等离子体发射光谱诊断用于射频磁控溅射GaP薄膜的工艺参数优化

以GaP为靶材、Ar为工作气体,采用射频磁控溅射法制备了厚层GaP膜.对沉积过程中的辉光放电等离子体进行了发射光谱诊断,发现只有ArⅠ发射谱线.研究了工艺参数对发射谱线强度的影响规律,并在此基础上通过同时改变射频功率、Ar气流量及工作气压,使ArⅠ发射谱线强度保持相同.发现通过增大射频功率、减小工作气压而保持ArⅠ发射谱线强度不变可以提高GaP膜的沉积速率,并使GaP膜的沉积工艺参数得到优化.在优化后的工艺参数下制备出了符合化学计量比、红外透过性能好的厚层GaP膜. 关键词： GaP薄膜 射频磁控溅射 等离子体发射光谱 红外透射     

磁控溅射沉积薄膜预溅射时间的光谱诊断

利用Omni-λ300系列光栅光谱仪、CCD数据采集和处理系统以及光纤导光系统等构成的等离子体光谱分析系统,实现了实时获取射频磁控溅射过程中等离子体光谱,分别对NiTa,TiAl陶瓷靶,NiAl,TiAl合金靶四种靶材的磁控溅射过程产生的等离子体进行监测,以TaⅡ333.991 nm,NiⅠ362.473 nm,AlⅠ396.153 nm和TiⅠ398.176 nm为分析线,获得了分析谱线强度随时间的变化规律,并以此为依据确定了预溅射时间,同时研究了不同溅射功率和压强对预溅射时间的影响。     

磁控溅射ZnO薄膜生长的等离子体发射光谱研究

通过反应磁控溅射过程中的等离子体发射光谱，研究了制备ZnO薄膜的沉积温度、氧气流量比例R=O₂/(O₂+Ar)对Zn和O原子发射光谱的影响，并结合ZnO薄膜的结构和物理性能，探讨了沉积温度在ZnO薄膜生长中的作用.研究结果显示：当R≥0.75%时， Zn的溅射产额随R的增加基本呈线性下降规律.当R介于10%—50%时，氧含量的变化相对平缓，有利于ZnO薄膜生长的稳定性控制.Zn原子发射光谱强度随沉积温度的变化可以分为三个阶段.当沉积温度低于250℃时，发射光谱强 关键词： ZnO 薄膜生长 反应磁控溅射 等离子体发射光谱     

GaP薄膜的射频磁控溅射沉积及其计算机模拟

以GaP为靶材采用射频磁控溅射法制备GaP红外光学薄膜，通过保持Ar Ⅰ 750nm发射光谱线强度不变获得了不同工艺参数，并对沉积过程进行了计算机模拟.功率较小、气压较大时，Ga和P的溅射率、输运效率及沉积到衬底时的能量均较小，Ga的溅射率及输运效率均大于P的，使薄膜沉积速率较低、薄膜中Ga的含量大于P的，GaP薄膜产生较大吸收.功率较大、气压较小时，Ga和P的溅射率、输运效率及沉积到衬底时的能量均增大，Ga的溅射率大于P的、但其输运效率小于P的，使GaP薄膜的沉积速率增大、薄膜中Ga与P的含量接近化学计量比，GaP薄膜的吸收降低，因此有利于制备厚度较大的GaP薄膜. 关键词： GaP 薄膜 射频磁控溅射 计算机模拟     

大气压等离子体辅助多晶硅薄膜化学气相沉积参数诊断

本文采用发射光谱法诊断了大气压下Ar气、SiCl₄及H₂气混合气体（Ar/SiCl₄/H₂）射频放电等离子体射流特性.利用Si原子谱线强度计算了电子激发温度并以此估算了Si原子数密度,研究了射频功率及气体流量对电子激发温度和Si原子数密度以及SiCl₄解离率的作用. 关键词： 大气压等离子体射流 发射光谱 电子激发温度 多晶硅薄膜沉积     

大气压等离子体辅助多晶硅薄膜化学气相沉积参数诊断

本文采用发射光谱法诊断了大气压下Ar气、SiCl₄及H₂气混合气体（Ar/SiCl₄/H₂）射频放电等离子体射流特性.利用Si原子谱线强度计算了电子激发温度并以此估算了Si原子数密度,研究了射频功率及气体流量对电子激发温度和Si原子数密度以及SiCl₄解离率的作用.     

利用等离子体辅助脉冲磁控溅射实现 多晶硅薄膜的低温沉积

本文报道了利用电感耦合等离子体辅助中频直流脉冲磁控溅射在温度300 ℃ 以下沉积氢化多晶硅薄膜的制备方法. 利用拉曼散射、X射线衍射、透射电子衍射和傅里叶红外光谱对多晶硅薄膜进行了表征. 详细研究了氢气在沉积过程中所起的作用, 并结合Langmuir探针和发射光谱等等离子体诊断方法, 对辅助等离子体源在多晶硅薄膜制备过程中所起到的作用进行了讨论.     

射频磁控溅射法制备ZnS多晶薄膜及其性质

实验采用射频磁控溅射法在玻璃衬底上沉积了ZnS多晶薄膜,研究了沉积气压、退火温度和衬底温度对ZnS薄膜质量的影响.利用X射线衍射(XRD)分析了薄膜的微结构,并计算了内应力值.通过紫外-可见光分光光度计测量了薄膜的透过谱,计算了Urbach能量和禁带宽度.利用扫描电子显微镜(SEM)观察了薄膜的表面形貌.结果表明: 衬底温度为室温时沉积的ZnS薄膜具有较大的压应力,并且内应力值随着工作气压增大而增大,在300 ℃下进行退火处理后内应力松弛,衬底温度为350 ℃时制备的ZnS薄膜内应力小,透过率高,经300 ℃退火处理后结晶质量有所提高. 关键词： ZnS薄膜 射频磁控溅射 内应力     

Effects of experimental parameters on composition of boron carbon nitride thin films deposited by magnetron sputtering

We have synthesized boron carbon nitride thin films by radio frequency magnetron sputtering. The films structure and composition were characterized by X-ray diffraction, Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. The results indicate that the three elements of B, C, N are chemically bonded with each other and atomic-level hybrids have been formed in the films. The boron carbon nitride films prepared in the present experiment possess a disordered structure. The influence of PN₂/PN₂+Ar, total pressure and substrate bias voltage on the composition of boron carbon nitride films is investigated. The atomic fraction of C atoms increases and the fractions of B, N decrease with the decrease of PN₂/PN₂+Ar from 75% to 0%. There is an optimum total pressure. That is to say, the atomic fractions of B, N reach a maximum and the fraction of C atoms reaches a minimum at the total pressure of 1.3 Pa. The boron carbon nitride films exhibit lower C content and higher B, N contents at lower bias voltages. And the boron carbon nitride films show higher C content and lower B, N contents at higher bias voltages.     

Nanocrystalline titanium carbide thin films deposited by reactive magnetron sputtering

We investigated the structure and composition of titanium carbide thin films deposited by the reactive magnetron sputter ion plating process as a function of deposition parameters. The films were sputtered onto unheated glass substrates by means of an unbalanced planar d.c. magnetron equipped with a titanium target using a mixture of argon and methane. The deposition parameters ranged from 0.05 Pa to 2 Pa for total working gas pressurep _T, from 10% to 60% (volume) for relative methane concentration in the working gas mixture, from 45 mm to 85 mm for the substrate-to-target distanced _s-t and from −50V to −800V for the substrate biasU _S. It was found that the crystallinity of the thin films strongly decreases with increasingp _T,d _s-t andU _S. The experiments described show the conditions necessary to obtain sputter-deposited nanocrystalline titanium carbide films. This work has been partially supported by the Grant Agency of the Czech Republic under Grant No. 106/96/K245 and by the Ministry of Education of the Czech Republic under Grant No. VS96 059.     

Cu-In-O composite thin films deposited by reactive DC magnetron sputtering

Cu-In-O composite thin films were deposited by reactive DC magnetron sputtering at room temperature. The samples were characterized by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD), UV/vis spectrophotometer, four-probe measurement and Seebeck effect measurement, etc. The samples contain Cu, In and O. The ratios of Cu to In and O to In increase with increase in O₂ flow rates. The ratio of Cu to In is over 1 and this suggests that Cu is in excess. The obtained Cu-In-O thin films are very possibly made of rhombohedral In₂O₃ and monoclinic CuO. Transmittance of the films decreases with increase in O₂ flow rate. The decrease in transmittance results from increase in Cu content in the films. The optical band gap of all the samples is estimated to be 4.1-4.4 eV, which is larger than those of In₂O₃ and CuO. The sheet resistance of the films decreases with increase in O₂ flow rate. Conductivity of the films is a little low, due to the addition of Cu and the poor crystalline quality of the film. The conduction behavior of the films is similar to that of In₂O₃ and the conduction mechanism of Cu-In-O thin films is through O vacancy.     

GaN films deposited by middle-frequency magnetron sputtering

GaN films were deposited on Si (111) substrates by middle-frequency magnetron sputtering. X-ray diffraction revealed preferential GaN (0 0 0 2) orientation normal to the substrate surface for all the films deposited. The diffraction intensity and N contents were found to depend strongly on the total gas pressure. Good quality films were only obtained at pressures in the range of 0.4-1.0 Pa. Little diffraction of GaN (0 0 0 2) could be observed either at total pressures below 0.4 Pa or above 1.0 Pa. The GaN films produced under the optimized conditions have an N:Ga ratio of 1:1 as determined by energy-dispersive X-ray spectroscopy.     

The effect of hydrogen on copper nitride thin films deposited by magnetron sputtering

Copper nitride thin films were deposited on Si (1 0 0) wafers by reactive magnetron sputtering at various H₂/N₂ ratios. X-ray diffraction measurements show that the films are composed of Cu₃N crystallites with anti-ReO₃ structure and exhibit preferred orientation of [1 0 0] direction. Although the relative composition of the films has obviously changes with the H₂/N₂ ratios, the orientations of the films keep almost no changes. However, the grain size, lattice parameter and composition of the films are strongly dependent on the H₂/N₂ ratios. The copper nitride films prepared at 10% H₂/N₂ ratios show poor stability and large weight gain compared to the copper nitride films prepared at 0% H₂/N₂ ratios.     

GeC薄膜的射频磁控反应溅射制备及性质

用射频磁控反应溅射法在ZnS衬底上制备了GeC薄膜,研究了工艺参数对Ge靶溅射及GeC薄膜红外透射性能的影响.衬底温度较低时GeC薄膜中含有H,形成了CH₂,CH₃,Ge-CH₃等,使薄膜产生红外吸收;随衬底温度升高,薄膜红外吸收明显减小.靶基距、射频功率、Ar:CH₄气体流量比、总气压对靶面中毒及溅射影响较大,但对GeC薄膜红外吸收影响较小.靶面中毒严重时,所制备无氢GeC薄膜附着性能差,随靶中毒减弱薄膜附着性能变好.优化工艺后,在ZnS衬底上制备了附着性能良好的无氢GeC薄膜,其折射率约为1.78,薄膜中C的含量比Ge的大,二者主要形成了C—Ge键.所制备的GeC/GaP红外增透保护膜系对ZnS衬底有良好的增透效果. 关键词： GeC薄膜 红外透射光谱 射频磁控溅射 XPS     

Superconducting and structural properties of YBaCuO thin films deposited by inverted cylindrical magnetron sputtering

Thin films of YBaCuO have been deposited onto Al₂O₃, MgO, SrTiO₃ and ZrO₂ substrates by inverted cylindrical magnetron sputtering. The main advantage of this preparation technique is the high reproducibility of the results allowing systematic studies of the film properties as a function of deposition parameters. Optimum preparation conditions were a low discharge voltage (100 V), a high oxygen partial pressure (2×10^–1 Torr) in an oxygen argon mixture, and substrate temperatures around 800°C. The films grow highly textured on all substrates yielding single crystalline growth on SrTiO₃ and MgO as proved by X-ray diffraction and channeling. The zero resistance values of the sharp transtions usually are around 90 K. highest critical current densities were determined in films grown on MgO and SrTiO₃ with values up to 5.5×10⁶ A/cm² at 77 K.     

Magnetic anisotropy properties of CoZrNb thin films deposited on PET substrate by magnetron sputtering

Soft magnetism and magnetic anisotropy properties of CoZrNb thin films deposited on polyethylene terephthalate (PET) substrate by magnetron sputtering were investigated. As the film thickness increases, the coercivity of films decreases from 7 to 4 Oe. It exhibits an in-plane uniaxial magnetic anisotropy as the thickness of CoZrNb thin films increases. An easy axis is observed in CoZrNb films along the direction transverse to the rolling direction of the polymer web.     

衬底温度对反应磁控溅射W掺杂ZnO薄膜的微观结构及光电性能的影响

采用直流脉冲反应磁控溅射方法生长W掺杂ZnO（WZO）透明导电氧化物薄膜并研究了衬底温度对薄膜微观结构、组分、表面形貌以及光电性能的影响.实验结果表明,WZO薄膜具有良好的（002）晶面择优取向,且适当的衬底温度是制备优质WZO薄膜的关键因素.随着衬底温度升高,薄膜表面粗糙度先增大后减小;衬底温度较高时,薄膜的结构致密,结晶质量好,电子迁移率高.当衬底温度为325℃时,WZO薄膜获得最低电阻率9.25×10^-3Ω·cm,方块电阻为56.24Ω/□,迁移率为11.8 cm² V^-1·s^-1,其在可见光及近红外区域（400—1500 nm）范围的平均透过率达到85.7%.