission electron microscopy (TEM) images and high-resolution X-ray diffraction (XRD) patterns indicated definite MQW structures. The photoluminescence (PL) emission around 1.55 μm wavelength was observed for 10.34 nm GaSb/30 nm Al_0.6Ga_0.4Sb MQW structure at room temperature. Dependence of PL emission energy on GaSb well width was well explained by finite square well potential model.     

Growth and characterization of GaN and AlN films on (1 1 1) and (0 0 1) Si substrates

GaN and AlN films were grown on (1 1 1) and (0 0 1) Si substrates by separate admittances of trimethylgallium (or trimethylaluminum) and ammonia (NH₃) at 1000°C. A high temperature (HT) or low temperature (LT) grown AlN thin layer was employed as the buffer layer between HT GaN (or HT AlN) film and Si substrate. Experimental results show that HT AlN and HT GaN films grown on the HT AlN-coated Si substrates exhibit better crystalline quality than those deposited on the LT AlN-coated Si substrates. Transmission electron microscopy (TEM) of the HT GaN/HT AlN buffer layer/(1 1 1)Si samples shows a particular orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. High quality HT GaN films were achieved on (1 1 1) Si substrates using a 200 Å thick HT AlN buffer layer. Room temperature photoluminescence spectra of the high quality HT GaN films show strong near band edge luminescence at 3.41 eV with an emission linewidth of ∼110 meV and weak yellow luminescence.     

Nanostructural and optical features of amorphous AlxSi0.45−xO0.55 (0 ⩽ x ⩽ 0.05) thin films prepared by RF-magnetron sputter techniques

The nanostructural, chemical, and optical features of Al_xSi_0.45−xO_0.55 (0 ⩽ x ⩽ 0.05) thin films were investigated in terms of Al concentration and post-deposition annealing conditions; the films were prepared by co-sputtering a Si main target and Al-chips, and the annealing was carried out at temperatures of 400–1100 °C. The a-Si_0.45O_0.55 films prepared without Al-chips and annealed at 800 °C contain ∼3.5 nm-sized Si nanocrystallites. The photoluminescence (PL) intensity as well as the volume fraction of Si nanocrystallites increased with increasing the concentration of Al to a certain level. In particular, the intensity of the PL spectra of the Al_0.025Si_0.425O_0.550 films which were annealed at 800 °C increased significantly at wavelengths of ∼580 nm. It is highly likely that the observed increase in the PL intensity is caused by the raise in the total volume of the ∼3.5 nm-sized nanocrystallites in the films. The addition of Al as well as the post-deposition annealing allow adjustment and control of the nanostructural and light-emission features of the a-SiO_x films.     

Structural study of undoped and (Mn, In)-doped SnO2 thin films grown by RF sputtering

Undoped and 5%(Mn, In)-doped SnO₂ thin films were deposited on Si(1 0 0) and Al₂O₃ (R-cut) by RF magnetron sputtering at different deposition power, sputtering gas mixture and substrate temperature. X-ray reflectivity was used to determine the films thickness (10–130 nm) and roughness (～1 nm). The combination of X-ray diffraction and Mössbauer techniques evidenced the presence of Sn⁴⁺ in an amorphous environment, for as-grown films obtained at low power and temperature, and the formation of crystalline SnO₂ for annealed films. As the deposition power, substrate temperature or O₂ proportion are increased, SnO₂ nanocrystals are formed. Epitaxial SnO₂ films are obtained on Al₂O₃ at 550 °C. The amorphous films are quite uniform but a more columnar growth is detected for increasing deposition power. No secondary phases or segregation of dopants were detected.     

Polarities of AlN films and underlying 3C-SiC intermediate layers grown on (1 1 1) Si substrates

The hydride vapor phase epitaxy (HVPE) of {0 0 0 1} AlN films on {1 1 1} Si substrates covered with epitaxial {1 1 1} cubic SiC (3C-SiC intermediate layers) was carried out. 3C-SiC intermediate layers are essential to obtain high-quality AlN films on Si substrates, because specular AlN films are obtained with 3C-SiC intermediate layers, whereas rough AlN films are obtained without 3C-SiC intermediate layers. We determined the polarities of AlN films and the underlying 3C-SiC intermediate layers by convergent beam electron diffraction (CBED) using transmission electron microscopy. For the first time, the polarities of the AlN films and the 3C-SiC intermediate layers were determined as Al and Si polarities, respectively. The AlN films were hardly etched by aqueous KOH solution, thereby indicating Al polarity. This supports the results obtained by CBED. The result is also consistent with electrostatic arguments. An interfacial structure was proposed. The 3C-SiC intermediate layers are promising for the HVPE of AlN films on Si substrates.     

Effects of vicinal angles from (0 0 1) surface on the Boron-doping features of high-quality homoepitaxial diamond films grown by the high-power microwave plasma chemical-vapor-deposition method

Vicinal surface effects on homoepitaxial growth and boron-doping processes have been studied in case of single-crystalline diamond (0 0 1) surfaces grown using the high-power microwave plasma chemical-vapor-deposition (MWPCVD) method. The off-angles inclined from the on-orientation (0 0 1) surfaces ranged to 5° along the [1 1 0] or [1 0 0] direction, while the concentration of doping B(CH₃)₃ gas was kept constant with a B/C ratio of 50 ppm. Although a number of square-like growth hillocks often appeared, depending substantially on the crystalline quality of the high-pressure/high-temperature-synthesized (HPHT) Ib diamond substrates employed, the number and shape of the hillocks changed significantly with the increasing off-angle. For the vicinal surfaces with off-angles of ≈3° inclined along the [1 1 0] direction, macroscopically flat surfaces were obtained, compared with the other off-angle cases examined. Furthermore, the growth rate and acceptor density of substitutional boron atoms in the homoepitaxial layers were found to substantially increase with the increasing off-angle. These indicate that the step density can play important roles not only in the homoepitaxial growth but also in the boron-incorporation process during the high-power MWPCVD growth.     

N-type doping of GaN/Si(1 1 1) using Al0.2Ga0.8N/ALN composite buffer layer and Al0.2Ga0.8N/GaN superlattice

The characteristics of Si-doped and undoped GaN/Si(1 1 1) heteroepitaxy with composite buffer layer (CBL) and superlattice are compared and discussed. While as-grown Si-doped GaN/Si(1 1 1) heteroepitaxy shows lower quality compared to undoped GaN, crack-free n-type and undoped GaN with the thickness of 1200 nm were obtained by metalorganic chemical vapor deposition (MOCVD). In order to achieve the crack-free GaN on Si(1 1 1), we have introduced the scheme of multiple buffer layers; composite buffer layer of Al_0.2Ga_0.8N/AlN and superlattice of Al_0.2Ga_0.8N/GaN on 2-in. Si(1 1 1) substrate, simultaneously. The FWHM values of the double-crystal X-ray diffractometry (DCXRD) rocking curves were 823 arcsec and 745 arcsec for n-GaN and undoped GaN/Si(1 1 1) heteroepitaxy, respectively. The average dislocation density on GaN surface was measured as 3.85×10⁹ and 1.32×10⁹ cm⁻² for n-GaN and undoped GaN epitaxy by 2-D images of atomic force microscopy (AFM). Point analysis of photoluminescence (PL) spectra was performed for evaluating the optical properties of the GaN epitaxy. We also implemented PL mapping, which showed the distribution of edge emission peaks onto the 2 inch whole Si(1 1 1) wafers. The average FWHMs of the band edge emission peak was 367.1 and 367.0 nm related with 3.377 and 3.378 eV, respectively, using 325 nm He-Cd laser as an excitation source under room temperature.     

Plasma enhanced chemical vapor deposition of ZnO thin films

Zinc oxide thin films were deposited on silicon and corning-7059 glass substrates by plasma enhanced chemical vapor deposition at different substrate temperatures ranging from 36 to 400 °C and with different gas flow rates. Diethylzinc as the source precursor, H₂O as oxidizer and argon as carrier gas were used for the preparation of ZnO films. Structural and optical properties of these films were investigated using X-ray diffraction, reflection high energy electron diffraction, atomic force microscopy and photoluminescence. Highly oriented films with (0 0 2) preferred planes were obtained on silicon kept at 300 °C with 50 ml/min flow rate of diethylzinc without any post annealing. Reflection high energy electron diffraction pattern also showed the crystalline nature of these films. A textured surface with rms roughness ∼28 nm was observed by atomic force microscopy for the films deposited at 300 °C. A sharp peak at 380 nm in the PL spectra indicated the UV band-edge emission.     

Effects of substrate orientation on aluminum grown on MgAl2O4 spinel using molecular beam epitaxy

Al thin films have been grown on single-crystal MgAl₂O₄ spinel substrates using solid source molecular beam epitaxy. The structural properties of Al layers were systematically investigated as a function of substrate orientation. X-ray diffraction reveals that Al layers are coherently grown on both (0 0 1)- and (1 1 1)-oriented spinel substrates. However, scanning electron microscopy and atomic force microscopy show that Al layers on (0 0 1) spinel substrates display smoother surface morphology than those grown on (1 1 1) spinel substrates. Additionally, electron backscatter diffraction and transmission electron microscopy demonstrate the presence of a high density of twin domain structures in Al thin films grown on (1 1 1) spinel substrates.     

Epitaxially grown Yb:KLu(WO4)2 composites for continuous-wave and mode-locked lasers in the 1 μm spectral range

Epitaxial layers of up to 50% Yb-doped monoclinic KLu(WO₄)₂ could be successfully grown on passive KLu(WO₄)₂ substrates. These composite samples were characterized and continuous-wave and mode-locked laser operation was achieved with Ti:sapphire and diode-laser pumping. A 10% Yb-doped epitaxy provided an output power exceeding 500 mW at 1030 nm and a maximum slope efficiency of 66% with Ti:sapphire laser pumping. A 50% Yb-doped epitaxy exhibited serious thermal problems without special cooling and rather limited cw performance. Quasi-cw operation provided in this case an average output power of 43 mW at 1032 nm for a 10% duty cycle. More than 100 mW cw could be generated at 1030 nm also with diode-pumping of the 10% Yb-doped KLu(WO₄)₂ epitaxy. Pulses as short as 114 fs were generated at 1030 nm with this same sample under Ti:sapphire laser pumping in a laser mode-locked by a saturable absorber mirror.     

Heteroepitaxy of InSb films grown on a Si(0 0 1) substrate with AlSb buffer layer

The growth of InSb films on a Si(0 0 1) substrate with AlSb buffer layer was performed in an ultra high vacuum chamber (UHV) by a co-evaporation of elemental Indium (In) and antimony (Sb) sources. The samples were characterized by Auger electron spectroscopy (AES), X-ray diffraction (XRD) and atomic force microscopy (AFM). The surface morphology and the crystal quality of the grown films strongly depend on the flux ratio of Sb/In. It is found that the optimized flux ratio for the one-step growth procedure is about 2.9 to obtain the InSb films with smooth surface and good crystal quality, for the growth temperature of 300 °C. The two-step growth procedure was also used to further improve the crystal quality of the films.     

Effect of tellurium deposition rate on the properties of Cu–In–Te based thin films and solar cells

To investigate the effects of tellurium (Te) deposition rate on the properties of Cu–In–Te based thin films (Cu/In=0.30–0.31), the films were grown on both bare and Mo-coated soda-lime glass substrates at 200 °C by co-evaporation using a molecular beam epitaxy system. The microstructural properties were examined by means of scanning electron microscopy and X-ray diffraction. The crystalline quality of the films was improved with increase in the deposition rate of Te, and exhibited a single CuIn₃Te₅ phase with a highly preferred (1 1 2) orientation. Te-deficient film (Te/(Cu+In)=1.07) grown with a low Te deposition rate showed a narrow bandgap of 0.99 eV at room temperature. The solar cell performance was affected by the deposition rate of Te. The best solar cell fabricated using CuIn₃Te₅ thin films grown with the highest deposition rate of Te (2.6 nm/s) yielded a total area (0.50 cm²) efficiency of 4.4% (V_oc=309 mV, J_sc=28.0 mA/cm², and FF=0.509) without light soaking.     

Undoped and arsenic-doped low temperature (∼165 °C) microcrystalline silicon for electronic devices process

Microcrystalline silicon films are deposited at 165 °C by plasma enhanced chemical vapor deposition (PECVD) from silane, highly diluted in hydrogen–argon mixtures. Ar addition during the deposition allows to increase the crystallinity from 24% to 58% for 20 nm thick films. The final crystallinity for 350 nm thick films reaches 72% with an increase in the grain size. A further increase, still 80%, is provided by substrate pre-treatment using hydrogen plasma before the deposition process. Arsenic doped μc-Si films, deposited on previous optimized (5 W power and 1.33 mbar pressure) undoped films without stopping the plasma between the deposition of both layers, show high electrical conductivity up to 20 S cm⁻¹.     

Crystallization of bismuth titanate and bismuth silicate grown as thin films by atomic layer deposition

Bismuth silicate and bismuth titanate thin films were deposited by atomic layer deposition (ALD). A novel approach with pulsing of two Bi-precursors was studied to control the Si/Bi atomic ratio in bismuth silicate thin films. The crystallization of compounds formed in the Bi₂O₃–SiO₂ and Bi₂O₃–TiO₂ systems was investigated. Control of the stoichiometry of Bi–Si–O thin films was studied when deposited on Si(1 0 0) and crystallization was studied for films on sapphire and MgO-, ZrO₂- and YSZ-buffered Si(1 0 0). The Bi–Ti–O thin films were deposited on Si(1 0 0) substrate. Both Bi–Si–O and Bi–Ti–O thin films were amorphous after deposition. Highly a-axis oriented Bi₂SiO₅ thin films were obtained when the Bi–Si–O thin films deposited on MgO-buffered Si(1 0 0) were annealed at 800 °C in nitrogen. The full-width half-maximum values for 200 peak were also studied. An excess of bismuth was found to improve the crystallization of Bi–Ti–O thin films and the best crystallinity was observed with Ti/Bi atomic ratio of 0.28 for films annealed at nitrogen at 1000 °C. Roughness of the thin films as well as the concentration depth distribution were also examined.     

Preparation and properties of titanium silicide coating glass by CVD

Titanium silicide thin films were prepared on glass substrates by chemical vapor deposition using SiH₄ and TiCl₄ as the precursors. The phase structure of the thin films was identified by XRD. The surface morphology of the thin films was observed by FESEM. The sheet resistance and optical behaviors of the thin films were measured by the four point resistivity test system and FTIR spectrometer, respectively. Titanium disilicide (TiSi₂) thin films with the face-centered orthorhombic structure are formed. The suitable formation temperature of the TiSi₂ crystalline phase is about 710 °C. The formation of TiSi₂ crystalline phase is dependent on the thickness of thin films and a quantity of the crystalline phase of TiSi₂ in the thin film is directly related to mole ratio of SiH₄/TiCl₄. The sheet resistance of the TiSi₂ thin films is dependent on the formation of the TiSi₂ crystalline phase. With the mole ratio of SiH₄/TiCl₄ of 3, the lowest sheet resistance (0.7 Ω/□) of titanium silicide thin film is formed at 710 °C. The maximum reflectance of the TiSi₂ thin films is about 0.95 on the broad IR heat radiation. A related reaction mechanism was proposed.     

Influence of amorphous buffer layers on the crystallinity of sputter-deposited undoped ZnO films

Undoped ZnO films were deposited by radio frequency (RF) magnetron sputtering on amorphous buffer layers such as SiO_x, SiO_xN_y, and SiN_x prepared by plasma enhanced chemical vapor deposition (PECVD) for dielectric layer in thin film transistor (TFT) application. ZnO was also deposited directly on glass and quartz substrate for comparison. It was found that continuous films were formed in the thickness up to 10 nm on all buffer layers. The crystallinity of ZnO films was improved in the order on quartz>SiO_x >SiO_xN_y>glass>SiN_x according to the investigated intensities of (0 0 2) XRD peaks. The crystallite sizes of ZnO were in the order of SiO_x～glass >SiN_x. Stable XRD parameters of ZnO thin films were obtained to the thickness from 40 to 100 nm grown on SiO_x insulator for TFT application. Investigation of the ZnO thin films by atomic force microscope (AFM) revealed that grain size and roughness obtained on SiN_x were larger than those on SiO_x and glass. Hence, both nucleation and crystallinity of sputtered ZnO thin films remarkably depended on amorphous buffer layers.     

Growth of germanium sulfide by hot wire chemical vapor deposition for nonvolatile memory applications

The growth of amorphous germanium sulfide (Ge–S) thin films using the hot wire chemical vapor deposition method has been performed at deposition temperatures in the range of 22–450 °C and pressures between 100 and 1800 Pa. Tetraallylgermanium and propylene sulfide were used as precursors for germanium and sulfur, respectively. The growth rate varies in the range of 1 and 100 nm/min and increases with increasing pressure and decreasing temperature. However, only the films deposited with lower growth rate exhibit conformal filling and good step coverage that could be observed at a growth rate of approximately 20 nm/min. Higher temperatures yield higher Ge content in the Ge–S films. In addition, the typical resistive switching behavior (three or four orders of magnitude) indicated that those films are suitable for nonvolatile memory applications.     

Growth and characterization of zirconium oxide thin films on silicon substrate

The growth and characterization of zirconium oxide (ZrO₂) thin films prepared by thermal oxidation of a deposited Zr metal layer on SiO₂/Si were investigated. Uniform ZrO₂ thin film with smooth surface morphology was obtained. The thermal ZrO₂ films showed a polycrystalline structure. The dielectric constant of the ZrO₂ film has been shown to be 23, and the equivalent oxide thickness (EOT) of the ZrO₂ stacked oxide is in the range of 3.38–5.43 nm. MOS capacitors with ZrO₂ dielectric stack show extremely low leakage current density, less than 10^?6 A/cm² at ?4 V. Consequently, using this method, high-quality ZrO₂ films could be fabricated at oxidation temperature as low as 600 °C.     

Geometric modeling of homoepitaxial CVD diamond growth: I. The {1 0 0}{1 1 1}{1 1 0}{1 1 3} system

Plasma-assisted CVD homoepitaxial diamond growth is a process that must satisfy many stringent requirements to meet industrial applications, particularly in high-power electronics. Purity control and crystalline quality of the obtained samples are of paramount importance and their optimization is a subject of active research. In the process of such studies, we have obtained high purity CVD diamond monocrystals with unusual morphologies, namely with apparent {1 1 3} stable faces. This phenomenon has led us to examine the process of CVD diamond growth and build up a 3D geometrical model, presented here, describing the film growth as a function of time. The model has been able to successfully describe the morphology of our obtained crystals and can be used as a predictive tool to predetermine the shape and size of a diamond crystal grown in a given process configuration. This renders accessible control of desirable properties such as largest usable diamond surface area and/or film thickness, before the cutting and polishing manufacture steps take place. The two latter steps are more sensitive to the geometry of the growth sectors, which will be addressed in a companion paper.Our model, applicable to the growth of any cubic lattice material, establishes a complete mapping of the final morphology state of growing diamond, as a function of the growth rates of the crystalline planes considered, namely {1 0 0}, {1 1 1}, {1 1 0}, and {1 1 3} planes, all of which have been observed experimentally in diamond films. The model makes no claim as to the stability of the obtained faces, such as the occurrence of non-epitaxial crystallites or twinning. It is also possible to deduce transient behavior of the crystal morphology as growth time is increased. The model conclusions are presented in the form of a series of diagrams, which trace the existence (and dominance) boundaries of each face type, in presence of the others, and where each boundary crossing represent a topology change in terms of number of faces, edges and vertices. We validate the model by matching it against crystals published in the literature and illustrate its predictive value by suggesting ways to increase usable surface area of the diamond film.