Influence of oxygen partial pressure on the properties of undoped InOx films deposited at room temperature by rf-PERTE

Transparent and conductive/semiconductive undoped indium oxide (InO_x) thin films were deposited at room temperature. The deposition technique used is the radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) of indium (In) in the presence of oxygen. The influence of oxygen partial pressure on the properties of these films is presented. The oxygen partial pressure varied between 3 × 10^?2 and 1.3 × 10^?1 Pa. Undoped InO_x films, 100 nm thick, deposited at the oxygen partial pressure of 6 × 10^?2 Pa show a conductive behaviour, exhibit an average visible transmittance of 81%, a band gap around 2.7 eV and an electrical conductivity of about 1100 (Ω cm)^?1. For oxygen pressures greater than 6 × 10^?2 Pa, semiconductive films are obtained, maintaining the visible transmittance. Films deposited at lower pressures are conductive but dark. From XPS data, films deposited at an oxygen partial pressure of 6 × 10^?2 Pa show the highest amount of oxygen in the film surface and the lowest ratio between oxygen in the oxide crystalline and amorphous phases.     

The effect of oxygen partial pressure on physical properties of nano‐crystalline silver oxide thin films deposited by RF magnetron sputtering

Nano‐crystalline silver oxide films were deposited on glass and silicon substrates held at room temperature by RF magnetron sputtering of silver target under different oxygen partial pressures. The influence of oxygen partial pressure on the structural, morphological, electrical and optical properties of deposited films was investigated. Varying oxygen partial pressure during the sputter deposition leads to changes of mixed phase of Ag₂O and Ag to a single phase of Ag₂O and to AgO. The X‐ray diffraction and X‐ray photoelectron spectroscopy results showed the formation of single phase Ag₂O with cubic structure at oxygen partial pressures of 2x10^‐2 Pa while the films deposited at higher oxygen partial pressure of 9x10^‐2 Pa showed the formation of single phase of AgO with monoclinic structure. Raman spectroscopic studies on the single phase Ag₂O showed the stretching vibration of Ag‐O bonds. Single‐phase Ag₂O films obtained at oxygen partial pressure of 2x10^‐2 Pa were nano‐crystalline with crystallite size of 20 nm and possessed an electrical resistivity of 5.2x10^‐3 Ωcm and optical band gap of 2.05 eV. The films deposited at higher oxygen partial pressure of 9x10^‐2 Pa were of AgO with electrical resistivity of 1.8x10^‐2 Ωcm and optical band gap of 2.13 eV. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Transport properties of microcrystalline silicon,prepared at high growth rate

Amorphous/microcrystalline transition was studied in the high growth-rate depositions of hydrogenated silicon films at a high pressure (700 Pa) in a depletion regime using a series of samples with the ratio of hydrogen to silane flows from 10 to 32. Results show the characteristic features of the amorphous/microcrystalline transition: abrupt change of dark conductivity and crystallinity accompanied by peaks of roughness and diffusion length, observed previously at standard growth rates.     

On the oxidation mechanism of microcrystalline silicon thin films studied by Fourier transform infrared spectroscopy

Insight into the oxidation mechanism of microcrystalline silicon thin films has been obtained by means of Fourier transform infrared spectroscopy. The films were deposited by using the expanding thermal plasma and their oxidation upon air exposure was followed in time. Transmission spectra were recorded directly after deposition and at regular intervals up to 8 months after deposition. The interpretation of the spectra is focused on the Si-H_x stretching (2000-2100 cm⁻¹), Si-O-Si (1000-1200 cm⁻¹), and O_xSi-H_y modes (2130-2250 cm⁻¹). A short time scale (< 3 months) oxidation of the crystalline grain boundaries is observed, while at longer time scales, the oxidation of the amorphous tissue and the formation of O-H groups on the grain boundary surfaces play a role. The implications of this study on the quality of microcrystalline silicon exhibiting no post-deposition oxidation are discussed: it is not sufficient to merely passivate the surface of the crystalline grains and fill the gap between the grains with amorphous silicon. Instead, the quality of the amorphous silicon tissue should also be taken into account, since this oxidation can affect the passivating properties of the amorphous tissue on the surface of the crystalline silicon grains.     

Growth,electrical and optical behaviour of nanocrystalline Ag2Cu2O3 films produced by RF magnetron sputtering

Thin films of Ag₂Cu₂O₃ were formed on glass substrates by RF magnetron sputtering technique under different oxygen partial pressures in the range 5 × 10^‐3 – 8 × 10^‐2 Pa using mosaic target of Ag₇₀Cu₃₀. The influence of oxygen partial pressure on the core level binding energies, crystallographic structure, and electrical and optical properties of the deposited films was studied. The atomic ratio of copper to silver in the films was 0.302. The oxygen content was in correlation with the oxygen partial pressure maintained during the growth of the films. The films formed at oxygen partial pressures < 2 × 10^‐2 Pa was mixed phase of Ag₂Cu₂O₃ and Ag. The films deposited at 2 × 10^‐2 Pa were single phase of Ag₂Cu₂O₃. The crystallite size of the films formed at 2 × 10^‐2 Pa was 12 nm, while those films annealed at 473 K was 16 nm. The nanocrystalline Ag₂Cu₂O₃ films formed at oxygen partial pressure of 2 × 10^‐2 Pa showed electrical resistivity of 8.2 Ωcm and optical band gap of 1.95 eV. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Crystallinity of the mixed phase silicon thin films by Raman spectroscopy

Raman spectra of the mixed phase silicon films were studied for a sample with transition from amorphous to fully microcrystalline structure using four excitation wavelengths (325, 514.5, 632.8 and 785 nm). Factor analysis showed the presence of two and only two spectrally independent components in the spectra within the range from 250 to 750 cm^?1 for all four excitation wavelengths. The 785 nm excitation was found optimal for crystallinity evaluation and by comparison with surface crystallinity obtained by atomic force microscopy, we have estimated the ratio of integrated Raman cross-sections of microcrystalline and amorphous silicon at this wavelength as y = 0.88 ± 0.05.     

Sputter power and sputter pressure influenced structural and optical behaviour of RF sputtered nanocrystalline ZnO films

Zinc oxide thin films were deposited on p‐type (100) silicon and Corning glass substrate by using RF magnetron sputtering at different sputter powers range 100–200 W and sputter pressures range 2–8 Pa. The deposited films were characterized by X‐ray diffraction, atomic force microscopy, scanning electron microscopy, Fourier transform infrared spectroscope and UV‐Vis‐NIR spectrophotometer. The films formed at sputter power of 100 W consists of weak (100) reflection and then sputter power increased to 150 W additional (110) reflection was present with enhancement in the intensity of (100) peak. Further increase of sputtering power to 200 W the intensity of (100) phase decreased with the presence of additional peaks of (002) and (101) of ZnO. The FTIR analysis confirms the Zn‐O absorption band was located at 414 cm^‐1. The optical band gap of zinc oxide films decreased from 3.28 to 3.07 eV with increase of sputter power from 100 to 200 W. The maximum crystallite size of 21 nm, the root mean square roughness of 7.2 nm was found at films formed at working pressure of 5 Pa. The optical transmittance of the films increased from 88 to 96% and then decreased to 84% with increase of sputter pressure from 2 to 8 Pa.     

Optical and electrical properties of chlorinated and hydrogenated amorphous silicon prepared by glow discharge

Chlorinated and hydrogenated amorphous silicon films were prepared by glow discharge of a SiCl₄/H₂ mixture. Infrared spectra of these films show that, in addition to the hydrogen induced bands, two new modes appear at 545 cm^?1 (SiCl stretching) and 500 cm^?1 (Si TO modes induced by chlorine). Observation of the 545 cm^?1 band proves that chlorine is able to act as a dangling bond terminator in an amorphous silicon matrix. A good agreement is found between the total amount of chlorine determined by electron microprobe analysis and the value estimated from the integrated strength of the SiCl stretching mode. The relatively high value of the optical band gap (1.80 eV) of our material containing only 5 at.% bonded hydrogen shows that chlorine plays a major role in the optical gap value. Electrical conductivity, photoconductivity and luminescence properties are qualitatively similar to that of a: SiH films.     

Raman scattering in low wavenumber region as a new probe to structural properties of microcrystalline silicon

The structural properties of microcrystalline silicon (μc-Si) are studied by Raman scattering. It is found that the intensity of each Raman band closely correlates with the absorption coefficient in the interband region and that the Raman band at ca. 150 cm^?1 is a sensitive probe to randomness of Si-Si bonding structure in μc-Si.     

Low-temperature growth of nanocrystalline silicon films prepared by RF magnetron sputtering: Structural and optical studies

In order to contribute to the understanding of the optoelectronics properties of hydrogenated nanocrystalline silicon films, a detailed study has been conducted. Structural analysis (infrared absorption and Raman scattering spectroscopy), combined with optical measurements spectroscopy (optical transmission, photothermal deflection spectroscopy and photoconductivity) were used to characterize the films. The samples were elaborated by radio-frequency magnetron sputtering of crystalline silicon target, under a hydrogen (70%) and Argon (30%) gas mixture, at three different total pressures (2, 3 and 4 Pa) and varying substrate temperature (100, 150 and 200 °C). The results clearly indicate that the films deposited at 2 Pa are amorphous, while for 3 and 4 Pa nanocrystalline structures are observed. These results are discussed in the framework of the existing models.     

Preparation of microcrystalline silicon solar cells on microcrystalline silicon carbide window layers grown with HWCVD at low temperature

N-type microcrystalline silicon carbide layers prepared by hot-wire chemical vapor deposition were used as window layers for microcrystalline silicon n–i–p solar cells. The microcrystalline silicon intrinsic and p-layers of the solar cells were prepared with plasma-enhanced chemical vapor deposition at a very high frequency. Amorphous silicon incubation layers were observed at the initial stages of the growth of the microcrystalline silicon intrinsic layer under conditions close to the transition from microcrystalline to amorphous silicon growth. ‘Seed layers’ were developed to improve the nucleation and growth of microcrystalline silicon on the microcrystalline silicon carbide layers. Raman scattering measurement demonstrates that an incorporation of a ‘seed layer’ can drastically increase the crystalline volume fraction of the total absorber layer. Accordingly, the solar cell performance is improved. The correlation between the cell performance and the structural property of the absorber layer is discussed. By optimizing the deposition process, a high short-circuit current density of 26.7 mA/cm² was achieved with an absorber layer thickness of 1 μm, which led to a cell efficiency of 9.2%.     

A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

Mapping of mechanical stress in silicon thin films on silicon cantilevers by Raman microspectroscopy

We have used plasma enhanced chemical vapor deposition (PECVD) to deposit silicon thin films (～0.2–1 μm) with different crystallinity fractions on Nanosensors PtIr5 coated atomic force microscopy (AFM) cantilevers (450 × 50 × 2 μm³). Microscopic measurements of Raman scattering were used to map both internal stress and extrinsic stress induced in the films by bending the cantilevers using a nanomanipulator (Kleindiek Nanotechnik MM3A). Thanks to the excellent elasticity of the cantilevers, the films could be bent to curvature radii down to 300 μm. We observed the stress induced shift of the TO–LO phonon Raman band of more than 3 cm^?1 for fully microcrystalline film corresponding to the stress ～0.8 GPa. The shift of the similar film with amorphous structure was ～2.5 cm^?1.     

Effect of deposition pressure on microstructure and properties of hydrogenated carbon nitride films prepared by DC-RF-PECVD

Hydrogenated carbon nitride (a-CN:H films) were deposited on n-type (1 0 0) silicon substrates making use of dual direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), at working pressure of 2–20 Pa, using a mixed gas of CH₄ and N₂ as the source gas. The growth rate, composition, bonding structure of the deposited films were characterized by means of XPS and FTIR, and the mechanical properties of the deposited films were investigated by nano-indentation test. It was found that the parameters for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The growth rate of the deposited films increased at first with increasing deposition pressure, then saturated with further increase of the deposition pressure. The N/C ratio inside the deposited films increased with increasing working pressure except that it was as much as 0.50 at a working pressure of 5.0 Pa. The nano-hardness of the films decreased with increasing deposition pressure. CN radicals were remarkably formed in the deposited films at higher pressures, and their contents are related to the nitrogen concentrations in the deposited films.     

Remote plasma deposition of microcrystalline silicon thin-films: Film structure and the role of atomic hydrogen

Microcrystalline silicon films grown in an expanding thermal plasma, i.e. in the absence of ion bombardment, are found to be porous and rich in nano-sized voids. By carrying out an extensive investigation on the material quality of films deposited in the amorphous-to-microcrystalline transition regime, on the microcrystalline silicon growth development, and on the influence of the substrate temperature, it is concluded that the inferior material quality is related to the lack of a sufficient amount of amorphous silicon tissue. As possible cause for the insufficient amount of amorphous silicon tissue, the interaction of atomic hydrogen with amorphous silicon films has been studied in order to highlight a possible competition between film growth and H-induced etching of amorphous silicon, and between film growth and H-induced surface/film modification. The etch rates obtained are too low to compete with film growth. Furthermore, atomic H cannot be considered responsible for the poor quality of amorphous tissue present in the microcrystalline silicon films, as the H up-take mainly takes place in divacancies. These results suggest that ion bombardment may be a necessary condition to provide good quality microcrystalline silicon films.     

Epitaxial growth of tin oxide film on TiO2(1 1 0) using molecular beam epitaxy

Growth of tin oxide thin films using molecular beam epitaxy in a pyrolyzed nitrogen dioxide atmosphere on a titanium dioxide (1 1 0) substrate was investigated using X-ray photoelectron spectroscopy (XPS), electron diffraction, and atomic force microscopy (AFM). Properties of deposited films were studied for their dependence on substrate temperature and oxidation gas pressure. Analyses using XPS data revealed that tin atoms were fully oxidized to Sn⁴⁺ and SnO₂ films were grown epitaxially in deposition conditions of substrate temperatures of 627 K or higher and NO₂ pressure greater than 3×10⁻³ Pa. At a substrate temperature of 773 K, a smooth surface with atomic steps was visible in the SnO₂ films, but above or below this temperature, fine grains with crystal facets or porous structures appeared. At pressures of 8×10⁻⁴ to 3×10⁻⁴ Pa, the randomly oriented SnO phase was dominantly grown. Further decreasing the pressure, the Sn metal phase, which was epitaxially crystallized at less than 500 K, was also grown.     

Optoelectronic properties of hot-wire silicon layers deposited at 100 °C

Hot-wire chemical vapor deposition is employed for the deposition of amorphous and microcrystalline silicon layers at substrate temperature kept below 100 °C with the aid of active cooling of the substrate holder. The hydrogen dilution is varied in order to investigate films at the amorphous-to-microcrystalline transition. While the amorphous layers can be produced with a reasonably low defect density as deduced from subgap optical absorption spectra and a good photosensitivity, the microcrystalline layers are of a lesser quality, most probably due to a decrease of crystallinity during the film growth. In the amorphous growth regime, the Urbach energy values decrease with increasing hydrogen dilution, reaching a minimum of 67 meV just before the microcrystalline threshold. By varying the total gas pressure, the growth rate of the films is changed. The lowest deposition rate of this study (0.16 nm/s) produced the amorphous sample with the highest photoresponse (1 × 10⁶).     

Optical properties of microcrystalline 3C–SiC:H films measured by resonant photothermal bending spectroscopy

Optical absorption coefficient spectra of hydrogenated microcrystalline cubic silicon carbide (μc-3C–SiC:H) films prepared by Hot-Wire CVD method have been estimated for the first time by resonant photothermal bending spectroscopy (resonant-PBS). The optical bandgap energy and its temperature coefficient of μc-3C–SiC:H film is found to be about 2.2 eV and 2.3 × 10⁻⁴ eV K⁻¹, respectively. The absorption coefficient spectra of localized states, which are related to grain boundaries, do not change by exposure of air and thermal annealing. The localized state of μc-3C–SiC:H has different properties for impurity incorporation compared with that of hydrogenated microcrystalline silicon (μc-Si:H) film.     

Hydrogenated microcrystalline silicon thin films deposited by RF-PECVD under low ion bombardment energy using voltage waveform tailoring

We present experimental results for hydrogenated amorphous and microcrystalline silicon (a-Si:H and μc-Si:H) thin films deposited by PECVD while using a voltage waveform tailoring (VWT) technique to create an electrical asymmetry in the reactor. VWT dramatically modifies the mean ion bombardment energy (IBE) during growth, and we show that for a constant peak-to-peak excitation voltage (V_PP), waveforms resembling “peaks” or “valleys” result in very different material properties. Using Raman scattering spectroscopy, we show that the crystallinity of the material depends strongly on the IBE, as controlled by VWT. A detailed examination of the Raman scattering spectra reveals that the narrow peak at 520 cm^? 1 is disproportionately enhanced by lowering the IBE through the VWT technique. We examine this effect for a range of process parameters, varying the pressure, hydrogen–silane dilution ratio, and total flow of H₂. In addition, the SiH_X bonding in silicon thin films deposited using VWT is characterised for the first time, showing that the hydrogen bonding character is changed by the IBE. These results demonstrate the potential for VWT in controlling the IBE during thin film growth, thus ensuring that application-appropriate film densities and crystallinities are achieved, independent of the injected RF power.     

Properties of thin-film silicon solar cells at very high irradiance

The focussed beam of a low-power helium–neon laser is used to study accelerated light-induced degradation (Staebler–Wronski effect) and high steady-state photocarrier generation rates in amorphous and microcrystalline silicon thin-film solar cells, at up to 13 MW m^? 2 irradiance. Even at these high power densities, COMSOL® simulations indicate that heat diffusion into the substrate, aided by spreading conduction via the Ag back-contact, restricts the temperature rise to less than 14 °C. Short-circuit current may be measured directly, and the I–V characteristic estimated by taking into account shunting by the inactive part of the cell. The improved resistance to degradation of microcrystalline silicon cells is shown to persist to high irradiance. Computer simulations of an amorphous silicon solar cell are presented that are consistent with measured un-degraded and degraded properties, and offer insight into prevailing defect creation processes and carrier recombination mechanisms.